Ebyte E22-400M33S User manual

1
E22-400M33S User Manual
SX1268 433/470MHz 2W SPI Chip LoRa Module

E22-400M33S User Manual
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Content
DISCLAIMER................................................................................................................................................................................................................................3
1. OVERVIEW............................................................................................................................................................................................................................... 4
1.1 INTRODUCTION ........................................................................................................................................................................................4
1.2 FEATURES ................................................................................................................................................................................................. 4
1.3 APPLICATION SCENARIOS ..................................................................................................................................................................... 5
2. SPECIFICATION PARAMETERS......................................................................................................................................................................................5
2.1 LIMIT PARAMETERS ................................................................................................................................................................................5
2.2 WORKING PARAMETERS ........................................................................................................................................................................5
3. MECHANICAL DIMENSIONS AND PIN DEFINITION ..........................................................................................................................................6
4. BASIC OPERATION...............................................................................................................................................................................................................8
4.1 HARDWARE DESIGN ...............................................................................................................................................................................8
4.2 SOFTWARE WRITING ..............................................................................................................................................................................9
5. BASIC APPLICATIONS ......................................................................................................................................................................................................10
5.1 BASIC CIRCUITS ................................................................................................................................................................................... 10
6. FREQUENTLY ASKED QUESTIONS...........................................................................................................................................................................10
6.1 COMMUNICATION RANGE IS TOO SHORT .........................................................................................................................................10
6.2 MODULE IS EASY TO DAMAGE .......................................................................................................................................................... 11
6.3 BER IS TOO HIGH .................................................................................................................................................................................11
7. WELDING WORK INSTRUCTION ............................................................................................................................................................................... 11
7.1 REFLOW TEMPERATURE ..................................................................................................................................................................... 11
7.2 REFLOW PROFILE .................................................................................................................................................................................11
8. RELATED MODELS ............................................................................................................................................................................................................12
9. ANTENNA GUIDE ............................................................................................................................................................................................................... 13
9.1 ANTENNA RECOMMENDATIONS ........................................................................................................................................................ 13
10. BATCH PACKING METHOD ........................................................................................................................................................................................ 14
REVISION HISTORY...............................................................................................................................................................................................................15
ABOUT US...................................................................................................................................................................................................................................15

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Disclaimer
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Products, names, logos and designs described herein may in whole or in part be
subject to intellectual property rights. Reproduction, use, modification or disclosure to
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liability for the use of the information. No warranty, either express or implied, is given,
including but not limited, with respect to the accuracy, correctness, reliability and
fitness for a particular purpose of the information. This document may be revised by
EBYTE at any time. For most recent documents, visit www.ebyte.com.

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1. Overview
1.1 Introduction
E22-400M33S is based on the new generation of LoRaTM RF chip
SX1268 produced by Semtech in the United States as the core of
independent research and development of the maximum power of 2W and
suitable for 433/470MHz SMD LoRaTM wireless module, using
industrial-grade high-precision 32MHz crystal oscillator.
Since the original imported SX1268 is used as the core of the
module, the power amplifier (PA) and low noise amplifier (LNA) are built
in on top of the original one, which makes the maximum transmitting
power reach 2W and further improve the receiving sensitivity, and the
overall communication stability is greatly improved compared with the products without power amplifier and low noise
amplifier. Compared with the previous generation of LoRaTM transceivers, the anti-interference performance and
communication distance have been improved, further widening the gap with products of FSK and GFSK modulation
methods. The product can cover an ultra-wide applicable frequency range from 410 to 493MHz and is backward
compatible with SX1278 and SX1276.
As this module is pure RF transceiver module, it needs to use MCU driver or use special SPI debugging tool.
1.2 Features
Compared with the SX1278 module, the SX1268 module has the significant advantages of lower power
consumption, higher speed and longer distance.
Communication distance up to 16km under ideal conditions.
Built-in PA+LNA, which substantially improves the communication distance and communication stability.
Maximum transmitting power of 2W, adjustable in multiple levels by software.
Support for global license-free ISM 433/470MHz band.
Support multiple modulation modes, LoRaTM/FSK/GFSK/MSK/GMSK/OOK;
Support data transmission rate from 0.018k to 62.5kbps in LoRaTM mode.
FSK mode support for data rates up to 300kpbs.
Downward compatibility with SX1278/SX1276 series RF transceivers.
Large FIFO capacity, supporting 256 Byte data cache.
A new SF5 spread spectrum factor introduced to support dense networks.
support for 3.3 to 5.5V power supply, greater than 5V power supply are available to ensure the best performance.

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Industrial-standard design, supporting extended use at -40 to +85°C.
Dual antennas optional (IPEX/stamp hole) for user-friendly secondary development and easy integration.
1.3 Application Scenarios
Home security alarms and remote keyless entry.
Smart home as well as industrial sensors, etc..
Wireless alarm security systems.
Building automation solutions.
Wireless industrial grade remote controls.
Advanced meter reading architecture (AMI).
Automotive industry applications.
2. Specification parameters
2.1 Limit parameters
Main parameters
Performance
Remarks
Minimum
value
Maximum
value
Supply Voltage（V）
0
5.5
Permanent module burnout above 5.5V
Blocking power（dBm）
-
10
The probability of burning is small when used in
close proximity
Operating temperature（℃）
-40
+85
Industrial Grade
2.2 Working parameters
Main parameters
Performance
Remarks
Minimum
value
Typical
values
Maximum
value
Operating Voltage（V）
3.3
5.0
5.5
≥5.0V Guaranteed output
power
Communication level（V）
3.3
Risk of burnout with 5V TTL
Operating temperature（℃）
-40
-
+85
Industrial grade design
Operating Frequency Band（MHz）
410
433/470
493
ISM band support
Power
consumpt
ion
Emission current（mA）
650
Instantaneous power
consumption
Receiving current（mA）
14

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Dormant current（uA）
2
Software shutdown
Maximum transmitting power（dBm）
32.5
33.0
33.5
Reception sensitivity（dBm）
-124
-125
-126
Airspeed 0.3kbps
airspeed（bps）
0.6k
-
300k
User-programmed control
0.018k
-
62.5k
User-programmed control
Main parameters
Description
Remarks
Reference Distance
12km
Clear and open, antenna gain 5dBi, antenna height 2.5m, air rate
0.3kbps
FIFO
256Byte
Maximum length of a single transmission
Crystal Frequency
32MHz
Modulation mode
LoRa(Recomm
end)
Packaging method
SMD
Interface method
2.54mm
Stamp Holes
Communication Interface
SPI
0～10Mbps
Dimension
38.5*24mm
Antenna Interface
Stamp
Holes/IPEX
Equivalent impedance about 50Ω
Weight
4.9g
±0.1g

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3. Mechanical dimensions and pin definition
Pin Serial
Number
Pin Name
Pin
Orientation
Pin Usage
1
GND
Ground wire, connected to power reference ground
2
GND
Ground wire, connected to power reference ground
3
GND
Ground wire, connected to power reference ground
4
GND
Ground wire, connected to power reference ground
5
GND
Ground wire, connected to power reference ground
6
RXEN
Input
RF switch receive control pin, connected to external microcontroller
IO, active high
7
TXEN
Input
RF switch transmit control pin, connected to external microcontroller
IO or DIO2, active high
8
DIO2
Input/Output
Configurable general purpose IO port (see SX1268 manual for details)
9
VCC
Power supply, range 3.3 to 5.5V (it is recommended to increase the
external ceramic filter capacitor)
10
VCC
Power supply, range 3.3 to 5.5V (it is recommended to increase the
external ceramic filter capacitor)
11
GND
Ground wire, connected to power reference ground
12
GND
Ground wire, connected to power reference ground
13
DIO1
Input/Output
Configurable general purpose IO port (see SX1268 manual for details)

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14
BUSY
Output
For status indication (see SX1268 manual for details)
15
NRST
Input
Chip reset trigger Input pin, active low
16
MISO
Output
SPI Data Output Pin
17
MOSI
Input
SPI Data Input Pin
18
SCK
Input
SPI Clock Input Pin
19
NSS
Input
Module chip select pin to start an SPI communication
20
GND
Ground wire, connected to power reference ground
21
ANT
Antenna connector, stamp hole (50Ω characteristic impedance)
22
GND
Ground wire, connected to power reference ground
4. Basic operation
4.1 Hardware Design
Recommend using a DC regulated power supply to power the module with as small a ripple coefficient as possible,
and the module needs to be reliably grounded.
Please pay attention to the correct connection of the positive and negative terminals of the power supply, as a
reversed connection may cause permanent damage to the module.
Please check the power supply to ensure that it is between the recommended supply voltage, if it exceeds the
maximum value it may cause permanent damage to the module.
Please check the stability of the power supply, the voltage should not fluctuate significantly and frequently.
When designing the power supply circuit for the module, it is often recommended to retain more than 30% margin
to have the whole machine conducive to long-term stable operation.
modules should be as far away as possible from the power supply, transformers, high-frequency alignments and
other parts of the electromagnetic interference.
High-frequency digital alignment, high-frequency analog alignment, power supply alignment must be avoided
below the module, if it is necessary to pass below the module, assuming that the module is soldered in the Top
Layer, in the module contact part of the Top Layer pavement copper (all pavement copper and good grounding),
must be close to the digital part of the module and alignment in the Bottom Layer.
Assuming that the module is soldered or placed in the Top Layer, it is also wrong to run wires randomly in the
Bottom Layer or other layers, which will affect the spurious and reception sensitivity of the module to varying
degrees.
Assuming that there are large electromagnetic interference devices around the module will also greatly affect the
performance of the module, according to the strength of the interference is recommended to be properly away from
the module, if the situation allows the appropriate isolation and shielding.
Assuming that there are large electromagnetic interference alignments around the module (high-frequency digital,
high-frequency analog, power supply alignments) will also greatly affect the performance of the module, according
to the intensity of the interference, it is recommended to keep away from the module, and if the situation permits,

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appropriate isolation and shielding can be done.
communication line if the use of 5V level, must be connected in series with 1k-5.1k resistors (not recommended,
there is still a risk of damage).
try to stay away from some of the physical layer is also 2.4GHz TTL protocol, for example: USB3.0.
Antenna mounting structure has a big impact on the module performance, make sure the antenna is exposed,
preferably vertically up. When the module is installed inside the case, you can use a high quality antenna extension
cable to extend the antenna to the outside of the case.
The antenna must not be installed inside the metal case, it will cause the transmission distance to be greatly
weakened.
It is recommended to add 200R protection resistors to the RXD/TXD of the external MCU.
4.2 Software Writing
This module is SX1268/SX1262+PA+LNA, its driving method is fully equivalent to SX1268/SX1262, users can
operate exactly according to SX1268/SX1262 chip book.
DIO1 and DIO2 are general-purpose IO ports, which can be configured for various functions; among them, DIO2
can be connected to TXEN and not to the MCU IO port for controlling RF switch emission, see SX1262 manual for
details, which can be suspended if not used.
Internal use DIO3 for 32MHz TCXO crystal power supply (DIO3 configuration output 1.8V)

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5. Basic Applications
5.1 Basic Circuits
6. Frequently Asked Questions
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage is lower than recommended under room temperature. The lower the voltage is, the
smaller the transmitting power is.
Due to antenna quality or poor matching between antenna and module.

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6.2 Module is easy to damage
Please check the power supply to ensure that it is within the recommended value. If it exceeds the maximum value,
the module will be permanently damaged;
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER is too high
There is interference from the same frequency signal nearby, stay away from the interference source or modify the
frequency and channel to avoid interference.
The clock waveform on the SPI is not standard, check whether there is interference on the SPI line, and the SPI bus
alignment should not be too long.
Unsatisfactory power supply may also cause garbled code, be sure to ensure the reliability of the power supply.
Poor quality or too long extension cable or feeder line may also cause high BER.
7. Welding work instruction
7.1 Reflow Temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Warm-up time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rise rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
liquid phase temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above the liquid
phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average drop rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25°C to peak
temperature
6 minutes max
8 minutes max
7.2 Reflow Profile

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8. Related Models
SKU
Chip
Frequency
Hz
Transmitting
power
dBm
Test
Distance
km
Package
Size
mm
Communicatio
n Interface
E22-400M22S
SX1268
433/470M
22
7
SMD
14*20
SPI
E22-900M22S
SX1262
868/915M
22
7
SMD
14*20
SPI
E22-400M33S
SX1268
433/470M
30
12
SMD
24*38.5
SPI
E22-900M30S
SX1262
868/915M
30
12
SMD
24*38.5
SPI
E22-230T22S
SX1262
230M
22
5
SMD
16*26
TTL
E22-400T22S
SX1268
433/470M
22
5
SMD
16*26
TTL
E22-900T22S
SX1262
868/915M
22
5
SMD
16*26
TTL
E22-230T30S
SX1262
230M
30
10
SMD
25*40.5
TTL
E22-400T30S
SX1268
433/470M
30
10
SMD
25*40.5
TTL
E22-900T30S
SX1262
868/915M
30
10
SMD
25*40.5
TTL

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9. Antenna Guide
9.1 Antenna Recommendations
Antenna is an important role in the communication process, often poor quality antenna will have a great impact on the
communication system, so we recommend some antennas as supporting our wireless module and more excellent
performance and reasonable price.
SKU
Type
Frequency
Hz
Interface
Gain
dBi
Height
mm
Feeders
cm
Function
TX433-NP-431
0
Flexible
Antenna
433M
Welding
2.0
43.8*9.5
-
Built-in flexible, FPC soft
antenna
TX433-JZ-5
Glue Stick
Antenna
433M
SMA-J
2.0
52
-
Ultra Short Straight,
Omni-directional Antenna
TX433-JZG-6
Glue Stick
Antenna
433M
SMA-J
2.5
62
-
Ultra Short Straight,
Omni-directional Antenna
TX433-JW-5
Glue Stick
Antenna
433M
SMA-J
2.0
50
-
Bendable glue stick,
omni-directional antenna
TX433-JWG-7
Glue Stick
Antenna
433M
SMA-J
2.5
75
-
Bendable glue stick,
omni-directional antenna
TX433-JK-11
Glue Stick
Antenna
433M
SMA-J
2.5
110
-
可Bendable glue stick,
omni-directional antenna
TX433-JK-20
Glue Stick
Antenna
433M
SMA-J
3.0
210
-
可Bendable glue stick,
omni-directional antenna
TX433-XPL-10
0
Suction cup
antenna
433M
SMA-J
3.5
185
100
Small Suction cup antenna，
Cost effectiveness
TX433-XP-200
Suction cup
antenna
433M
SMA-J
4.0
190
200
Middle Suction cup
antenna，Low loss
TX433-XPH-30
0
Suction cup
antenna
433M
SMA-J
6.0
965
300
Big Suction cup antenna，
High Gain
TX490-JZ-5
Glue Stick
Antenna
470/490M
SMA-J
2.0
50
-
Ultra Short Straight,
Omni-directional Antenna
TX490-XPL-10
0
Suction cup
antenna
470/490M
SMA-J
3.5
120
100
Small Suction cup antenna，
Cost effectiveness

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10. Batch packing method

15
Revision history
Version
Revision Date
Revision Notes
Maintaining people
1.0
2022-10-20
Manual Release
Yan
1.1
2022-12-6
Bug fixes
Yan
About us
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