Diamond Systems JASPER User manual

JASPER
COM Express Type 6 Carrier Board and SBC
User Manual
Revision No
Release Date
Comments
1.1
02/08/2023
Initial release
1.2
05/03/2023
General text and image updates
© Copyright 2023
Diamond Systems Corp.
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [e-mail]

Jasper User Manual V1.2 www.diamondsystems.com Page 2
Contents
1Important Safe Handling Information ............................................................................................................ 4
2Introduction...................................................................................................................................................... 6
2.1 Jasper Product Overview ............................................................................................................................. 6
2.2 Baseboard Variants...................................................................................................................................... 8
2.3 Jasper Ordering Guide................................................................................................................................. 8
2.4 Product Photos............................................................................................................................................. 9
3Functional Overview...................................................................................................................................... 11
3.1 COM Express Carrier System.................................................................................................................... 11
3.2 Power Supply Specifications...................................................................................................................... 11
3.3 Ethernet Ports............................................................................................................................................. 11
3.4 PCIe Link Routing....................................................................................................................................... 11
3.5 SATA M.2 Socket ....................................................................................................................................... 11
3.6 USB ............................................................................................................................................................ 12
3.7 Audio........................................................................................................................................................... 12
3.8 LVDS LCD.................................................................................................................................................. 12
3.9 HDMI........................................................................................................................................................... 12
3.10 Serial Ports................................................................................................................................................. 12
3.11 Data Acquisition.......................................................................................................................................... 13
3.12 Backup Battery ........................................................................................................................................... 13
3.13 Trusted Platform Module (TPM)................................................................................................................. 13
3.14 Utility........................................................................................................................................................... 13
3.15 GPIO Header.............................................................................................................................................. 13
3.16 PCIe Minicard Socket................................................................................................................................. 13
3.17 PCIe104 Expansion.................................................................................................................................... 13
3.18 LED Indicators............................................................................................................................................ 14
4Block Diagram................................................................................................................................................ 15
5Mechanical Drawing ...................................................................................................................................... 16
6Connector and Jumper Location ................................................................................................................. 18
6.1 Jumper Selection........................................................................................................................................ 19
7Connector Pinout Specifications................................................................................................................. 22
7.1 Power In (J16) ............................................................................................................................................ 22
7.2 Battery (J18)............................................................................................................................................... 22
7.3 Fan Connector (J31)................................................................................................................................... 22
7.4 Ethernet (J23 & J24)................................................................................................................................... 23
7.5 Audio (J3) ................................................................................................................................................... 23
7.6 USB 2.0 Ports (J25).................................................................................................................................... 23
7.7 USB 3.0 Ports (J14, J20 & J21).................................................................................................................. 24
7.8 LVDS (J4)................................................................................................................................................... 24
7.9 LCD Backlight (J29).................................................................................................................................... 25
7.10 HDMI (J17 & J22)....................................................................................................................................... 25
7.11 VGA (J2)..................................................................................................................................................... 26
7.12 Serial ports (J19 & J26).............................................................................................................................. 26
7.13 M.2 Socket (J15)......................................................................................................................................... 27
7.14 SATA (J9)................................................................................................................................................... 28
7.15 Analog I/O (J16) and Digital I/O (J13) ........................................................................................................ 28
7.16 Utility (J27).................................................................................................................................................. 29
7.17 GPIO Connector (J5).................................................................................................................................. 29
7.18 PCIe Mini Card (J11 & J12)........................................................................................................................ 30
7.19 PCIe104 Connector (J1)............................................................................................................................. 31

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7.20 COM Express type 6 Compact / Basic connector Pinout (J28 & J30) ....................................................... 32
8I/O Connector List.......................................................................................................................................... 37
9Specifications................................................................................................................................................. 38
10 Limited Warranty............................................................................................................................................ 39

Jasper User Manual V1.2 www.diamondsystems.com Page 4
1 IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-
sensitive. This increases the likelihood of the boards incurring accidental damage during handling, installation,
and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in
sequential order:
•Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
•Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
•Unpack components and remove them from their anti-static bags only when they are ready to be
used.
•Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
•Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure
or damage. In this type of damage, the board eventually stops functioning because of some defective
components. Usually, the failure can be identified, and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB
surface, cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The
ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type
of damage. However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards.
Do not pile boards on top of each other or cram too many boards within a small location. This can cause
damage to connector pins or fragile components.

Jasper User Manual V1.2 www.diamondsystems.com Page 5
Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape
using needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, in an effort to release it off the stack. Tugging the board off the
stack in this manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the
board. Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board
while it is powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to
withstand a reverse power supply connection. This will destroy almost all ICs connected to the power supply.
In this case, the board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive
power will often have a visible hole or show some deformation on the surface due to vaporization inside the
package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the
board, the input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will
withstand an erroneous connection of up to 36V on the analog inputs, even when the board is powered off,
but not on all boards, and not under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an
analog output will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, onmost Diamond Systems boards
connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage
beyond this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage
could extend to other chips in the circuit.
IMPORTANT! Always check twice before Powering Up!

Jasper User Manual V1.2 www.diamondsystems.com Page 6
2 INTRODUCTION
2.1 Jasper Product Overview
This Product is a COM Express Compact/Basic type 6 carrier board with PCIe104. The carrier is designedto support
a variety of COM Express modules to provide both rapid product line expansion with a variety of processors and
long life by enabling simple replacement of the COM when the designed-in one becomes obsolete.
The COM Express module mounts on the bottom side of the board, and the PCIe104 expansion sockets are on the
top side. The board dimensions are 4.000” x 5.750”, matching the 3.5 inch form factor in size and mounting hole
pattern. The larger size is necessitated due to the incompatibility between the mounting hole patterns of the two
form factors plus the desire to provide increased PCB coastline for I/O connectors.
A thicker PCB (.090” / 2.3mm), latching I/O connectors, and full -40/+85C operating temperature provide increased
ruggedness, enabling the board to work reliably in mobile and harsh environment applications.
A special feature of Jasper is that most I/O connectors are located along the front edge. This makes it possible to
design and build I/O boards that mate directly to Jasper without the use of cables, to reduce size and increase
ruggedness for rugged systems applications.

Jasper User Manual V1.2 www.diamondsystems.com Page 7
Feature Description and Connector Type
Feature
Description
Connector Type
Power
18V-36V wide input or 12V fixed supply
Signal Terminated to 8 Position Vertical
Connector Header (J16)
RTC
3V power input for RTC functionality
Signal Terminated to 2 Position Vertical
Connector Header (J18)
Ethernet
ETH-1 10/100/1000Mbps from COM module
Signal Terminated to 10 Position RA
Connector Header (J23)
ETH-2 10/100/1000Mbps via I210 Ethernet
controller
Signal Terminated to 10 Position RA
Connector Header (J24)
Mass Storage
2 PCIe minicard socket with USB and SATA
Minicard2 supports Nano SIM interface
2 PCIe MiniCard 52 Position (J11 & J12)
1 M.2 2242 / 2280 SATA/x1 PCIe
M.2 Socket (J15)
1 Standard 7pin SATA connector
SATA Connector (J9)
Audio
HDA to Analog Audio converter
Signal Terminated to 10 Position Vertical
Connector Header (J3)
USB
2x USB 2.0
Signal Terminated to 10 Position RA
Connector Header (J25)
3x USB3.0 / USB2.0
Signal Terminated to 10 Position
Connector Header (J20, J21, J14)
Serial Ports
4 ports Software configurable RS-232/422/485
through SP336 transceivers or 2 RS232 only
Signal Terminated to 10 Position RA
Connector Header (J19, J26)
Display
2x HDMI
Signal Terminated to 20 Position
Connector Header (J17, J22)
1x VGA (Based on the COMe module)
Signal Terminated to 10 Position RA
Connector Header (J2)
1x Dual Channel 24-bit LVDS port with 3.3V / 5V
power option
Signal Terminated to 30 Position RA
Connector Header (J4)
LCD Backlight
LCD backlight power and control signals with 5V /
12V power option
Surface Mount 6 Position Connector
Receptacle (J29)
Analog/Digital IO
16 Single ended/ 8 Differential ended Ain
4 Aout
22 Programmable direction digital I/O, 3.3V/5V
logic compatible
Analog Signal Terminated to 30 Position
Vertical Connector Header (J6)
DIO Signal Terminated to 20 Position
Vertical Connector Header (J13)
PCIe104
4 PCIe x1 ports, 1x PCIe x16
Signal Terminated to 156 Position Vertical
Connector Header (J1)
Others
4 GPI, 4 GPO, I2C, Reset Button, Power Button
…………………………………………………
Operating System Support
Windows 10; Ubuntu; Linux
Mechanical, Electrical and Environmental Properties
Form-Factor
4.000” x 5.750”
Cooling Mechanism
Conduction cooling with bottom side heat spreader (target heat spreader height 13mm as per
COM express specification)
Power Input Range
18V-36V wide range input or Fixed 12V +/-10% supply
Operating
Temperature Range
-40°C to +85°C ambient (final system capability depends on the COM installed)

Jasper User Manual V1.2 www.diamondsystems.com Page 8
2.2 Baseboard Variants
Feature
Baseline
JSP-BB01D
Full-Feature
JSP-BB02D
Full Feature w/ DAQ
JSP-BB03A
Gigabit Ethernet
1
2
2
Minicard socket
2
2
2
M.2 socket
1
1
1
SATA connector
1
1
1
HDMI
2
2
2
VGA*
1
1
1
LVDS
1
1
1
USB 3.0
3
3
3
USB 2.0
2
2
2
Serial
2x RS-232
4x RS-232/422/485
(Jumper for protocol
selection)
4x RS-232/422/485
(SW control for
protocol selection)
PCIe104
No
Yes
Yes
Audio
No
1
1
Analog/Digital
IO
No
No
16 SI/8 DE Ain
4 Aout
22 DIO
Others
4 GPI, 4 GPO
I2C
Reset & Power Button
4 GPI, 4 GPO
I2C,1x RS232
Reset & Power Button
4 GPI, 4 GPO
I2C, 1x RS232
Reset & Power Button
2.3 Jasper Ordering Guide
The table below lists the available standard configurations for the carrier board. As the board can work with
multiple COMs, new COMs are tested and added regularly, so check the Diamond website for currently available
SBC processor options. In general when a new COM is added, OS support will also be available for the current
versions of Windows and Ubuntu Linux.
JSP-BB01D
Jasper COM Carrier, low cost model, 18-36VDC In
JSP-BB02D
Jasper COM Carrier, PCIe/104 expansion, Digital I/O, 18-36VDC In
JSP-BB03A
Jasper COM Carrier, PCIe/104 and Data Acquisition, 18-36VDC In
6882210
Mounting Plate for Jasper Carrier (included with the carrier board)

Jasper User Manual V1.2 www.diamondsystems.com Page 9
2.4 Product Photos
Figure 2-1: COM module installation side (Bottom)
Figure 2-2: I/O expansion side

Jasper User Manual V1.2 www.diamondsystems.com Page 10
Figure 2-3: Side view showing COM Express module and heat spreader
Figure 2-4: Bottom view showing Basic size COM heat spreader nested in mounting plate