Fastwel CPC507 User manual

CPC507
3U CPCI Serial Elbrus CPU Module
User Manual
Rev. 001
February 2021
The product described in this manual is compliant
with all related CE standards.

Product Title: CPC507
Document name: CPC507 User Manual
Manual version: 001
Ref. docs:
Copyright © 2021 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description
Product Index
Date
001
Initial version
CPC507
February 2021
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya St.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA
Tel.:
[phone] Tel.:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

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Table of Contents
Table of Contents.....................................................................................................................................................1
List of Tables............................................................................................................................................................2
List of Figures…………………………………. ........................................................................................................... 3
Conventions…………………………………………………………………………………………………………………….5
General rules of usage …...……………………………………………………………………………………….………….7
Manufacturer's warranties…………………………………………………………………………………………………….7
Transportation, Unpacking and Storage ………………………………………………………………………...………….9
1. INTRODUCTIOIN……………………………………………………………………………..………………………………11
1.1 System overview…………………………………………..…………………………………………………...………….11
1.2 General description of the module…………………………………………………………..…………………………..11
2. GENERAL INFORMATION………………………………………………………………….………………………………12
2.1 General Features of CPC507……………………………………………...……………………………………………..12
2.2 Compatibility with the PICMG/VITA standards………………………………………………………………......……..14
2.3 Module versions …………………………………………………………………………………………………………...14
2.4 Delivery checklist…………………………………………………………………………………………………………..15
2.5 Packaging information………………………………………………………………………………………………….....15
2.6 System expansion options……………………………………………………………………………………………......15
2.7 System information……………………………………………………………………………………………………......15
2.8 External view and location of the main elements………………………………………………………………………16
3. FUNCTIONAL DESCRIPTION…………………………………………………..…………………………………………..20
3.1 Specific performance features of functional nodes………………………...…………………………………………..20
3.2 Module Interfaces……………………………………………………………………...…………………………………..21
3.3 Timers……………………………………………………………..………………………………………………………..39
3.4 SPI controller / LEDs / GPIO……………………………………………………………..………………………………42
3.5 Devices on the local SMBus……………………………………………………………………………………..……….44
3.6 Battery………………………………….…………………………………………………………………………………...44
3.7 NAND drive………………………………………...……………………………………………………………………….44
4. INSTALLATION…...…………....…………………………………………………………………………………………….45
4.1 Safety requirements…………………………...…………………………………………………………………………..45
4.2 CPC507 installation procedure……………………………………...……………………………………………………46
4.3 Board removal procedure…...…………………………………………………………………………………………….47
4.4 Installing peripherals to CPC507……………………..………………………………………………………………….47
4.5 Battery replacement…………………………………………...…………………………………………………………..48
4.6 Installing CFast Drive…………...…………………………………………………………………………………………48
5. SYSTEM SETUP……………………………………………………………………………………………….……………..49
5.1 Resetting the BIOS Setup settings…………………………………………………………………………………..…..49
6. AMI APTIO BIOS SETUP………………………….…………………………………………..…………………………….50
6.1 Starting and Updating BIOS Setup…………………………………………………………………………......……….50
6.2 Advanced …………………………………………………………………………………………………………………..52
7. TROUBLESHOOTING………………………………………………..………………………………………………………53
8. POWER CONSUMPTION……………………………………………………..……………………………………………..54
9. INFLUENCE OF EXTERNAL FACTORS…………………………………….…………………………….....…………...55
9.1 CPC507 operating conditions and MTBF…………………………………………………………………………......…..55
ANNEX A: TERMS, ACRONYMS AND ABBREVIATIONS …………………….……………………………………………..56
ANNEX B: DICSLAIMER…………………………………………………………………………………………………..……….58

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List of Tables
Table 2 1: System information……..……………………………………………………………………………………………..15
Table 3-1: Purpose of XMC1 XS7 (P15) and XMC2 XS8 (P15) connectors pins on the CPC507 board ……………..22
Table 3-2: PMC connector pin assignment…………………………………………………………………………………….24
Table 1-1: Assignment of SATA XS6 connector pins………………………………………………………………………...25
Table 3-4: Assignment of XP2 connector pins………………………………………………………………………………...26
Table 3-5: Assignment of USB connector pins on the front panel of CPC507…………………………………………..27
Table 3-6: Assignment of Gigabit Ethernet connector pins…………………………………………………………………27
Table 3-7: Assignment of XS1 DisplayPort connector pins of the CPC507 module……………………………………29
Table 3-8: State of the SYS LED of the CPC507 module……………………………………………………………………..30
Table 3-9: Color code designations of connectors…………………………………………………………………………...33
Table 1-2: Assignment of pins of the CompactPCI XS20 system connector (J1)……………………………………..34
Table 1-3: Pin assignment of the XS18 (J2) system connector of 64-bit CompactPCI bus………………………….35
Table 1-4: Pin assignment of the XS21 (J3) connector of CPC507……………………………………………………….36
Table 3-13: Assignment of the XS19 (J4) connector pins of the CPC507 module………………………………………37
Table 3-14: Assignment of the XS17 (J5) connector pins of CPC507……………………………………………………..38
Table 3-15: Registers of the SPI controller……………………………………………………………………………………..42
Table 3-16: Device addresses on SMBus……………………………………………………………………………………….44
Table 7 1: CPC507 fault causes and their rectifications……………………………………………………………………..53
Table 8 1: Supply voltage of +5 V,+3.3 V,+12 V,-12 V fed from the CPCI bus…………………………………………….54
Table 9 1: Influence of external factors during operation of CPC507……………………………………………………..55
Table A 1 –Terms, acronyms and abbreviations……………………………………………………………………………..56

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List of Figures
Figure 1-1: Block diagram of CPC507…………..……………………………………………………………………………….17
Figure 2 2: Location of the main components of CPC507, top view………………………………………………………18
Figure 2 3: CPC507: size and dimensions ……………………………………………………………………………………..19
Figure 3-1: XMC XS7 (P15) and XS8 (P15) connectors……………………………………………………………………….22
Figure 3-2: Connectors PMC XS10 (P1), XS11 (P3), XS12 (P2) and XS13 (P4)…………………………………………..23
Figure 3-3: USB connectors on the front panel of CPC507…………………………………………………………………26
Figure 3-4: Gigabit Ethernet RJ45 connector………………………………………………………………………………….27
Figure 3-5: DisplayPort connector……………………………………………………………………………………………….29
Figure 3-6: LEDS on the front panel of CPC507……………………………………………………………………………….30
Figure 3-7: CompactPCI connectors (J1 –J5 in accordance with the CompactPCI specification)………………….32
Figure 6-1: Assignment of navigation keys…………………………………………………………………………………….50
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and
is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their
consequences, as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. CompactPCI is a trademark of the PCI industrial Computers
Manufacturers Group. Ethernet is a registered trademark of Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc.
Intel is a trademark of Intel Corporation. Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft Corporation. In addition,
this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

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Ownership rights
This document contains information that is the property of Fastwel Group. It may not be copied or
transmitted by any known means, nor may it be stored in information storage and retrieval systems
without the prior written consent of Fastwel Group or one of its authorized agents. The information
contained in this document, to the best of our knowledge, is free from any errors, however, Fastwel
Group accepts no responsibility for any inaccuracies and their consequences, as well as liability
arising from the use or application of any diagram, product or example given in this document.
Fastwel Group reserves the right to change and improve both this document and the product
presented inside of it at its discretion without any further notice.
Safety requirements
This Fastwel Group’s product is developed and tested for the purpose of ensuring compliance to
the electric safety requirements. Its design provides long-term trouble-free operation. The service
life of the product can be significantly reduced due to the improper handling during unpacking and
installation. Therefore, in the interests of your safety and in order to ensure proper operation of the
product, you should follow the recommendations below.

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Conventions
Caution, High Voltage!
This sign and text warn of the dangers associated with electrical discharges (> 60 V)
when touching the device or any part of it. Failure to follow the precautions mentioned
or prescribed in the regulations may endanger your life or health, and may result in
damages to the equipment. Please also read the below subparagraph dedicated to the
rules for working with high voltage.
Attention! Static-Sensitive Device!
This sign and text indicate that the electronic boards and their components are
sensitive to static electricity, so proper care should be taken when handling this device
and performing inspections to ensure integrity and functionality of the device.
Attention! Hot surface!
This sign and text warn of the danger associated with touching hot surfaces of the
device.
Attention!
This sign is aimed at drawing your attention to aspects of this User Manual that, if not
fully understood or ignored, may endanger your health or cause damages to the
equipment.
Note
This sign is used to text fragments that should be read carefully.

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Safety requirements
This Fastwel Group product has been developed and tested to ensure compliance with electrical
safety requirements. Its design provides long-term fail-safe operation. The product's life cycle may
be significantly shortened due to mishandling during unpacking and installation. Therefore, for your
own safety and for ensuring proper operation of the device, you should follow the
recommendations given below.
Rules for safe handling with high voltage
Attention!
All operations with this device should only be performed by personnel with sufficient qualifications.
Caution, High Voltage!
Before installing the board in the system, make sure that the mains power supply is off. The same
also applies to the installation of expansion boards.
There is a serious risk of electric shock during installation, repairs, and maintenance of the device,
so always unplug the power supply cord while carrying out of works. The same also applies to the
other power supply cables.
Board Handling Instructions
Static-sensitive device!
Electronic boards and their components are sensitive to static electricity. Therefore, special
attention should be given when handling these devices to ensure their safety and operability.

Do not leave the board in the non-operating position without protective packaging.
If possible, always work with the board in workplaces protected against static electricity.
Should this not be possible, the user should remove the static charge before touching the product
with their hands or tools. The best way to do so is by touching any metal part of the system
enclosure.
It is especially important to observe precautions when replacing expansion boards, jumpers,
etc. If the product is equipped with batteries to power the memory or real-time clock, avoid placing
the board on conducting surfaces such as anti-static mats or sponges. They can cause short
circuits and damage the battery and the board's conducting circuits.

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General rules of usage
In order to keep the warranty, the product must not be altered or changed in any way. Any
changes and improvements unauthorized by Fastwel Group other than those contained in this
User Manual or received from the technical support service of Fastwel Group in the form of a set of
instructions for their implementation will void the warranty.
This device should be installed and connected only to systems that meet all necessary technical
and climatic requirements. This also applies to the operating temperature range of a particular
version of the board. You should also consider the temperature limits of the batteries installed on
the board.
Only follow the instructions in this User Manual when performing all necessary installation and
configuration operations.
Retain the original packaging for storing products in the future or to transport in case of a
warranty claim. If it is necessary to transport or store the board, pack it the same way as it was
packed at the time of receipt.
Proceed with extra caution when handling and unpacking the device. Follow the instructions
given above and in the below chapter “Transportation, Unpacking and Storage”.
MANUFACTURER’S WARRANTIES
Warranty liabilities
The manufacturer guarantees that the CPC507 Module meets the requirements of technical
specifications of the specs TU 4013-005-52415667-05, provided that the Consumer complies with
the operating conditions, transportation, storage, installation and mounting, set by the operational
documents.
The manufacturer guarantees that the products supplied by it will not show any manufacturing
defects and materials used in compliance with the rules of operation and maintenance during the
warranty period established at the moment. The Manufacturer's obligation under this warranty is to
repair or replace, free of charge, any defective electronic component included in the returned
product.
Products that failed through the Manufacturer’s fault during the warranty period will be repaired
free of charge. In other cases, the Consumer will be billed based on current remuneration rates
and the cost of consumables.
Right of liability limitation
The manufacturer is not responsible for any damages caused to the Consumer’s property due to
the failure of the product in the process of its use.
Warranty period
The warranty period for the manufacturer's products is 36 months from the date of sale (unless
otherwise provided by the delivery agreement).

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For customized products, the warranty period is 60 months from the date of sale (unless otherwise
provided by the delivery agreement).
Limitation of warranty obligations
The above warranty does not apply to:
- the products (including software) that have been repaired or modified by the employees who do
not represent the Manufacturer. The exception is when the Consumer has made repairs or made
changes to the product strictly in accordance with the instructions previously agreed and approved
by the Manufacturer in writing;
- the products which have failed because of inappropriate change of a polarity sign (to the opposite
one) of the power supply source, incorrect operation, transportation, storage, installation, mounting
or accident.
Procedure for returning products for repairs
In order to return the products for repairs:
- contact the Product Supplier or any official dealer of the Product Supplier for return material
authorization for the product;
- attach to the returned product the fault identification report made in the form adopted by the
Consumer, indicating the list of circumstances and signs of malfunction;
- place the product in the consumer packaging of the Manufacturer (antistatic bag) and cardboard
packaging (box)), in which the product was delivered to the Consumer. If there is no antistatic bag,
the Consumer loses the right to warranty service unilaterally;
− the Consumer pays all the expenses related to the delivery of the product to the Supplier or any
official dealer of the Supplier.

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Transportation, Unpacking and Storage
Transportation
The modules should be transported in the separate manufacturer’s packaging (container),
consisting of an individual antistatic packaging and a cardboard box, in closed transport (road, rail,
air in heated and sealed compartments) under storage conditions 5 according to the GOST
standard 15150-69 or under storage conditions 3 for sea transportation.
It is allowed to transport the modules packed in individual antistatic bags in manufacturer’s group
packaging (container).
Transportation of packaged modules should be carried out in accordance with the rules of
transportation of goods currently valid for this type of transport.
During handling operations and transportation, the packed modules should not be subjected to
sudden shocks, drops, impacts and precipitation. The packed modules should be placed on the
vehicle in such a way as to preclude their further movements.
Unpacking
Before unpacking, after transportation at negative ambient temperatures, the modules must be
kept for 6 hours under storage conditions 1, in accordance with the GOST standard 15150-69.
Do not place the packed modules near any heat sources before unpacking.
When unpacking the modules, it is necessary to observe all precautions to ensure their safety, as
well as marketable condition of manufacturer’s consumer packaging.
When unpacking, it is necessary to check the modules for any external mechanical damages after
transportation.
Storage
Storage conditions of the modules 1 comply with the GOST standard 15150-69.

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Three Year Warranty
Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects
in materials and workmanship under normal use and service for the currently established warranty
period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any
defective component part of such products free of charge.
Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation
or use of its products. Fastwel shall have no liability for direct or consequential damages of any
kind arising out of sale, delay in delivery, installation, or use of its products.
If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of
charge. For out of warranty repairs, the customer will be invoiced for repair charges at current
standard labor and materials rates.
Warranty period for Fastwel products is 36 months since the date of purchase.
For customized products, the warranty period is 60 months from the date of sale (unless otherwise
provided by the delivery agreement).
The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power, supply reversal, misuse, neglect,
accident, or improper installation.
Returning a product for repair
1. Apply to Fastwel Company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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1 Introduction
1.1 System overview
The CPC507 CompactPCI (CPCI) CPU module (presented in this User Manual) supports the PCI
architecture. This allows you to work with a wide range of equipment. To get the information on the
CompactPCI standard, please refer to the PCI and CompactPCI Standards Specification. For more
information on these standards and their use, please visit the official website of the PCI Industrial
Computer Manufacturers Group (PICMG) at: http://www.picmg.org/.
1.2 General Description of the Module
The CPC507 CPU module, implemented in accordance with the CompactPCI 6U standard,
expands the line of Fastvel 6U modules. The most important feature of this module is the
availability of two platforms for the installation of PMC / XMC mezzanine modules. By using a
single-chip solution based on AMD FP5 APU (Ryzen Embedded V-Series) SoC, together with two
mezzanine modules, CPC507 can be used in compact and cost-effective computing systems.
The Ryzen Embedded platform is a new solution from AMD (launched in 2018, availability period:
10 years) based on the 14 nm technology. The System on a chip supports modern high-speed
interfaces and also has an integrated graphics core with a large number of high-resolution digital
video outputs.

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2 General Information
2.1 General Features of CPC507
●Processor AMD Ryzen Embedded V1404I SoC APU 2.0GHz 25 W:
- 4 x cores x64, 8 x threads;
- 8 x graphics cores;
- 6MB cache;
● RAM:
- DDR4-2400 SDRAM up to 16 GB with ECC support;
- 64-bit data bus;
● Video Output:
- DisplayPort (4096x2160@60Hz) interface, routed to the front panel;
- 3 x DisplayPort (4096x2160@60Hz) interfaces are routed to RIO;
- Simultaneous operation of all interfaces is possible.
● PCI Bus:
- Routed to the CompactPCI J1/J2 connectors;
- 64bit/66MHz;
- Implemented on the bridge PCIe->PCI-X PI7C9X130;
- Operation in the peripheral slot (Non-transparent Bridge mode).
● LPC Bus:
- Routed to RIO and to the debugging connector on the module;
● PCIe Bus:
- PCIe Gen3 (up to 8GT/s) is routed to the P15 XMC connector with support of devices up to x8;
- Possibility to use link x8 in the 2x4 mode (configurable in BIOS), links x4 are routed to the P15
XMC1 and XMC2 connectors;
- XMC is compatible with the ANSI/VITA 42.3 specification.
● SMBus:
- Compatibility with specification 2.0;
- Rate up to 100kbps.
● FLASH BIOS:
- 16 MB SPI-Flash;
- Modifiable within the system;
● FRAM:
- Volume 32 KB;
- Implemented on SPI Bus.
● Integrated SSD:

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- Capacity 32 GB;
- SATA III 6 Gbps interface;
● SATA Interface:
- One interface is routed to the CFast connector;
- One interface is used for connecting integrated SSD.
● SPI Interface:
- FRAM support;
- Frequency up to 25 MHz.
● 4 x LAN ports 10/100/1000 Mb on PCIe x2 Gen2:
- One channel is routed to the RIO connector;
- Two channels are routed to the backplane (PICMG 2.16);
- One channel is routed to the front panel;
- Intel® Ethernet Controller I350 is used;
● USB ports:
- Support of USB 2.0 (480 Mb/sec), USB 3.0 (5 Gb/sec);
- Connection of up to 3 x devices via connectors on the front panel (USB 3.0);
- 3 x USB 2.0 interfaces are routed to RIO;
● Real Time Clock:
- Power is supplied from the CR2032 (3V) lithium battery;
● Audio:
- HD Audio interface, routed to the RIO connector;
● Watchdog Timer:
- Internal, with possibility of program control;
● Hardware monitor:
- Implemented via the SMBus interface;
- Monitoring of up to 7 power supply voltages;
- Monitoring of CPU temperature;
- Monitoring of PCB temperature;
● Support of XMC/PMC expansion boards:
- Support of two PMC/XMC modules;
- PCI-X 64bit/66MHz Bus is routed to the P1-P4 PMC1 and PMC2 (ANSI/VITA 39, PCI-X for PMC
and Processor PMC) connectors;
- PMC I/O P4 is routed to RIO for both mezzanines (PICMG PMC on CompactPCI R1.0
Specification);
- PCIe x8 Gen3 Bus is routed to the P15 XMC1 (ANSI/VITA 42.3, XMC: PCI Express Protocol
Layer) connector, can be used in the mode x4 for two mezzanines.
● LEDs:
- Board start diagnostics LED;
- LED for accessing SATA drives;

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- LED for indication of processor overheating;
- Two program-controlled LEDs (User LEDs);
● Software compatibility:
- Linux Debian 10;
- Astra Linux Special Edition, “Smolensk” release v1.5, v1.6;
- Microsoft Windows 10 IoT Enterprise 64bit.
2.2 Compatibility with the PICMG/VITA standards
The CPC507 module is compatible with the following PICMG/VITA standards:
- PICMG 2.0 CompactPCI R3.0 Specification;
- PICMG 2.3 PMC on CompactPCI R1.0 Specification;
- PICMG 2.16 CompactPCI Packet Switching Backplane R1.0 Specification;
- ANSI/VITA 42.0 XMC: Switched Mezzanine Card Base Specification;
- ANSI/VITA 42.3 XMC: PCI Express Protocol Layer;
- ANSI/VITA 30.1 2mm Connector Practice for Conduction Cooled Euroboards;
- ANSI/VITA 39 PCI-X for PMC and Processor PMC;
2.3 Module versions
CPC507-01 –CPC507 CPU-module, AMD Ryzen Embedded V1404I 2.0GHZ 4 Cores,
16GB DDR4 SDRAM, -40…+70 C
CPC507-02 –CPC507 CPU-module, AMD Ryzen Embedded V1404I 1.7GHZ 4 Cores, 8GB
DDR4 SDRAM, -40…+85 C
Available options:
\COATED –Conformal coating.

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2.4 Delivery checklist
The delivery checklist for CPC507 includes:
- CPC507 CPU Module;
- Installation kit –1 pcs;
- Packaging;
2.5 Packaging information
The CPC507 Module is supplied in a box of the following size: 350х260х70 mm.
Packaged weight of the device –no more than 0.8 kg.
Note
Keep the module’s anti-static bag and consumer packaging in their original form until
the end of the warranty period.
2.6 System expansion options
The number of interfaces routed from the CPC507 module can be increased by installing 2 x
XMC/PMC expansion modules.
2.6.1 PMC/XMC Modules
PMC/XMC interface of the CPC507 board supports two expansion modules of the XMC/PMC
standard, which ensures an easy and flexible adaptation of CPC507 in accordance with the
requirements of various applications (see subparagraph 3.2.1 PMC/XMC Interface).
2.7 System information
Table 2 1: System information
Characteristics
Note
Operation in the system slot
as the System Master
The CPC507 module is designed for the use as the System Master. In this
capacity, it can interrelate with seven peripheral boards via a 64-bit 33/66
MHz bus. At the same time, CPC507 can work in a peripheral slot, in this
case the CPC507 module is connected to the PCI bus through a
“nontransparent” bridge.
Operation in the peripheral
slot of the system
The CPC507 module, when installed in the system’s peripheral slot, is
connected to the PCI bus through the “nontransparent” bridge. The
CPC507 is powered from the backplane and can operate in packet
switching mode (if the system supports this mode) with support of up to 2
x Gigabit Ethernet channels.

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Operating systems
CPC507 is program compatible with the following operating systems:
Linux Debian 10;
Astra Linux Special Edition, “Smolensk” release v1.5, v1.6;
Microsoft Windows 10 IoT Enterprise 64bit;
2.8 External view and location of the main elements
The following figures will help you identify the components, understand their relationships and
functions. The board versions may have minor differences that are not shown in the diagrams.
2.8.1 Functional block diagram
The functional block diagram is shown in the following figure (see Fig. 2 1):

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Figure 2-1: Block diagram of CPC507
Soldered
DDR4 SDRAM
8 GB
AMD Ryzen
Embedded V1404I
4C/8T 2.0 GHz
SPI
BIOS
64 Mbit
Front Panel
USB 0-2
LPC
Interface
CPCI J5CPCI J1/J2
Power PCI Bus
64/66Mhz
4xLED
PMC I/O
64
CPCI J3
PCI-E/PCI-X
Bridge
PI7C9X130
PCI-E/PCI-X
Bridge
PI7C9x130 64Bit/100Mhz
PCI-X
SPI
Ch1
USB 3-5
Ports
Ejector
Switch
CPC507 CPCI 6U Board
Block Diagram
PMC1 Connector
P1-P4
XMC1 Connector
P15
LPC
CPCI J4
Eth1DisplayPort
CFast
Connector
DP PowerGPIO
PMC2 Connector
P1-P4
XMC2 Connector
P15
FPGA
USB 0-2
DP1
Gigabit
Ethernet Gigabit
Ethernet HD
AUDIO DP
PCIe x2 Gen1
SATA1
SATA0
PCIe x2 Gen1
USB 3-5
DP2
DP3
Switch
PCIe x4 Gen3 PCIe x4 Gen3
PCIe x4 Gen3
PCIe x8 Gen3
HD AUDIO
Intel i350
PCIe x2 Gen2
SSD
32 GB
Soldered
DDR4 SDRAM
8 GB
Ch2
PMC I/O
64 DP
DP4
Gigabit
Ethernet
COM0
UART0

CPC507
C P C 5 0 7 U s e r M a n u a l 18
2.8.2 Location of main components
Figure 2 2: Location of the main components of CPC507, top view
The appearance of the module versions may slightly differ from the one shown in this figure.