Digital Equipment MicroPDP-11 User manual

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MicroPDP-11
Systems
Technical Manual
Prepared by Educational Services
of Digital Equipment Corporation

1st Edition, June 1985
2nd Edition, September 1985
© Digital Equipment Corporation 1985.
All Rights Reserved.
The material
in this manual is for informational purposes and is subject to change
without notice.
Digital Equipment Corporation assumes
no responsibility for any errors that may
appear
in this manual.
FCC Notice: This equipment generates, uses, and may emit radio frequency
energy. The equipment has been type tested and found to comply with the limits
for a Class A computing device pursuant to SUbpart J of Part 15 of FCC Rules,
which are designed to provide reasonable protection against such a commercial
environment. Operation
of this equipment in a residential area may cause interfer-
ence
in which case, the user, at his own expense, may be required to take mea-
sures to correct the interference.
Printed in U.S.A.
The manuscript for this book was created on a VAX-ll/780 system and, via a
translation program, was automatically typeset
by Digital's DECset Integrated Pub-
lishing System. The book was produced by Educational Services Development and
Publishing in Marlboro, MA.
The following are trademarks of Digital Equipment Corporation.
~DmDDmDTM
MicroVAX RSX
DEC
PDP RT
DECmate P/OS UNIBUS
DECUS Professional
VAX
DECwriter Q-Bus
VMS
DIBOL Rainbow VT
MASSBUS
RSTS Work Processor
MicroPDP-ll

Introduction
Chapter 1
1.1
1.2
1.2.1
1.2.2
1.3
1.3.1
1.3.2
1.4
1.5
1.5.1
1.5.2
1.6
1.7
Chapter 2
2.1
2.2
2.2.1
2.2.2
2.2.3
2.2.4
2.3
2.4
2.4.1
2.4.2
2.5
Contents
BA23 Enclosure
INTRODUCTION .................................................................. 1-1
BA23-A FRAME .................................................................... 1-2
BA23-A Bezels................................................................... 1-3
Air Circulation ................................................................... 1-3
FRONT CONTROL PANEL .................................................. 1-4
Control Panel Printed Circuit Board.................................. 1-6
LTC DIP Switch Unit........................................................ 1-7
MASS STORAGE................................................................... 1-8
BACKPLANE ASSEMBLy..................................................... 1-8
Mass Storage Signal Distribution Panel............................ 1-8
Q22-Bus Backplane............................................................ 1-10
POWER SUPPLY
AND FANS............................................... 1-13
REAR I/O DISTRIBUTION PANEL...................................... 1-18
MicroPDP-ll Base Systems
INTRODUCTION .................................................................. 2-1
KDJII-B CPU MODULE....................................................... 2-2
KDJII-B LEDs .................................................................. 2-6
KD]11-B Baud Rate Select Switch .................................... 2-6
KDJII-B DIP Switch ......................................................... 2-7
KDJll-B Location
in MicroPDP-ll/73 and
MicroPDP-ll/83 Systems.............................................. 2-8
KD]11-B AUTOMATIC BOOT MODE.................................. 2-9
KDJII-B DIALOG MODE...................................................... 2-10
Entering Dialog Mode ....................................................... 2-10
Dialog Commands .............................................................. 2-11
KDJII-B SETUP MODE ....................................................... 2-12
iii

Contents
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
2.5.7
2.5.8
2.5.9
2.5.10
2.5.11
2.5.12
2.5.13
2.5.14
2.5.15
2.6
2.6.1
2.6.2
2.6.3
2.7
2.8
2.9
2.9.1
2.9.1.1
2.9.1.2
2.10
2.10.1
2.10.2
2.10.3
2.10.4
2.10.5
2.10.6
2.10.7
2.10.8
iv
Setup Command 1: Exit..................................................... 2-12
Setup Command 2: List/Change Parameters
in Setup Table................................................................ 2-12
Setup Command 3: List/Change Boot Translation
in Setup Table................................................................ 2-17
Setup Command 4: List/Change Automatic Boot
Selection in Setup Table ................................................ 2-18
Setup Command 5: Reserved ............................................ 2-19
Setup Command 6: List/Change Switch Boot Selection
in Setup Table................................................................ 2-19
Setup Command 7: List Boot Programs............................ 2-19
Setup Command 8: Initialize the Setup Table ................... 2-19
Setup Command 9: Save Setup Table into EEPROM........ 2-19
Setup Command 10: Load EEPROM Data into
Setup Table.................................................................... 2-19
Setup Command 11: Delete EEPROM BooL .................... 2-20
Setup Command 12: Load an EEPROM Boot into
Memory.......................................................................... 2-20
Setup Command 13: Edit/Create an EEPROM
BooL ....... 2-20
Setup Command 14: Save Boot into EEPROM ................. 2-21
Setup Command 15: Enter ROM ODT.............................. 2-21
KDF11-BE CPU
AND KDF11-BF CPU ASSEMBLIES......... 2-22
KDFII-BE......................................................................... 2-24
KDF11-B Baud Rate Select Switches................................ 2-29
KDF11-B Location
in a MicroPDP-11/23 System............. 2-29
KDFII-B AUTOMATIC BOOT MODE................................. 2-30
KDF11-B CONSOLE DIALOG MODE .................................. 2-31
MSVll-P MEMORY MODULE (-PK, -PL) ........................... 2-32
Expansion (CSR and Starting Addresses) .......................... 2-34
CSR Address ................................................................. 2-34
Starting Address ........................................................... 2-34
MSV11-JD (M8637-D) AND MSV11-JE (M8637-E)
MEMORY MODULES........................................................ 2-35
Error Correction................................................................ 2-36
Battery Backup.................................................................. 2-37
Private Memory Interconnect (PMI) ................................. 2-38
Location of the MSVll-JD, -JE Memory .......................... 2-38
Jumper Setting................................................................... 2-39
MSV11-JD, JE Switch Settings.......................................... 2-39
Memory Address Switch Settings...................................... 2-40
CSR Address Switch Settings............................................ 2-42

2.10.9
2.11
2.12
2.12.1
2.12.2
2.13
2.13.1
2.13.2
2.13.3
Chapter 3
3.1
3.1.1
3.1.2
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.2.9
3.2.10
3.2.11
3.2.12
3.2.13
3.3
3.3.1
3.3.2
3.3.2.1
3.3.2.2
3.3.3
3.3.3.1
3.3.3.2
3.3.4
3.3.5
3.4
3.4.1
3.4.2
Contents
MSV11-JD, JE LEDs ......................................................... 2-43
RQDX1, RQDX2, AND RQDX3 DISK CONTROLLERS....... 2-44
RQDX1-E (M7512) AND RQDX2-E (M7513) EXTENDER
MODULES ......................................................................... 2-46
RQDX1-E (M7512) Extender Module ............................... 2-47
RQDXE (M7513) Extender Module .................................. 2-48
TQK50 (M7546) TAPE CONTROLLER ............................... 2-51
Unit Number DIP Switch .................................................. 2-52
Revision Level DIP Switch................................................ 2-53
TQK50 LEDs..................................................................... 2-53
System Options
INTRODUCTION .................................................................. 3-1
Ordering Options ............................................................... 3-1
Module Configuration ........................................................ 3-2
COMMUNICATIONS............................................................. 3-4
DEQNA Ethernet Interface............................................... 3-4
DHV11 Asynchronous Multiplexer.................................... 3-6
DLVE1 Asynchronous Line Interface................................ 3-9
DLVj1 Asynchronous Interface ......................................... 3-13
DMV11 Synchronous Controller........................................ 3-16
DPV11 Synchronous Interface .......................................... 3-20
DRV11 Parallel-Line Interface .......................................... 3-24
DRV11-B DMA Interface .................................................. 3-27
DRV11-J High-Density Parallel Interface.......................... 3-30
DUV11 Synchronous Serial-Line Interface........................ 3-32
DZQ11 Asynchronous Multiplexer -(Four Lines) ............. 3-35
DZV11 Asynchronous Multiplexer..................................... 3-38
LPV11 Interface Module ................................................... 3-41
MASS STORAGE................................................................... 3-44
RC25 Disk Subsystem....................................................... 3-44
RD51, RD52, and RD53 Disk Drives................................ 3-46
Factory Configuration ................................................... 3-46
Disk Formatting............................................................ 3-49
RQDX1, RQDX2, and RQDX3 Disk Controllers ............... 3-51
RQDX1-E (M7512) Extender Module........................... 3-53
RQDXE (M7513) Extender Module.............................. 3-55
RX50-AA Diskette Drive................................................... 3-56
RL02 Disk Subsystem ....................................................... 3-57
BACKUP DEVICES ............................................................... 3-59
TQK25-EP Tape Drive Subsystem.................................... 3-59
TQK50-KA Tape Drive Subsystem ................................... 3-61
v

Contents
Chapter 4
4.1
4.2
4.3
4.3.1
4.3.2
4.4
4.5
4.6
4.6.1
4.6.2
4.7
4.7.1
4.7.2
4.8
Chapter 5
5.1
5.2
5.3
5.3.1
5.3.2
5.4
5.4.1
5.4.2
5.4.3
5.5
5.6
5.7
5.7.1
5.7.2
5.7.3
5.8
5.9
5.9.1
vi
Configuration
CONFIGURATION RULES ................................................... 4-1
MODULE PHYSICAL PRIORITy ......................................... 4-1
EXPANSION SPACE ............................................................. 4-2
Backplane........................................................................... 4-2
Rear I/O Distribution PaneL ............................................ 4-2
POWER REQUIREMENTS ................................................... 4-3
BUS LOAD ............................................................................ 4-3
MODULE CSR ADDRESSES AND INTERRUPT
VECTORS .......................................................................... 4-3
Floating CSR Address........................................................ 4-6
Floating Address Guidelines .............................................. 4-8
CONFIGURATION EXAMPLES ........................................... 4-9
Base System Configuration................................................ 4-9
Advanced System Configuration ........................................ 4-10
PREPARE THE SETUP TABLE AND THE OPERATING
SySTEM............................................................................. 4-12
Diagnostics
INTRODUCTION .................................................................. 5-1
STARTUP SELF-TEST......................................................... 5-1
KDJll-B TESTING PROCEDURE........................................ 5-2
KDJ11-B Messages............................................................ 5-4
KDJll-B Console Terminal Messages............................... 5-6
KDFll-B TESTING PROCEDURES..................................... 5-8
KDF11-B Messages........................................................... 5-8
KDFll-B Diagnostic LEDs................................................ 5-9
KDF11-B System HalL ..................................................... 5-10
CONSOLE EMULATOR MODE............................................ 5-10
KDJll-B AND KDFll-B OCTAL DEBUGGING
TECHNIQUE (ODT) .......................................................... 5-11
USER TEST DISKETTES..................................................... 5-12
User-Friendly Diagnostics ................................................. 5-12
Field Service Diagnostics................................................... 5-13
Field Service Test Diskettes ............................................. 5-13
OTHER DIAGNOSTIC MEDIA ............................................. 5-14
TESTING WITH THE DEC/XII RUN-TIME
EXERCISER....................................................................... 5-14
Run-Time Exerciser Messages.......................................... 5-14

5.9.1.1
5.9.1.2
5.9.1.3
5.9.2
5.9.3
5.10
5.10.1
5.10.2
5.10.3
5.10.4
5.11
Chapter 6
6.1
6.2
6.3
6.4
6.4.1
6.4.2
6.4.3
6.5
6.6
6.7
6.8
6.9
6.10
Appendices
Contents
System Error Messages................................................ 5-15
Data Error Messages.................................................... 5-15
Status Error Message ................................................... 5-16
Selecting and Deselecting Program Modules.................... 5-16
Expanding the Run-Time Exerciser................................... 5-17
TESTING WITH THE XXDP+ PROGRAMS........................ 5-17
XXDP+ Messages.............................................................. 5-18
Starting a Program............................................................ 5-19
Restarting a Program........................................................ 5-19
Modifying a Diagnostic Program ....................................... 5-19
TROUBLESHOOTING THE BA23 ENCLOSURE ................ 5-21
FRU Removal and Replacement Procedures
INTRODUCTION .................................................................. 6-1
CONTROL PANEL REMOVAL............................................. 6-6
RX50 DISKETTE DRIVE REMOVAL .................................. 6-8
RD5n FIXED DISK DRIVE REMOVAL................................ 6-10
RD51 Disk Drive Read/Write Board Removal .................. 6-12
RD52 Main Printed Circuit Board RemovaL.................... 6-16
RD53 Disk Drive Read/Write Board Removal .................. 6-20
BACKPLANE ASSEMBLY REMOVAL ................................. 6-22
POWER SUPPLY (H7864-A/H7864) REMOVAL.................. 6-27
REAR COOLING FAN REMOVAL ....................................... 6-30
FRONT FAN REMOVAL ...................................................... 6-32
MODULE REMOVAL............................................................ 6-36
REAR I/O INSERT PANEL REMOVAL ............................... 6-40
Appendix A Backplane Pin Assignments
Appendix B Logical Unit Number Designation
Appendix C Formatting a MicroPDP-ll System
Appendix D Configuration Worksheet
Appendix E TK50 Extended Diagnostics
Appendix F RQDXE (M7513) Jumper Configurations
Index
vii

Contents
FIGURES
1-1 Floor-Stand BA23 Enclosure ................................................................ 1-1
1-2
BA23-A Frame ..................................................................................... 1-2
1-3 BA23 Removable Bezels....................................................................... 1-3
1-4
Air Flow ............................................................................................... 1-4
1-5 BA23 Front Control Panel.................................................................... 1-5
1-6 Control Panel with
PC Board ............................................................... 1-7
1-7 Backplane Assembly (Front View from Control Panel Side) ................ 1-8
1-8 Internal Cabling
in a BA23 Enclosure .................................................. 1-9
1-9 Backplane.............................................................................................. 1-11
1-10 Backplane Grant Continuity.................................................................. 1-12
1-11 Location
of Power Supply..................................................................... 1-13
1-12 Power Supply (Rear
View) ................................................................... 1-17
1-13 Rear
I/O Distribution Panel (KDJ11-B SLU Display Panel Shown) ...... 1-18
1-14
I/O Insert Panels and Adapter Plate .................................................... 1-19
2-1 KDJII-B SLU Display Panel ................................................................ 2-3
2-2 KDJII-B Internal Cabling..................................................................... 2-3
2-3 KDJII-B Module Layout ...................................................................... 2-5
2-4 KDFII-BE SLU Panel.......................................................................... 2-23
2-5 KDFII-BE CPU Module ...................................................................... 2-25
2-6 MSVII-P Module Layout ..................................................................... 2-32
2-7 MSV11-JD, -JE Memory Module.......................................................... 2-36
2-8 +5 V Jumper Connections .................................................................... 2-37
2-9 +5 VBB Battery Backup Jumper Connections...................................... 2-37
2-10 PMI/Q22-Bus Interface ........................................................................ 2-38
2-11 RQDXl and RQDX2 Controller Modules ............................................. 2-45
2-12 RQDXI-E Module................................................................................. 2-48
2-13 TQK50 (M7546) Jumpers and Switches............................................... 2-52
3-1 DEQNA Module Layout........................................................................ 3-4
3-2 DEQNA Internal Cabling ...................................................................... 3-5
3-3 DHVll Module Layout ........................................................................ 3-7
3-4 DHVll Internal Cabling....................................................................... 3-8
3-5 DLVEI Module Layout ........................................................................ 3-9
3-6 DLVEI Internal Cabling....................................................................... 3-12
3-7 DLVj1 Module Layout.......................................................................... 3-14
3-8 DLVJl Internal Cabling........................................................................ 3-15
3-9 DMVll Module Layout........................................................................ 3-18
3-10
DMV11 Internal Cabling ...................................................................... 3-19
3-11
DPVll Module Layout......................................................................... 3-21
3-12
DPVll Internal Cabling ....................................................................... 3-23
viii

Contents
3-13 DRV11 Module Layout......................................................................... 3-24
3-14 DRV11 Internal Cabling ....................................................................... 3-26
3-15 DRV11-B Module Layout ..................................................................... 3-26
3-16 DRV11-B Internal Cabling.................................................................... 3-29
3-17 DRV11-j Module Layout ...................................................................... 3-30
3-18 DRV11-j Internal Cabling..................................................................... 3-31
3-19
DUV11 Module Layout ........................................................................ 3-32
3-20 DUV11 Internal Cabling....................................................................... 3-34
3-21
DZQ11 (M3106) Module Layout .......................................................... 3-35
3-22
DZQ11 (M3106) Internal Cabling......................................................... 3-37
3-23
DZV11 Module Layout ......................................................................... 3-38
3-24
DZV11 Internal Cabling ....................................................................... 3-40
3-25 LPV11 Module Layout ......................................................................... 3-41
3-26 LPV11 Internal Cabling........................................................................ 3-43
3-27 RC25 Disk Subsystem .......................................................................... 3-45
3-28 M7740 Module Layout ......................................................................... 3-45
3-29 RD51 Disk Drive
and Shunt jumper.................................................... 3-47
3-30 RX50 Diskette Drive............................................................................ 3-49
3-31
RQDX1 and RQDX2 Module Layouts .................................................. 3-52
3-32 RQDX1-E jumper Locations................................................................. 3-54
3-33 RX50 Diskette Drive............................................................................ 3-56
3-34 RL02 Disk Drive Subsystem ................................................................ 3-57
3-35 RLV12 Module Layout ......................................................................... 3-58
3-36 TK25 Tape Drive................................................................................. 3-59
3-37 M7605 Module Layout ......................................................................... 3-60
3-38 TQK50 Tape Drive Sybsystem ............................................................ 3-62
3-39 M7546 Module Layout ......................................................................... 3-63
4-1 Configuration Worksheet..... '" .............................................................. 4-5
4-2 Cable Connections for the Base System............................................... 4-9
4-3 Base System ......................................................................................... 4-10
4-4 Cable Connections for an Advanced Configuration............................... 4-11
4-5 Advanced System ................................................................................. 4-11
5-1 Error Message Screen.......................................................................... 5-7
5-2 Troubleshooting Flowchart................................................................... 5-22
6-1 BA23 Enclosure FRUs ......................................................................... 6-5
6-2 Remove the Control Panel.................................................................... 6-7
6-3 RX50 Diskette Drive RemovaL........................................................... 6-9
6-4 RD5n Removal (RD51 Disk Drive Shown)........................................... 6-11
6-5 Set the RD52 jumper Clip ................................................................... 6-12
6-6 RD51 Disk Drive Skid Plate RemovaL ............................................... 6-13
ix

Contents
6-7 RD51 Disk Drive Allen Screws and Connector P5 Removal ............... 6-13
6-8 RD51 Disk Drive Connectors P6, P7, P8, and P4 ............................... 6-14
6-9 DIP Shunt Pack Setting........................................................................ 6-15
6-10 Remove the Slide Plate ........................................................................ 6-16
6-11 Remove the
2- Pin Connector and Screws ............................................ 6-17
6-12 Remove the Front
BezeL .................................................................... 6-17
6-13 Remove Phillips Screws from Heatsink................................................ 6-18
6-14 Remove the
MPCB ............................................................................... 6-19
6-15 RD53 Read/Write Board RemovaL..................................................... 6-21
6-16 Accessing the Backplane ...................................................................... 6-23
6-17 Removing Cables and Modules ............................................................. 6-25
6-18 Removing Access Cover and Screws.................................................... 6-26
6-19 Removing the Backplane ...................................................................... 6-26
6-20 Power Supply RemovaL....................................................................... 6-28
6-21 Remove Power Supply and Fan Connector .......................................... 6-29
6-22 Install Rear Fan Power Cable .............................................................. 6-30
6-23 Rear Cooling Fan Power Cable Position............................................... 6-30
6-24 Remove the Fan from the Chassis ....................................................... 6-31
6-25 Install the Rear Fan ............................................................................. 6-32
6-26 Disconnect the Front Cooling Fan........................................................ 6-33
6-27 Remove the Front Cooling Fan ............................................................ 6-34
6-28 Connect the Front Fan Power
Cable and Fan Guard ........................... 6-34
6-29 Install Replacement Fan ....................................................................... 6-35
6-30 Module Removal................................................................................... 6-37
6-31 Quad-Height Module Ejector Levers .................................................... 6-39
6-32 Rear
I/O Insert Panel Removal ............................................................ 6-41
A-I Quad-Height Module Contact Finger Identification.............................. A-I
F-l Three Possible Disk Drive Arrangements (Factory Setting)................ F-2
F-2 Three Fixed Disk Drives with
an RQDXE (Arrangement 1) ............... F-3
F-3
An RX50 and a Fixed Disk Drive with an RQDXE .............................. F-4
F-4
An RX50 and two RD5n Disk Drives with an RQDXE
(Arrangement 1) ............................................................................... F-5
F-5 A Fixed Disk Drive and
an RX50 in a BA23-A Expansion Box ........... F-6
F-6
An RX50 and Two Fixed Disk Drives (Arrangement 2) ...................... F-7
F-7 Two Fixed Disk Drives and
an RX50 (Arrangement 3) ....................... F-8
F-8 Three Fixed Disk Drives (Arrangement 2)F-9
x

Contents
TABLES
1-1 MicroPDP-ll Systems Dimensions and Weights.................................. 1-2
1-2 Front Control Panel Controls and Indicators........................................ 1-5
1-3 R7864-A (Rev20) Power Supply Specifications.................................... 1-15
1-4 R7864 (RevI2) Power Supply Specifications ....................................... 1-16
2-1 KDJ11-B Factory Setting ..................................................................... 2-5
2-2 Baud Rate/Mode Select Switch ............................................................ 2-6
2-3 KDJll Settings for Switches 2, 3, and 4 ............................................. 2-7
2-4 Switch Settings for Switches 6, 7, and 8 ............................................. 2-8
2-5 Setup
Mode Commands ........................................................................ 2-12
2-6 KDJll-B Setup Default Parameter Values........................................... 2-13
2-7 ROM Code Mode Selections................................................................. 2-14
2-8 PMG Count Settings............................................................................. 2-15
2-9
Clock Signal Sources ............................................................................ 2-15
2-10 ROM Addresses Disabled ..................................................................... 2-16
2-11
ROM ODT Commands.......................................................................... 2-21
2-12 KDFll-BE Module Factory Jumper Configuration............................... 2-26
2-13 KDFII-BE Module Factory Switch Configuration................................ 2-27
2-14 KDFll-BE Diagnostic/Bootstrap Switch Settings ................................ 2-27
2-15
KDFll-B Baud Rate Switch Settings................................................... 2-29
2-16
MSVll Memory Modules .................................................................... 2-32
2-17
MSVll-P Factory Jumper Configuration.............................................. 2-33
2-18
MSVll-P CSR Configuration ............................................................... 2-34
2-19
MSVll-P Starting Address Configuration............................................ 2-35
2-20 MSVll-JD, -JE Memory Modules ........................................................ 2-36
2-21 MSVll-JD,
-JE Jumper Configurations ................................................ 2-39
2-22 MSVll-JD,
-JE Starting Memory Address Selection ........................... 2-41
2-23 Common Memory Starting Address ..................................................... 2-42
2-24
CSR Address Selection......................................................................... 2-43
2-25
RQDXn Factory Jumper Configuration................................................. 2-46
2-26 RQDXI-E Factory Configuration.......................................................... 2-47
2-27 Three Possible Arrangements Using the
RQDXE ................................ 2-49
2-28
RQDXE Jumper Setting (Factory Configuration) ................................. 2-49
2-29 Four Fixed Disks With an
RQDXE. ...................................................... 2-50
2-30
RQDXE Configuration for Three RD5n Disk Drives ........................... 2-50
2-31 M7546 Fixed CSR Address.................................................................. 2-51
2-32 Unit Number Switch Pack Settings...................................................... 2-52
2-33 Revision Level Switch Pack.................................................................. 2-53
3-1
CSR Addresses and Interrupt Vectors ................................................. 3-5
3-2
DRVll CSR Address ........................................................................... 3-7
3-3
DRVll Interrupt Vector...................................................................... 3-8
xi

Contents
3-4 DLVEI Fixed CSR Addresses.............................................................. 3-10
3-5 DLVEI Interrupt Vector...................................................................... 3-10
3-6 DLVEI Jumper Factory Setting........................................................... 3-11
3-7 DLVEI
Baud Rate Selection ................................................................ 3-12
3-8
DL VJl CSR Address ............................................................................ 3-13
3-9 DLVJI Interrupt Vector....................................................................... 3-14
3-10 DMVll Versions.................................................................................. 3-16
3-11
DMVll Interfaces................................................................................ 3-16
3-12
DMVll CSR Address........................................................................... 3-17
3-13
DMVll Interrupt Vector ..................................................................... 3-17
3-14
DPVll CSR Address............................................................................ 3-22
3-15
DPVll Interrupt Vector ...................................................................... 3-22
3-16
DRVll CSR Address ........................................................................... 3-25
3-17
DRVll Interrupt Vector...................................................................... 3-25
3-18 DRVII-B
CSR Address........................................................................ 3-28
3-19 DRVII-B Interrupt Vector .................................................................. 3-28
3-20 DRVII-J CSR Address......................................................................... 3-31
3-21 DUV11
CSR Address ........................................................................... 3-33
3-22
DUVll Interrupt Vector...................................................................... 3-33
3-23
DZQll CSR Address............................................................................ 3-36
3-24
DZQll Interrupt Vector ...................................................................... 3-36
3-25
DZV11 CSR Address............................................................................ 3-39
3-26
DZVll Interrupt Vector ...................................................................... 3-39
3-27 LPV11
CSR Address ............................................................................ 3-42
3-28
LPVll Interrupt Vector....................................................................... 3-42
3-29 LPV11 Jumper Configuration ............................................................... 3-42
3-30 M7740 CSR Address............................................................................ 3-44
3-31 RD51 DIP Shunt Pack Factory Setting................................................ 3-48
3-32
RQDX CSR Address............................................................................. 3-53
3-33 RQDXI-E Factory Configuration.......................................................... 3-54
3-34
RQDXE Jumper Setting (Factory Configuration) ................................. 3-55
3-35
RQDXE Configuration for Three Fixed Disk Drives............................ 3-55
3-36 RLV12
CSR Address............................................................................ 3-58
3-37
RL V12 Interrupt Vector ...................................................................... 3-58
3-38 M7605
CSR Address............................................................................ 3-61
3-39 M7605 Interrupt Vector ...................................................................... 3-61
3-40 M7546 CSR Address............................................................................ 3-63
4-1 Order of Modules in the BA23 Backplane............................................ 4-2
4-2 Current and Power Limits.................................................................... 4-3
4-3 Power Requirements, Bus Loads, I/O Panel......................................... 4-4
4-4 Address/Vector Worksheet................................................................... 4-6
4-5 Floating CSR Address Chart ................................................................ 4-7
xii

Contents
5-1 Self-Test Listing................................................................................... 5-2
5-2
KD]11-B Self-Test and Boot/Diagnostic ROM Messages..................... 5-4
5-3 KDJ11-B Self-Test and Boot/Diagnostic ROM Messages..................... 5-9
5-4 List
of LED Self-Test Display Codes ................................................... 5-10
5-5 Console ODT Commands...................................................................... 5-12
5-6 Select/Deselect Commands................................................................... 5-16
5-7 XXDP+ Diagnostic Programs............................................................... 5-18
6-1 Field Replaceable Units........................................................................ 6-2
6-2
RD51 Jumper Configuration ................................................................. 6-15
A-I
KDJ11-B (M8190)/KDF11-BE (M8189) Module Backplane Pin
Assignments (Rows A and B) ........................................................... A-2
A-2 KDJ11-B (M8190)/KDF11-BE (M8189) Module Backplane Pin
Assignments (Rows C and D) ........................................................... A-2
A-3
MSV11-PK (M8067) Module Backplane Pin Assignments
(Rows A and B) ................................................................................. A-3
A-4
MSV11-PK (M8067) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-3
A-5
DZV11-A (M7957) Module Backplane Pin Assignments
Rows A and B) .................................................................................. A-4
A-6
DZV11-A (M7957) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-4
A-7 RQDXl (M8369) Module Backplane Pin Assignments
(Rows A and B) ................................................................................. A-5
A-8
RQDXl (M8639) Module Backplane Pin Assignments
(Rows C and D) ................................................................................ A-5
B-1 Disk Unit Designation .......................................................................... B-1
B-2 RQDX Standard Logical Unit Number Configuration........................... B-3
B-3 RQDX Logical Unit Number Jumper Configuration ............................. B-4
B-4
RQDX Unit Number and Jumper Format............................................. B-4
D-l Sample Worksheet for Generating CSR Addresses.............................. D-3
D-2
Blank Worksheet for Generating CSR Addresses ................................ D-4
E-l Error Printout Commands .................................................................... E-ll
E-2 Sample Messages and Their Source..................................................... E-11
E-3 Data Reliability Test Status Drive Errors............................................ E-12
F-l RQDXE Jumper Setting (Factory Configuration) ................................. F-2
F-2
RQDXE Jumper Setting for Three RD5n Disk Drives
(Arrangement
1) ............................................................................... F-3
F-3
RQDXE Jumper Setting for an RX50 and Fixed Disk Drive................ F-4
F-4
RQDXE Jumper Setting for an RX50 and Two Fixed Disk Drives
(Arrangement
1) ............................................................................... F-5
xiii

Contents
F-5 RQDXE jumper Setting for a Fixed Disk Drive and an RX50 in a
BA23-A Expansion Box ..................................................................... F-6
F-6
RQDXE jumper Setting for an RX50 and Two Fixed Disk Drives
(Arrangement
2) ............................................................................... F-7
F-7
RQDXE jumper Setting for Two Fixed Disk Drives and an RX50
(Arrangement
3) ............................................................................... F-8
F-8
RQDXE jumper Setting for Three Fixed Disk Drives
(Arrangement
2) ............................................................................... F-9
xiv

Introduction
This manual is one of a set that describes the MicroPDP-ll systems in a BA23
enclosure and is intended for an experienced user. The MicroPDP-ll System
Owner's Manual (EK-MICll-OM) describes the unpacking, installation, checkout,
and normal operation of the MicroPDP-ll systems.
The KDJll-BC CPU User's Guide (EK-KDJEB-UG) describes the use and operation
of the KDJll-B CPU module. The KDFll-BA CPU User's Guide (EK-KDFEB-UG)
describes the use and operation
of the KDFll-B CPU module. The MicroPDP-ll
System Illustrated Parts Breakdown (EK-OLCP5-IP) shows the mechanical break-
down of the MicroPDP-ll in the BA23 mounting enclosure. The MicroPDP-ll
Systems Service Maintenance Guide (EK-MICll-SG) provides instructions on field
service maintenance and
on how to troubleshoot down to the field replaceable unit
(FRU) level.
Notes, Cautions, and Warnings
Any notes, cautions, and warnings that appear in this manual are defined as:
• NOTE -contains general information.
• CAUTION -contains information to prevent damage to equipment.
• WARNING -contains information to prevent personal injury.
Related Documents*
MicroPDP-ll Systems Owner's Manual
MicroPDP-ll Systems Service Maintenance Guide
MicroPDP-ll System Illustrated Parts Breakdown
KDJll-BC CPU User's Guide
KDFll-BA CPU User's Guide
RQDXl Controller Module User's Guide
Microcomputer Interfaces Handbook
Microcomputer
and Memories Handbook
EK-MICII-0M
EK-MICl1-SG
EK-OLCP5-IP
EK-KDJIB-UG
EK-KDFEB-UG
EK-RQDXI-UG
EB-20175-20
EB-18451-20
* The text of this document contains additional references to Digital documents.
xv

Introduction
You can order these documents from:
Digital Equipment Corporation
Accessories and Supplies Group
P.O. Box CS2008
Nashua, NH 03061
Attention: Documentation Products
Glossary Location
Glossary references are located in the glossary of common computing terms found
in your owner's manual for your system. This glossary contains some, but not all,
of the following acronyms.
Acronyms Used in this Document
Note that
• Signal names
• Acronyms displayed in messages
• Acronyms used by diagnostic programs
are not included
in the following list.
ANSI
ASCII
APC
BCSR
BOT
CCITT
CIS
CPU
CSR
CSRA
DDCMP
DIP
DMA
DMSCP
DU
DUP
ECC
EEPROM
XVI
American National Standards Institute
American Standard Code for Information Interchange
(a standard
code
of 7- or 8-bit coded characters used in the transmission of
data for processing)
Assembled program count
Boot control and status register
Beginning of tape
Comite Consultatif Internationale de Telephonie et Telegraphie
(International Telephone and Telegraph Consultative Committee)
Commercial instruction
set
Central processing unit
Control status register
Control status register address
Digital data communication message protocol
Dual in-line package
Direct memory access
Disk mass storage control protocol
Disk unit
Diagnostic utilities protocol
Error correction code
Electrically erasable programmable read only memory

EIA
EIS
EOT
EPROM
ERR
FP
FPP
FRU
I/O
IP
LED
LOE
LSB
LSI
LTC
LUN
MMU
MOS
MPCB
MSB
MSCP
ODT
PC
PMG
PMI
PP
PROM
PSW
RAM
RDY
ROM
SA
SDLC
SLU
SYS ERR
TMSCP
UART
UQSSP
VOLT SEL
WR
WRT PROT
Introduction
Electronic Industries Association
Extended instruction set
End of tape
Erasable programmable read only memory
Error
Floating-point
Floating-point processor
Field replaceable unit
Input/output
Initialize polling (usually refers to an address in the CSR)
Light emitting diode
Loop-on-error
Least significant bit
Large-scale integration
Line time clock
Logical unit number
Memory management unit
Metallic oxide semiconductor
Main printed circuit board
Most significant bit
Mass storage control protocol
Octal debugging technique
Printed circuit
Processor mastership grant
Private memory interconnect
Purge and poll (refers to a diagnostic procedure)
Programmable read only memory
Processor status word
Random access memory
Ready
Read only memory
Starting address (refers here to a location within the CSR)
Synchronous data-link control
Serial line unit (associated here with a CPU module)
System error
Tape mass storage control protocol
Universal asynchronous receiver/transmitter (refers to a device
that performs parallel-to-serial and serial-to-parallel conversion)
U/Q-Bus storage systems protocol
Voltage select
Wrap (refers to a bit in the control status register)
Write-protect
XVII

BA23 Enclosure
1.1 INTRODUCTION
The BA23 micro systems enclosure (Figure 1-1) supports the MicroPDP-ll com-
puter systems and a
wide variety of hardware options. The fan-cooled enclosure
operates
in an open office environment and includes the following major
components:
• BA23-A frame • Backplane
• Front control panel • Power supply and fans
• Mass storage area • Rear I/O distribution panel
Chapter 2 discusses the contents of typical MicroPDP-ll, MicroPDP-ll/73, and
MicroPDP-ll/83 systems.
Figure
1-1 Floor-Stand BA23 Enclosure
1-1