Diamond Systems Ziggy User manual

Ziggy User Manual Rev 1.0 www.diamondsystems.com Page 1
Ziggy Baseboard
NVIDIA Jetson TX2 Base Board
Copyright 2019
FOR TECHNICAL SUPPORT Diamond Systems Corporation
PLEASE CONTACT: 555 Ellis Street
Mountain View, CA 94043 USA
[e-mail] Tel [phone]
Fax [phone]
www.diamondsystems.com
Revision
Date
Comment
1.00
07/16/2019
Initial Release

Ziggy User Manual Rev 1.0 www.diamondsystems.com Page 2
CONTENTS
1. Important Safe Handling Information .............................................................................................................3
2. Introduction.......................................................................................................................................................5
2.1 Features................................................................................................................................................5
2.2 Operating System Support....................................................................................................................5
2.3 Mechanical, Electrical, Environmental..................................................................................................6
3. Functional Block Diagram ...............................................................................................................................7
3.1 Feature Descriptions.............................................................................................................................8
3.1.1 Processor Module.............................................................................................................................8
3.1.2 Backup Battery .................................................................................................................................8
3.1.3 Ethernet............................................................................................................................................8
3.1.4 Display..............................................................................................................................................8
3.1.5 Camera.............................................................................................................................................8
3.1.6 USB ..................................................................................................................................................8
3.1.7 Audio.................................................................................................................................................8
3.1.8 Micro SD...........................................................................................................................................8
3.1.9 Serial Ports.......................................................................................................................................8
3.1.10 DAQ..............................................................................................................................................8
3.1.11 Connectivity..................................................................................................................................9
3.1.12 LED Indicators..............................................................................................................................9
3.1.13 Power Supply............................................................................................................................ 10
4. Mechanical Board Drawing........................................................................................................................... 10
5. Board Layout (Connector and Jumper Locations)..................................................................................... 11
6. I/O Connectors ............................................................................................................................................... 13
6.1 Connector Pin-out and Signal Description......................................................................................... 13
6.1.1 Utility (J1)....................................................................................................................................... 13
6.1.2 External Battery (J2)...................................................................................................................... 13
6.1.3 Camera (J3)................................................................................................................................... 14
6.1.4 DAQ I/O (J4).................................................................................................................................. 15
6.1.5 SAM Programming Header (J5).................................................................................................... 15
6.1.6 Fan Connector (J6)........................................................................................................................ 15
6.1.7 HDMI (J7) ...................................................................................................................................... 16
6.1.8 Ethernet (J8).................................................................................................................................. 16
6.1.9 USB 3.0 Ports (J9)......................................................................................................................... 16
6.1.10 Power In (J10)........................................................................................................................... 16
6.1.11 Serial Ports (J11)....................................................................................................................... 17
6.1.12 Micro SD (J13) .......................................................................................................................... 17
6.1.13 USB 2.0 OTG (J14)................................................................................................................... 17
6.2 List of Connectors.............................................................................................................................. 18
7. I/O Cables ....................................................................................................................................................... 19
8. Getting Started............................................................................................................................................... 20
8.1 Development Kit................................................................................................................................. 20
8.2 Quick Setup ....................................................................................................................................... 20
9. INSTALLING DSC IMAGE in module............................................................................................................ 21
10. DAQ................................................................................................................................................................. 23
11. Thermal Solutions.......................................................................................................................................... 24
12. Specifications................................................................................................................................................. 25

Ziggy User Manual Rev 1.0 www.diamondsystems.com Page 3
1. IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear appropriate
ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
The Venus SBC contains a high number of I/O connectors with connection to sensitive electronic
components. This creates many opportunities for accidental damage during handling, installation and
connection to other equipment. The list here describes common causes of failure found on boards returned to
Diamond Systems for repair. This information is provided as a source of advice to help you prevent damaging
your Diamond (or any vendor’s) embedded computer boards.
ESD damage –This type of damage is usually almost impossible to detect, because there is no visual sign of
failure or damage. The symptom is that the board eventually simply stops working, because some component
becomes defective. Usually the failure can be identified and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage during handling or storage –On some boards we have noticed physical damage from
mishandling. A common observation is that a screwdriver slipped while installing the board, causing a gouge
in the PCB surface and cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on what is near the corner. Most of our boards are designed
with at least 25 mils clearance between the board edge and any component pad, and ground / power planes
are at least 20 mils from the edge to avoid possible shorting from this type of damage. However these design
rules are not sufficient to prevent damage in all situations.
A third cause of failure is when a metal screwdriver tip slips, or a screw drops onto the board while it is
powered on, causing a short between a power pin and a signal pin on a component. This can cause
overvoltage / power supply problems described below. To avoid this type of failure, only perform assembly
operations when the system is powered off.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. However our boards are generally very dense, and if the board has components very
close to the board edge, they can be damaged or even knocked off the board when the board tilts back in the
rack. Diamond recommends that all our boards be stored only in individual ESD-safe packaging. If multiple
boards are stored together, they should be contained in bins with dividers between boards. Do not pile boards
on top of each other or cram too many boards into a small location. This can cause damage to connector pins
or fragile components.
Power supply wired backwards –Our power supplies and boards are not designed to withstand a reverse
power supply connection. This will destroy each IC that is connected to the power supply (i.e. almost all ICs).
In this case the board will most likely will be unrepairable and must be replaced. A chip destroyed by reverse
power or by excessive power will often have a visible hole on the top or show some deformation on the top
surface due to vaporization inside the package. Check twice before applying power!
Board not installed properly in PC/104 stack –A common error is to install a PC/104 board accidentally
shifted by 1 row or 1 column. If the board is installed incorrectly, it is possible for power and ground signals on
the bus to make contact with the wrong pins on the board, which can damage the board. For example, this
can damage components attached to the data bus, because it puts the 12V power supply lines directly on
data bus lines.

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Overvoltage on analog input –If a voltage applied to an analog input exceeds the design specification of
the board, the input multiplexor and/or parts behind it can be damaged. Most of our boards will withstand an
erroneous connection of up to 35V on the analog inputs, even when the board is powered off, but not all
boards, and not in all conditions.
Overvoltage on analog output –If an analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most of our boards, a short circuit to ground on an
analog output will not cause trouble.
Overvoltage on digital I/O line –If a digital I/O signal is connected to a voltage above the maximum
specified voltage, the digital circuitry can be damaged. On most of our boards the acceptable range of
voltages connected to digital I/O signals is 0-5V, and they can withstand about 0.5V beyond that (-0.5 to 5.5V)
before being damaged. However logic signals at 12V and even 24V are common, and if one of these is
connected to a 5V logic chip, the chip will be damaged, and the damage could even extend past that chip to
others in the circuit.
Bent connector pins –This type of problem is often only a cosmetic issue and is easily fixed by bending the
pins back to their proper shape one at a time with needle-nose pliers. The most common cause of bent
connector pins is when a PC/104 board is pulled off the stack by rocking it back and forth left to right, from
one end of the connector to the other. As the board is rocked back and forth it pulls out suddenly, and the pins
at the end get bent significantly. The same situation can occur when pulling a ribbon cable off of a pin header.
If the pins are bent too severely, bending them back can cause them to weaken unacceptably or even break,
and the connector must be replaced.

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2. INTRODUCTION
This product is a Jetson TX2 module-based board with rich graphics and camera input capability. This base board
converts Jetson TX2 module into a complete embedded system by providing interface circuitry, I/O connectors for
all the major features of the module, camera interface, power supply and additional I/O capability.
Ziggy TX2 Base Board redefines possibility; a combination of performance, power efficiency, integrated deep
learning capabilities and rich I/O remove the barriers to a new generation of products
The base board also contains a Micro SD card for storage option with all key I/O connectors placed along one
edge for cable-free installation.
2.1 Features
Module NVIDIA Jetson TX2
SoC Parker Series SoC
GPU NVIDIA Pascal™, 256 CUDA cores
CPU HMP Dual Denver 2/2MB L2 + Quad ARM A57/2MB L2
VIDEO 4K x 2K 60Hz Encode (HEVC)
4K x 2K 60Hz Decode (12-Bit Support)
MEMORY 8 GB 128-Bit LPDDR4
4K x 2K 60Hz Encode (HEVC)
4K x 2K 60Hz Decode (12-Bit Support)
58.2 GB/s (51.2 GB/s TX2i)
Memory 1x microSD slot
Connectivity 1 10/100/100 Mbps directly from module
USB 2 USB 3.0 ports to standard header
1x USB micro with OTG support
HDMI HDMI 2.0a/b directly from processor
Serial ports 2 ports with RS-232 capability
DAQ 13 digital IO
6x ADC Input
2x DAC Output
Utility 1x I2C, 1xUART, 1x SPI, Reset
2.2 Operating System Support
Linux Kernel version 4.4.38, Ubuntu 16.04 aarch64

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2.3 Mechanical, Electrical, Environmental
Form factor 3.43” x 1.97” (87mm x 50mm)
Cooling Conduction cooling, heat spreader
Power +9V /+5.5V to +18VDC; +12V Typical
Operating Temp -40°C to +85°C at outer surface of heat spreader
Environmental Designed to meet the following conditions:
Shock: MIL-STD-202G, Method 213-B, Table 213-1 Condition A, 50G / 11ms half sine, non-
operational
Vibration: MIL-STD-202G, Method 214A, Table 214-1, Condition D, 11.95G random vibration, 15
minutes per axis, operational

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3. FUNCTIONAL BLOCK DIAGRAM
Ziggy Base Board Block Diagram
V1.3
Jetson
TX2/TX2i
400pin
Connector
VIN (5.5-18V) TX2
VIN (9-18V) TX2i
Power Supply
13x DIO (3.3V)
6 ADC (3.3V)
2 DAC (3.3V)
SAM MCU
Gb Ethernet
Magnetics
HDMI 2.0
1x Camera
SD Micro SD
2x USB2.0
2x USB3.0
Utility Con
2x RS-232
Transceiver
2x UART
I2C, UART,SPI, PWR_BTN, RST
USB3.0
USB2.0
CSI 2x4 Lane
HDMI
GBE
I2C/SPI
Figure 1 Functional Block Diagram

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3.1 Feature Descriptions
This section describes the key subsystems of Ziggy.
3.1.1 Processor Module
The baseboard supports Jetson TX2 / TX2i modules. Jetson TX2 is the fastest, most power-efficient embedded AI
computing device. The latest addition to the industry-leading Jetson embedded platform, this 7.5-watt
supercomputer on a module brings true AI computing at the edge. It's built around an NVIDIA Pascal™-family
GPU and loaded with 8 GB of memory and 59.7 GB/s of memory bandwidth. It features a variety of standard
hardware interfaces that make it easy to integrate it into a wide range of products and form factors.
3.1.2 Backup Battery
A 2x1 input connector is provided for connecting the external backup battery.
3.1.3 Ethernet
The board provide one 10/100/1000 Ethernet port directly from the module The MDIx signals from the module are
terminated to standard RJ45 connector with integrated magnetics.
LEDs for Link, Activity, and Speed Indication are available on RJ45 jack
3.1.4 Display
Ziggy offers HDMI2.0 a/b video output. The HDMI port is directly from the processor and is made available on a
standard HDMI header. Integrated audio support is provided along with HDMI display.
3.1.5 Camera
The board supports one MIPI CSI x2 camera interface through 30pin I-PEX connector. Supporting signals like I2C
and control signals are available through connector so that user can directly interface the camera to the board.
3.1.6 USB
2x USB3.0 (with USB2.0) ports are available from the Jetson module. These ports are available on the standard
USB3.0 connector on the Ziggy. Note that only bottom port on the dual USB3.0 connector supports USB3.0 due
to the current software mapping.
1 x USB2.0 from the module is interfaced to micro USB with OTG support
3.1.7 Audio
Audio interface is integrated with HDMI interface. No separate audio analog outputs are provided.
3.1.8 Micro SD
The board offers one micro SD connector with 4-bit data 3.3V for an additional low-cost storage option
3.1.9 Serial Ports
The board provides 2 serial ports from the module.
Two serial ports are available on 2x5 header through MAX3232 transceiver with RS232 protocol support.
Jumpers for Termination Control circuit is incorporated to enable termination resistor (120 Ohm) for RS422 and
3.1.10 DAQ
The board has a SAM microcontroller, through which 13 Digital I/O signals, 6 Analog Inputs and 2 DAC output are
made available through 2x13 header. All the IOs are 3.3V level.

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SAM microcontroller is interfaced to the Jetson Module via SPI interface. An EEPROM is connected to the
controller for storing the calibration values of ADC/DAC.
3.1.11 Connectivity
Jetson module supports WLAN/Bluetooth integrated with Male I-PEX antenna connectors for WLAN/ BT are
located on the module.
WLAN:
2x2 MIMO
802.11ac compliant (backwards compatible with legacy 802.11b/g/a/n devices)
Bluetooth:
Bluetooth 4.1 ready (can connect to Bluetooth 4.1 enabled devices)
HIDP
Audio –A2DP (advanced audio distribution profile)
RFKILL
The board supports socket for plugging the Skywire LTE CAT1 module from NimbeLink. 2x10 socket is provided
on the board with USB and UART to support the LTE module.
3.1.12 LED Indicators
The board provides the following LED indicators. All LEDs are located near to board edge or their respective
features. All LEDs are labeled in silkscreen with their function.
Power In: Green LED for Power IN
Power Good Green LED for Power Good indication.
Host LED Green LED to indicate Module is booted successfully
Ethernet: Green LED for Link, activity, and speed for each port
User LED Green LED for DAQ activity

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3.1.13 Power Supply
Ziggy supports wide range +9VDC to 18VDC. Typical input voltage is +12VDC
All required supply voltages for the board are derived from the input. These power supplies are sized to support
the highest capacity of the module plus have enough reserve capacity to support the below add-on features:
12V 5V 3.3V Feature
1.6A Jetson TX2/TX2i Module
1A USB Ports
0.1A 0.1A Camera circuit
4. MECHANICAL BOARD DRAWING
Figure 2: Mechanical Board Drawing