Digital Equipment VAX 4000 500A Instruction Manual

VAX4000
Model500A/505A/600A/700A/705A
Operation
Order Number: EK–494AB–OP. B01
Digital Equipment Corporation
Maynard, Massachusetts

First Edition, March 1990
Seventh Edition, July 1994
The information in this document is subject to change without notice and should not be construed
as a commitment by Digital Equipment Corporation.
Digital Equipment Corporation assumes no responsibility for any errors that may appear in this
document.
The software, if any, described in this document is furnished under a license and may be used or
copied only in accordance with the terms of such license. No responsibility is assumed for the use
or reliability of software or equipment that is not supplied by Digital Equipment Corporation or its
affiliated companies.
Restricted Rights: Use, duplication or disclosure by the U.S. Government is subject to restrictions
as set forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software clause
at DFARS 252.227–7013.
Copyright © Digital Equipment Corporation 1990, 1994. All Rights Reserved.
The following are trademarks of Digital Equipment Corporation: CompacTape, CX, DDCMP, DEC,
DECconnect, DECdirect, DECnet, DECscan, DECserver, DECUS, DECwindows, DELNI, DEMPR,
DESQA, DESTA, DSRVB, DSSI, InfoServer, IVAX, KDA, KLESI, KRQ50, MicroVAX, MSCP, Q–bus,
Q22–bus, RA, RQDX, RV20, SA, SDI, ThinWire, TK, TMSCP, TQK, TS05, TU, VAX, VAX 4000,
VAXcluster, VAX DOCUMENT, VAXELN, VAXlab, VAXserver, VMS, VT, and the DIGITAL logo.
All other trademarks and registered trademarks are the property of their respective holders.
FCC NOTICE: The equipment described in this manual generates, uses, and may emit radio
frequency. The equipment has been type tested and found to comply with the limits for a Class A
computing device pursuant to Subpart J of Part 15 of FCC Rules, which are designed to provide
reasonable protection against such radio frequency interference.
Operation of the equipment in a residential area may cause interference, in which case the user
at his own expense will be required to take whatever measures may be required to correct the
interference.
S2579
This document was prepared using VAX DOCUMENT Version 2.1.

Contents
Preface ................................................ vii
1 System Overview
1.1 Front View and Physical Description . . . . . . . . . . . . . . . . . 1–2
1.1.1 BA440Enclosure ............................. 1–6
1.1.1.1 Mass Storage Shelf . . . . . . . . . . . . . . . . . . . . . . . . 1–7
1.1.1.2 System Control Panel (SCP) . . . . . . . . . . . . . . . . . 1–8
1.1.1.3 CardCage ............................... 1–10
1.1.1.4 ConsoleModule ........................... 1–12
1.1.1.5 DSSI Bus 0 Connector and KZQSA-In
Connector................................ 1–15
1.1.1.6 Power Supply Controls and Indicators . . . . . . . . . . 1–16
1.1.1.7 Fans.................................... 1–19
1.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20
1.2.1 Base System Components . . . . . . . . . . . . . . . . . . . . . . 1–20
1.2.1.1 Central Processing Unit (CPU) . . . . . . . . . . . . . . . 1–20
1.2.1.2 Console Serial Line Unit (SLU) . . . . . . . . . . . . . . . 1–20
1.2.1.3 MainMemory............................. 1–20
1.2.1.4 Network Controller . . . . . . . . . . . . . . . . . . . . . . . . 1–21
1.2.1.5 CPU DSSI Controllers . . . . . . . . . . . . . . . . . . . . . . 1–21
1.2.2 Optional Components . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21
1.2.2.1 Mass Storage Devices and Controllers . . . . . . . . . . 1–22
1.2.2.2 Mass Storage Subsystems . . . . . . . . . . . . . . . . . . . 1–23
1.2.2.3 Mass Storage Expanders . . . . . . . . . . . . . . . . . . . . 1–24
1.2.2.4 Communication Controllers . . . . . . . . . . . . . . . . . . 1–25
1.2.2.5 Real-Time Controllers . . . . . . . . . . . . . . . . . . . . . . 1–27
1.2.2.6 PrinterInterfaces.......................... 1–27
1.2.2.7 Additional DSSI Buses . . . . . . . . . . . . . . . . . . . . . . 1–28
1.2.2.8 Other Available Options . . . . . . . . . . . . . . . . . . . . . 1–30
1.3 DSSI VAXcluster Configuration (VMS Systems Only) . . . . 1–30
iii

2 Operating the System
2.1 Before You Operate the System . . . . . . . . . . . . . . . . . . . . . 2–1
2.2 SwitchSettings ................................. 2–1
2.2.1 NormalOperation ............................ 2–2
2.2.2 SpecialOperation............................. 2–3
2.3 TurningOntheSystem ........................... 2–4
2.4 BootingtheSystem .............................. 2–6
2.4.1 Autobooting the System . . . . . . . . . . . . . . . . . . . . . . . . 2–6
2.4.2 Booting the System from Console Mode . . . . . . . . . . . . 2–11
2.5 UsingtheSystem................................ 2–13
2.6 HaltingtheSystem .............................. 2–13
2.7 RestartingtheSystem............................ 2–14
2.8 Turning Off the System . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–15
2.9 Recovering from an Over Temperature Condition . . . . . . . 2–15
3 Operating the System Options
3.1 MassStorageOptions ............................ 3–1
3.1.1 EF/RF-Series Integrated Storage Elements . . . . . . . . . 3–2
3.1.1.1 EF/RF-Series Controls and Indicators . . . . . . . . . . 3–2
3.1.1.2 Write-Protecting an EF/RF-Series ISE . . . . . . . . . . 3–4
3.1.1.3 Changing the Bus Node ID Plugs . . . . . . . . . . . . . 3–9
3.1.2 TF-Series Tape Drive . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10
3.1.2.1 Operation of the Drive . . . . . . . . . . . . . . . . . . . . . . 3–12
3.1.2.2 Labeling a Tape Cartridge . . . . . . . . . . . . . . . . . . . 3–13
3.1.2.3 Write-Protecting a Tape Cartridge . . . . . . . . . . . . . 3–14
3.1.2.4 Tape Cartridge Handling and Storage
Guidelines ............................... 3–16
3.1.2.5 Inserting a Tape Cartridge in TF-Series Drive . . . . 3–17
3.1.2.6 Removing a Tape Cartridge . . . . . . . . . . . . . . . . . . 3–20
3.1.2.7 Summary of TF-Series Tape Drive Controls and
Indicators................................ 3–22
3.1.2.8 Cleaning the TF-Series Tape . . . . . . . . . . . . . . . . . 3–23
3.1.3 TK70TapeDrive ............................. 3–24
3.1.3.1 Operation of the Drive . . . . . . . . . . . . . . . . . . . . . . 3–25
3.1.3.2 Labeling a Tape Cartridge . . . . . . . . . . . . . . . . . . . 3–26
3.1.3.3 Write-Protecting a Tape Cartridge . . . . . . . . . . . . . 3–27
3.1.3.4 Tape Cartridge Handling and Storage
Guidelines ............................... 3–29
3.1.3.5 Inserting a Tape Cartridge . . . . . . . . . . . . . . . . . . . 3–30
3.1.3.6 Removing a Tape Cartridge . . . . . . . . . . . . . . . . . . 3–33
iv

3.1.3.7 Summary of TK70 Tape Drive Controls and
IndicatorLights........................... 3–34
3.2 Communication Controller Options . . . . . . . . . . . . . . . . . . 3–36
3.2.1 Asynchronous Serial Controllers . . . . . . . . . . . . . . . . . 3–36
3.2.1.1 Asynchronous Controllers Without Modem
Support ................................. 3–36
3.2.1.2 Asynchronous Controllers With Modem
Support ................................. 3–37
3.2.2 Synchronous Controllers . . . . . . . . . . . . . . . . . . . . . . . 3–37
3.2.3 Ethernet Network Controllers . . . . . . . . . . . . . . . . . . . 3–38
3.3 Real-TimeOptions............................... 3–39
3.4 PrinterOptions ................................. 3–39
3.5 AddingOptions ................................. 3–39
A Related Documentation
B Backup Procedures
B.1 Overview of Standalone BACKUP . . . . . . . . . . . . . . . . . . . B–1
B.1.1 Installing Standalone BACKUP on the System
Disk....................................... B–2
B.1.2 Booting Standalone BACKUP from the System
Disk....................................... B–2
B.1.3 Installing Standalone BACKUP on a Tape
Cartridge................................... B–3
B.1.4 Booting Standalone BACKUP from a Tape
Cartridge................................... B–5
B.2 Backing Up the System Disk . . . . . . . . . . . . . . . . . . . . . . . B–6
B.3 Restoring the System Disk . . . . . . . . . . . . . . . . . . . . . . . . . B–10
C Programming Parameters for DSSI Devices
C.1 DSSI Device Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . C–2
C.2 How VMS Uses the DSSI Device Parameters . . . . . . . . . . C–3
C.3 Examining and Setting DSSI Device Parameters . . . . . . . . C–5
C.3.1 Entering the DUP Driver Utility . . . . . . . . . . . . . . . . . C–8
C.3.2 Setting Allocation Class . . . . . . . . . . . . . . . . . . . . . . . . C–9
C.3.3 SettingUnitNumber.......................... C–10
C.3.4 SettingNodeName ........................... C–12
C.3.5 SettingSystemID ............................ C–12
C.3.6 Exiting the DUP Server Utility . . . . . . . . . . . . . . . . . . C–13
v

Glossary
Index
Figures
1–1 Possible DSSI Configurations . . . . . . . . . . . . . . . . . . . . 1–29
Tables
1–1 Maximum DSSI Devices Supported Per
Configuration................................ 1–23
1–2 R400XExpansion............................. 1–24
2–1 Normal Power-Up Indications . . . . . . . . . . . . . . . . . . . 2–5
2–2 DeviceNames ............................... 2–10
3–1 EF/RF-Series ISE Controls and Indicators . . . . . . . . . . 3–4
3–2 TF-Series Tape Drive Controls . . . . . . . . . . . . . . . . . . . 3–22
3–3 TF-Series Tape Drive Indicators . . . . . . . . . . . . . . . . . 3–22
3–4 TK70 Tape Drive Controls . . . . . . . . . . . . . . . . . . . . . . 3–34
3–5 TK70 Tape Drive Indicator Lights . . . . . . . . . . . . . . . . 3–35
B–1 Standalone BACKUP Qualifiers . . . . . . . . . . . . . . . . . . B–7
vi

Preface
This manual tells you how to use your system. It is structured as follows.
• Chapter 1 provides an overview of the system.
• Chapter 2 tells you how to use the system.
• Chapter 3 tells you how to use options installed in the system.
• Appendix A lists related documentation.
• Appendix B describes procedures for creating backup files.
• Appendix C tells you how to set and examine DSSI device parameters from
console mode.
• A glossary explains key terms and abbreviations.
The following conventions are used in this manual.
Convention Meaning
Key A terminal key used in text and examples. For example, Break
indicates that you press the Break key on your terminal keyboard.
Ctrl/C Hold down the Ctrl key while you press the C key.
BOLD Your input. For example,
>>>BOOT MIA5
shows that you must enter BOOT MIA5 at the console prompt.
NOTE Provides general information about the current topic.
CAUTION Provides information to prevent damage to equipment or software.
vii

1
System Overview
Your system components are housed in a BA440 enclosure. It is a freestanding
pedestal that can house the following:
• Card cage
• System controls
• Central processing unit (CPU) module
• Memory modules
• Console module
• EF/RF-series Integrated Storage Elements (ISEs)
• TF-series or TK50, TK70 tape drives
• Q–bus option modules
• Power supply
• Fans
Using the dual-disk RF31T or RF35 or RF36, up to seven EF- to RF-series ISEs,
or up to six RF-series ISEs and a tape drive, can be mounted inside the BA440
enclosure.
System Overview 1–1

1.1 Front View and Physical Description
Your system has a divided door that restricts access to the system controls.
MLO-004032
A three-position rotary lock lets you lock the upper and lower doors, or just the
lower door. Opening the upper door lets you access controls for the EF/RF-series
Integrated Storage Elements (ISEs), tape drive, and System Control Panel (SCP).
Opening both doors lets you access all system controls and cable connections.
1–2 System Overview

Tape Drive Controls and
Door Handle
(Both Doors) MLO-004958
Middle Key Position:
No Access to Controls
Bottom Key Position:
Access to Power Switch;
All Controls and Indicators
Top Key Position:
Access to SCP, ISEs, and
Rotary Lock
Indicators (Upper Door)
System Overview 1–3

Opening and Closing the Doors
The divided door lets you access the mass storage devices and system control
panel (SCP), while restricting access to the Power switch and console module.
Open and close the doors as follows.
1. Insert the key in the lock on the front door. Turn the key to the top position
to open the upper door, or to the bottom position to open both doors.
With the key in the bottom position, the upper and lower doors will open
together.
2. Swing the doors open.
3. To close the doors, simply reverse the procedure. When pushing the doors
closed, push gently at the top right of the upper door and the bottom right of
the lower door.
MLO-004034
Top Key Position
1–4 System Overview

MLO-004035
Bottom Key Position
The next section describes the BA440 enclosure, which is exposed when you open
both doors.
System Overview 1–5

1.1.1 BA440 Enclosure
Opening both doors lets you access the components housed in the BA440
enclosure.
System Control
Power Supply
Integrated Storage Elements (ISEs)
Card Cage
MLO-004016
Tape Drive
Panel (SCP)
Console Module
Fans
The BA440 enclosure can contain the following.
• Mass storage — TF-series or TK50, TK70 tape drives and, using the dual-
disk RF31T, RF35, RF36, up to six EF/RF-series ISEs or up to seven EF- to
RF-series ISEs and no tape drive
All enclosures contain the following.
• System control panel (SCP)
• Card cage containing modules — CPU and memory
• Console module
• Power supply
• Fans
1–6 System Overview

1.1.1.1 Mass Storage Shelf
The mass storage shelf extends across the top of the enclosure. It contains a tape
drive, and up to six EF/RF-series ISEs (tapeless systems can have up to seven
EF- to RF-series ISEs). Each ISE has its own controls and indicators.
ISE 3 ISE 2 ISE 1 and 0 Tape Drive
MLO-007696
Instructions for using ISEs and the TF-series or TK50, TK70 tape drives are in
Chapter 3.
System Overview 1–7

1.1.1.2 System Control Panel (SCP)
The system control panel is to the right of the storage devices.
DC OK Indicator
Over Temperature
Warning Indicator
Halt Button
Restart Button
MLO-008343
The SCP controls and indicators function as follows.
Over Temperature Warning Indicator — A red indicator that
flashes when the system internal temperature is approaching a level
that may cause system components to overheat. In addition to the
flashing indicator, an audible alarm provides warning of a possible
over temperature condition. If the components continue to heat, the
system will automatically shut down to prevent components from being
damaged. Section 2.9 provides instruction for turning on the system
after a shutdown due to overheat conditions.
1–8 System Overview

DC OK Indicator — A green indicator that shows the power supply
voltages are within the correct operating range. If the indicator is not
lit when system power is on, refer to your system Troubleshooting and
Diagnostics manual.
Halt Button — A two-position button. When you press it, the system
halts. A red indicator on the button lights when the button is set to the
in position. Before you enter console commands, press the button again
to return it to the out position. When the button is returned to the
out position, the console mode prompt (
>>> ) is displayed on the console
terminal. Now you can enter console commands. If you inadvertently
press the Halt button, type C Return to continue. Chapter 2 describes
halting your system in more detail.
CAUTION
Pressing the Halt button halts the system regardless of the
setting of the Break Enable/Disable switch on the console
module.
Restart Button — It has a green indicator. When you press the
button, the system returns to a power-up condition and self-tests are
run. If you specified a boot device and if the Break/Enable Disable
switch is set to disable, the system will reboot system software.
Further instructions on restarting your system are in Chapter 2.
Note
The Halt and Restart buttons can be disabled to prevent accidental use.
Contact your Digital service representative if you want to disable those
controls.
System Overview 1–9

1.1.1.3 Card Cage
The modules in your system are mounted in a 12-slot card cage under the mass
storage shelf. The number and type of option modules installed in your system
depend on your configuration. A typical configuration would be as follows.
• Slots 1 through 4 are reserved for memory modules.
• Slot 5 is reserved for the CPU. A console module with system controls and
connectors covers those slots.
• Slots 6 through 12 are available for Q–bus option modules.
MLO-004037
Baud
300___________0
600___________1
1200__________2
2400__________3
4800__________4
9600__________5
19200_________6
38400_________7
Bus 1
Bus 0
Y
X
Slots 5 - 1Slots 12 - 6
Each Q–bus slot, even an empty one, is protected by a module cover. Together the
covers form a shield with a threefold purpose:
• Protect external devices from electrical interference generated by the system.
• Protect the system from electrical interference generated by external devices.
• Maintain airflow integrity.
1–10 System Overview

CAUTION
Do not operate your system without Digital-supplied module covers.
They are required to protect the equipment and to meet international
regulatory standards. Do not substitute other module covers as they may
not meet the required specifications.
Operating your system without the module covers has the following
consequences.
• The system may overheat due to improper air circulation.
• The system will not comply with FCC and VDE requirements for
electromagnetic shielding and may produce electrical interference that
affects other equipment.
• The system is susceptible to electrical interference or damage from
external sources.
The design of module covers varies, depending on the type of module installed in
each slot.
• Modules requiring external cable connections, such as communication
controllers, have recessed covers that are riveted directly to the module.
The recessed covers provide space for connecting cables.
• Modules requiring no external cable connections, such as mass storage
controllers, are covered by flush covers. Empty slots are also covered by flush
covers which may be single or double width.
All covers, except those covering empty slots, have a label identifying the module
installed in the slot.
Cables connecting your system to peripheral devices (such as terminals, modems,
and printers) are attached to communication controllers. Each cable can contain
multiple lines. The cables run under the system and out the back or side, where
they are split into individual lines. Chapter 3 describes those connections in more
detail.
System Overview 1–11

1.1.1.4 Console Module
Your system can have up to four memory modules. The memory modules occupy
the first four slots of the card cage and are followed by the CPU. The memory and
CPU modules are behind a console module that covers the first five slots. The
console module has several system controls and connectors.
Baud
300___________0
600___________1
1200__________2
2400__________3
4800__________4
9600__________5
19200_________6
38400_________7
Bus 1
Bus 0
Y
X
Power-Up
Mode Switch
Baud Rate
Select Switch
LED Display
DSSI
Connectors
Modified
Modular Jack
Break Enable/
Disable Switch
Bus Node
Ethernet
Connector
Standard
Ethernet
ThinWire
Ethernet
ID Plugs
Connector
Connector
Switch
(External
Bus,
Bus 1)
MLO-004038
Power-Up Mode Switch — A three-position rotary switch that
determines how your system responds at power-up:
Language Inquiry Mode (the top position, indicated by
a profile of a human face) causes your system to display a
language selection menu at power-up if your console terminal
supports multiple languages. If a default boot device is not
selected, this mode displays a list of bootable devices and
prompts you to select a device from the list. Once you select a
device, your system autoboots from that device each time you
turn it on.
1–12 System Overview