EKE-Electronics EKE-Trainnet DIO2908A User manual

EKE-Trainnet®
DIO2908A
Digital Input Output Module
DIO SIL Technical Manual

EKE-Electronics Ltd.
Piispanportti 7, FIN-02240 Espoo, FINLAND
Tel. [phone]
Fax [phone]
e-mail: [e-mail]
Marketing and sales
e-mail: [e-mail]
TMS implementations, passenger train functions and
IEC 61131-3 type application programming
e-mail: [e-mail]
Technical support and maintenance requests
e-mail: [email protected]om
The most recent information on EKE Electronics’ products and services is available at www.eke.com.
Under copyright law no part of this document may be copied, reproduced or transferred electrically or
manually, not even partly, without prior written permission of EKE-Electronics Ltd. This document is subject
to change without notice.
The EKE-Trainnet® is a registered trademark of EKE-Electronics Ltd.
Copyright © 2013 EKE-Electronics Ltd. All rights reserved.
EKE-Trainnet®DIO2908A Digital Input Output Module SIL Technical Manual ver. 1.00

1. General information ............................................................................................. 4
Symbols used in this manual......................................................................... 51.1
Safety considerations .................................................................................... 61.2
1.2.1 Considerations in safety system design..................................................... 6
Correct handling of the module...................................................................... 61.3
Disposal of the module.................................................................................. 61.4
2. DIO module features and operation.................................................................... 8
Module identification...................................................................................... 82.1
DIO module features.................................................................................... 102.2
DIO module- Secure Application connection............................................... 112.3
Inputs........................................................................................................... 122.4
2.4.1 Input wetting current ................................................................................ 12
2.4.2 Input read rate.......................................................................................... 12
2.4.3 Input thresholds....................................................................................... 12
2.4.4 Input self-test ........................................................................................... 13
2.4.5 Data reply message................................................................................. 13
Outputs........................................................................................................ 152.5
2.5.1 Output control.......................................................................................... 15
2.5.2 Output readback ...................................................................................... 16
2.5.3 Output protection ..................................................................................... 16
2.5.4 Outputs at startup .................................................................................... 18
2.5.5 Output emergency states......................................................................... 18
3. Installation........................................................................................................... 19
Warnings ..................................................................................................... 193.1
Cable Recommendations ............................................................................ 203.2
3.2.1 I/O cable .................................................................................................. 20
3.2.2 Installing the I/O cable on the module...................................................... 21
4. Technical data..................................................................................................... 22
Non-metallic parts........................................................................................ 224.1
I/O Connector (X1)....................................................................................... 234.2
Electrical specifications................................................................................ 244.3
Reliability..................................................................................................... 254.4
Safety .......................................................................................................... 254.5
Insulation and voltage withstand.................................................................. 254.6
Environmental and EMC test specifications................................................. 264.7
Contents
EKE-Electronics Ltd. pursues a policy of continual product development. Although
every effort is made to produce up-to-date product documentation this publication should
not be regarded as an infallible guide to current specifications. We reserve the right to
make changes without prior notice.
COPYRIGHT EKE-ELECTRONICS LTD. 2013

General information
DIO2908A SIL Technical Manual ver. 1.00 4
1. General information
This is the SIL Technical Manual for the EKE-Trainnet® DIO2908A Digital Input Output
H module.
This manual is for system user and for designers.
This manual contains following chapters:
Chapter 1: General information
Chapter 2: DIO module features and operation
Chapter 3: Installation
Chapter 4: Technical data
This manual does not include information on other EKE-Trainnet®
products than the DIO SIL module. If you need information about
other EKE-Trainnet® products (e.g. modules, racks or accessories),
refer to the manual of the product in question.
This chapter includes general information about this manual. The following topics are
covered in this chapter:
Symbols used in this manual
Safety considerations
Correct handling of the module
Disposal of the module

General information
5DIO2908A SIL Technical Manual ver. 1.00
Symbols used in this manual1.1
In this manual, situations that require caution are marked with special warning symbols.
The warning symbols appear in the beginning of the appropriate chapter. The following
symbols are used.
Figure 1.1 Electric shock warning symbol
Figure 1.2 ESD warning symbol
Figure 1.3 General caution symbol
Figure 1.4 Note symbol
Figure 1.5 Separate collection for Waste Electrical and Electronic Equipment according to
Directive 2002/96/EC (WEEE)

General information
DIO2908A SIL Technical Manual ver. 1.00 6
Safety considerations1.2
It is not allowed to remove the DIO module from system / rack. It
is also not allowed to update the module software or to perform
module level diagnostics or repairs.
1.2.1Considerations in safety system design
It is not possible to detect all possible module internal errors. It is recommended to use
the following design guidelines:
The safe-state design approach and output readback should be implemented on
application level.
To increase availability the system level redundancy should be implemented.
In case there is communication error on the module level the module safe state
will be activated (refer to chapter 2.5.5 on p.18).
Correct handling of the module1.3
Electrostatic discharge (ESD) can damage electronic circuits. EKE products are
protected against ESD. However, you run the risk of delivering electrostatic discharges
to the module whenever you handle it or any of its components.
To avoid this risk, only handle the DIO module at a static-free workstation. If this is not
possible, you must ground yourself using a wrist strap and a resistive connection cord.
Remember to handle the module according to these instructions even when you are
removing a defective module and sending it to maintenance.
Disposal of the module1.4
In order to reduce the environmental load over the product’s entire lifecycle,
EKE-Electronics’ products are designed to be as safe as possible to manufacture, use,
and dispose of
Parts which can be recycled should always be taken to the appropriate processing
centres, after hazardous waste has been removed. All parts and components containing
hazardous materials must be disposed of in accordance with waste legislation and
instructions issued by the environmental authorities. The risks involved and the
necessary precautions must be taken into account when handling waste products.
Therefore, please execute proper processing of disposal in accordance with local law.

General information
7DIO2908A SIL Technical Manual ver. 1.00
Table 1.1 Disposal of the DIO module, X = action, (X) = action in cases where
processing is available
Part Main materials
of disposal Recyclable materials Waste disposal sites Hazardous waste (separate
collection)
Frame and
covers
Metal
Plastic
Rubber
Aluminium
Stainless steel
PUR, PU
Other plastics
X
X
X
X
X
Component
boards
Lead
(X)
X
Packing
Cardboard PE X X

DIO module features and operation
DIO2908A SIL Technical Manual ver. 1.008
2. DIO module features and
operation
This chapter includes information about DIO module functionality and features.
Module identification
DIO module features
DIO module – Secure Application connection
Inputs
Outputs
Module identification2.1
The following figure shows where to find the version and the modification
information.

DIO module features and operation
9DIO2908A SIL Technical Manual ver. 1.00
Figure 2.1 The location of version and modification information
A modification label shows the module modification. It is located on the back
connector. The label includes letters, and the modification is indicated by crossing
out one. If letter A is crossed out, the modification is A, and so on. This modification
field is for the entire module.
The circuit board may have a different modification level, indicated by numbers,
which are printed on the board’s modification field. This is found on the back side of
the circuit board on the lower left section.

DIO module features and operation
DIO2908A SIL Technical Manual ver. 1.0010
The Board test label indicates that the module has gone through the required testing
cycle. It is located above the board modification field.
The Board serial number identifies the module. It is located above the board test
label.
The Board ID above the Board serial number indicates an ID for the circuit board.
The Module ID located just below the front connector indicates an ID for this entire
module.
DIO module features2.2
The DIO module has 32 channels. From all the channels 24 are inputs and eight (8)
may function as either input or output .The Input and Input/Output channels are
divided into two groups that can have different Group Voltages (e.g. 110 V and 24
V). The two groups are not galvanically isolated.
The following figure presents a general functionality diagram of the DIO module.
Figure 2.2 Functionality diagram of the DIO module (I=Input, I/O=Input/Output)