Diamond Systems OSBOURNE User manual

OSBOURNE
Carrier for NVIDIA®AGX ORIN Module
User Manual
Revision No
Release Date
Comments
0.21
12/05/2022
Initial Release
© Copyright 2022
Diamond Systems Corporation
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [e-mail]

Osbourne User Manual V0.21 www.diamondsystems.com Page 2
Contents
1Important Safe Handling Information ............................................................................................................ 4
2Introduction...................................................................................................................................................... 6
2.1 Osbourne Product Overview ........................................................................................................................ 6
2.2 Osbourne Ordering Guide............................................................................................................................ 7
2.3 Product Photos............................................................................................................................................. 8
2.4 AGX Orin Modules Overview........................................................................................................................ 9
3Functional Overview...................................................................................................................................... 10
3.1 Processor Modules..................................................................................................................................... 10
3.2 Power Supply Specifications...................................................................................................................... 10
3.3 Backup Battery ........................................................................................................................................... 10
3.4 Ethernet Ports............................................................................................................................................. 10
3.5 Display Controller ....................................................................................................................................... 11
3.6 Camera Serial Interface (CSI).................................................................................................................... 11
3.7 Audio Interface............................................................................................................................................ 11
3.8 Serial Ports................................................................................................................................................. 11
3.9 PCIe/USB 3.2/UFS Link Routing Controllers ............................................................................................. 11
3.9.1 PCIe Minicard Socket............................................................................................................................................11
3.9.2 USB........................................................................................................................................................................11
3.9.3 PCIe M.2 M-Key Socket.........................................................................................................................................11
3.9.4 M.2 E-Key Socket...................................................................................................................................................12
3.9.5 PCIe x16 Connector...............................................................................................................................................12
3.10 Digital I/O.................................................................................................................................................... 12
3.11 CAN............................................................................................................................................................ 12
3.12 Utility........................................................................................................................................................... 12
3.13 LED Indicators............................................................................................................................................ 12
4Functional Block Diagram ............................................................................................................................ 13
4.1 Baseboard Block Diagram.......................................................................................................................... 13
4.2 AGX Orin Series Module Block Diagram.................................................................................................... 14
5Mechanical Drawing ...................................................................................................................................... 15
6Connector and Jumper Location ................................................................................................................. 17
6.1 Jumper Selection........................................................................................................................................ 17
6.1.1 Serial Port Termination Jumper Selection.............................................................................................................17
6.1.2 DIO Jumper Selection............................................................................................................................................17
6.1.3 Configuration Jumper Selection ............................................................................................................................17
7Connector Pinout Specifications................................................................................................................. 18
7.1 Main I/O Connector .................................................................................................................................... 18
7.2 Camera (J8)................................................................................................................................................ 21
1.1 PCIe Mini Card Socket 1 (J12)................................................................................................................... 23
1.2 PCIe Mini Card Socket 2 (J13)................................................................................................................... 24
1.3 PCIe Connector (J5)................................................................................................................................... 25
1.4 M.2 M-Key PCIe SSD Socket (J3).............................................................................................................. 27
1.5 M.2 E-Key Socket (J7)................................................................................................................................ 28
1.6 RGMII Adapter Connector (J9)................................................................................................................... 29
1.7 Auxiliary Power In (J14).............................................................................................................................. 30
1.8 Fan Connector (J2)..................................................................................................................................... 30
1.9 Auxiliary Power Out (J6)............................................................................................................................. 30
1.10 MCU Programming Header (J10)............................................................................................................... 30
7.3 Jetson Orin B2B Connector Interface......................................................................................................... 31
8I/O Connector List.......................................................................................................................................... 33
9B2B Connectors............................................................................................................................................. 34

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9.1 B2B I/O Board Connectivity........................................................................................................................ 34
9.1.1 Block Diagram for I/O Connector.........................................................................................................................34
9.1.2 Mechanical Drawings For I/O Connector.............................................................................................................35
9.2 B2B 1G Ethernet Board Connector............................................................................................................ 36
9.2.1 Mechanical Drawing .............................................................................................................................................36
10 Specifications................................................................................................................................................. 37
11 Limited Warranty............................................................................................................................................ 38

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1 IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-
sensitive. This increases the likelihood of the boards incurring accidental damage during handling, installation,
and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in
sequential order:
•Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
•Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
•Unpack components and remove them from their anti-static bags only when they are ready to be
used.
•Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
•Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure
or damage. In this type of damage, the board eventually stops functioning because of some defective
components. Usually, the failure can be identified, and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB
surface, cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The
ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type
of damage. However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards.
Do not pile boards on top of each other or cram too many boards within a small location. This can cause
damage to connector pins or fragile components.

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Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape
using needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, in an effort to release it off the stack. Tugging the board off the
stack in this manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the
board. Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board
while it is powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to
withstand a reverse power supply connection. This will destroy almost all ICs connected to the power supply.
In this case, the board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive
power will often have a visible hole or show some deformation on the surface due to vaporization inside the
package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the
board, the input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will
withstand an erroneous connection of up to 36V on the analog inputs, even when the board is powered off,
but not on all boards, and not under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an
analog output will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, onmost Diamond Systems boards
connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage
beyond this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage
could extend to other chips in the circuit.
IMPORTANT! Always check twice before Powering Up!

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2 INTRODUCTION
2.1 Osbourne Product Overview
Osbourne is a Jetson AGX Orin module-based board with rich graphics and camera input capability. Osbourne
board converts Jetson AGX Orin module into a complete embedded system by providing interface circuitry, I/O
connector for all the major features of the module, camera interface, power supply and additional I/O capability.
Osbourne Base Board Bring your next-gen products to life with the world’s most powerful AI computer for energy-
efficient autonomous machines. The modules deliver up to 275 TOPS of AI performance with power configurable
between 15W and 60W. Jetson Orin modules provide the ideal solution for a new age of Robotics.
The baseboard is the latest product from Diamond Systems to integrate the newly released Standalone NVIDIA
AGX Orin System on Module (SoM) Series:
•AGX Orin 32GB
•AGX Orin 64 GB
Feature Description and Connector Type
Feature
Description
Connector Type
Power
7V-20V wide input supply
Signal Terminated to 150
Position RA Connector
Header (J4)
RTC
3V power input for RTC functionality
Signal Terminated to 150
Position RA Connector
Header (J4)
Ethernet
1G/2.5G/5G/10G Multi Mode Gigabit Ethernet without on
board Magnetics
Signal Terminated to 150
Position RA Connector
Header (J4)
10/100/1000Mbps through RGMII adapter board without
on board Magnetics
Mass Storage
2x mPCIe socket
PCIe MiniCard 52 Position
(52-Pin-Surface Mount,
Right Angle)
1 M.2 M Key (2280 or 2242) (NVMe) expansion slots (4
lane PCIe Gen 3)
M.2 (Key M) Socket
1 M.2 E key 2230
67 Position Female M.2
Connector (Surface Mount,
Right Angle)
Audio
Via ALC5640 CODEC
Signal Terminated to 150
Position RA Connector
Header (J4)
USB
4x USB 2.0, 3x USB 3.2
Signal Terminated to 150
Position RA Connector
Header (J4)
Serial Ports
2 x ports Software configurable RS-232/422/485 through
SP336 transceivers with bypass option to access TTL
signals
Signal Terminated to 150
Position RA Connector
Header (J4)
2x ports fixed RS-232 through SP3243 transceivers with
bypass option to access TTL signals
Signal Terminated to 150
Position RA Connector
Header (J4)
Display
1x HDMI 2.0a/b directly from the Module
Signal Terminated to 150
Position RA Connector
Header (J4)
Camera
4 x4 / 8 x2 lane CSI-2 Camera Interface
Surface Mount 120 Position
Connector Receptacle

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Digital I/Os
8 Digital IO via I2C to GPIO
Signal Terminated to 150
Position RA Connector
Header (J4)
CAN
2x CAN with Non isolated transceivers
Signal Terminated to 150
Position RA Connector
Header (J4)
Fan
Active Thermal Solution with PWM & Tach Input
Connector Header Surface
Mount 1x4 position
Utility
PWR_BTN, RESET, FORCE RECOVERY, I2C(3.3V),
SPI(3.3V)
Signal Terminated to 150
Position RA Connector
Header (J4)
Operating System Support
Linux Kernel version
4.4.38; U
buntu 20.04
Mechanical, Electrical and Environmental Properties
Form-Factor
120mm x 115mm
Cooling Mechanism
Conduction Cooling
Power Input Range
+7 to +20VDC, +18V Typical
Operating Temperature
Range
-25°C to +80°C at Thermal Transfer Plate (TTP) surface of
Orin Module
2.2 Osbourne Ordering Guide
The table below lists the current and planned part numbers in the Osbourne product family.
OSB-ASY-0131-E1F1
Osbourne system / development kit, includes OSB-BB01
baseboard, AGX Orin 32GB module, OSB-PNL01 commercial I/O
adapter, ACC-ETHRGM1 2nd Ethernet PHY, ACC-HSSTV-01 fan
sink, Linux OS installed into Orin module, fully assembled and
tested
OSB-PNL01
Osbourne commercial I/O adapter, Jumper port configuration
OSB-PNL02
Osbourne commercial I/O adapter, fixed port configuration (MOQ)
ACC-ETHRGM1
RGMII Ethernet PHY adapter module
ACC-HSSTV-01
Heat Sink Kit with Fan for AGX Xavier / Orin

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2.3 Product Photos
Orin module installation side
I/O expansion side

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2.4 AGX Orin Modules Overview
Measuring 100mm x 87mm module, Bring your next-gen products to life with the world’s most powerful AI
computer for energy-efficient autonomous machines. Up to 8X the performance of the last generation, 275 TOPS
for multiple concurrent AI inference pipelines, and high-speed interface support for multiple sensors make this the
ideal solution for applications from manufacturing and logistics to retail and healthcare.
AGX Orin Series Feature Description
Feature
Description
AGX Orin 32GB
AGX Orin 64GB
GPU
1792-core NVIDIA Ampere architecture
GPU with 56 Tensor Cores
2048-core NVIDIA Ampere architecture
GPU with 64 Tensor Cores
AI Performance
200 TOPS
275 TOPS
GPU Max
Frequency
939 MHz
1.3 GHz
CPU
8-core Arm®Cortex®-A78AE v8.2 64-bit
CPU
2MB L2 + 4MB L3
12-core Arm®Cortex®-A78AE v8.2 64-bit
CPU
3MB L2 + 6MB L3
CPU Max Frequency
2.2 GHz
2.2 GHz
Memory
32GB 256-bit LPDDR5
204.8GB/s
64GB 256-bit LPDDR5
204.8GB/s
Video Encode
1x 4K60 (H.265)
3x 4K30 (H.265)
6x 1080p60 (H.265)
12x 1080p30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
8x 1080p60 (H.265)
16x 1080p30 (H.265)
Video Decode
1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265)
22x 1080p30 (H.265)
Power
15W - 40W
15W - 60W
Networking
1x GbE
1x 10GbE
Storage
64GB eMMC 5.1
DL Accelerator
2x NVDLA v2
DLA Max Frequency
1.4 GHz
Vision Accelerator
1x PVA v2
Camera
Up to 6 cameras (16 via virtual channels*)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
USB
3x USB 3.2 Gen2 (10 Gbps)
4x USB 2.0
Display
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Other I/O
4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs
PCIe
Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)
Mechanical
100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate

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3 FUNCTIONAL OVERVIEW
The following section provides functional details of the key sub-systems implemented on the baseboard.
3.1 Processor Modules
The baseboard supports Jetson™AGX Orin Series modules.
Jetson AGX Orin module with up to 275 TOPS and 8X the performance of the last generation for multiple
concurrent AI inference pipelines, plus high-speed interface support for multiple sensors, Jetson Orin modules
provide the ideal solution for a new age of Robotics. 4nos of M3 4mm standoffs are provided on the module side
for fixing the AGX Orin module.
3.2 Power Supply Specifications
The board can be powered from wide input voltage range of +7V to +20V, typically 18V. Supply input should be
greater than 15 V if PCIe x16 card is being used.
Maximum allowable reflected ripple, measured at the voltage input connector is 50mV p-p.
All required supply voltages for the board derived from the +(7Vto 20V) input. These power supplies are sized to
support the highest capacity on-board memory and have enough reserve capacity to support the below add-on
features.
Power Requirements for Supplementary Features
VIN
12 V
5V
3.3V
Feature
5.4A
6A
Jetson Orin Module (50W)
1.5A
2.6A
1A
M.2 2280 SSD
Minicard (1.3A per Module)
M.2 E key
3A
1A
USB3.2 Ports (1A per Port)
USB2.0 Ports (0.5A per Port)
0.5A
0.5A
Camera circuit
4A
2A
X16 PCIe
3.3 Backup Battery
An onboard 2032 vertical coin battery holder is provided. The board can boot and function normally without abackup
battery as well. The backup voltage signal is also connected to IO connector to connect external backup battery for
rugged application. RTC of Orin module backup voltage of 3V with 1.8V to 3.46V max is required.
3.4 Ethernet Ports
The board offers Two ethernet port one supports 1G and other supports the 10G ethernet speed.
10G Ethernet port derived using MGBE interface from Orin module using 10G ethernet PHY. Onboard magnetics
are NOT provided. LED signals provided for Link, Activity, and Speed Indication
The 10/100/1000 Ethernet port is implemented from the RGMII adapter board. Onboard magnetics are NOT
provided. LED signals are provided for Link, Activity, and Speed Indication.

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3.5 Display Controller
The board offers one HDMI/DP video output option. The HDMI/DP port is directly from the Module and made
available on the I/O connector board connector. All the common choke and ESD protection circuitry are provided
on the baseboard. I2C level shifting, and load switch need to be on the IO board.
3.6 Camera Serial Interface (CSI)
Osbourne baseboard includes a 120-pin (2 × 60, 0.5 mm pitch) camera expansion connector matching exactly to
the Development kit connector. The connector used on the board is a Samtec QSH-060-01-H-D-A. The mating
connector is a Samtec QTH-060-0x-H-D-A (x is for the height). The expansion connector includes interface
options for multiple CSI DPHY or CPHY cameras. Refer to the Jetson AGX Orin Camera Module Hardware
Design Guide for more information.
CSI up to 4 × 4 lane or 6 × 2 lane
CAM_I2C, Clock and Control GPIOs for the cameras
I2C (2x in addition to CAM_I2C)
Off the shelf add-on board from E-con systems or other vendors could be plugged on to the DB connector to
support the 4x 4 lane camera or 6 dual lane cameras OR customer can develop their own daughterboard based
on the requirement.
Refer to Section Camera Installation Procedures of the Addendum for installation and operation procedures.
3.7 Audio Interface
The design provides audio support from a ALC5640audio chip. Audio I/O signals include stereo line out and
mono/stereo mic in. The audio signals made available on the I/O connector board connector.
3.8 Serial Ports
The board supports up to 4 serial ports from the module. Two numbers of RS232/422/485 ports are derived using
single SP336 transceiver. Software control for protocols selection via GPIOs provided. On board jumper option
provided to select termination (120 Ohm) for RS232/RS422/RS485 protocols.
Another Two fixed RS232 protocol ports are derived using MAX3243EIPW transceiver. Option to bypass the
serial transceiver are supported.
3.9 PCIe/USB 3.2/UFS Link Routing Controllers
The Orin module facilitates multiple high-speed interfaces brought out on the module in two different configurations.
The table below shows the mapping of USB3.2/PCIe on Osbourne board. Maximum 3 PCIe ports are supported in
Configuration #1. For more information on configuration selection refer Configuration Jumper Selection section.
3.9.1 PCIe Minicard Socket
The board support one full-size modules minicard sockets in Configuration #1 and two full-size modules minicard
sockets in configuration #2. Two threaded spacers each are mounted on the board for installing full-size modules.
Both the mPCIe sockets derives the USB2.0 interface from a USB2.0 Hub.
Micro sim connector is supported for one of the minicard socket. Board provides 2nos onboard M2 4mm standoff
to mount each minicard module. Single M2 3.55mm provided on the opposite of the module to act as a nut for half
size minicard.
3.9.2 USB
The board supports 1x USB2.0 via USB 2.0 hub routed to I/O connector. Three numbers of USB3.2 and three
USB2.0 ports are also routed to the I/O connector. USB power switch, common choke and ESD protection
circuitry are provided on the baseboard. One of the USB ports is shared with the PCIe for configuration #2.
3.9.3 PCIe M.2 M-Key Socket

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The board offers M.2 PCIe based SSD module socket. x4 PCIe lanes from the AGX Orin module is routed to the
M.2 M-Key socket. The board supports two module sizes: 2280 & 2242. Onboard M3 4 mm standoff to mount M.2
2280 SSD provided.M3 2mm standoff provided on the opposite of the module to act as nut for 2242 size M.2 M
key modules.
3.9.4 M.2 E-Key Socket
An M.2 2230 E-key socket is provided. E key socket supports x1Lane PCIe interface. PCIe port is shared with
SDIO, USB2.0 and I2S interface by default. Three pad option for UART shared with serial port transceiver is
supported. Onboard M3 2 mm standoff to mount M.2 E Key 2230 module is provided.
3.9.5 PCIe x16 Connector
A standard PCIe x16 RA connector is provided on the baseboard to support x8 PCIe interface. This port is shared
with the one of the minicard socket and can be selected based on Jumper JP3. For more detail on Jumper
selection Refer Configuration Jumper Selection Section.
3.10 Digital I/O
The board provides 8x digital I/O’s, which are individually configurable as an output or input. Digital I/Os are
realized using an I2C GPIO expander. The expander device is accessible on the I2C address 0x22.The I/Os are
routed to the I/O connector. On board ESD protection is provided.
Provision is to select the DIO Voltage level of 3.3/5V and configure Pull up and pull down though the Jumper JP2
is provided. Refer DIO Jumper Selection for more detail.
3.11 CAN
The board provides two CAN interface from the AGX Orin module to the I/O connector. MCP2551T-I/SN can
transceiver is used with baud rates from 60 kbaud up to 1 Mbaud.
3.12 Utility
Power button, Force recovery, Reset SPI and I2C signals are connected to the I/O connector for additional I/O
expansion when required.
3.13 LED Indicators
The board provides the following LED indicators. All LEDs are located near to board edge or their respective
features. All LEDs are labeled in silkscreen with their function
Position
Description
PWRIN
Green LED for Power IN
PWRON
Green LED for Power Good indication.
BOOT
Green LED for successful system boot

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4 FUNCTIONAL BLOCK DIAGRAM
4.1 Baseboard Block Diagram
The following Block Diagram illustrates the key functional blocks of the baseboard with integrated NVIDIA AGX
Orin Series Module.
Osbourne Block Diagram
Jetson AGX Orin
R0p21
Level
Shifter
UART 1
S
o
C
HDMI_DP2_TXx
USB2.0 Port 0
UPHY0 Lane 1
USB2.0 Port 1
UPHY0 Lane 2
UPHY2 Lane 4
(MGBE C0)
XFI0 MDC/MDIO
10GbE
PHY
M.2, Key E Socket
Wi-Fi Data IF
BT Audio
BT IF
Power
Regs
Camera
Expansion
Connector
Misc Control
Camera
LPDDR5
eMMC 5.1
M.2, Key M Socket
NVME
Misc Control IF
I/O connector board connector
USB2.0
Hub
USB3.2 (P2)
USB3.2 (P1)
MGBE Port 0
FAN Control
Minicard
Socket 2
Secure SPI NOR
Thermal Sensor
I2S1
I2C1
CAN 0
CAN 1
GPIO
Exp
8x DIO
CAN
TXR
Audio
Codec
USB2 (Hub)
Common
Configuration #1 Only
Configuration #2 Only
FAN Connector
RGMII RGMII
Adapter MDI
USB3.2 (P0)
USB2.0 Port 2
USB2 (Hub)
UART 9
UART 2
UART 5 (muxed)
SP336
I2C 4
SP3243
Power
Ckts
PMIC_BBAT
X16 PCIe
Right angle
Socket
Nano SIM
Socket
UPHY0 Lane 0
PEX_CLK_C1 (C0) MUX
2:1
SPI 1
XFI0 INT/RST
I2C5
MCLK01
Reset
Power On
Force Recovery
I2C2
I2C5
CSI[7:0]
MCLK[04:02]
CAM Ctrl
UPHY1 Lane 0
PEX_CLK5 (C5)
PCIe Control
UPHY0 Lanes [7:4]
PEX_CLK4 (C4)
PCIe Control
I2C2
UPHY2 Lane 0
PEX_CLK0 (C7)
PCIe Control
USB2.0 Port 3
UART5 (muxed)
I2S1
SDIO
UPHY0 Lane 3
PEX_CLK 6 (C1)
PCIe Control
SYS_VIN_HV
SYS_VIN_MV
CONFIG SEL
CAN
TXR
Minicard
Socket 1
MUX
1:2
CARD SEL UPHY1 Lanes [7:1]
I2C3
Figure 4-1: Baseboard Functional Block Diagram

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4.2 AGX Orin Series Module Block Diagram
The following Block Diagram illustrates a high-level view of the AGX Orin Series components. The ports are
broken out through the carrier board.
Figure 4-2: AGX Orin Series Module Functional Block Diagram

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5 MECHANICAL DRAWING
Below Figures Depict the Top and Bottom Mechanical view of the Baseboard.
Figure 5-1: Baseboard Mechanical Top View

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Figure 5-1: Baseboard Mechanical Bottom View

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6 CONNECTOR AND JUMPER LOCATION
6.1 Jumper Selection
The Jumper blocks on the Elton baseboard can be configured to enable/disable or alter the default signal routing
settings on the circuit, using Jumper shunts.
The following table describes the Jumper Blocks on the baseboard.
Jumper
Description
JP1
Serial Termination Enable/Disable
JP2
DIO voltage selection/DIO push pull selection
JP3
PCIe/Minicard selection, Configuration, WOL,
Auto Power Selection
6.1.1 Serial Port Termination Jumper Selection
JP1 Jumpers Configuration are provided enable and disable the termination of serial ports1-2.
Position
Function
IN
OUT
TX1
121E Termination Enabled for SER1 TX RS-485/RS-422 Mode
Enabled
Disabled*
RX1
121E Termination Enabled for SER1 RX RS-485/RS-422 Mode
Enabled
Disabled*
TX2
121E Termination Enabled for SER2 TX RS-485/RS-422 Mode
Enabled
Disabled*
RX2
121E Termination Enabled for SER2 RX RS-485/RS-422 Mode
Enabled
Disabled*
*Default Mode
6.1.2 DIO Jumper Selection
JP2 Jumpers are provided to select the voltage level and Pullup/pull down configuration of the DIO. By default,
the DIOs are 3.3 Volare pulled down. The configuration is as shown below:
Position
Function
IN
OUT
5V
DIO Voltage Level
5V
3V3
DIO Voltage Level
3.3V*
PU
DIO Pull up Enable
Enabled
Disabled
PD
DIO Pull down Enable
Enabled*
Disabled
*Default Mode
Note: Make sure 5V and 3V3 Jumper are not IN at same time.
6.1.3 Configuration Jumper Selection
JP3 Jumpers Configuration are provided to select the Voltage level of Digital I/Os. By default, the DIOs are 3.3 V.
The configuration is as shown below:
Position
Function
IN
OUT
PCIE
x16 PCIE / MINICARD Selection
x16 PCIE
MINICARD*
CFG
Boot Configuration
Config #2
Config #1 *
WOL
Wake on LAN
Enabled
Disabled*
AUTO
Auto Power
Enabled
Disabled*
*Default Mode

Osbourne User Manual V0.21 www.diamondsystems.com Page 18
7 CONNECTOR PINOUT SPECIFICATIONS
7.1 Main I/O Connector
Most I/O connections are routed to a high density, high-speed I/O connector located on the front edge of the
board. A variety of I/O connector boards may be designed based on the application requirements. A connector
board using commercial type connectors and oriented in line with the carrier board is available as part no. OSB-
PNL01.
Direction w.r.t
Osbourne
Voltage
Level/Pin Type
Signal Name
Pin#
Pin#
Signal Name
Voltage
Level/Pin Type
Direction w.r.t
Osbourne
Output
Analog Output
AUDIO_HPOR_HD
A
1
2
GND_AUD
Audio Ground
Output
Analog Output
AUDIO_HPOL_HD
A
3
4
AUDIO_MIC_L
Analog Signal
Power
3 V
V_3P0_RTC_CON
5
6
AUDIO_MIC_R
Analog Signal
Power
5 V
V_5P0_A
7
8
AUDIO_PRSNT_L
1.8 V
Input
Power
3.3 /5.0 V
V_DIO
9
10
GND_DIG
Ground
Bi-directional
3.3 /5.0 V
DIO_PA7
11
12
USB3/PCIE_UPHY
_RX0_P
USB2 Diff pair/
PCIe Diff pair
Input
Bi-directional
3.3 /5.0 V
DIO_PA6
13
14
USB3/PCIE_UPHY
_RX0_N
USB2 Diff pair/
PCIe Diff pair
Input
Bi-directional
3.3 /5.0 V
DIO_PA5
15
16
GND_DIG
Ground
Bi-directional
3.3 /5.0 V
DIO_PA4
17
18
USB3/PCIE_UPHY
_TX0_P
USB3 Diff pair/
PCIe Diff pair
Output
Bi-directional
3.3 /5.0 V
DIO_PA3
19
20
USB3/PCIE_UPHY
_TX0_N
USB3 Diff pair/
PCIe Diff pair
Output
Bi-directional
3.3 /5.0 V
DIO_PA2
21
22
GND_DIG
Ground
Bi-directional
3.3 /5.0 V
DIO_PA1
23
24
USB3_UPHY_RX1
_P
USB3 Diff pair
Input
Bi-directional
3.3 /5.0 V
DIO_PA0
25
26
USB3_UPHY_RX1
_N
USB3 Diff pair
Input
Power
5 V
V_USB3_1
27
28
GND_DIG
Ground
Bi-directional
USB2 Diff pair
USB2_D1_CH_N
29
30
USB3_UPHY_TX1
_P
USB3 Diff pair
Output
Bi-directional
USB2 Diff pair
USB2_D1_CH_P
31
32
USB3_UPHY_TX1
_N
USB3 Diff pair
Output
Power
5 V
V_USB3_2
33
34
GND_DIG
Ground
Bi-directional
USB2 Diff pair
USB2_D0_CH_N
35
36
HDMI_DP2_TX0_C
ON_P
HDMI Diff pair
Output
Bi-directional
USB2 Diff pair
USB2_D0_CH_P
37
38
HDMI_DP2_TX0_C
ON_N
HDMI Diff pair
Output
Output
1.8 V
GPIO20_DP/HDMI
_EN_1P8
39
40
GND_DIG
Ground
Output
Open-Drain,
1.8V (3.3V
tolerant)
DP2_AUX_CH_P
41
42
HDMI_DP2_TX3_C
ON_P
HDMI Diff pair
Output
Bi-directional
Open Drain,
1.8V (3.3V
tolerant
DP2_AUX_CH_N
43
44
HDMI_DP2_TX3_C
ON_N
HDMI Diff pair
Output
Bi-directional
Open Drain,
1.8V (3.3V
tolerant
HDMI_CEC_CON
45
46
GND_DIG
Ground
Bi-directional
CMOS –1.8V
DP2/HDMI_HPD
47
48
HDMI_DP2_TX2_C
ON_N
HDMI Diff pair
Output
Input
RS232 Signal
UART5_CTS_RS2
32
49
50
HDMI_DP2_TX2_C
ON_P
HDMI Diff pair
Output
Input
RS232 Signal
UART5_RX_RS23
2
51
52
GND_DIG
Ground

Osbourne User Manual V0.21 www.diamondsystems.com Page 19
Output
RS232 Signal
UART5_RTS_RS2
32
53
54
HDMI_DP2_TX1_C
ON_N
HDMI Diff pair
Output
Output
RS232 Signal
UART5_TX_RS232
55
56
HDMI_DP2_TX1_C
ON_P
HDMI Diff pair
Output
Input
RS232 Signal
UART3_9_RX_RS
232
57
58
GND_DIG
Ground
Output
RS232 Signal
UART3_9_TX_RS2
32
59
60
USB3_UPHY_RX2
0_P
USB3 Diff pair
Input
Power
5 V
V_USB2_VBUS
61
62
USB3_UPHY_RX2
0_N
USB3 Diff pair
Input
Bi-directional
USB2 Diff pair
USB2_HUB_D4_C
H_N
63
64
GND_DIG
Ground
Bi-directional
USB2 Diff pair
USB2_HUB_D4_C
H_P
65
66
USB3_UPHY_TX2
0_P
USB3 Diff pair
Output
Power
5 V
V_USB3_3
67
68
USB3_UPHY_TX2
0_N
USB3 Diff pair
Output
Bi-directional
USB2 Diff pair/
PCIe Diff pair
USB2/PCIE_CLK_
CH_N
69
70
GND_DIG
Ground
Bi-directional
USB2 Diff pair/
PCIe Diff pair
USB2/PCIE_CLK_
CH_P
71
72
NC
Bi-directional
CAN
Differential Pair
CAN1_L
73
74
NC
Bi-directional
CAN
Differential Pair
CAN1_H
75
76
NC
Bi-directional
CAN
Differential Pair
CAN0_L
77
78
NC
Bi-directional
CAN
Differential Pair
CAN0_H
79
80
NC
Input
RS232/ RS422/
RS485
CTS2/RX2_N
81
82
NC
Input
RS232/ RS422/
RS485
RX2/RX2_P
83
84
NC
Bi-directional
RS232/ RS422/
RS485
RTS2/TX2_N/RX2_
N
85
86
NC
Bi-directional
RS232/ RS422/
RS485
TX2/TX2_P/RX2_P
87
88
NC
Input
RS232/ RS422/
RS485
CTS1/RX1_N
89
90
NC
Input
RS232/ RS422/
RS485
RX1/RX1_P
91
92
NC
Bi-directional
RS232/ RS422/
RS485
RTS1/TX1_N/RX1_
N
93
94
GND_DIG
Ground
Bi-directional
RS232/ RS422/
RS485
TX1/TX1_P/RX1_P
95
96
GBE_MDI0_P
1G Eth
differential Pair
Bi-directional
Bi-directional
I2C data; 3.3 V
I2C_GP8_DAT_3P
3
97
98
GBE_MDI0_N
1G Eth
differential Pair
Bi-directional
Output
I2C Clock; 3.3
V
I2C_GP8_CLK_3P
3
99
100
GND_DIG
1G Eth
differential Pair
Ground
Input
3.3 V
BUTTON_POWER
_ON_N
101
102
GBE_MDI1_P
1G Eth
differential Pair
Bi-directional
Bi-directional
Open Drain,
1.8V
SYS_RST_IN_N
103
104
GBE_MDI1_N
1G Eth
differential Pair
Bi-directional
Input
CMOS –1.8V
FORCE_RECOVE
RY#
105
106
GND_DIG
Ground
NC
107
108
GBE_MDI2_P
1G Eth
differential Pair
Bi-directional
NC
109
110
GBE_MDI2_N
1G Eth
differential Pair
Bi-directional
Output
Open-Drain,
3.3V
PEX_C1_RST_N
111
112
GND_DIG
Ground

Osbourne User Manual V0.21 www.diamondsystems.com Page 20
Connector on Osbourne: Samtec ERF8-075-01-L-D-
RA-L-TR
Mating Connector:
ERM8-075-01-L-D-RA-L-TR for in-line connector
board
ERM8-075-02.0-L-DV-TR for right angle connector
board (part can be changed be based on the mating
height)
Input
3.3 V
MEM_ERS_GPIO
113
114
GBE_MDI3_P
1G Eth
differential Pair
Bi-directional
Output
1.8 V
SER_GPIO_SEL
115
116
GBE_MDI3_N
1G Eth
differential Pair
Bi-directional
Output
1.8 V
CAN_SER_SEL2
117
118
GND_DIG
Ground
Output
1.8 V
CAN_SER_SEL1
119
120
MGBE0_PHY_A_P
10G Eth
differential Pair
Bi-directional
Output
3.3 V
SPI1_SCK_3P3
121
122
MGBE0_PHY_A_N
1G Eth
differential Pair
Bi-directional
Output
3.3 V
SPI1_CS0_3P3
123
124
GND_DIG
Ground
Input
3.3 V
SPI1_MISO_3P3
125
126
MGBE0_PHY_B_P
1G Eth
differential Pair
Bi-directional
Output
3.3 V
SPI1_MOSI_3P3
127
128
MGBE0_PHY_B_N
1G Eth
differential Pair
Bi-directional
Output
1.8 V
KSZ_LED2
129
130
GND_DIG
Ground
Output
1.8 V
KSZ_LED1
131
132
MGBE0_PHY_C_N
1G Eth
differential Pair
Bi-directional
Output
Open Drain,
20mA
MGBE_LED2
133
134
MGBE0_PHY_C_P
1G Eth
differential Pair
Bi-directional
Output
Open Drain,
20mA
MGBE_LED1
135
136
GND_DIG
Ground
Output
Open Drain,
20mA
MGBE_LED0
137
138
MGBE0_PHY_D_P
1G Eth
differential Pair
Bi-directional
Power
3.3 V
V_3P3
139
140
MGBE0_PHY_D_N
1G Eth
differential Pair
Bi-directional
Ground
GND_DIG
141
142
GND_DIG
Ground
Power
V_VIN
143
144
V_VIN
Power
Power
V_VIN
145
146
V_VIN
Power
Power
V_VIN
147
148
V_VIN
Power
Power
V_VIN
149
150
V_VIN
Power