Fastwel CPC507 User manual

CPC507
SoC AMD FP5 APU Based
6U Compact PCI CPU Module
User Manual
Rev. 002
August 2022
The product described in this manual is compliant
with all related CE standards.

Product Title: CPC507
Document name: CPC507 User Manual
Manual version: 002
Ref. docs:
Copyright © 2022 Fastwel Co. Ltd. All rights reserved.
Revision Record
Rev. Index
Brief Description
Product Index
Date
001
Initial version
CPC507
February 2021
002
Compliance assessment
CPC507
August 2022
Contact Information
Fastwel Co. Ltd
Fastwel Corporation US
Address:
108 Profsoyuznaya St.,
Moscow 117437,
Russian Federation
6108 Avenida Encinas,
Suite B, Carlsbad,
CA92011, USA
Tel.:
[phone] Tel.:
[phone]
Fax:
[phone]
E-mail:
[email protected] E-mail:
[email protected]
Web:
http://www.fastwel.com/

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Table of Contents
Table of Contents.....................................................................................................................................................1
List of Tables............................................................................................................................................................2
List of Figures…………………………………. ........................................................................................................... 3
Conventions…………………………………………………………………………………………………………………….5
General rules of usage …...……………………………………………………………………………………….………….7
Manufacturer's warranties…………………………………………………………………………………………………….7
Transportation, Unpacking and Storage ………………………………………………………………………...………….9
1. INTRODUCTIOIN……………………………………………………………………………..………………………………11
1.1 System overview…………………………………………..…………………………………………………...………….11
1.2 General description of the module…………………………………………………………..…………………………..11
1.3 Module versions …………………………………………………………………………………………………………...11
2. GENERAL INFORMATION………………………………………………………………….………………………………12
2.1 General Features of CPC507……………………………………………...……………………………………………..12
2.2 Compatibility with the PICMG/VITA standards ……………………………………………………………......……….13
2.3 Device dimensions………………………………………………………………………………………………………...14
2.4 Delivery checklist…………………………………………………………………………………………………………..14
2.5 Operational conditions …..…………………………………………………………………………………………….....15
2.6 Product labeling ………….……………………………………………………………………………………………......16
2.7 Packaging information ……………………………………………………………..…………………………………......16
3. DESIGN AND OPERATION …….…………………………………………………..……..………………………………..17
3.1 Block diagram ………………………...……………………………………………….…………………………………..17
3.2 Specific performance features of functional nodes ………………………………………………………………..…..18
3.3 System expansion options ….…………………………………..………………………………………………………..19
3.3.1 PMC/XMC Modules……...……………………………………………………………………………………………19
3.4 Using the module in the CPCI system ……...…………………………………………..………………………………19
3.5 Location of main components …………………………………………………………………………………..……….20
4. INTENDED USE……....…………....…………………..…………………………………………………………………….21
4.1 Module Interfaces ………………..…………...…………………………………………………………………………..21
4.1.1 XMC interface………………………………………………………………………………………………………..21
4.1.2 PMC interface………………………………………………………………………………………………………..22
4.1.3 SATA interface………………………………………………………………………………………………………24
4.1.4 COM port…………………………………………………………………………………………………………..…25
4.1.5 Connectors on the front panel of CPC507…………………………………………………………………….…25
4.1.6 LEDs on the front panel of CPC507……………………………………………………………………………....28
4.1.7 Using the module in CompactPCI system………………………………………………………………………..28
4.1.8 Compact PCI connectors…………………………………………………………………………………………..29
4.2 Timers ………………………………………………………………...……………………………………………………36
4.2.1 Watchdog Timer…………………………………………………………………………………………………….36
4.2.2 Description of I/O registers of WDT controller…………………………………………………………………..37
4.3 SPI controller / LEDs / GPIO …...………………………………………………….…………………………………….39
4.3.1 Description of SPI controller registers…………………………………………………………………………...39
4.3.2 Programming SPI device………………………………………………………………………………………….40
4.3.3 FRAM with sequential access……………………………………………………………………………………40
4.4 Devices on the local SMBus ……………………..……………………………………………...……………………….41
4.5 Battery ……………..…………………………………………...…………………………………………………………..41
5. INSTALLATION…..…………………………………………………………………………………………….……………..42
5.1 Safety requirements …………………………………..…………………………………………………………..…..42
5.2 CPC507 installation procedure……………………………………………………………………………………….43
5.3 Board Removal Procedure……………………………………………………………………………………………44
5.4 Installing peripherals to CPC507……………………………………………………………………………………..44
5.4.1 Connecting USB devices……………………………………………………………………………………….45
5.5 Battery replacement…………………………………………………………………………………………………...45
5.6 Installing CFast Drive………………………………………………………………………………………………….45
6. SYSTEM SETUP ……………………..…………….…………………………………………..…………………………….46

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6.1 Resetting the BIOS Setup settings …………………………………………………………...……………......……….46
7. AMI APTIO BIOS SETUP ………………….………………………..………………………………………………………47
7.1 Starting and Updating BIOS Setup …………………………………………………………...……………......……….47
7.1.1 Starting BIOS Setup…………………………………………………………………………………………….47
7.1.2 Navigation keys ……………………….……………………………………………...……………......……….47
7.1.3 BIOS Update …………………………………………………………...………………….………......……….48
7.2 Advanced……………..…………………………………………………………………………………………………...49
7.2.1 Fastwel Features………………………………………………………………………………………………..49
8. CPC507 TROUBLESHOOTING ……..…………………..…………………..……………………………………………..50
9. POWER CONSUMPTION …………………………………….……………….....………………………….....…………...51
ANNEX A: TERMS, ACRONYMS AND ABBREVIATIONS …………………….……………………………………………..52
ANNEX B: DICSLAIMER…………………………………………………………………………………………………..……….53
List of Tables
Table 1-1: Versions of CPC507…..……………………………………………………………………………………………….11
Table 2-1: Delivery checklist ……………………………………………………………………………………………………..15
Table 2-2: Operational ranges of external influencing factors …………………………………………………………….15
Table 3-1: System information …………………………………………………………………………………………………...19
Table 4-1: Purpose of XMC1 XS7 (P15) and XMC2 XS8 (P15) connector pins on the CPC507 board …….………...21
Table 4-2: PMC connector pin assignment ………………………………………..…………………………………………..23
Table 4-3: Assignment of SATA XS6 connector pins ……..…………………………………………………………………24
Table 4-4: Assignment of XP2 connector pins …………………………………………..……………………………………25
Table 4-5: Assignment of USB connector pins on the front panel of CPC507…………………………………………..26
Table 4-6: Assignment of Gigabit Ethernet connector pins …...…………………………………………………………...26
Table 4-7: Assignment of XS1 DisplayPort connector pins of the CPC507 module ….………………………………..27
Table 4-8: State of the SYS LED of the CPC507 module …………………………………………………………………….28
Table 4-9: Color code designations of connectors ………………….……………………………………………………….31
Table 4-10: Assignment of pins of the CompactPCI XS20 (J1) system connector ..……………...……………………31
Table 4-11: Pin assignment of the XS18 (J2) system connector of 64-bit CompactPCI bus ..………………………..32
Table 4-12: Pin assignment of the XS21 (J3) connector of CPC507…...…...……………………………………………..33
Table 4-13: Assignment of the XS19 (J4) connector pins of the CPC507 module ………..……...…………………….34
Table 4-14: Assignment of the XS17 (J5) connector pins of CPC507……………………………………………………..35
Table 4-15: Timer Current Value Register [23:0]…………………………………...………………………………………….37
Table 4-16: Timer Initial Value Register [23:0]……………………………..…………………………………………………..37
Table 4-17: Status Register………………………………………………………………………………………………………..38
Table 4-18: Control Register………………………………………………………………………………………………………38
Table 4-19: Registers of the SPI controller…………………………………………………………………………………..…39
Table 4-20: Device addresses on SMBus……………………………………………………………………………………….41
Table 7-1: Assignment of navigation keys……………………………………………………………………..………………47
Table 7-2: Setting the Fastwel Features…………………..…………………………………………………………………….49
Table 8-1: Causes of module faults and their rectifications………………………………………………………………...50
Table 9-1: Supply voltage of +5 V,+3.3 V,+12 V,-12 V fed from the CPCI bus……………………………………………51
Table A 1 –Terms, acronyms and abbreviations …………………………………………………………………...………..52

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List of Figures
Figure 2-1: Device dimensions…………………………………………...………………………………………………………14
Figure 3-1: Block diagram of the device ……………...………………………………………………………………………..17
Figure 3-2: Location of the main components of CPC507………………………………….……………………………….20
Figure 4-1: XMC XS7 (P15) and XS8 (P15) connectors ………………………….…………………………………………..21
Figure 4-2: Connectors PMC XS10 (P3), XS11 (P1), XS12 (P3) and XS13 (P2)……………..……………………………22
Figure 4-3: USB connectors on the front panel of CPC507………...……………………………………………………….25
Figure 4-4: Gigabit Ethernet RJ45 connector ……………………...………………………………………………………….26
Figure 4-5: DisplayPort connector …………………..………………………………………………………………………….27
Figure 4-6: LEDS on the front panel of CPC507……………………………………………………………………………….28
Figure 4-7: CompactPCI connectors (J1 –J5 in accordance with the CompactPCI specification) ...……………….30
Figure 7-1: Assignment of navigation keys……………………………………………………………………………………47
All information in this document is provided for reference only, with no warranty of its suitability for any specific purpose. This information has been thoroughly checked and
is believed to be entirely reliable and consistent with the product that it describes. However, Fastwel accepts no responsibility for inaccuracies, omissions or their
consequences, as well as liability arising from the use or application of any product or example described in this document.
Fastwel Co. Ltd. reserves the right to change, modify, and improve this document or the products described in it, at Fastwel's discretion without further notice. Software
described in this document is provided on an “as is” basis without warranty. Fastwel assumes no liability for consequential or incidental damages originated by the use of
this software.
This document contains information, which is property of Fastwel Co. Ltd. It is not allowed to reproduce it or transmit by any means, to translate the document or to convert
it to any electronic form in full or in parts without antecedent written approval of Fastwel Co. Ltd. or one of its officially authorized agents.
Fastwel and Fastwel logo are trademarks owned by Fastwel Co. Ltd., Moscow, Russian Federation. CompactPCI is a trademark of the PCI industrial Computers
Manufacturers Group. Ethernet is a registered trademark of Xerox Corporation. IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc.
Intel is a trademark of Intel Corporation. Pentium M and Celeron M are trademarks of Intel Corporation. Microsoft is a trademark of the Microsoft Corporation. In addition,
this document may include names, company logos and trademarks, which are registered trademarks and, therefore, are property of their respective owners.
Fastwel welcomes suggestions, remarks and proposals regarding the form and the content of this Manual.

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Ownership rights
This document contains information that is the property of Fastwel Group. It may not be copied or
transmitted by any known means, nor may it be stored in information storage and retrieval systems
without the prior written consent of Fastwel Group or one of its authorized agents. The information
contained in this document, to the best of our knowledge, is free from any errors, however, Fastwel
Group accepts no responsibility for any inaccuracies and their consequences, as well as liability
arising from the use or application of any diagram, product or example given in this document.
Fastwel Group reserves the right to change and improve both this document and the product
presented inside of it at its discretion without any further notice.
Safety requirements
This Fastwel Group’s product is developed and tested for the purpose of ensuring compliance to
the electric safety requirements. Its design provides long-term trouble-free operation. The service
life of the product can be significantly reduced due to the improper handling during unpacking and
installation. Therefore, in the interests of your safety and in order to ensure proper operation of the
product, you should follow the recommendations below.

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Conventions
Caution, High Voltage!
This sign and text warn of the dangers associated with electrical discharges (> 60 V)
when touching the device or any part of it. Failure to follow the precautions mentioned
or prescribed in the regulations may endanger your life or health, and may result in
damages to the equipment.
Attention! Static-Sensitive Device!
This sign and text indicate that the electronic boards and their components are
sensitive to static electricity, so proper care should be taken when handling this device
and performing inspections to ensure its integrity and functionality.
Attention! Hot surface!
This sign and text warn of the dangers associated with touching hot surfaces of the
device.
Attention!
This sign is aimed at drawing your attention to aspects of this User Manual. Failure to
fully understand or ignoring these aspects may endanger your health or cause
damages to the equipment.
Note
This sign is used to text fragments that should be read carefully.

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Safety requirements
This Fastwel Group product has been developed and tested to ensure compliance with electrical
safety requirements. Its design provides long-term failsafe operation. Mishandling the product
during unpacking and installation may significantly affect the product's life cycle. Therefore, for
your own safety and for ensuring proper operation of the device, you should follow the
recommendations given below.
Rules for safe handling with high voltage
Attention!
All operations with this device should only be performed by personnel with sufficient qualifications.
Caution, High Voltage!
Before installing the board in the system, make sure that the mains power supply is off. The same
also applies to the installation of expansion boards.
There is a serious risk of electric shock during installation, repairs, and maintenance of the device,
so always unplug the power supply cord while carrying out of works. The same also applies to the
other power supply cables.
Board Handling Instructions
Static-sensitive device!
Electronic boards and their components are sensitive to static electricity. Therefore, special
attention should be given when handling these devices to ensure their safety and operability.

Do not leave the board in the non-operating position without protective packaging.
If possible, always work with the board in workplaces protected against static electricity.
Should this not be possible, the user should remove the static charge before touching the product
with their hands or tools. The best way to do so is by touching any metal part of the system
enclosure.
It is especially important to observe precautions when replacing expansion boards, jumpers,
etc. If the product is equipped with batteries to power the memory or real-time clock, avoid placing
the board on conducting surfaces such as anti-static mats or sponges. They can cause short
circuits and damage the battery and the board's conducting circuits.


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General rules of usage
In order to keep the warranty, the product must not be altered or changed in any way. Any
changes and improvements unauthorized by Fastwel Group other than those contained in this
User Manual or received from the technical support service of Fastwel Group in the form of a set of
instructions for their implementation will void the warranty.
This device should be installed and connected only to systems that meet all necessary technical
and climatic requirements. This also applies to the operating temperature range of a particular
version of the board. You should also consider the temperature limits of the batteries installed on
the board.
Only follow the instructions in this User Manual when performing all necessary installation and
configuration operations.
Retain the original packaging for storing products in the future or to transport in case of a
warranty claim. If it is necessary to transport or store the board, pack it the same way as it was
packed at the time of receipt.
Proceed with extra caution when handling and unpacking the device. Follow the instructions
given above and in the below chapter “Transportation, Unpacking and Storage”.
MANUFACTURER’S WARRANTIES
Warranty liabilities
The manufacturer guarantees that the CPC507 Module meets the requirements of technical
specifications for IMES.467444.117, provided that the Consumer complies with the operating
conditions, transportation, storage, installation and mounting, set by the operational documents.
The manufacturer guarantees that the products supplied by it will not show any manufacturing
defects and materials used in compliance with the rules of operation and maintenance during the
warranty period established at the moment. The Manufacturer's obligation under this warranty is to
repair or replace, free of charge, any defective electronic component included in the returned
product.
Products that failed through the Manufacturer’s fault during the warranty period will be repaired
free of charge. In other cases, the Consumer will be billed based on current remuneration rates
and the cost of consumables.
Right of liability limitation
The manufacturer is not responsible for any damages caused to the Consumer’s property due to
the failure of the product in the process of its use.
Warranty period
The warranty period for the manufacturer's products is 36 months from the date of sale (unless
otherwise provided by the delivery agreement).
For customized products, the warranty period is 60 months from the date of sale (unless otherwise
provided by the delivery agreement).

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Limitation of warranty obligations
The above warranty does not apply to:
- the products (including software) that have been repaired or modified by the employees who do
not represent the Manufacturer. The exception is when the Consumer has made repairs or made
changes to the product strictly in accordance with the instructions previously agreed and approved
by the Manufacturer in writing;
- the products which have failed because of inappropriate change of a polarity sign (to the opposite
one) of the power supply source, incorrect operation, transportation, storage, installation, mounting
or accident.
Procedure for returning products for repairs
In order to return the products for repairs:
- contact the Product Supplier or any official dealer of the Product Supplier for return material
authorization for the product;
- attach to the returned product the fault identification report made in the form adopted by the
Consumer, indicating the list of circumstances and signs of malfunction;
- place the product in the consumer packaging of the Manufacturer (antistatic bag) and cardboard
packaging (box)), in which the product was delivered to the Consumer. If there is no antistatic bag,
the Consumer loses the right to warranty service unilaterally;
− the Consumer pays all the expenses related to the delivery of the product to the Supplier or any
official dealer of the Supplier.

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Transportation, Unpacking and Storage
Transportation
The modules should be transported in the separate manufacturer’s packaging (container),
consisting of an individual antistatic packaging and a cardboard box, in closed transport (road, rail,
air in heated and sealed compartments) under storage conditions 5 according to the GOST
standard 15150-69 or under storage conditions 3 for sea transportation.
It is allowed to transport the modules packed in individual antistatic bags in manufacturer’s group
packaging (container).
Transportation of packaged modules should be carried out in accordance with the rules of
transportation of goods currently valid for this type of transport.
During handling operations and transportation, the packed modules should not be subjected to
sudden shocks, drops, impacts and precipitation. The packed modules should be placed on the
vehicle in such a way as to preclude their further movements.
Unpacking
Before unpacking, after transportation at negative ambient temperatures, the modules must be
kept for 6 hours under storage conditions 1, in accordance with the GOST standard 15150-69.
Do not place the packed modules near any heat sources before unpacking.
When unpacking the modules, it is necessary to observe all precautions to ensure their safety, as
well as marketable condition of manufacturer’s consumer packaging.
When unpacking, it is necessary to check the modules for any external mechanical damages after
transportation.
Storage
Storage conditions of the modules 1 comply with the GOST standard 15150-69.

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Three Year Warranty
Fastwel Co. Ltd. (Fastwel), warrants that its standard hardware products will be free from defects
in materials and workmanship under normal use and service for the currently established warranty
period. Fastwel’s only responsibility under this warranty is, at its option, to replace or repair any
defective component part of such products free of charge.
Fastwel neither assumes nor authorizes any other liability in connection with the sale, installation
or use of its products. Fastwel shall have no liability for direct or consequential damages of any
kind arising out of sale, delay in delivery, installation, or use of its products.
If a product should fail through Fastwel's fault during the warranty period, it will be repaired free of
charge. For out of warranty repairs, the customer will be invoiced for repair charges at current
standard labor and materials rates.
Warranty period for Fastwel products is 36 months since the date of purchase.
For customized products, the warranty period is 60 months from the date of sale (unless otherwise
provided by the delivery agreement).
The warranty set forth above does not extend to and shall not apply to:
1. Products, including software, which have been repaired or altered by other than
Fastwel personnel, unless Buyer has properly altered or repaired the products in
accordance with procedures previously approved in writing by Fastwel.
2. Products, which have been subject to power, supply reversal, misuse, neglect,
accident, or improper installation.
Returning a product for repair
1. Apply to Fastwel Company or to any of the Fastwel's official representatives for the
Product Return Authorization.
2. Attach a failure inspection report with a product to be returned in the form, accepted by
customer, with a description of the failure circumstances and symptoms.
3. Carefully package the product in the antistatic bag, in which the product had been
supplied. Failure to package in antistatic material will VOID all warranties. Then
package the product in a safe container for shipping.
4. The customer pays for shipping the product to Fastwel or to an official Fastwel
representative or dealer.

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1 Introduction
1.1 System overview
The CPC507 (IMES.467444.117) CPU module (hereinafter referred to as the Device or the
Product) presented in this User Manual is manufactured in CompactPCI (CPCI) form-factor and
supports the PCI architecture. This allows you to work with a wide range of equipment. For the
information on the CompactPCI standard, please refer to the relevant specifications for PCI and
CompactPCI Standards. For more information on these standards and their use, please visit the
official website of the PCI Industrial Computer Manufacturers Group (PICMG) at:
http://www.picmg.org/.
1.2 General Description of the Module
The CPC507 CPU module, implemented in accordance with the 6U CompactPCI standard,
expands the line of Fastwel 6U modules. The most important feature of this module is the
availability of two platforms for installation of PMC / XMC mezzanine modules. By using a single-
chip solution based on AMD FP5 APU (Ryzen Embedded V-Series) SoC, together with 2
mezzanine modules, CPC507 can be used in compact and cost-effective computing systems.
The Ryzen Embedded platform is an up-to-date solution from AMD (launched in 2018, availability
period: 10 years) based on the 14 nm technology. The System on a Chip (SoC) supports modern
high-speed interfaces and also has an integrated graphics core with a large number of high-
resolution digital video outputs.
1.3 Module versions
Module versions are specified in the Table 1-1 below.
Table 1-1 –Versions of CPC507
Name
Conventional
name
Ordering name
Note
CPC507 CPU
Module
CPC507
CPC507-01
AMD Ryzen Embedded V1404I processor 25W 4 cores, 16GB
DDR4 SDRAM with ECC support, 3x LAN 10/100/1000 Mb, 3x
USB 3.1, DisplayPort, CFast, 64 GB 3D NAND Flash, from -40
°C to +70 °C.
CPC507-02
AMD Ryzen Embedded V1404I processor 15 W 4 cores, 8 GB
DDR4 SDRAM with ECC support, 3 x LAN 10/100/1000 Mb, 3
x USB 3.1, DisplayPort, CFast, 64 GB 3D NAND Flash, from -
40 °C to +85 °C.
Note –Application of conformal coating is available. When ordered, the -COATED option is added to the version name, for
example CPC507-01-COATED.

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2 General Information
2.1 General Features of CPC507
● Processor AMD Ryzen Embedded V1404I SoC APU:
- 4 x cores x64, 8 x threads;
- 8 x graphics cores;
- 6 MB cache;
● RAM:
◦ DDR4-2400 SDRAM with ECC support:
- 16 GB (for CPC507-01);
- 8 GB (for CPC507-02).
● Video Output:
- DisplayPort (4096x2160@60Hz) interface, routed to the front panel;
● PCI Bus:
- Routed to the CompactPCI J1/J2 connectors;
- 64bit/66MHz;
- Implemented on the bridge PCIe->PCI-X PI7C9X130;
- Operation in the peripheral slot (Non-transparent Bridge mode).
● PCIe Bus:
- PCIe Gen3 (up to 8GT/s) is routed to the P15 XMC connector with support of up to x8 devices;
- Possibility to use link x8 in the 2x4 mode (configurable in BIOS), links x4 are routed to the P15
XMC1 and XMC2 connectors;
● FRAM:
- Volume 32 KB;
● Integrated SATA SSD:
- Capacity 64 GB 3D NAND Flash (Pseudo-SLC);
- SATA III 6 Gbps interface;
● CFast drive:
- Speed SATA III 6 Gbps interface;
● SPI interface:
- FRAM support;
● 3 x LAN ports 10/100/1000 Mb on PCIe x4 Gen2:
- 2 x channels are routed to the backplane (PICMG 2.16);
- 1 x channel is routed to the front panel;
- Intel® Ethernet Controller I350 is used;
● USB ports:

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- Support of USB 2.0 (480 Mb/sec), USB 3.1 Gen 1 (5 Gb/sec);
- Connection of up to 3 x devices via connectors on the front panel (USB 3.1 Gen 1);
● Real Time Clock:
- Power is supplied from the CR2032 (3V) lithium battery;
● Watchdog Timer:
- 30 µs to 512 s with program control option;
● Hardware monitor:
- Implemented via the SMBus interface;
- Monitoring of up to 7 power supply voltages;
- Monitoring the board temperature at two points;
● Support of XMC/PMC expansion boards:
- Support of 2 x PMC/XMC modules;
- PCI-X 64bit/66MHz bus is routed to the P1-P4 PMC1 and PMC2 connectors;
- PMC I/O P4 is routed to RIO for the both mezzanines (PICMG PMC on CompactPCI R1.0
Specification);
- PCIe x8 Gen3 Bus is routed to the P15 XMC1 (ANSI/VITA 42.3, XMC: PCI Express Protocol
Layer) connector, can be used in the x4 mode for 2 x mezzanines.
● LEDs:
- Board start diagnostics LED;
- LED for accessing SATA drives;
- LED for indication of processor overheating;
- Two program-controlled LEDs (User LEDs);
● Software compatibility:
- Linux Debian 10;
- Astra Linux Special Edition, “Smolensk” release v1.5, v1.6;
- Microsoft Windows 10 IoT Enterprise 64bit.
● MTBF:
- Min. 50,000 hours;
2.2 Compatibility with the PICMG/VITA standards
The CPC507 module is compatible with the following PICMG/VITA standards:
- PICMG 2.0 CompactPCI R3.0 Specification;
- PICMG 2.3 PMC on CompactPCI R1.0 Specification;
- PICMG 2.16 CompactPCI Packet Switching Backplane R1.0 Specification;
- ANSI/VITA 42.0 XMC: Switched Mezzanine Card Base Specification;
- ANSI/VITA 42.3 XMC: PCI Express Protocol Layer;
- ANSI/VITA 30.1 2mm Connector Practice for Conduction Cooled Euroboards;
- ANSI/VITA 39 PCI-X for PMC and Processor PMC;

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2.3. Device dimensions
Figure 2-1: Device dimensions
2.4. Delivery checklist
The complete delivery checklist for CPC507 is specified in the Table 1-2.

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C P C 5 0 7 . U s e r M a n u a l 15
Table 2-1: Delivery checklist
Designation
Name
Number
Note
IMES.467444.117
IMES.467444.117-01
CPC507-01 CPU Module
CPC507-02 CPU Module
1 pcs.
IMES.467941.057
An installation kit consisting of:
- locking mechanism IMES.741124.233 - 1 pcs;
- screw DIN7985-M2,5x6-A2 - 2 pcs.
1 pcs.
IMES.421945.071-16
Packaging
1 pcs.
2.5 Operational conditions
The product must be remain functional under climatic and mechanical effects given in Table 1-3.
Table 2-2: Operational ranges of external influencing factors
Influencing factor
Characteristics of the influencing
factor
Value of the influencing
factor
1. Sinusoidal vibration
Acceleration amplitude, m/s2(g)
20 (2)
Frequency range, Hz
10-500
2. Single acting mechanical shock
Acceleration amplitude, m/s2(g)
300 (30)
Duration of shock acceleration, ms
11
3. Repeated mechanical shock
Acceleration amplitude, m/s2(g)
100 (10)
Duration of shock acceleration, ms
11
Influencing factor
Characteristics of the influencing
factor
Value of the influencing
factor
Number of shocks
1000
4. Ambient temperature
Measuring range, °С
•version СРС507-01
•version СРС507-02
From -40 to +70
From -40 to +85
5. Cyclic damp heat*
Temperature, °С
55

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Relative humidity, %
93
* - only for versions with conformal coating (additional option, when ordering –COATED is added to the product name)
2.6 Product labeling
Product labelling shall contain:
- Name and trademark of the manufacturer;
- Product name;
- Factory number of the product;
- Product's version.
The package labelling shall contain:
- Product name;
- Product version;
- Factory number of the product.
2.7 Packaging information
The CPC507 Module is supplied in a box of the following size: 350х260х70 mm.
Packaged weight of the device –no more than 0.8 kg.
Note
Keep the module’s anti-static bag and consumer packaging in their original form until
the end of the warranty period.

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C P C 5 0 7 . U s e r M a n u a l 17
3 Design and operation
3.1 Block diagram
The block diagram is specified in Figure 3-1 below.
Fig. 3-1 –Block diagram of the device

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C P C 5 0 7 . U s e r M a n u a l 18
3.2 Specific performance features of functional nodes
AMD Ryzen Embedded SoC APU
64-bit AMD CPU, manufactured on 14nm technology node, offering TDP of 25W and an industrial
operating temperature range (from -40 to + 105°C).
This CPU is a single-chip solution that combines 4 x AMD “Zen”processing cores, a 64-bit dual-
channel DDR4 SDRAM memory controller (up to 32 GB, 2400 MHz) and ECC support, the up-to-
date AMD Radeon Vega graphics subsystem with 2D/3D acceleration, an I/O subsystem (PCIe,
USB, SATA) and a set of standard hardware platform support (RTC, UART, Timers, GPIO).
The processor is implemented in the FP5-BGA1140 enclosure, 35x25mm.
DDR4 SDRAM
The board can have 18 x DDR4 2400 MHz SDRAM chips installed (soldered) on it with a total
capacity of up to 16GB. (18 x 8 GB x 8). The operating mode is two-channel, with ECC support.
RTC, NVRAM
The real time clock is integrated into the SoC. The clock operation in the power-off state is ensured
by a CR2032 lithium battery installed on the board. BIOS settings are stored in FRAM non-volatile
memory.
FRAM
There is a non-volatile memory of 32 KB (Ramtron, FM25V02, SPI), which is required for storing
user data (used as a replacement for standard non-volatile RAM). The manufacturer guarantees
100 trillion read/write cycles, which in this type of application corresponds to ~ 340 years of
operation (in the case of a continuous cyclic write/ read procedure).
BGA SSD
The board is equipped with a 64 GB SATA III 6 Gbps SSD in a TFBGA 16x20mm Jedec MO-276
enclosure.
Ethernet
The board has 3 x integrated Gigabit Ethernet interfaces. One is routed to the front panel, the other
two –to the backplane (PICMG 2.16). The interfaces are implemented on the high-speed Intel®
Ethernet Controller I350.
USB
The board has 3 x USB 3.1 Gen 1 channels routed to type A USB connectors on the front panel.
CFast
The CFast is used for connecting appropriate drives. SATA III (6 Gbps) speed is supported.
DisplayPort
The interface is designed to connect digital monitors with a resolution up to 4096x2160@60Hz.
PCI Express
The PCIe Gen3 bus is routed to the P15 XMC1 connector in accordance with the ANSI/VITA 42.3
standard. The interface enables you to connect XMC expansion modules with a set of links x1, x2,
x4, x8. A PCIe x4 link is routed to the P15 XMC2 connector. It can be used if the link on the XMC1
is narrowed down to x4.
PCI
The PCI bus is implemented on the Pericom PI7C9X130 reversible bridge chip connected to the
PCIe x2 bus. The following operating modes are supported: PCI 32bit/33MHz, PCI 64bit/66MHz.
The operation both in the system and in the peripheral slot is supported.
COM0
The debug COM port is routed to the IDC XP2 connector on the board.