Diamond Systems OSBOURNE User manual

OSBOURNE
Carrier for NVIDIA®AGX ORIN Module
User Manual
Revision No
Release Date
Comments
0.21
12/05/2022
Initial Release
© Copyright 2022
Diamond Systems Corporation
www.diamondsystems.com
FOR TECHNICAL SUPPORT
PLEASE CONTACT:
Email: [e-mail]

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Contents
1Important Safe Handling Information ............................................................................................................ 4
2Introduction...................................................................................................................................................... 6
2.1 Osbourne Product Overview ........................................................................................................................ 6
2.2 Osbourne Ordering Guide............................................................................................................................ 7
2.3 Product Photos............................................................................................................................................. 8
2.4 AGX Orin Modules Overview........................................................................................................................ 9
3Functional Overview...................................................................................................................................... 10
3.1 Processor Modules..................................................................................................................................... 10
3.2 Power Supply Specifications...................................................................................................................... 10
3.3 Backup Battery ........................................................................................................................................... 10
3.4 Ethernet Ports............................................................................................................................................. 10
3.5 Display Controller ....................................................................................................................................... 11
3.6 Camera Serial Interface (CSI).................................................................................................................... 11
3.7 Audio Interface............................................................................................................................................ 11
3.8 Serial Ports................................................................................................................................................. 11
3.9 PCIe/USB 3.2/UFS Link Routing Controllers ............................................................................................. 11
3.9.1 PCIe Minicard Socket............................................................................................................................................11
3.9.2 USB........................................................................................................................................................................11
3.9.3 PCIe M.2 M-Key Socket.........................................................................................................................................11
3.9.4 M.2 E-Key Socket...................................................................................................................................................12
3.9.5 PCIe x16 Connector...............................................................................................................................................12
3.10 Digital I/O.................................................................................................................................................... 12
3.11 CAN............................................................................................................................................................ 12
3.12 Utility........................................................................................................................................................... 12
3.13 LED Indicators............................................................................................................................................ 12
4Functional Block Diagram ............................................................................................................................ 13
4.1 Baseboard Block Diagram.......................................................................................................................... 13
4.2 AGX Orin Series Module Block Diagram.................................................................................................... 14
5Mechanical Drawing ...................................................................................................................................... 15
6Connector and Jumper Location ................................................................................................................. 17
6.1 Jumper Selection........................................................................................................................................ 17
6.1.1 Serial Port Termination Jumper Selection.............................................................................................................17
6.1.2 DIO Jumper Selection............................................................................................................................................17
6.1.3 Configuration Jumper Selection ............................................................................................................................17
7Connector Pinout Specifications................................................................................................................. 18
7.1 Main I/O Connector .................................................................................................................................... 18
7.2 Camera (J8)................................................................................................................................................ 21
1.1 PCIe Mini Card Socket 1 (J12)................................................................................................................... 23
1.2 PCIe Mini Card Socket 2 (J13)................................................................................................................... 24
1.3 PCIe Connector (J5)................................................................................................................................... 25
1.4 M.2 M-Key PCIe SSD Socket (J3).............................................................................................................. 27
1.5 M.2 E-Key Socket (J7)................................................................................................................................ 28
1.6 RGMII Adapter Connector (J9)................................................................................................................... 29
1.7 Auxiliary Power In (J14).............................................................................................................................. 30
1.8 Fan Connector (J2)..................................................................................................................................... 30
1.9 Auxiliary Power Out (J6)............................................................................................................................. 30
1.10 MCU Programming Header (J10)............................................................................................................... 30
7.3 Jetson Orin B2B Connector Interface......................................................................................................... 31
8I/O Connector List.......................................................................................................................................... 33
9B2B Connectors............................................................................................................................................. 34

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9.1 B2B I/O Board Connectivity........................................................................................................................ 34
9.1.1 Block Diagram for I/O Connector.........................................................................................................................34
9.1.2 Mechanical Drawings For I/O Connector.............................................................................................................35
9.2 B2B 1G Ethernet Board Connector............................................................................................................ 36
9.2.1 Mechanical Drawing .............................................................................................................................................36
10 Specifications................................................................................................................................................. 37
11 Limited Warranty............................................................................................................................................ 38

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1 IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothing and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-
sensitive. This increases the likelihood of the boards incurring accidental damage during handling, installation,
and connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in
sequential order:
•Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
•Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
•Unpack components and remove them from their anti-static bags only when they are ready to be
used.
•Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
•Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure
or damage. In this type of damage, the board eventually stops functioning because of some defective
components. Usually, the failure can be identified, and the chip can be replaced.
To prevent ESD damage, always follow proper ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB
surface, cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may
not cause damage to the circuitry, depending on components located near the edges. Most Diamond System
boards are designed with a minimum 25 mils clearance between the board edge and component pad. The
ground/power planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type
of damage. However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located
close to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all its boards be stored only in individual ESD-safe packaging units. If
multiple boards are stored together, they should be contained in bins with dividers placed between the boards.
Do not pile boards on top of each other or cram too many boards within a small location. This can cause
damage to connector pins or fragile components.

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Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape
using needle-nose pliers.
The most common cause of a bent connector pin is when the board is pulled off a stack by tugging it at angles
from one end of the connector to the other, in an effort to release it off the stack. Tugging the board off the
stack in this manner can bend the pin(s) significantly.
A similar situation can occur when pulling a ribbon cable off a pin header. If the pins are bent too severely,
bending them back can cause them to weaken or break. In this case, the connector must be replaced.
Power Damages: There are various causes of power-specific damages that can occur while handling the
board. Some common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board
while it is powered-up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to
withstand a reverse power supply connection. This will destroy almost all ICs connected to the power supply.
In this case, the board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive
power will often have a visible hole or show some deformation on the surface due to vaporization inside the
package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the
board, the input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will
withstand an erroneous connection of up to 36V on the analog inputs, even when the board is powered off,
but not on all boards, and not under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a
power supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an
analog output will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified
voltage, the digital circuitry can be damaged. The acceptable voltage range, onmost Diamond Systems boards
connected to digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage
beyond this limit can damage the circuitry.
Other considerations are Logic Signals, which are typically generated between 12V to 24V.
If a Digital I/O Line of 12V to 24V is connected to a 5V logic chip, the chip will be damaged, and the damage
could extend to other chips in the circuit.
IMPORTANT! Always check twice before Powering Up!

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2 INTRODUCTION
2.1 Osbourne Product Overview
Osbourne is a Jetson AGX Orin module-based board with rich graphics and camera input capability. Osbourne
board converts Jetson AGX Orin module into a complete embedded system by providing interface circuitry, I/O
connector for all the major features of the module, camera interface, power supply and additional I/O capability.
Osbourne Base Board Bring your next-gen products to life with the world’s most powerful AI computer for energy-
efficient autonomous machines. The modules deliver up to 275 TOPS of AI performance with power configurable
between 15W and 60W. Jetson Orin modules provide the ideal solution for a new age of Robotics.
The baseboard is the latest product from Diamond Systems to integrate the newly released Standalone NVIDIA
AGX Orin System on Module (SoM) Series:
•AGX Orin 32GB
•AGX Orin 64 GB
Feature Description and Connector Type
Feature
Description
Connector Type
Power
7V-20V wide input supply
Signal Terminated to 150
Position RA Connector
Header (J4)
RTC
3V power input for RTC functionality
Signal Terminated to 150
Position RA Connector
Header (J4)
Ethernet
1G/2.5G/5G/10G Multi Mode Gigabit Ethernet without on
board Magnetics
Signal Terminated to 150
Position RA Connector
Header (J4)
10/100/1000Mbps through RGMII adapter board without
on board Magnetics
Mass Storage
2x mPCIe socket
PCIe MiniCard 52 Position
(52-Pin-Surface Mount,
Right Angle)
1 M.2 M Key (2280 or 2242) (NVMe) expansion slots (4
lane PCIe Gen 3)
M.2 (Key M) Socket
1 M.2 E key 2230
67 Position Female M.2
Connector (Surface Mount,
Right Angle)
Audio
Via ALC5640 CODEC
Signal Terminated to 150
Position RA Connector
Header (J4)
USB
4x USB 2.0, 3x USB 3.2
Signal Terminated to 150
Position RA Connector
Header (J4)
Serial Ports
2 x ports Software configurable RS-232/422/485 through
SP336 transceivers with bypass option to access TTL
signals
Signal Terminated to 150
Position RA Connector
Header (J4)
2x ports fixed RS-232 through SP3243 transceivers with
bypass option to access TTL signals
Signal Terminated to 150
Position RA Connector
Header (J4)
Display
1x HDMI 2.0a/b directly from the Module
Signal Terminated to 150
Position RA Connector
Header (J4)
Camera
4 x4 / 8 x2 lane CSI-2 Camera Interface
Surface Mount 120 Position
Connector Receptacle

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Digital I/Os
8 Digital IO via I2C to GPIO
Signal Terminated to 150
Position RA Connector
Header (J4)
CAN
2x CAN with Non isolated transceivers
Signal Terminated to 150
Position RA Connector
Header (J4)
Fan
Active Thermal Solution with PWM & Tach Input
Connector Header Surface
Mount 1x4 position
Utility
PWR_BTN, RESET, FORCE RECOVERY, I2C(3.3V),
SPI(3.3V)
Signal Terminated to 150
Position RA Connector
Header (J4)
Operating System Support
Linux Kernel version
4.4.38; U
buntu 20.04
Mechanical, Electrical and Environmental Properties
Form-Factor
120mm x 115mm
Cooling Mechanism
Conduction Cooling
Power Input Range
+7 to +20VDC, +18V Typical
Operating Temperature
Range
-25°C to +80°C at Thermal Transfer Plate (TTP) surface of
Orin Module
2.2 Osbourne Ordering Guide
The table below lists the current and planned part numbers in the Osbourne product family.
OSB-ASY-0131-E1F1
Osbourne system / development kit, includes OSB-BB01
baseboard, AGX Orin 32GB module, OSB-PNL01 commercial I/O
adapter, ACC-ETHRGM1 2nd Ethernet PHY, ACC-HSSTV-01 fan
sink, Linux OS installed into Orin module, fully assembled and
tested
OSB-PNL01
Osbourne commercial I/O adapter, Jumper port configuration
OSB-PNL02
Osbourne commercial I/O adapter, fixed port configuration (MOQ)
ACC-ETHRGM1
RGMII Ethernet PHY adapter module
ACC-HSSTV-01
Heat Sink Kit with Fan for AGX Xavier / Orin

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2.3 Product Photos
Orin module installation side
I/O expansion side

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2.4 AGX Orin Modules Overview
Measuring 100mm x 87mm module, Bring your next-gen products to life with the world’s most powerful AI
computer for energy-efficient autonomous machines. Up to 8X the performance of the last generation, 275 TOPS
for multiple concurrent AI inference pipelines, and high-speed interface support for multiple sensors make this the
ideal solution for applications from manufacturing and logistics to retail and healthcare.
AGX Orin Series Feature Description
Feature
Description
AGX Orin 32GB
AGX Orin 64GB
GPU
1792-core NVIDIA Ampere architecture
GPU with 56 Tensor Cores
2048-core NVIDIA Ampere architecture
GPU with 64 Tensor Cores
AI Performance
200 TOPS
275 TOPS
GPU Max
Frequency
939 MHz
1.3 GHz
CPU
8-core Arm®Cortex®-A78AE v8.2 64-bit
CPU
2MB L2 + 4MB L3
12-core Arm®Cortex®-A78AE v8.2 64-bit
CPU
3MB L2 + 6MB L3
CPU Max Frequency
2.2 GHz
2.2 GHz
Memory
32GB 256-bit LPDDR5
204.8GB/s
64GB 256-bit LPDDR5
204.8GB/s
Video Encode
1x 4K60 (H.265)
3x 4K30 (H.265)
6x 1080p60 (H.265)
12x 1080p30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
8x 1080p60 (H.265)
16x 1080p30 (H.265)
Video Decode
1x 8K30 (H.265)
2x 4K60 (H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30 (H.265)
1x 8K30 (H.265)
3x 4K60 (H.265)
7x 4K30 (H.265)
11x 1080p60 (H.265)
22x 1080p30 (H.265)
Power
15W - 40W
15W - 60W
Networking
1x GbE
1x 10GbE
Storage
64GB eMMC 5.1
DL Accelerator
2x NVDLA v2
DLA Max Frequency
1.4 GHz
Vision Accelerator
1x PVA v2
Camera
Up to 6 cameras (16 via virtual channels*)
16 lanes MIPI CSI-2
D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
USB
3x USB 3.2 Gen2 (10 Gbps)
4x USB 2.0
Display
1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Other I/O
4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs
PCIe
Up to 2 x8 + 1 x4 + 2 x1
(PCIe Gen4, Root Port, & Endpoint)
Mechanical
100mm x 87mm
699-pin Molex Mirror Mezz Connector
Integrated Thermal Transfer Plate

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3 FUNCTIONAL OVERVIEW
The following section provides functional details of the key sub-systems implemented on the baseboard.
3.1 Processor Modules
The baseboard supports Jetson™AGX Orin Series modules.
Jetson AGX Orin module with up to 275 TOPS and 8X the performance of the last generation for multiple
concurrent AI inference pipelines, plus high-speed interface support for multiple sensors, Jetson Orin modules
provide the ideal solution for a new age of Robotics. 4nos of M3 4mm standoffs are provided on the module side
for fixing the AGX Orin module.
3.2 Power Supply Specifications
The board can be powered from wide input voltage range of +7V to +20V, typically 18V. Supply input should be
greater than 15 V if PCIe x16 card is being used.
Maximum allowable reflected ripple, measured at the voltage input connector is 50mV p-p.
All required supply voltages for the board derived from the +(7Vto 20V) input. These power supplies are sized to
support the highest capacity on-board memory and have enough reserve capacity to support the below add-on
features.
Power Requirements for Supplementary Features
VIN
12 V
5V
3.3V
Feature
5.4A
6A
Jetson Orin Module (50W)
1.5A
2.6A
1A
M.2 2280 SSD
Minicard (1.3A per Module)
M.2 E key
3A
1A
USB3.2 Ports (1A per Port)
USB2.0 Ports (0.5A per Port)
0.5A
0.5A
Camera circuit
4A
2A
X16 PCIe
3.3 Backup Battery
An onboard 2032 vertical coin battery holder is provided. The board can boot and function normally without abackup
battery as well. The backup voltage signal is also connected to IO connector to connect external backup battery for
rugged application. RTC of Orin module backup voltage of 3V with 1.8V to 3.46V max is required.
3.4 Ethernet Ports
The board offers Two ethernet port one supports 1G and other supports the 10G ethernet speed.
10G Ethernet port derived using MGBE interface from Orin module using 10G ethernet PHY. Onboard magnetics
are NOT provided. LED signals provided for Link, Activity, and Speed Indication
The 10/100/1000 Ethernet port is implemented from the RGMII adapter board. Onboard magnetics are NOT
provided. LED signals are provided for Link, Activity, and Speed Indication.