Fastwel CPC314 User manual

CPC314
CPU Module
User Manual
Rev. 001
November 2021
The product described in this manual is compliant
with all related CE standards.

Product Title: CPC314
Document name: CPC314 User Manual
User Manual version: 001
Ref. docs:
Copyright © 2021 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description
Product Index
Date
001
Preliminary version
CPC314
November, 2021
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya St.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA
Tel.:
[phone] Tel.:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

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Table of Contents
Table of Contents.....................................................................................................................................................1
List of Tables............................................................................................................................................................2
List of Figures…………………………………. ........................................................................................................... 3
Conventions…………………………………………………………………………………………………………………….6
General rules of usage …...……………………………………………………………………………………….………….8
Manufacturer's warranties…………………………………………………………………………………………………….8
Transportation, Unpacking and Storage …………………………………………………….………………...………….10
1Description and operation.................................................................................................................. 11
1.1 Purpose of the device…………………………………………………………………………………………..11
1.2 Technical specifications………………………………………………………………………………………..11
1.3 Connection to the device………………………………………………………………………………………13
1.4 Power supply …………………………………………………………………………………………………...14
1.5 Block diagram………………..…………………………………………………………………………….……15
1.6 Overall and fitting dimensions ……..……………………………...…………………………………………..16
1.7 Location of main elements …………………………………………………………………………………….17
1.8 Versions …………………..……………………………………………………………………………………..18
1.9 Delivery checklist …………………………….…………………………………………………………………19
1.10 Structure and functioning ……………………………………………..……………………………………….19
1.11 Labelling ……………………………….………………………………………………………………………..36
1.11 Packaging …..………………………….………………………………………………………………………..37
2Intended Use........................................................................................................................................ 38
2.1 Operating limitations ….……………………………………………………………………………………………...…38
2.2 Distribution of hardware interrupts……………………………………………………………………………………..38
2.3 DMA channels …………………………………………………………………………………………………………..38
2.4 I/O address space ………………………………………………………………………………………………………39
2.5 Memory address space…………………………………………………………………………………………………40
2.6 Using the processor’s GPIO ports……………………………………………………………………………………..40
2.7 WDT0 and WDT1 watchdog timers……………………………………………………………………………………42
3Installation and configuration............................................................................................................ 47
3.1 Setting the switches……………………………………………………………………………………………………..47
3.2 Configuring device parameters (BIOS SETUP)………………………………………………………………………47
4Software ............................................................................................................................................... 48
4.1 Basic software……..……………………………………………………………………………………………………..48
4.2 Establishing connection between PC and the device ……………………………………….………………………48
4.3 Operation of the device with AT keyboard and VGA monitor……………………………………………………….48
4.4 BIOS SOC Vortex86DX3 interface for reading serial number……………………………………………………...49
4.5 SOC Vortex86DX3 BIOS interface for reading/writing to FRAM…………………………………………………...49
4.6 Service programs………………………………………………………………………………………………………..50
4.7 BIOS Update……………………………………………………………………………………………………………..51
4.8 Switching the reference frequency for COM1, COM2, COM3, COM4………………………………………….…51
4.9 Working with I2C devices…………………………………………………………………………………………….…52
5Basic Input / Output System (BIOS) .................................................................................................. 54
5.1 Main…………….…..……………………………………………………………………………………………………..55
5.2 Advanced ………………………………………………..……………………………………….………………………56
5.3 PCI / PnP …………………………………………………………..…………………………………………………….64
5.4 Boot………………………………………………………………………………………………………………………..67
5.5 Security……………………………………………………………………………………………………………………69
5.6 Exit………………………………………………………………………………………………………………………...72
ANNEX A: …………………….…………………………………………………………………………………………....………...73
ANNEX B: ………………….………………………………………………………………………………………………..…….....74
ANNEX C: DISCLAIMER…………………………………………………………………………………………………..…….....77

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List of Tables
Table 1-1: Requirements for the external power supply parameters................................................................14
Table 1-2: Purpose of the power supply connector pins...................................................................................15
Table 1-3: Purpose of the pins of RS-422/485 (XP16, XP17) ports..................................................................21
Table 1-4: Configuration of the COM3 (X4, X5) port.........................................................................................21
Table 1-5: Configuration of the COM4 (X6, X7) port.........................................................................................21
Table 1-6: Purpose of the pins of RS-232 (XP14, XP15) ports.........................................................................23
Table 1-7: Frequency divider values for serial ports.........................................................................................24
Table 1-8: Purpose of pins of PS/2 (XP8) port..................................................................................................25
Table 1-9: Purpose of pins of the USB (XP3) ports..........................................................................................25
Table 1-10:Purpose of pins of the LAN1, LAN2 (XP1) ports..............................................................................26
Table 1-11:Purpose of pins of LPT (XP5) connector.........................................................................................27
Table 1-12: Purpose of the VGA (XP12) port pins ……………….……………………………..……………….…….28
Table 1-13: Purpose of LVDS (XP13) port pins ……………….…………………………………...……………….….28
Table 1-14: Purpose of Audio ports pins (XP10, XP11) ……………………………………..……………………..…29
Table 1-15: Purpose of XS1 connector pins: PC/104 (ISA 8/16-bit) rows A, B …………………………………….29
Table 1-16: Purpose of XS1 connector pins: PC/104 (ISA 8/16-bit) rows C, D …………………………………….30
Table 1-17: Purpose of XS2 connector pins: PCI/104 (PCU 32-bit) rows A, B …………………………………..…31
Table 1-18: Purpose of XS2 connector pins: PCI/104 (PCU 32-bit) rows C, D …………………………………….32
Table 1-19: Purpose of device LEDs……………………………………………... ………………………………….…33
Table 1-20: Purpose of pins of XP9 indication connector ………………………………………………………….....34
Table 1-21: Purpose of ADC channels ADC_AUX [7:0] ………………………..…………………………...……..…35
Table 1-22: Purpose of GPIO (XP2) port pins …………………………...……... …………………………………….35
Table 1-23: Purpose of GPIO (XP18) port pins ……………………….....………………………………………….…36
Table 1-24: Purpose of GPIO (XP6) port pins …………………………...………………………………………….....36
Table 2-1: Addresses of hardware interrupts …………..……………………... …………………………………….38
Table 2-2: DMA channels of the device …………………………………………………………………………….…38
Table 2-3: Distribution of I/O address space ……………………………………………………………………….....39
Table 2-4: Addresses of memory devices …………...…………………...………….………………………...…..…40
Table 2-5: GPIO control registers …………..……………………………………………………………………….....40
Table 2-6: Purpose of GPIO ports …………...…………………...………….……………………….………...…..…41
Table 2-7: WDT0 restart register …………...……………………………………………………………………….....42
Table 2-8: Index register of the WDT0 port address …………...…………………...………….……………………42
Table 2-9: Data register of the WDT0 port …………..……………….…………………………………………….....43
Table 2-10: Register of WDT0 timer control …....…………………........…….……………...……….………...…..…43
Table 2-11: Register of WDT0 event selection ……..……........…………………………...……………………….....43
Table 2-12: Register CNT0 of the WDT0 timer value ………..…...……………..…...………….………….....…..…44
Table 2-13: Register CNT1 of the WDT0 timer value …....…………………........…….………………....…...…..…44
Table 2-14: Register CNT2 of WDT0 timer value ……..……........………………………..……………………….....44
Table 2-15: WDT0 timer state register ………..…..........................……………..…...………….………….....…..…44
Table 2-16: WDT1 restart register …………………..…....…………………........…….…………………..…...…..…45
Table 2-17: WDT1 timer control register ……..……........…………...……………………..……………………….....45
Table 2-18: WDT1 event selection register ………..……………....……………..…...………….………….....…..…45
Table 2-19: Register CNT0 of WDT1 timer value ………..…..........................……………...….………….....…..…46
Table 2-20: Register CNT1 of WDT1 timer value …....………..……………........…….………………....…...…..…46
Table 2-21: Register CNT2 of WDT1 timer value ……..……........………………………..……………………….....46
Table 2-22: WDT1 timer state register ………..…...…………………….………..…...………….………….....…..…46
Table 3-1: Purpose of switches for device configuration ……..……........……….……..………………………......47
Table 5-1: Description of the “Main” menu ………………….………..…...…………….….……………….....…..…55
Table 5-2: Description of the “Advanced” menu….………….………..…...……..…….….……………….....…..…56
Table 5-3: Description of the “IDE Configuration” menu…….………..…...……..…….….……………….....…..…57
Table 5-4: Description of the “Primary IDE Master” menu….………..…...……..…….….……………….....…..…59
Table 5-5: Description of the “Remote Access Configuration” menu …...……..…….….……………….....…...…61
Table 5-6: Description of the “USB Configuration” menu …..………..…...……..…….….……………….....…..…63
Table 5-7: Description of the “PCI/ PnP” menu ….………..…...……..…….….………………………….......…..…65
Table 5-8: Description of the “Boot” menu ……………..…….………..…...……..…….….……………….....…..…67
Table 5-9: Description of the “Boot Settings Configuration” menu ….…...……..…….….……………….....…..…68

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Table 5-10: Description of the “Security» menu …………..…….….…..…...……..…….….……………….....…..…70
Table 5-11: Description of the “SouthBridge Configuration” menu ….………..……..…….……………….....…..…71
Table 5-12: Description of the “Exit» menu (output) …………………...….…...……..…….……………….....……..72
List of Figures
Figure 1-1: Block diagram of the device ............................................................................................................15
Figure 1-2: Overall and fitting dimensions .........................................................................................................16
Figure 1-3: Location of main elements of the device on the top side of the board.............................................17
Figure 1-4: Location of the main elements of the device on the bottom side of the board.................................18
Figure 1-5: Output stages of RS-422/485 ports of the device............................................................................22
Figure 1-6: Connecting modules via RS-485 interface ......................................................................................22
Figure 1-7: Connecting modules via RS-422 interface ......................................................................................23
Figure 1-8: Numbering pins of the XS1 connector a) top view of the device, b) bottom view of the device with
the organizer installed into connector..............................................................................................31
Figure 1-9: Numbering XS2 connector pins a) top view of the device, b) bottom view of the device with the
organizer installed into connector....................................................................................................33
Figure 5-1: Screen during the device boot (POST)..………………………………………………………………….54
Figure 5-2: Screen of the “Main” menu ………………………………………………….………………………….….55
Figure 5-3: Screen of the “Advanced” menu ……………...…………………………..……………………………....56
Figure 5-4: Screen of the “IDE Configuration” menu ………………………………………………………..………..57
Figure 5-5: Screen of the “Secondary IDE Master” menu …....................................……………..……………….59
Figure 5-6: Screen of the “Remote Access Configuration” menu.…………………..……………………………....61
Figure 5-7: Screen of the “USB Configuration” menu...……………………………………………………..………..63
Figure 5-8: Screen of the “PCI/ PnP” menu …..........................................................……………..……………….65
Figure 5-9: Screen of the “Boot” menu.………………………………………………...……………………………....67
Figure 5-10: Screen of the “Boot Settings Configuration” menu……………………………………………..………..68
Figure 5-11: Screen of the “Security” menu …...........................................................……………..……………….69
Figure 5-12: Screen of the “SouthBridge Configuration” menu ……………………………………………..………..71
Figure 5-13: Screen of the “Exit” menu …..................................................................……………..…………….....72
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and
is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their
consequences, as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. CompactPCI is a trademark of the PCI industrial Computers
Manufacturers Group. Ethernet is a registered trademark of Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc.
Intel is a trademark of Intel Corporation. Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft Corporation. In addition,
this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

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This User Manual is designed for providing you with the operating principle and general information
required for commissioning, intended use and maintenance of the CPC314 CPU Module
IMES.467444.148 (hereinafter referred to as the “device” or the “product”) manufactured by
Fastwel Group.
The device is made in PC/104-plus format and is designed for use in various embedded systems
that require operation in an extended temperature range (from -40 to +85 °С), compatibility of
applications with x86 architecture of CPUs, as well as a combination of high performance and low
level of generated thermal power and power consumption.
The document is designed for developers of distributed control and data collection systems,
process control systems and embedded control systems, for system administrators and engineers
involved in the industrial automation area.

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Ownership rights
This document contains information that is the property of Fastwel Group. It may not be copied or
transmitted by any known means, nor may it be stored in information storage and retrieval systems
without the prior written consent of Fastwel Group or one of its authorized agents. The information
contained in this document, to the best of our knowledge, is free from any errors, however, Fastwel
Group accepts no responsibility for any inaccuracies and their consequences, as well as liability
arising from the use or application of any diagram, product or example given in this document.
Fastwel Group reserves the right to change and improve both this document and the product
presented inside of it at its discretion without any further notice.
Safety requirements
This Fastwel Group’s product is developed and tested for the purpose of ensuring compliance to
the electric safety requirements. Its design provides long-term trouble-free operation. The service
life of the product can be significantly reduced due to the improper handling during unpacking and
installation. Therefore, in the interests of your safety and in order to ensure proper operation of the
product, you should follow the recommendations below.

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Conventions
Caution, High Voltage!
This sign and text warn of the dangers associated with electrical discharges (> 60 V)
when touching the device or any part of it. Failure to follow the precautions mentioned
or prescribed in the regulations may endanger your life or health, and may result in
damages to the equipment. Please also read the below subparagraph dedicated to the
rules for working with high voltage.
Attention! Static-sensitive device!
This sign and text indicate that electronic boards and their components are sensitive
to static electricity, so care should be taken when handling this device and performing
inspections to ensure integrity and functionality of the device.
Attention!
This sign is aimed at drawing your attention to aspects of this User Manual that, if not
fully understood or ignored, may endanger your health or cause damages to the
equipment.
Note
This sign is used to text fragments that should be read carefully.

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Safety requirements
This Fastwel Group product has been developed and tested to ensure compliance with electrical
safety requirements. Its design provides long-term fail-safe operation. The product's life cycle may
be significantly shortened due to mishandling during unpacking and installation. Therefore, for your
own safety and for ensuring proper operation of the device, you should follow the
recommendations given below.
Rules for safe handling with high voltage
Attention!
All operations with this device should only be performed by personnel with sufficient qualifications.
Caution, High Voltage!
Before installing the board in the system, make sure that the mains power supply is off. The same
also applies to the installation of expansion boards.
There is a serious risk of electric shock during installation, repairs, and maintenance of the device,
so always unplug the power supply cord while carrying out of works. The same also applies to the
other power supply cables.
Instructions for board handling
Static-sensitive device!
Electronic boards and their components are sensitive to static electricity. Therefore, special
attention should be given when handling these devices to ensure their safety and operability.

Do not leave the board in the non-operating position without protective packaging.
If possible, always work with the board in workplaces protected against static electricity.
Should this not be possible, the user should remove the static charge before touching the product
with their hands or tools. The best way to do so is by touching any metal part of the system
enclosure.

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General rules of usage
In order to keep the warranty, the product must not be altered or changed in any way. Any
changes and improvements unauthorized by Fastwel Group other than those contained in this
User Manual or received from the technical support service of Fastwel Group in the form of a set of
instructions for their implementation will void the warranty.
This device should be installed and connected only to systems that meet all necessary technical
and climatic requirements. This also applies to the operating temperature range of a particular
version of the board. You should also consider the temperature limits of the batteries installed on
the board.
Follow the instructions in this User Manual only when performing all necessary installation and
configuration operations.
Retain the original packaging for storing products in the future or to transport in case of a
warranty claim. If it is necessary to transport or store the board, pack it the same way as it was
packed at the time of receipt.
Proceed with extra caution when handling and unpacking the device. Follow the instructions
given below.
It is not allowed to connect external equipment, communication interface cables without
disconnecting the power supply of the product and connected external equipment.
MANUFACTURER’S WARRANTIES
Warranty liabilities
The manufacturer guarantees that CPC314 meets the requirements of technical specifications of
the “CPU MODULE IN PC104 FORMAT” TU 4013-004-52415667-05 provided that the Consumer
complies with the operating conditions, transportation, storage, installation and mounting, set by
the operational documents.
The manufacturer guarantees that the products supplied by it will not show any manufacturing
defects and materials used in compliance with the rules of operation and maintenance during the
warranty period established at the moment. The Manufacturer's obligation under this warranty is to
repair or replace, free of charge, any defective electronic component included in the returned
product.
Products that failed through the Manufacturer’s fault during the warranty period will be repaired
free of charge. In other cases, the Consumer will be billed based on current remuneration rates
and the cost of consumables.
Right of limitation liability
The manufacturer is not responsible for any damages caused to the Consumer’s property due to
the failure of the product in the process of its use.
Warranty period
The warranty period for the manufacturer's products is 36 months from the date of sale (unless
otherwise provided by the delivery agreement).

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For customized products, the warranty period is 60 months from the date of sale (unless otherwise
provided by the delivery agreement).
The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power, supply reversal, misuse, neglect,
accident, or improper installation.
Returning a product for repair
1. Apply to Fastwel Company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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Transportation, Unpacking and Storage
Transportation
The modules should be transported in the separate manufacturer’s packaging (container),
consisting of an individual antistatic packaging and a cardboard box, in closed transport (road, rail,
air in heated and sealed compartments) under storage conditions 5 according to the GOST
standard 15150-69 or under storage conditions 3 for sea transportation.
It is allowed to transport the modules packed in individual antistatic bags in manufacturer’s group
packaging (container).
Transportation of packaged modules should be carried out in accordance with the rules of
transportation of goods currently valid for this type of transport.
During handling operations and transportation, the packed modules should not be subjected to
sudden shocks, drops, impacts and precipitation. The packed modules should be placed on the
vehicle in such a way as to preclude their further movements.
Unpacking
Before unpacking, after transportation at negative ambient temperatures, the modules must be
kept for 6 hours under storage conditions 1, in accordance with the GOST standard 15150-69.
Do not place the packed modules near any heat sources before unpacking.
When unpacking the modules, it is necessary to observe all precautions to ensure their safety, as
well as marketable condition of manufacturer’s consumer packaging.
When unpacking, it is necessary to check the modules for any external mechanical damages after
transportation.
Storage
Storage conditions of the modules 1 comply with the GOST standard 15150-69.

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1 Description and operation
1.1 Purpose of the device
The device is a highly integrated solution based on the x86 platform for the use in real time
systems of management, production control, data acquisition and processing and can operate in
the standalone and slave mode. Connection of the main I/O means (VGA monitor, LVDS panel,
keyboard, mouse, printers, USB) enables the device to be used in systems with operator
participation. For data storage, both a microSD card integrated into a socket and an external
storage device connected to SATA port, or external USB devices can be used.
The product is made in PC/104-plus format and enables you to solve most of the tasks of input-
output of digital signals and information processing. Expanding device’s functionality is also
possible by connecting additional expansion modules of the PC/104 and PC/104-plus format.
The product can be connected to RS-232, RS-485 and Ethernet networks, which makes it possible
to use it in distributed input-output and information processing systems.
1.2 Technical specifications
Vortex86DX3 CPU (x86-compatible instruction set):
- Clock rate: 800 MHz;
- Number of physical cores: 2;
- 32 x bit x86 core;
- 32 bit memory bus;
- L1 cache (64 KB);
- L2 cache (512 KB);
- Internal bus frequency: 100 MHz

RAM:
- DDR3 SDRAM 2 GB (soldered onboard);
- Memory bus width: 32 bit;
- Memory bus operating frequency: 667 MHz;
Video subsystem:
- video controller with 2D accelerator;
- port for connection of VGA monitor with resolution up to 1920х1440, color 32 bit;
- port for connection of LVDS panel with resolution up to 1920х1440, color 32 bit;
Audio port:
- port for mic connection (mono);
- Line-in, Line-out ports (stereo);
PCI104 bus: (PCI 33 MHz 32 bit);
PC104 bus: (ISA 8/16 bit, 8/16 MHz);

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Non-volatile RAM:
- volume: 8 KB;
- implemented using the FRAM technology, SPI interface;
- battery power supply is not required;
Connector for microSD cards:
- support of SD, SDHC cards, speed class 6;
- microSD 4 GB (pSLC NAND), already installed when delivered;
- the card is defined as Primary IDE Master within the system;
Port for SATA drive:
- standard SATA connector;
- 1.5 Gb Gen I and 3 Gb Gen II;

LAN ports:
- 2 x Fast Ethernet 10/100 Mb/s ports;
- system isolation of each port: 500V;

USB ports (host):
- support of USB 1.1, USB 2.0 (HS, FS, LS);
- connection of up to 2 devices;
GPIO port
- 8 x I/O lines;
- compatibility with the level +5V (TTL);

LPT port
Serial ports:
- COM1: RS-232 (9-wire);
- COM2: RS-232 (9-wire);
- exchange rate over RS-232: up to 230,400 Kb/s;
- protection against ESD 15 kV (IEC1000-4-2);
- COM3: isolated RS-422/485 (individual system isolation 500V);
- COM4: isolated RS-422/485 (individual system isolation 500V);
- automatic (hardware) control of transmission direction for RS-485 ports;
- exchange rate over RS-422/485: up to 1.5 Mb/s 1


Watchdog timers:
- 2 watchdog timers, built into the processor, with a programmable event and an actuation interval
of 30.5 µs…512 s;

Real Time Clock:
- consumption current when power is off 2 µA2

Integrated lithium battery 3V:
- CR2032, standard capacity 200 mA*h;
Buzzer
Isolated port of reset / interrupt source
1Exchange rate over serial ports is defined by the frequency divider register.
2Standard value under normal conditions

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Digital temperature sensor
Measuring the temperature of the CPU board from - 55 to +125 °С,
Typical absolute error of temperature measurement:3
± 2.0 °C (within the range from -40 to +85 °C);
Conversion code –additional, with a character
Resolution and price per unit fort the least significant bit: 12 bit (11+ character) / 0.0625 °C
Conversion time is up to 300 ms.
Measuring secondary supply voltages of the module by an integrated ADC
Compatibility with operating systems:
- FreeDOS, Microsoft™ MS-DOS® 6.22
- Linux
- Windows Embedded Standard 7
Console serial ports: COM1 / COM2 / COM3 / COM4;
Power supply voltage: from 4.75 to 5.25 V
Operating temperature range: from -40 to +85 °С
Storage conditions for the modules: 1 according to the GOST standard 15150-69
Humidity: from 5 to 95%, at +25 °С, non-condensing;
Resistance to multiple/single shocks: 50/150 g;
Vibration resistance: 10 g for frequencies from 50 to 2000 Hz;
 MTBF 4: min. 100,000 hours;
Dimensions, max: (115.6±0,5) х (102.2±0,5) х (24.2±0,5) mm;
Module's weight, max.: 0.2 kg;
Packed weight, max.: 0.4 kg;
1.3 Connection to the device
Below is the typical list of interface boards and devices, which may be connected to the device:
Devices with Ethernet interface;
Devices compatible with RS-232 and RS-422;
RS-485 multiuser networks;
microSD memory cards;
SATA drives;
USB devices, type 1.1 and 2.0 (Full-speed, High-speed), including devices of the USB Mass
Storage Device type;
Keyboard, mouse (USB and PS/2 ports);
Monitors and TFT panels;
PC-compatible printer (USB or LPT port);
Expansion modules in PC/104 or PC/104-plus format.
3The measurement accuracy is not standardized and is determined by the data given in the manufacturer’s
documentation.
4The MTBF value is calculated using the Telcordia Issue 1 calculation model (Method I Case 3) for
continuous operation when located on the ground under conditions corresponding to the climatic category
Moderately Cold Climate 4 in accordance with GOST 15150-69 standard, at an ambient temperature of
+30°С.

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1.4 Power Supply
The device’s power supply should meet the requirements specified in Table 1-1.
The device is powered through the PC/104 and PC/104-plus connectors (if installed). If you need
to supply power from an external source, you can use the additional XP7 power supply connector
(4-pin AMP 4-171826-4 connector).
The power supply should provide the starting current specified in Table 1-1. It is also permitted to
use a power supply with a current limiting mode for at least 3.0 A (excluding any peripherals
connected). When choosing a power supply, the starting current and the current consumption of
expansion modules and other devices connected to the device ports, should be considered.
The device is equipped with an active circuit for protection against short circuit and reverse voltage
supply. There is also a surge protection against overvoltage above 30 V (direct or reverse polarity)
by parallel connection of the TVS protection diode SM6T33CA. In case of a long-term supply of
more than 30V supply voltage (direct or reverse polarity), the TVS protection diode may fail. The
duration of the voltage supply where the TVS protection diode fails depends on the level of the
supplied voltage and the ambient temperature: at an ambient temperature of 24°C and an input
voltage level of up to 60V, failure is possible in one second, at the level of up to 120V - in less than
one second.
There are following consumers of the +5 V input power supply:
1) Device (+5V @ 1.5A);
2) External equipment connected to USB ports (4x ports, maximum consumption of each port is
+5V @ 0.5A);
3) External equipment, connection to LPT port (1 x port, maximum consumption of each port is
+5V @ 0.75A);
4) LVDS panel (1 x port, maximum consumption of +3.3V @ 0.75A);
5) External equipment, connection to GPIO port (maximum consumption of +5V @ 0.75A);
6) External equipment, connected to RS-232 ports (2 x ports, maximum consumption of +5V @
0.75A).
The maximum possible load-carrying capacity for the "+5 V" power supply voltage is 5 A. If the 6A
value is exceeded, the active protection of the device will be triggered and the input power will be
disconnected, which will be automatically restored when the load current falls below the 6A limit
value, in which case the device will restart.
Table 1-1 - Requirements for the external power supply parameters
Version
Power supply
voltage, V
Voltage limiting
values, V
Load current, A
Start-up current, A
CPC314-01
without peripherals
+5V
from +4.75 to +5.25
2.0
3.0
Recommended mating part for additional XP11 power connector (AMP 4-171826-4): AMP 4-
171822-4 and AMP 170263-1 sets of pins (available for order as ACS00038 kit (socket and pins)
or as ACS00038-01 kit (socket , pins and 1m long wires).

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Table 1-2 –Purpose of the power supply connector pins
1.5 Block diagram
Fig. 1-1 –Block diagram of the device
Power supply connector: AMP 4-171826-4
Pin#
Function
1
+5 V
2
GND
3
GND
4
-

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1.6 Overall and fitting dimensions
Fig. 1-2 below demonstrates overall and fitting dimensions.
Fig. 1-2 –Overall and fitting dimensions

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1.7 Location of main elements
Fig. 1-3 –Location of main elements of the device on the top side of the board

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Fig. 1-4 Location of the main elements of the device on the bottom side of the board
The assignment of connectors and switches is given in paragraph 1.10 Structure and
functioning and paragraph 3.1 Setting the switches.
The device is made in accordance with the PC/104-plus v.2.0 specification.
On the top side, there is a deviation from the specification for the maximum height of components
(8.76 mm) and in the area of the processor’s heatsink: 10.8 mm.
On the bottom side, there is a deviation from the specification for the maximum height of the
components (4.83 mm) in the area of XS3 mounting for the CR2032 battery: 5.30 mm.
1.8 Versions
Item No.
Version
Description
1
CPC314-01
IMES.467444.148
PC/104+, Vortex86DX3 800MHz, 2GB RAM,
microSD 4GB, 2 x LAN, 2 x USB, VGA, PS/2,
LPT, 2 x RS-232, 2 x RS-485, 8 x GPIO,
FreeDOS
Note
The modules with conformal coating obtain the “\СOATED” inscription when ordered.