Fujitsu SPARC M12-2 User manual

Fujitsu SPARC M12-2/M12-2S
Service Manual
Manual Code: C120-0019-15EN
January 2023

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Contents
Preface xix
Chapter 1 Before Starting Maintenance Work 1
1.1 Warning/Caution Indications 1
1.2 Labels 2
1.2.1 Warning Labels 2
1.2.2 Standard Label 3
1.2.3 System Nameplate Label 4
1.3 R ID Tag 5
1.4 Safety Precautions 5
1.5 Precautions on Static Electricity 6
1.6 Other Precautions 8
1.7 Emergency Power-Off 9
1.8 Tools Required for Maintenance 10
Chapter 2 Understanding the System Units 11
2.1 Understanding the Names and Locations of the Units 11
2.1.1 Units Accessible rom the ront 12
2.1.2 Units Accessible rom the Rear 13
2.1.3 Internal Units 14
2.2 Checking the Memory Configuration Rules 15
2.2.1 Memory Installation Rules 16
2.2.2 Checking Memory Information 21
iii

2.3 Understanding the OPNL unctions 22
2.3.1 OPNL Display unction 24
2.3.2 OPNL Control unction 24
2.4 Understanding the LED Indications 26
2.4.1 OPNL LEDs 26
2.4.2 System Locator 28
2.4.3 LEDs of Each Unit 29
2.5 Understanding the Types of Cable 36
2.5.1 Types of Cable 36
2.5.2 Ports for Cable Connections 36
Chapter 3 Understanding
the Types of Maintenance 39
3.1 Types of Maintenance 40
3.2 Types of Maintenance Applicable to the SPARC M12-2 43
3.2.1 Types of Maintenance for RU Replacement (SPARC M12-2)
43
3.2.2 Types of Maintenance for RU Addition (SPARC M12-2) 45
3.2.3 Types of Maintenance for RU Removal (SPARC M12-2) 46
3.3 Types of
Maintenance Applicable to the SPARC M12-2S (1BB
Configuration) 48
3.3.1 Types of Maintenance for RU Replacement (SPARC M12-2S in
the 1BB Configuration) 48
3.3.2 Types of Maintenance for RU Addition (SPARC M12-2S in the
1BB Configuration) 50
3.3.3 Types of Maintenance for RU Removal (SPARC M12-2S in the
1BB Configuration) 53
3.4 Types of
Maintenance Applicable to the SPARC M12-2S (Multiple-BB
Configuration) 55
3.4.1 Types of Maintenance for RU Replacement (SPARC M12-2S in
a Multiple-BB Configuration) 55
3.4.2 Types of Maintenance for RU Addition (SPARC M12-2S in the
Multiple-BB Configuration) 60
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3.4.3 Types of Maintenance for RU Removal (SPARC M12-2S in the
Multiple-BB Configuration) 64
Chapter FRU Replacement Workflows 69
4.1 Active/Hot Replacement Workflows 69
4.1.1 Active/Hot Replacement Workflow of the XSC U 70
4.1.2 Active/Hot Replacement Workflow of a PCIe Card 71
4.1.3 Active/Hot Replacement Workflow of the Power Supply Unit
(PSU) 72
4.1.4 Active/Hot
Replacement Workflow of the ANU 72
4.1.5 Active/Hot Replacement Workflow of the HDD/SSD 73
4.1.6 Active/Hot Replacement Workflow of the PCI Expansion Unit
74
4.2 Active/Cold Replacement Workflows 76
4.2.1 Active/Cold Replacement Workflow of the XSC U 76
4.2.2 Active/Cold Replacement Workflow of a PCIe Card 78
4.2.3 Active/Cold Replacement Workflow of the
PSU 79
4.2.4 Active/Cold Replacement Workflow of the ANU 81
4.2.5 Active/Cold Replacement Workflow of the ANBPU 82
4.2.6 Active/Cold Replacement Workflow of the HDD/SSD 83
4.2.7 Active/Cold Replacement Workflow of the HDDBPU 85
4.2.8 Active/Cold Replacement Workflow of the OPNL 86
4.2.9 Active/Cold Replacement Workflow of the CMU 87
4.2.10 Active/Cold Replacement Workflow
of Memory 89
4.2.11 Active/Cold Replacement Workflow of the BPU 90
4.2.12 Active/Cold Replacement Workflow of the PSUBP 91
4.2.13 Active/Cold Replacement Workflow of the PCI Expansion Unit
93
4.2.14 Active/Cold Replacement Workflow of the XSC DUAL
Control Cable 94
4.2.15 Active/Cold Replacement Workflow of the XSC BB Control
Cable 96
Contents v

4.3 Inactive/Hot Replacement Workflows 97
4.3.1 Inactive/Hot Replacement Workflow of the XSC U 97
4.3.2 Inactive/Hot Replacement Workflow of a PCIe Card 98
4.3.3 Inactive/Hot Replacement Workflow of the PSU 99
4.3.4 Inactive/Hot Replacement Workflow of the ANU 100
4.3.5 Inactive/Hot Replacement Workflow of the HDD/SSD 101
4.3.6 Inactive/Hot Replacement Workflow of the PCI Expansion
Unit
102
4.4 Inactive/Cold Replacement Workflows 103
4.4.1 Inactive/Cold Replacement Workflow of the XSC U 104
4.4.2 Inactive/Cold Replacement Workflow of a PCIe Card 106
4.4.3 Inactive/Cold Replacement Workflow of the PSU 107
4.4.4 Inactive/Cold Replacement Workflow of the ANU 108
4.4.5 Inactive/Cold Replacement Workflow of the ANBPU 109
4.4.6 Inactive/Cold Replacement Workflow of the
HDD/SSD 110
4.4.7 Inactive/Cold Replacement Workflow of the HDDBPU 112
4.4.8 Inactive/Cold Replacement Workflow of the OPNL 113
4.4.9 Inactive/Cold Replacement Workflow of the CMU 114
4.4.10 Inactive/Cold Replacement Workflow of Memory 115
4.4.11 Inactive/Cold Replacement Workflow of the BPU 116
4.4.12 Inactive/Cold Replacement Workflow of the PSUBP 117
4.4.13 Inactive/Cold Replacement Workflow of
the Crossbar Cable
119
4.4.14 Inactive/Cold Replacement Workflow of the XBU 120
4.4.15 Inactive/Cold Replacement Workflow of the PCI Expansion
Unit 121
4.4.16 Inactive/Cold Replacement Workflow of the XSC DUAL
Control Cable 122
4.4.17 Inactive/Cold Replacement Workflow of the XSC BB Control
Cable 123
4.5 System-Stopped/Hot Replacement Workflows 125
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4.5.1 System-Stopped/Hot Replacement Workflow of the XSC U 125
4.5.2 System-Stopped/Hot Replacement Workflow of a PCIe Card
126
4.5.3 System-Stopped/Hot Replacement Workflow of the PSU 127
4.5.4 System-Stopped/Hot Replacement Workflow of the ANU 128
4.5.5 System-Stopped/Hot Replacement Workflow of the HDD/SSD
129
4.5.6 System-Stopped/Hot Replacement Workflow of the PCI
Expansion Unit 130
4.6 System-Stopped/Cold Replacement
Workflows 131
4.6.1 System-Stopped/Cold Replacement Workflow of the XSCFU 1 2
4.6.2 System-Stopped/Cold Replacement Workflow of a PCIe Card
133
4.6.3 System-Stopped/Cold Replacement Workflow of the PSU 134
4.6.4 System-Stopped/Cold Replacement Workflow of the FANU 1 5
4.6.5 System-Stopped/Cold Replacement Workflow of the ANBPU
136
4.6.6 System-Stopped/Cold Replacement Workflow of the HDD/SSD
137
4.6.7 System-Stopped/Cold Replacement Workflow of the HDDBPU
138
4.6.8 System-Stopped/Cold Replacement Workflow of the OPNL 139
4.6.9 System-Stopped/Cold Replacement Workflow of the CMU 140
4.6.10 System-Stopped/Cold Replacement Workflow of Memory 141
4.6.11 System-Stopped/Cold Replacement Workflow of the BPU 142
4.6.12 System-Stopped/Cold Replacement Workflow of the PSUBP
143
4.6.13 System-Stopped/Cold Replacement Workflow of the Crossbar
Cable 144
4.6.14 System-Stopped/Cold Replacement Workflow of the XBU 145
Contents vii

4.6.15 System-Stopped/Cold Replacement Workflow of the XSC
DUAL Control Cable 146
4.6.16 System-Stopped/Cold Replacement Workflow of the XSC BB
Control Cable 147
4.6.17 System-Stopped/Cold Replacement Workflow of the PCI
Expansion Unit 148
Chapter 5 FRU Addition Workflows 151
5.1 Active/Hot Addition Workflows 151
5.1.1 Active/Hot Addition Workflow of a PCIe Card 152
5.1.2 Active/Hot
Addition Workflow of the HDD/SSD 152
5.1.3 Active/Hot Addition Workflow of the PCI Expansion Unit 153
5.2 Active/Cold Addition Workflows 154
5.2.1 Active/Cold Addition Workflow of a PCIe Card 155
5.2.2 Active/Cold Addition Workflow of the HDD/SSD 156
5.2.3 Active/Cold Addition Workflow of the CMUU 158
5.2.4 Active/Cold Addition Workflow of Memory 159
5.2.5 Active/Cold
Addition Workflow of the PCI Expansion Unit 161
5.2.6 Active/Cold Addition Workflow of the SPARC M12-2S 162
5.3 Inactive/Hot Addition Workflows 164
5.3.1 Inactive/Hot Addition Workflow of a PCIe Card 164
5.3.2 Inactive/Hot Addition Workflow of the HDD/SSD 165
5.3.3 Inactive/Hot Addition Workflow of the PCI Expansion Unit
166
5.4 Inactive/Cold Addition
Workflows 167
5.4.1 Inactive/Cold Addition Workflow of a PCIe Card 168
5.4.2 Inactive/Cold Addition Workflow of the HDD/SSD 169
5.4.3 Inactive/Cold Addition Workflow of the CMUU 170
5.4.4 Inactive/Cold Addition Workflow of Memory 172
5.4.5 Inactive/Cold Addition Workflow of the PCI Expansion Unit
174
5.4.6 Inactive/Cold Addition Workflow of the SPARC M12-2S 175
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5.5 System-Stopped/Hot Addition Workflows 176
5.5.1 System-Stopped/Hot Addition Workflow of a PCIe Card 177
5.5.2 System-Stopped/Hot Addition Workflow of the HDD/SSD 177
5.5.3 System-Stopped/Hot Addition Workflow of the PCI Expansion
Unit 178
5.6 System-Stopped/Cold Addition Workflows 180
5.6.1 System-Stopped/Cold Addition Workflow of a PCIe Card 180
5.6.2 System-Stopped/Cold Addition Workflow of the HDD/SSD 181
5.6.3 System-Stopped/Cold Addition Workflow of the CMUU 182
5.6.4 System-Stopped/Cold Addition Workflow of Memory 183
5.6.5 System-Stopped/Cold Addition Workflow of the PCI Expansion
Unit 184
5.6.6 System-Stopped/Cold Addition Workflow of the SPARC M12-2S
186
Chapter 6 FRU Removal Workflows 189
6.1 Active/Hot Removal Workflows 189
6.1.1 Active/Hot Removal Workflow of a PCIe Card 190
6.1.2 Active/Hot Removal Workflow of the HDD/SSD 191
6.1.3 Active/Hot Removal Workflow of the PCI Expansion Unit 191
6.2 Active/Cold Removal Workflows 192
6.2.1 Active/Cold Removal Workflow of a PCIe Card 193
6.2.2 Active/Cold Removal Workflow of the HDD/SSD 195
6.2.3 Active/Cold Removal Workflow of the CMUU 196
6.2.4 Active/Cold Removal Workflow of Memory 198
6.2.5 Active/Cold Removal Workflow of the PCI Expansion Unit 199
6.2.6 Active/Cold Removal Workflow of the SPARC M12-2S 201
6.3 Inactive/Hot Removal Workflows 202
6.3.1 Inactive/Hot Removal Workflow of a PCIe Card 203
6.3.2 Inactive/Hot Removal Workflow of the HDD/SSD 204
6.3.3 Inactive/Hot Removal Workflow of the PCI Expansion Unit 205
6.4 Inactive/Cold
Removal Workflows 206
Contents ix

6.4.1 Inactive/Cold Removal Workflow of a PCIe Card 207
6.4.2 Inactive/Cold Removal Workflow of the HDD/SSD 208
6.4.3 Inactive/Cold Removal Workflow of the CMUU 209
6.4.4 Inactive/Cold Removal Workflow of Memory 211
6.4.5 Inactive/Cold Removal Workflow of the PCI Expansion Unit
212
6.4.6 Inactive/Cold Removal Workflow of the SPARC M12-2S 214
6.5 System-Stopped/Hot Removal
Workflows 215
6.5.1 System-Stopped/Hot Removal Workflow of a PCIe Card 215
6.5.2 System-Stopped/Hot Removal Workflow of the HDD/SSD 216
6.5.3 System-Stopped/Hot Removal Workflow of the PCI Expansion
Unit 217
6.6 System-Stopped/Cold Removal Workflows 219
6.6.1 System-Stopped/Cold Removal Workflow of a PCIe Card 219
6.6.2 System-Stopped/Cold Removal Workflow of the HDD/SSD 221
6.6.3 System-Stopped/Cold Removal
Workflow of the CMUU 222
6.6.4 System-Stopped/Cold Removal Workflow of Memory 223
6.6.5 System-Stopped/Cold Removal Workflow of the PCI Expansion
Unit 224
6.6.6 System-Stopped/Cold Removal Workflow of the SPARC M12-2S
226
Chapter 7 FRU Maintenance Precautions 227
7.1 Precautions for RU Replacement 227
7.2 Precautions for RU Expansion 230
7.3 Precautions for RU Reduction 232
Chapter 8 Preparation for Maintenance 235
8.1 Checking the System Configuration 235
8.1.1 Checking Logical Domain Configuration Information 235
8.1.2 Checking Hardware 236
8.1.3 Checking the XCP irmware Version 241
8.1.4 Checking the Software Version 243
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