Ebyte E21-400G37S User manual

E21-400G37S
User Manual
ISM band 433/470MHz patch type PA/LNA amplifier module

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 1
CONTENT
Disclaimer and copyright notice.......................................................................................................................................................2
Chapter I Overview..................................................................................................................................................................................... 3
1.1 Introduction................................................................................................................................................................................ 3
1.2 Features and functions......................................................................................................................................................... 3
Chapter II Specifications.....................................................................................................................................................................4
2.1 Limit parameter..........................................................................................................................................................................4
2.2 Working parameters...................................................................................................................................................................4
2.3 Parametric curve....................................................................................................................................................................... 4
Chapter 3 Mechanical Dimensions and Pin Definitions........................................................................................................ 6
Chapter 4 Basic Operation.....................................................................................................................................................................7
4. 1 Hardware design........................................................................................................................................................................... 7
4. 2 Software Edit...................................................................................................................................................................................8
Chapter 5 Basic Application................................................................................................................................................................ 8
5.1 Basic circuit.............................................................................................................................................................................. 8
Chapter 6 FAQ.................................................................................................................................................................................................9
6.1 Transmission distance is not ideal.......................................................................................................................................9
6. 2 Modules are easily damaged....................................................................................................................................................9
Chapter 7 Welding Operation Guidance........................................................................................................................................... 9
7.1 Reflow soldering temperature........................................................................................................................................... 9
7.2 Reflow welding curve........................................................................................................................................................... 10
Chapter 8 Related Models.....................................................................................................................................................................10
Chapter 9 Antenna Guide....................................................................................................................................................................... 11
9.1 Antenna recommendation.......................................................................................................................................................11
Chapter 10 Batch Packaging Method................................................................................................................................................12
Revision History....................................................................................................................................................................................... 12
About us .......................................................................................................................................................................................................... 12

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 2
Disclaimer and copyright notice
The information in this document, including the URL for reference, is subject to change without
notice. The document is provided "as is" without any warranty, including any warranty of
merchantability, fitness for a particular purpose or non infringement, and any warranty
mentioned elsewhere for any proposal, specification or sample. This document does not bear
any responsibility, including the responsibility for infringement of any patent rights arising
from the use of the information in this document. This document does not grant any license
to use intellectual property rights, whether express or implied, by estoppel or otherwise.
The test data obtained in this paper are all from the test of the Yibaite laboratory, and
the actual results may be slightly different.
It is hereby declared that all trade names, trademarks and registered trademarks mentioned
herein are the property of their respective owners.
Chengdu Yibaite Electronic Technology Co., Ltd. reserves the right of final interpretation.
be careful:
The content of this manual may change due to product version upgrade or other reasons. EBT
Electronic Technology Co., Ltd. reserves the right to modify the contents of this manual
without any notice or prompt. This manual is only used as a guide. Chengdu EBT Electronic
Technology Co., Ltd. makes every effort to provide accurate information in this manual, but
Chengdu EBT Electronic Technology Co., Ltd. does not ensure that the contents of the manual
are completely free of errors, and all statements, information and suggestions in this manual
do not constitute any express or implied warranty.

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 3
Chapter I Overview
1.1 Introduction
E21-400G37S is a pure hardware RF medium power amplifier (PA)
launched by Chengdu Yibaite Company. The maximum output power is 37dBm,
covering the frequency range of 410~493MHz. The module has a built-in
LNA low noise amplifier, which greatly improves the communication
distance between wireless networks.
The imported high-quality PA chip+our unique design scheme can
greatly improve the working efficiency of PA, lower the working
temperature, and enable continuous data transmission under the ambient
temperature of - 40 -+85 degrees. Built in LNA low noise amplifier,
filter, limiting device, low noise figure, improve the receiving
sensitivity of the receiving channel, and expand the communication distance.
Ultra low power consumption design, standby current is only 3uA, control mode is simple, only two I/O ports
are required for receiving and transmitting control switching, SOP chip design mode, ultra small size, very easy
to embed, the entire scheme is designed according to industrial grade, and the back is large area of bare copper,
customers can simply and reasonably add appropriate heat dissipation treatment according to requirements. Ultra
high stability, suitable for a variety of application scenarios, has been widely used in various industries, with
stable performance, long transmission distance, strong penetration and diffraction ability, etc.
1.2 Features and functions
Under ideal conditions, the communication distance can reach 20km;
The maximum transmission power is 37dBm;
410~493MHz frequency band;
High efficiency PA power amplifier, with PA efficiency above 40%;
LNA low noise amplifier, sensitivity increased by 14-17dB;
Built in amplitude limiting device to limit the input power amplitude of the receiving channel;
Ultra low power consumption design, standby current is only 3uA;
Support 3.3~5.5V internal control power supply and 7.5V PA power supply;
Industrial standard design, supporting long-term use at - 40~+85 ℃;
The installation of stamp hole patch is conducive to integration and mass production.

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 4
Chapter II Specifications
2.1 Limit parameter
Main parameter
Performance
Note
Min
Max
Supply voltage (V)
3.3
5.5
Permanently burned modules over 6V
PA drive voltage (V)
7.4
7.6
Default 7.5V power supply can output full power
Blocking power (dBm)
-
10dbm
High burning probability of high-power module
in close use
Operating temperature (℃)
-40
+85
Industrial grade
2.2 Working parameters
Main parameter
Performance
Note
Min
Type
Max
Supply voltage (V)
3.3
5
5.5
≥ 4.7V guaranteed output power
PA control voltage (V)
7.4
7.5
7.6
7.5V is recommended to ensure the best
performance
Operating temperature (℃)
-40
25
+85
Industrial grade design
Operating frequency band
(MHz)
410
-
493
ISM band
Power
waste
Emission current (mA)
1400
1500
1600
Instantaneous power 37dBm (power supply
voltage 5V, PA voltage 7.5V test)
Receiving current
(mA)
6.5
8
-
-100dBm input current 8mA
Sleep current（ μ A）
3.0
T/RX_EN = 0
Maximum transmit power (dBm)
36
37
38
The front stage input power is greater than
17dBm, which can ensure full power output
Receive gain (dBm)
14
15
17
-100dBm input
2.3 Parametric curve
Main parameter
Description
Note
Reference distance
20Km
Clear and open environment, antenna gain 5dBi, antenna height
2m, air speed 2.4kbps
Packaging method
SMD
/
Interface mode
1.5mm
Stamp hole
Overall dimensions
45*30mm
/
RF input/output interface
Stamp/IPX
Equivalent impedance about 50 Ω

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 5
2.3.1 Power
2.3.2 Smith and SWR

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 6
Chapter 3 Mechanical Dimensions and Pin Definitions
PIN
Name
Direction
Usage
1
GND
Ground wire, connected to reference ground
2
+7.5V
PA drive power VCC1
3
+7.5V
PA drive power VCC1
4
GND
Ground wire, connected to reference ground
5
+5V
Control power supply VCC2
6
GND
Ground wire, connected to reference ground
7
TXEN
Input
Enable the transmission mode, effective at high level
(support 3.3V/5V level)
8
RXEN
Input
Receive mode enable, active at high level (support
3.3V/5V level)
9
GND
Ground wire, connected to reference ground
10
PIN
Input/Output
Transmission mode: RF signal input/reception mode: RF
signal output
11
POUT
Output/Input
Transmission mode: RF signal output/reception mode: RF
signal input
12
GND
Ground wire, connected to reference ground
13
GND
Ground wire, connected to reference ground
14
GND
Ground wire, connected to reference ground
15
GND
Ground wire, connected to reference ground
16
GND
Ground wire, connected to reference ground
17
GND
Bottom heat dissipation pad, connecting module GND

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 7
Note:
1. TXEN and RXEN cannot be opened at the same time at any time, which may cause direct damage to
PA module.
2. The bottom bonding pad is connected to the internal GND, which needs to be coated with silicone
grease for heat dissipation or welded to the base plate to enhance heat dissipation.
Chapter 4 Basic Operation
4. 1 Hardware design
It is recommended to use DC regulated power supply to supply power to the module. The ripple coefficient
of the power supply should be as small as possible. The module should be reliably grounded. It is recommended
to use power supply above 20W;
Please pay attention to the correct connection of the positive and negative poles of the power supply. If
the connection is reversed, the module may be permanently damaged;
Please check the power supply to ensure that it is between the recommended power supply voltages. If it exceeds
the maximum value, the module will be permanently damaged;
Please check the stability of the power supply, and the voltage cannot fluctuate significantly and frequently;
When designing power supply circuit for modules, it is often recommended to reserve more than 30% margin,
which is conducive to long-term stable operation of the whole machine;
The module shall be as far away from power supply, transformer, high-frequency wiring and other parts with
large electromagnetic interference as possible;
High frequency digital wiring, high frequency analog wiring and power wiring must avoid the lower part of
the module. If it is really necessary to pass under the module, suppose that the module is welded on the
Top Layer, and the top layer of the module contact part is paved with copper (all are paved with copper and
well grounded), and must be close to the digital part of the module and routed on the Bottom Layer;
If the module is welded or placed in the top layer, it is also wrong to randomly route in the bottom layer
or other layers, which will affect the stray and receiving sensitivity of the module to varying degrees;
If there are components with large electromagnetic interference around the module, it will also greatly affect
the performance of the module. According to the intensity of the interference, it is recommended to keep
away from the module properly. If circumstances permit, appropriate isolation and shielding can be done;
Assuming that there are wiring (high-frequency digital, high-frequency analog, power wiring) with large
electromagnetic interference around the module will also greatly affect the performance of the module, it
is recommended to keep away from the module appropriately according to the intensity of the interference,
and appropriate isolation and shielding can be done if circumstances permit;
The antenna installation structure has a great impact on the module performance. It is necessary to ensure
that the antenna is exposed, preferably vertically upwards. When the module is installed inside the enclosure,
high-quality antenna extension cable can be used to extend the antenna outside the enclosure;
The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.
Pay attention to the good grounding, large area of grounding, small power ripple, increase the filter capacitor
and try to be close to the VCC and GND pins of the module;

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 8
4. 2 Software Edit
1. Mode description
Note: TX will be sent 2mS in advance_ EN is opened, and start time is reserved;
Pin Name
Mode
Note
TXEN
RXEN
External input high and low level, select mode
(support 3.3/5V level)
L
L
Sleep mode
When the module enters the sleep mode, PA and LNA
do not work
L
H
Receiving
mode
When the module enters the receiving mode, PA does
not work and LNA works
H
L
Emission
mode
The module enters the transmission mode, PA works,
LNA does not work
H
H
Not allow
TXEN and RXEN cannot be high level at the same time,
including program initialization, otherwise the
module will be permanently damaged
Chapter 5 Basic Application
5.1 Basic circuit

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 9
Chapter 6 FAQ
6.1 Transmission distance is not ideal
When there is a linear communication obstacle, the communication distance will decay accordingly;
Temperature, humidity and co frequency interference will lead to higher communication packet loss rate;
The ground absorbs and reflects radio waves, and the test effect near the ground is poor;
The sea water has a strong ability to absorb radio waves, so the seaside test effect is poor;
If there are metal objects near the antenna or placed in the metal shell, the signal attenuation will be very serious;
The power register is set incorrectly, and the air rate is set too high (the higher the air rate, the closer the distance);
The low voltage of the power supply is lower than the recommended value at room temperature, and the lower the
voltage, the smaller the power generation;
The matching degree between the antenna and the module is poor or the quality of the antenna itself is poor.
6. 2 Modules are easily damaged
Please check the power supply to ensure that it is between the recommended power supply voltages. If it exceeds the
maximum value, the module will be permanently damaged;
Please check the stability of the power supply, and the voltage cannot fluctuate significantly and frequently;
Please ensure anti-static operation during installation and use, and electrostatic sensitivity of high-frequency devices;
Please ensure that the humidity during installation and use is not too high, and some components are humidity
sensitive devices;
If there is no special demand, it is not recommended to use it at too high or too low temperature.
Chapter 7 Welding Operation Guidance
7.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Warm up time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rate of rise
3℃/second max
3℃/second max

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 10
Liquidous Temperature (TL)
Liquid phase
temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average falling rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25 ℃ to peak
temperature
6 minutes max
8 minutes max
7.2 Reflow welding curve
Chapter 8 Related Models
Model
PA + LNA
Frequency
PA maximum
power
LNA gain
Packaging
form
Antenna form
MHz
dBm
dBm
E21-400G30S
√
400~470
30
15
SMD
Stamp hole
E21-900G30S
√
850~931
30
12
SMD
Stamp hole

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 11
Chapter 9 Antenna Guide
9.1 Antenna recommendation
Antennas play an important role in the communication process, and poor quality antennas often have a great impact on
the communication system. Therefore, we recommend some antennas to be used as antennas supporting our wireless
modules with excellent performance and reasonable price.
Model
Type
Frequency
Gain
Size
Feeder
Interface
Feature
MHz
dBi
cm
cm
TX433-XP-200
Sucker
400~470
4
1.9
200
SMA-J
Ultra short straight,
omnidirectional antenna
TX433-JKD-20
Rubber
400~470
4
2.0
/
SMA-J
Bendable rubber rod,
omnidirectional antenna
TX868-XPL-100
Sucker
850~900
3.5
2.9
100
SMA-J
Small sucker antenna,
cost-effective
TX868-JKD-20
Rubber
850~900
3.0
2.0
/
SMA-J
Bendable rubber rod,
omnidirectional antenna
TX915-XPL-100
Sucker
900~931
3.5
2.6
100
SMA-J
Small sucker antenna,
cost-effective
TX868-JKS-20
Rubber
900~931
3.0
2.1
/
SMA-J
Bendable rubber rod,
omnidirectional antenna

Chengdu Ebyte Electronic Technology Co., Ltd E21-400G37 User Manual
Copyright ©2012–2019, hengdu Ebyte Electronic Technology Co., Ltd 12
Chapter 10 Batch Packaging Method
Revision History
Version
Revision date
Description
Maintainer
1.0
2021-8-31
First published
LJ
1.1
2022-10-12
Parameter
confirmation
Yan
About us
Hotline：[phone] Telephone：[phone]
Support：[e-mail] Website：https://www.es-ebyte.com/
Address：Building B2 and Building B5, No. 199, West District Avenue, High
tech West District, Chengdu, Sichuan