ekwb EK-TIM Indigo Extreme User manual

All disclosures, notices and warranty conditions are being written on EKWB web page. Please check terms of use. Re ision 1.3. Released on 27th of No ember, 2012.
This product is intended for installation only by expert users. Please consult with a qualified technician for installation. Improper installation may result in damage to your equipment. EK Water Bloc s assumes no liability whatsoever, expressed or implied, for the use of these
products, nor their installation. The following instructions are subject to change without notice. Please visit our web site at www.e waterbloc s.com for updates. Before installation of this product please read important notice, disclosure and warranty conditions printed on
the bac of the box or our home page.
STEP 1: QUICK OVERVIEW
STEP 1.1:
EK
-
TIM
Indigo Xtreme
:
Engineered Thermal Interface compatible with
AMD FX,™ Phenom,™ and Athlon™
Indigo Xtreme™ is an Engineered Thermal Interface (ETI)
that fits neatly between a CPU lid and heat sink or water
block to keep CPUs cooler Unlike greases, metallic
thermal interface pads or liquid metal alloys, Indigo
Xtreme is a self-contained and sealed structure, deploying
a Phase Change Metallic Alloy (PCMA) which reflows and
fills surface defects on the CPU lid and heat sink The
resultant interfacial layer is void-free and robust, with low
thermal contact and bulk resistance
Important: Unlike most thermal interface products, the Indigo Xtreme form-factor is
optimized for each application
Attempting to use Indigo Xtreme with CPUs or heat sinks other than those specified
may result in degraded performance or interfacial failure (See: Supported Hardware)
STEP 1.2: Compatibility List:
S pported Hardware:
Supported CPUs: All lidded AMD FX,™
Phenom™ and Athlon™ Processors
S pported Waterblock/Heat Sink Types:
In general, water blocks and heat sinks that contact entire surface of CPU lid are compatible with Indigo
Xtreme All EKWB CPU series water blocks water blocks are supported!
Uns pported Heat Sink Types:
Heat sinks that do not contact entire surface of CPU lid,
or surfaces with channels between mounting base and
heat pipes, are incompatible with Indigo Xtreme
Prior to the installation and reflow of Indigo Xtreme do not disable the Thermal Control
feature that protects your CPU from overheating
STEP 2: INSTALLATION PROCEDURE
STEP 1.3: ETI Kit Contents:
The Indigo Xtreme ETI is offered as part of an Engineered Thermal Interface Kit This kit
includes several cleanroom-grade surface cleaning products for (2) complete installations
The ETI kit includes:
Indigo Xtreme ETIs (2 installations)
Cleanroom-grade dry wiper cloths
Indigo Xtreme Clean™ (sample size)
Pair of powder-free nitrile gloves
Detailed Installation Guide
Check the condition of the ETI kit before installation; if any problem is found,
contact Enerdyne Solutions for a replacement
This FX compatible installation g ide differs from other Indigo Xtreme
models. Read entire instr ctions before beginning installation. Comp ter
operating system and temperat re monitoring tilities m st be installed prior to
se. Contact EKWB S pport if yo have any q estions.
STEP 2.1: Motherboard, CPU and Heat Sink/Block Removal:
Remove the motherboard (from the PC case) and all heat sink clips and support mechanisms from the
motherboard Remove the CPU from the motherboard socket and place on a non-abrasive, lint-free
surface for cleaning
STEP 2.2: Thermal Interface (grease) Compo nd Removal:
Using the supplied dry wiper cloth, apply pressure to thoroughly remove any existing interface
grease from the CPU lid and heat sink Clean with fresh areas of the wiper cloth until no visible
grease residue is detected on the wiper
If removing metal pad or liquid metal TIM residue, refer to manufacturer’s specific
cleaning methods
STEP 2.3: P t on Gloves:
Prior to the final degreasing step, the supplied powder-free nitrile gloves must be worn to prevent any
finger oils or contaminants from contacting the CPU lid, heat sink and ETI surfaces and to prevent skin
contact with Indigo Xtreme Clean™
Stray grease compound can be mitigated as gloves are applied immediately following the
Thermal Interface Compound Removal step
Installation manual for EK-TIM Indigo Extreme™

All disclosures, notices and warranty conditions are being written on EKWB web page. Please check terms of use. Re ision 1.3. Released on 27th of No ember, 2012.
STEP 2.5: CPU Installation:
Install the CPU in the motherboard Refer to motherboard or CPU installation instructions
The ETI can only be applied after correct installation of the CPU
STEP 2.4: Degrease CPU lid and Heat Sink/Block S rfaces:
Saturate a dry wiper cloth with Indigo Xtreme Clean™; use ~1/2 trial size bottle per ETI
installation; thoroughly wipe the CPU lid; repeat with the heat sink interfacial surfaces Continue
to wipe each surface with fresh areas of the wiper until no visible residue is detected on the
wiper Wipe all surfaces of any visible lint, fibers, or particulates
Be prepared to wipe the CPU lid and heat sink surfaces immediately upon saturating
each dry wiper cloth as the Xtreme Clean™ solvent will quickly evaporate When
finished, seal the used wiper in the ETI kit clear bag New CPUs or heat sinks must
be degreased as well Use only the supplied Indigo Xtreme Clean™ for the
degreasing step
Use the Xtreme Clean™ solvent in a well-ventilated area Avoid contact with plastics
(such as keyboards, computer cases, cooling fans, some waterblock housings,
coolant tube fittings, cables, etc ) Also, avoid contact with elastomers (coolant
tubing, gaskets, etc )
STEP 2.6: Indigo Xtreme Handling:
The Indigo Xtreme ETI may be handled on the blue surfaces only
ETI installation requires a lint-free environment
Do not remove the clear Top and Bottom liners prior to the specific installation step Do not
bend, flex or puncture any portion of the ETI Keep all chemical agents (Indigo Xtreme
Clean™, etc ) away from the ETI
STEP 2.7: Bottom Side Liner Removal:
Remove the “Bottom” side rectangular clear
liner by slowly peeling the liner, beginning
from the corner with the white BOTTOM”
label Hold the ETI on the blue edges (with
both hands to prevent any wrinkling or
warping) Do not remove the “Top” liner at
this step
Do not touch the exposed adhesive area after removal of the clear liner Once the
liner has been removed, proceed immediately to Step 2 8: Alignment and Placement
STEP 2.8: Alignment and Placement:
Orientation and alignment of the ETI to the CPU lid
and socket is critical Orient the ETI such that the
Bottom side is facing the CPU lid Refer to the figures
for correct placement
Hold the ETI on the blue edges (with both hands to
prevent any wrinkling or warping) Ensure that the ETI is
oriented with CPU lid/socket as shown
Align the square blue ring to the edge of the CPU lid
before making contact Carefully lower the ETI onto the
CPU lid surface With moderate, downward finger
pressure, completely press down all ETI surfaces onto
the CPU lid by following the square blue alignment ring
It is critical that the square blue alignment ring is completely on the CPU lid and
all blue ring surfaces are thoroughly pressed down
STEP 2.9: Heat Sink/Block Mo nting Hardware Installation:
Any heat sink clip supports may now be mounted over the installed ETI.
The ETI must extend beneath any heat sink clip support/frame and must not be bent
by the frame
Temporarily tape the heat sink clip to the heat sink base to keep the assembly stable
during heat sink mounting
STEP 2.10: Top Side Liner Removal:
Remove the “Top” side rectangular clear liner by slowly peeling the
liner, beginning from the corner with the white “TOP” label
Do not touch any of the clear surfaces after removal
of the clear liner Once the liner has been removed,
proceed immediately to Step 2 11: Heat Sink/Block
Mounting

All disclosures, notices and warranty conditions are being written on EKWB web page. Please check terms of use. Re ision 1.3. Released on 27th of No ember, 2012.
STEP 2.11: Heat Sink/Block Mo nting:
It is imperative that the heat sink or water block is aligned correctly before it makes
contact with the ETI Avoid any twisting on the ETI as the heat sink is
bolted/clamped down Apply a uniform pressure to the sink (while clamping) to
prevent it from shifting Visit the website for application notes specific to your cooler
For Clip and Bolt mo nted sinks/blocks: Initially tighten each bolt to latch onto
the clip support threading Apply uniform torque to all of the bolts (by alternating the
tightening of bolts) until fully tightened For plastic P sh-Pin mo nted
sinks/blocks: Start with the two push-pins opposite the socket hinge and apply
enough force to lock the final two push-pins
STEP 2.12: ETI Reflow:
As part of installation, the Indigo Xtreme ETI must first be heated with the CPU running under load
in order to reflow (melt) the PCMA
The interface is highly thermally resistive without a complete reflow Failure to perform
the exact reflow procedure may result in unacceptable thermal performance
A video demonstration of ETI reflow can be found at EKWB product page:
http://www ekwb com
STEP 3: ETI REFLOW PROCEDURE:
1 Orient the computer such that the motherboard and CPU are in a horizontal position
2 Unplug the CPU (heat sink) fan and case fan(s) For water cooled systems, turn off liquid pump However, you may need to plug in the CPU fan to get the computer to boot
3 Boot the computer into BIOS Clock frequency and voltage must be set back to default Be certain the “Hardware Thermal Control” is enabled Following boot into BIOS, unplug the CPU fan
4 Once in BIOS, proceed quickly into “PC Health Status” typically located at the bottom of the list of options
5 Within PC Health Status, follow the “Current CPU Temperature” (as a single temperature point) as illustrated in the bar graphs and corresponding tables below for your CPU Larger heat
sinks and full copper water blocks will require longer reflow times
#
All FX CPUs All other AM3 CPUs
1
PC is off (at room temperature),
motherboard is in a
horizontal position, and all pumps and fans
are
unplugged
PC is off (at room temperature),
motherboard is in a
horizontal position,
and all pumps and fans are
unplugged
2
Upon booting into BIOS, displayed CPU temperature
will
steadily rise to a peak temperature of ~80-90°C
Upon booting into BIOS, displayed CPU temperature
will
steadily rise to a peak temperature of ~75°C
3
Following the peak, CPU temperature will slowly drop
to
a bottoming point of ~70-75°C
However, during
descent, CPU temperature may stabilize for a moment at
~80°C Continue
to watch the temperature until it drops
to a bottoming point of ~70-75°C
Following the peak, CPU temperature will slowly drop to
a
bottoming point of ~65-70°C
However, during descent,
CPU temperature may stabilize for a moment at ~70°C
Continue to wat
ch the temperature until it drops to a
bottoming point of ~65-70°C
4
Following the bottoming point, the CPU temperature
will
slowly rise again Once CPU temperature has reached
~85°C, shut down computer; allow PC to cool for at least
10 minutes (for heat sinks) or at least 20 minutes (for
water blocks) before booting and connecting fans and/or
pumps.
Following the bottoming point, the CPU temperature
will
slowly rise again Once CPU temperature has reached
~75°C, shut down computer; allow PC to cool for at least
10 minutes (for heat sinks) or at least 20 minutes (for
water blocks) before booting and connecting fans and/or
pumps.
AMD multi-core processors have built-in protection (Hardware Thermal Control) that prevents the processor
from exceeding maximum core temperatures, thereby preventing any damage to the CPU
Avoid any bumping or excessive pressure on the heat sink/water block and keep the computer in the
horizontal position while cooling down.
If the CPU temperature does not follow a similar temperature profile as seen in the previous graphics, then
improper reflow may have occurred Proceed to Step 4 and re-install a new ETI
All FX CPUs
#4
#3
#1
#2
0
10
20
30
40
50
60
70
80
90
100
0 20 40 60
Time (seconds)
CPU Temperature (C)
All other AM3 CPUs
#4
#3
#1
#2
0
10
20
30
40
50
60
70
80
0 20 40 60
Time (seconds)
CPU Temperature (C)

All disclosures, notices and warranty conditions are being written on EKWB web page. Please check terms of use. Re ision 1.3. Released on 27th of No ember, 2012.
STEP 4: REMOVAL OF EK-TIM INDIGO EXTREME:
To disass
emble, release the clamping force from the heat sink/water
block The ETI may then be removed (intact) by first slowly peeling each corner The ETI is designed to adhesively capture excess alloy
(from differences of CPU lid/heat sink interfacial roughness and planarity) on their surfaces Any residual adhesive on the CPU or heat sink/water block may be removed with Xtreme Clean, acetone, or
xylene and a clean wiper or cotton cleaning swab Residual alloy is best removed by wetting a swab with Xtreme Clean and gentling rotating the swab to loosen and collect the alloy particles
Indigo Xtreme is a single-use interface product and any removal of the heat sink (pre/post-reflow) will require a new ETI All interface material and adhesive residue must be removed and the
CPU and heat sink re-cleaned (with the surface cleaning supplies including in the ETI kit only) prior to the re-installation of a new ETI
REFERENCES:
The Material Safety Data Sheet
(MSDS) for Indigo Xtreme Clean™ can be found at:
http://www ekwaterblocks com/shop/EK
-
IM/MSDS_Indigo pdf
Contact us for more information about this or other EK-TIM Indigo Xtreme applications at our website: http://www ekwb com
Store EK-TIM Indigo Xtreme at room temperature conditions of 22°C (72°F) and 50% R H , preferably in the original sealed enclosure and plastic bag
DISCLAIMER:
EKWB d o o and Enerdyne Solutions are not responsible for any damages due to external causes, including but not limited to, improper use, accident, neglect,
alteration, repair, improper installation, improper testing, or damages caused by overclocking
AMD FX,™ Phenom,™ and Athlon™ are trademarks of Advanced Micro Devices, Inc., USA.
Indigo Xtreme is a trademark of:
Enerdyne Solutions, Inc ,
125 West North Bend Way, PO Box 2660,
North Bend, WA , 98045 United States of America