Gooxi SL101-D04R-G3 User manual

1
Whitley Platform L-shaped Server
Barebones
User’s Manual
V1.0
Shenzhen Gooxi Information Security Co., Ltd.

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Dear user:
Copyright© Shenzhen Gooxi Information Security Co., Ltd. All rights reserved.
This user manual, including but not limited to all the information contained in it, is protected
by Copyright Law. Without the permission of Shenzhen Gooxi Information Security Co., Ltd.
(hereinafter referred to as "Gooxi"), it is not allowed to imitate, copy, extract, redistribute or use
for other purposes.
Disclaimer
Gooxi provides this user manual "present situation" and does not provide any express or
implied warranties and guarantees to the extent permitted by law, including but not limited to
commercial marketability, suitability for specific purposes, non-infringement of any other person's
rights and any. The use of this user manual or the inability to use this user manual guarantees, and
Gooxi does not guarantee and guarantee the accuracy or reliability of the results obtained from the
use of this user manual or any information obtained through this user manual.
Due to product version upgrades or other reasons, the contents of this user manual will be
updated from time to time. Unless otherwise agreed, this user manual is only used as a guide, and
the user should bear all the risks of using this user manual.
Trademark Statement
Gooxi is a trademark of Shenzhen Gooxi Information Security Co., Ltd.
Intel and Xeon are trademarks of Intel Corporation in the US and other countries.
Microsoft and Windows are trademarks of companies within the Microsoft group of
companies.
Linux is a registered trademark of Linus Torvalds.
Aspeed is a trademark of ASPEED Technology Inc..
The ownership of other trademarks belongs to their respective owners.
Product name: Gooxi Whitley Platform L-shaped Server Barebones
Manual Version: V1.0
Address: Area A, 5th Floor, Block A3, Digital Technology Park, Gaoxin South 7th Road,
High-tech Park, Nanshan District, Shenzhen City, Guangdong, China
Postcode: 518000
Website: https://www.gooxi.com
Words
Paraphrase
Platinum
Efficiency
Power Supplies
The platinum certified power supply is the "80 PLUS Platinum" standard, that is, the
conversion rate of 20% load is above 90%, the conversion rate of 50% load is above 94%,
and the conversion rate of 100% load is above 91%
M.2
The M.2 port is a new-generation port standard tailored for Ultrabook. It is a new port
specification introduced by Intel®to replace mSATA.
C620A
Intel®Chipset
RJ45
Common name for standard 8-bay modular interface
AST2500
Aspeed ®BMC Chip
Socket P
Intel ®processor interface types
-F CPU
Refers to the CPU that supports the Intel ®Omni-Path Host Fabric interface, Omni-Path
high-speed optical cable interconnection technology, which can support up to 100Gbps
end-to-end interconnection
8038 Fan
Fan with dimensions 80x80x38mm
LGA 4189
Full name is Land Grid Array, LGA 4189 represents 4189 contacts
CR2032
3V CR2032 lithium manganese battery , shaped like a button, referred to as a button
battery or a lithium manganese button battery
RS-232
One of the communication interfaces on the computer is the asynchronous transmission
standard interface, called COM port

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Glossary:
Abbreviation
Original
Chinese meaning
PCH
Platform Controller Hub
即之前统称的“南桥”
GbE
Gigabit Ethernet
千兆以太网
BMC
Baseboard Management Controller
基板管理控制器
IPMI
Intelligent Platform Management Interface
智能平台管理接口
CPU
Central Processing Unit
中央处理器
SATA
Serial Advanced Technology Attachment
串行 ATA 接口规范
SAS
Serial Attached SCSI
串行 SCSI
sSATA
secondary SATA
扩展 SATA 接口
LAN
Local Area Network
局域网
VGA
Video Graphics Array
视频传输标准
MB
Mother Board
主板
MIB
Motherboard Interface Board
主板转接板/侧板
BP
Backplane
背板
PCIE
Peripheral Component Interconnect Express
高速串行计算机扩展总线标准
USB
Universal Serial Bus
通用串行总线
FW
Firmware
固件
TPM
Trusted Platform Module
可信赖平台模块
IO
Input/Output
输入输出
BIOS
Basic Input-Output System
基本输入输出系统
CMOS
Complementary Metal Oxide Semiconductor
互补金属氧化物半导体
ME
Management Engine
管理引擎
DDR4
Double Data Rate 4 SDRAM
第四代双倍数据速率同步动态随机存储器
DIMMs
Dual-Inline-Memory-Modules
双列直插式存储模块
RDIMMs
Registered DIMMs
带寄存器的双线内存模块
LRDIMM
Load-Reduced DIMMs
低负载 DIMM
AEP
Apache Pass
Intel®傲腾 DDR4 内存代号
MEZZ CONN
Mezzanine Connector
夹层/扣卡
KVM
Keyboard Video Mouse
通过直接连接键盘、视频、鼠标端口，能够访
问和控制计算机
CPLD
Complex Programmable Logic Device
复杂可编程逻辑器件
Jtag
Joint Test Action Group, a joint test working group, mainly used for internal chip testing
NC Pin
Empty pin
XDP
Extend Debug Port, Intel ®CPU debugging interface

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ECC
Error Correcting Code
错误检查和纠正
CFM
Cubic Feet Per Minute
立方英尺每分钟
RPM
Revolution Per Minute
转每分
Conventions:
Note: Used to convey equipment or environmental safety warning messages, which, if not
avoided, may result in equipment replacement, data loss, reduced equipment performance, or other
unpredictable results.
Red arrow: Represents pointing to a location
Blue arrow: represents the action of pulling out or inserting downward or inserting at an angle
Hollow arrows: represent the next action or result
Dark blue rotation arrow 1: Represents the action of turning the screw clockwise or pulling
outward
Dark blue rotation arrow 2: Represents the action of turning the screw counterclockwise or
snapping it inward
Note: Used to convey equipment or environmental safety warning messages, which, if not avoided, may
result in equipment replacement, data loss, reduced equipment performance, or other unpredictable results.
Manual
version
Release date
Modify the description
V1.0
2021-AUG-1
Initial Release

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CONTENTS
CHAPTER 1 SAFETY STATEMENT ..................................................................................................................................... 8
1.1 GENERAL SAFETY MATTERS ................................................................................................................................................................. 8
1.2 TOXIC AND HAZARDOUS SUBSTANCES OR ELEMENTS IN PRODUCTS ..........................................................................................9
1.3 WARNING NOTICES .............................................................................................................................................................................. 10
1.4 CLIMATE AND ENVIRONMENTAL REQUIREMENTS ........................................................................................................................10
1.5 OTHER IMPORTANT DESCRIPTIONS ................................................................................................................................................ 11
CHAPTER 2 PRODUCT INTRODUCTION .......................................................................................................................12
2.1 SYSTEM INTRODUCTION ..................................................................................................................................................................... 12
2.2 PRODUCT FEATURES ............................................................................................................................................................................12
2.2.1 System parameters ......................................................................................................................................................................12
2.2.2 System Architecture................................................................................................................................................................... 14
2.3 INTRODUCTION OF SYSTEM COMPONENTS .....................................................................................................................................15
2.3.1 Front Panel Components ...........................................................................................................................................................19
2.4.2 Rear Panel Components ............................................................................................................................................................ 22
Rear panel port description................................................................................................................................................................. 24
2.4.3 Motherboard Components ........................................................................................................................................................ 25
2.4.4 HDD Backplane Components ..................................................................................................................................................28
2.4.5 DIMM slot locations .................................................................................................................................................................. 36
2.4.6 Hard disk label .............................................................................................................................................................................36
2.4.7 Hard disk indicator ..................................................................................................................................................................... 37
2.4.8 System Fan ................................................................................................................................................................................... 38
CHAPTER 3 INSTALLING SYSTEM COMPONENTS ...................................................................................................39
3.1 INSTALLATION OF CPU.......................................................................................................................................................................39
3.2 INSTALLATION OF HEAT SINK .............................................................................................................................................................39
3.3 MEMORY INSTALLATION ..................................................................................................................................................................... 40
3.3.1 Memory Support Specifications ..............................................................................................................................................40
3.3.2 How to install memory .............................................................................................................................................................. 41
3.4 HARD DISK INSTALLATION ................................................................................................................................................................. 42
3.5 FRONT HARD DISK BACKPLANE INSTALLATION .............................................................................................................................44
3.6 M.2 SSD INSTALLATION .....................................................................................................................................................................45
3.7 INSTALLATION OF PCI-E EXPANSION CARD ................................................................................................................................... 47
3.8 PCI-E MODULE INSTALLATION ..........................................................................................................................................................48
3.9 REAR HARD DISK MODULE BACKPLANE INSTALLATION ..............................................................................................................48
3.10 REAR HARD DISK MODULE INSTALLATION ...................................................................................................................................49
3.11 INSTALLATION OF POWER MODULE .............................................................................................................................................. 50
3.12 INSTALLATION OF THE FAN MODULE ............................................................................................................................................. 51
3.13 INSTALLATION OF THE WIND SHIELD .............................................................................................................................................52
3.14 INSTALLATION OF CD/DVD-ROM ................................................................................................................................................52
3.15 INSTALLATION OF THE UPPER COVER OF THE CHASSIS ............................................................................................................. 54
CHAPTER 4 SYSTEM RACK INSTALLATION ...............................................................................................................55
4.1 MOUNTING ON THE INNER RAIL OF THE GUIDE RAIL .................................................................................................................. 55
4.2 INSTALLING THE OUTER RAILS TO THE RACK................................................................................................................................55
4.3 INSTALL THE SERVER TO THE RACK .................................................................................................................................................56

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CHAPTER 5 BIOS PARAMETER SETTINGS .................................................................................................................. 58
5.1 ENTER THE BIOS SETUP INTERFACE ...............................................................................................................................................58
5.2 SETUP MENU PARAMETER DESCRIPTION ......................................................................................................................................... 58
5.2.1 Navigation Key Description.....................................................................................................................................................58
5.2.2 Main menu description.............................................................................................................................................................. 58
5.2.3 Advanced menu description..................................................................................................................................................... 60
5.2.4 Trusted Computing ..................................................................................................................................................................... 62
5.2.5 Serial Port Console Redirection .............................................................................................................................................. 63
5.2.6 Console Redirection Settings ...................................................................................................................................................64
5.2.7 SIO Configuration ...................................................................................................................................................................... 65
5.2.8 [*Active*] Serial Port................................................................................................................................................................ 66
5.2.9 Option ROM Dispatch Policy ..................................................................................................................................................67
5.2.10 PCI Subsystem Settings .......................................................................................................................................................... 68
5.2.11 CSM Configuration..................................................................................................................................................................69
5.2.12 NVMe Configuration...............................................................................................................................................................70
5.2.13 Network Stack Configuration ................................................................................................................................................71
5.2.14 iSCSI Configuration.................................................................................................................................................................72
5.2.15 Platform Configuration menu ................................................................................................................................................73
5.2.16 PCH SATA Configuration...................................................................................................................................................... 74
5.2.17 PCH sSATA Configuration .....................................................................................................................................................75
5.2.18 USB Configuration ...................................................................................................................................................................76
5.2.19 Miscellaneous Configuration.................................................................................................................................................77
5.2.20 Server ME Configuration ....................................................................................................................................................... 78
5.2.21 Runtime Error Logging ...........................................................................................................................................................78
5.2.22 Socket Configuration menu ................................................................................................................................................... 79
5.2.23 Processor Configuration ..........................................................................................................................................................80
5.2.24 Common RefCode Configuration.........................................................................................................................................83
5.2.25 UPI Configuration .................................................................................................................................................................... 84
5.2.26 Memory Configuration ............................................................................................................................................................86
5.2.27 Memory Topology .................................................................................................................................................................... 88
5.2.28 Memory Map............................................................................................................................................................................. 89
5.2.29 Memory RAS Configuration ................................................................................................................................................. 90
5.2.30 Socket Configuration ...............................................................................................................................................................92
5.2.31 Advanced Power Management Configuration ...................................................................................................................94
5.2.32 CPU P State Control................................................................................................................................................................ 95
5.2.33 Hardware PM State Control...................................................................................................................................................96
5.2.34 CPU C State Control................................................................................................................................................................97
5.2.35 Package C State Control......................................................................................................................................................... 98
5.2.36 CPU-Advanced PM Tuning ................................................................................................................................................... 99
5.2.37 Energy Perf BIAS.................................................................................................................................................................. 100
5.2.38 Server Mgmt Menu ................................................................................................................................................................101
5.2.39 System Event Log menu .......................................................................................................................................................102
5.2.40 BMC network configuration menu ....................................................................................................................................103
5.2.41 View System Event Log menu ............................................................................................................................................106
5.2.42 BMC User Setting ..................................................................................................................................................................107
5.2.43 Add User...................................................................................................................................................................................108
5.2.44 Delete User.............................................................................................................................................................................. 109
5.2.45 Change User Setting ..............................................................................................................................................................110

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5.2.46 Security menu ......................................................................................................................................................................... 111
5.2.47 Boot menu ................................................................................................................................................................................112
5.2.48 Save & Exit menu .................................................................................................................................................................. 113
5.3 USER OPERATION REMINDER ......................................................................................................................................................... 113
CHAPTER 6 RAID SETUP INSTRUCTIONS ..................................................................................................................115
6.1 PCH CONFIGURES RAID .................................................................................................................................................................115
6.1.1 Configuring RAID in UEFI Boot Mode.............................................................................................................................115
6.1.2 Configuring RAID in Legacy Boot Mode..........................................................................................................................122
6.2 RAID CARD CONFIGURES RAID ................................................................................................................................................... 130
6.2.1 Configuring RAID in UEFI Boot Mode.............................................................................................................................130
6.2.2 Configuring RAID in Legacy Boot Mode..........................................................................................................................175
CHAPTER 7 IPMI RAPID DEPLOYMENT .................................................................................................................... 193
7.1 RAPID DEPLOYMENT OF IPMI PROCESS ......................................................................................................................................193
7.1.1 Make sure the motherboard supports the IPMI function ................................................................................................ 193
7.1.2 Enter BIOS to set IPMI function .......................................................................................................................................... 193
7.1.3 IPMI port configuration Static mode...................................................................................................................................196
7.1.4 IPMI configuration Java SOL............................................................................................................................................... 196
7.2 QUICK START INSTRUCTIONS FOR IPMI FUNCTIONS ................................................................................................................197
7.2.1 Enter the operation interface ..................................................................................................................................................197
7.2.2 Default Username and Password ..........................................................................................................................................197
7.2.3 Contents of IPMI Management System ..............................................................................................................................198
7.2.4 Introduction to KVM Remote Management ......................................................................................................................199
7.2.5 KVM page introduction .......................................................................................................................................................... 199
7.2.6 Remote control shortcut operation ....................................................................................................................................... 201
7.2.7 Introduction to SOL .................................................................................................................................................................201
7.3 OTHER WAYS TO CONNECT TO IPMI............................................................................................................................................. 203
7.3.1 IPMI driver.................................................................................................................................................................................203
7.3.2 IPMI tools and other open source software ....................................................................................................................... 203

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Chapter 1 Safety Statement
1.1 General safety matters
To prevent the risk of personal and property damages, be sure to follow the recommendations below.
Please do not open the system cover by yourself, it should be operated by professionally trained maintenance
technicians. Do not touch the triangle-marked portion with the lightning bolt that may be subject to high voltage or
electric shock.
IMPORTANT: Disconnect all cables before servicing. (There may be more than one cable)
It is strictly forbidden to carry out live operations such as starting the machine before the cover is closed.
When it is necessary to open the cover, please wait for the internal equipment to cool before performing it,
otherwise it may cause burns to you.
Do not use this device in wet environments.
If an extension cable needs to be used, use a three-wire cable and make sure it is properly grounded.
Make sure the computer is well grounded. Different grounding methods are possible, but they must be
physically connected to ground. If you are not sure whether the grounding protection is safe, please contact the
appropriate agency or electrician to confirm. If cable routing is required, please contact Gooxi Hengyun
Information Security Co., Ltd. for advice.
Please use a three-core power cord and socket with grounding protection. Improper grounding may cause
leakage, burnout, or even personal injury.
Please ensure that the power socket and the power interface can be in close contact, loose contact may cause
a fire hazard.
Please use your computer under 220V AC voltage. Working with inappropriate voltage will cause the danger
of electric shock, fire and damage to the computer.
It is required that the computer is well ventilated and kept away from heat, fire, and cooling fans, otherwise
the computer may be at risk of smoke, fire or other damage due to overheating.
If you smell or see smoke from your computer, shut down the computer immediately and unplug the power
cord.
The power cord is required to be easily accessible from the power source and the power outlet. Please keep
the power cord and plug clean and undamaged, otherwise there may be a risk of electric shock or fire.
Note: There is a danger of explosion if the battery is improperly replaced. Only use the replacement parts of
the same or equivalent type recommended by the manufacturer. The used battery will pollute the environment.
Please set the replaced old battery according to the relevant instructions.
Keep your computer away from electromagnetic fields.
Stay away from electronic noise caused by high-frequency safety equipment such as air conditioners, large
fans, and large motors for radio and television stations.
Please do not plug or unplug the backplane cable or move the computer while the computer is running,
otherwise the computer may crash or parts may be damaged.

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Please try to avoid frequent restart or power on and off to prolong the life of your computer.
Please keep the environment clean and avoid dust. The temperature of the equipment working environment is
10℃~40℃, and the humidity is 35%~80%.
Please back up important data in time, Shenzhen Gooxi Information Security Co., Ltd. is not responsible for
data loss caused by any circumstances.
The optical drive used in this product is a Class 1 laser device.
Figure 1- 1
1.2 Toxic and hazardous substances or elements in products
During the 10-year environmental protection use period, the toxic and harmful substances or elements
contained in the product will not leak or mutate under normal use conditions, and the use of electronic information
products by users of electronic information products will not cause serious pollution to the environment or serious
damage to persons and property.
Component
Hazardous Substances
Pb
Hg
Cd
Cr VI
PBB
PBDE
Chassis / Baffle
X
O
O
O
O
O
Mechanical components
(fan, heat sink, motor, etc.)
X
O
O
O
O
O
Printed circuit components
- PCA*
X
O
O
O
O
O
Cable / Wire / Connector
X
O
O
O
O
O
HDD
X
O
O
O
O
O
Table 1- 1
Component
Harmful Substances
Pb
Hg
Cd
Cr VI
PBB
PBDE
Media read / Store device
(CD, etc.)
X
O
O
O
O
O
Power supply / adapter
X
O
O
O
O
O
Power cord
X
O
O
O
O
O
Pointing device (mouse,
etc.)
X
O
O
O
O
O
Keyboard
X
O
O
O
O
O

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UPS
X
O
O
O
O
O
Complete rack / Rail
products
X
X
O
O
O
O
Table 1- 2
○ means that the content of the toxic and harmful substance in all homogeneous materials of the component
is below the limit specified in GB/T26572-2011 Limit Requirements for Restricted Substances in Electronic
and Electrical Products.
× indicates that the content of the toxic and harmful substance in at least one homogeneous material of the
component exceeds the limit requirements specified in GB/T26572-2011 Limit Requirements for Restricted
Substances in Electronic and Electrical Products. However, it complies with the EU RoHS Directive (including
its exemption provisions).
Note: the table shows the information of toxic and hazardous substances in all possible components of Gooxi
server, storage and workstation products. Customers can refer to the status of toxic and hazardous substances in all
components of the purchased products according to this table.
1.3 Warning notices
This product complies with EMC Class A standards.
1.4 Climate and Environmental Requirements
The best working temperature of the equipment is 10℃-40℃; the maximum indoor ambient
temperature of the equipment is 40℃.
System battery 3 V CR2032 lithium battery
NOTE: Some configurations have been verified for performance at 45°C temperature and 90% (29°C
maximum dew point) humidity.
Temperature
Working temperature
10 °C~40°C（50 °F~104 °F），the maximum temperature gradient
is 10 ℃ per hour
Continuous operating temperature
range (below 950m or 3117ft above
sea level)
In the situation of no direct illumination, 10 ° C to 40 ° C (50 °F
to 104 °F)
Storage temperature range
–40°C~65°C (–40°F~149°F)
Humidity
Storage
The max. dew point is 33°C (91°F). The relative humidity is 5%
to 95%. The air must not condense at all times.
Continuous operating humidity
percentage range
The max. dew point is 26°C (78.8°F) The relative humidity is
10% to 80%
Table 1- 3

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If the lightning protection facilities of the computer are poor or not available, please shut down the
computer in thunderstorm weather and unplug the power line, network cable, telephone line, etc.
connected with the computer.
Please use the authorized operating system and software and configure them correctly. Shenzhen Gooxi
Information Security Co., Ltd. is not responsible for server failure caused by operating system and
software.
Please do not disassemble the chassis, increase or decrease the hardware configuration of the server.
Shenzhen Gooxi Information Security Co., Ltd. is not responsible for the hardware and data damage
caused by this.
When the server fails, please first check the "troubleshooting" section of this manual to determine and
remove common faults. If you are not sure the cause of the failure, please contact the technical support
department of Shenzhen Gooxi Information Security Co., Ltd. for help.
Choosing a suitable environment for the computer is helpful for the stable operation and can prolong the
life of the computer.
Shenzhen Gooxi Information Security Co., Ltd. reserves the right of final interpretation of the above terms
1.5 Other important descriptions
If the equipment is marked with a label, it means that the equipment with the label is only designed and
evaluated as the altitude of 2000m. Therefore, it is only suitable for safe use below 2000m, and there may be
potential safety hazards when it is used above 2000m.
If the equipment is marked with this mark, it means that the equipment with this mark is only designed and
evaluated based on non tropical climate conditions. Therefore, it is only suitable for safe use in non tropical
climate conditions, and there may be potential safety hazards when it is used in tropical climate conditions.

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Chapter 2 Product Introduction
2.1 System introduction
Gooxi Whitley dual-socket L-shaped series servers are based on the Intel Whitley platform, and are
widely used 1U, 2U, 4U dual-socket servers for the Internet, IDC (Internet Data Center), cloud computing,
enterprise market and telecom business applications. Rack-mounted L-shaped storage server. It is suitable for
high-density deployment of loads such as cloud computing, virtualization, high-performance computing
(HPC), and big data processing to improve data center space utilization. The server has the advantages of
large storage capacity, strong expansion capability, high reliability, easy management, and easy deployment.
2.2 Product Features
The CPU adopts 1 or 2 third-generation Intel®Xeon®Scalable processors (ICE Lake) 8300/ 6300/ 5300/
4300 series processors, LGA4189 socket, TDP 270W;
32 DDR4 memory slots support DDR4 LRDIMM/RDIMM/ECC, the memory frequency supports 2400/
2666/ 2933/ 3200MHz, and the maximum memory capacity is 12TB;
Standard one 3* PCIE 3.0x 8 Riser cards, eleven PCIE 3.0 expansion slots (including 1 OCP 3.0 slot),
support 2 full-width, full-length GPU cards;
The motherboard has two built-in PCIE 4.0x 4 M.2 ports;
Modular design, various combinations of PCIE and hard drives are available
Support 4/8/12/24/25/36* 2.5-inch or 3.5-inch hard disks, support flexible conversion of various NVME
models
Onboard 2 Gigabit data network ports and one Gigabit management network port
Optional 1 OCP3.0 network card module.
2.2.1 System parameters
Processor and memory
Processor
Support 1 or 2 third-generation Intel Whitley platform full series processors,
LGA4189 socket
TDP
Maximum support 270W
Amount of
processor cores
Up to 40 cores
Amount of
processors
2
Memory type
DDR4 ECC RDIMM/LRDIMM, memory frequency supports 2400/ 2667 / 2933/
3200MHz, single CPU supports 8 DDR4 channels , each channel supports 2
DIMMs ; 2 CPUs support a total of 32 DDR4 slots support a single. The
capacity is 16GB, 32GB, 64GB, 128GB, 256GB, maximum support 4TB
memory capacity (16* 256GB LRDIMMs), support Barlow Pass DIMMs (CR
1.5), maximum support 12 TB memory capacity (8* 256GB LRDIMM + 8*
512GB Barlow Pass mapped as memory)
Storage and I/O
storage controller
Internal storage: 2 SATA ports (7Pin), 3 Minisas 8643 ports, 2 PCIe 4.0 X4 M.2
ports, 2 slimline x8 ports
Driver
Support 4, 8, 12, 24, 36* 3.5/2.5-inch hot-swap SATA/SAS HDDs, 25* 2.5-inch

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hot-swap SATA/SAS HDDs, and the rear upper layer is optional and supports 2*
2×3.5 inch SAS/SATA or 2* 2×2.5 inch SAS/SATA or NVME hot-swap hard
drives.
External port
Front port: 2 USB3.0, 1 VGA port
Rear: 1 VGA, 1 DB-9COM port, 2 USB3.0, 1 RJ45 Gigabit management LAN
port, 2* Gigabit/10 Gigabit RJ45 network ports
BMC
ASPEED AST2500
PCIe expansion
Support 2 PCIe 4.0 x32 slots (can be converted into various types of PCIE slots
through PCEI adapter board) , 1 PCIe 4.0 x16, 1 OCP 3.0 (PCIe3.0 x8 signal), 2
Slimline (PCIe4.0 x8 Signal)
TPM
Support
Power supply
Power supply
Platinum 550W, 800W, 1200W, 1600W , 2200W hot-swap redundant power
supply (adapt according to actual power)
System fan
Fan
Support 4* 8038 fans (optional 4* 8056 fans)
Remote management
BMC chip
ASPEED AST2500
IPMI Compliant
IPMI2.0
Management port
1 dedicated RJ45 management network port
System depth
System depth 748MM.
Option Family Support List
System
CentOS 7.5/7.6/8.0/8.1
RHEL 7.4/7.5/7.6/8.0/8.1
SLES12 SP3/SP4
Ubuntu 18.04 / Ubuntu-20.04-
Fedora 28
Windows 10
Win server 2012 R2/2016/2019
Xenserver 7.1/ 7.2/
ESXi 6.7/ 7.0U1c
Windows Server 2012 2016 Hyper-V
BIOS
Name
AMI
Support start mode
HDD (internal)/CD/USB/PXE
TPM support
Yes
Safety certificate
Nation
Asia, Europe, Americas, Australia, Africa
Energy saving
certification
CECP, CELP
Safety certificate
CCC, CE, FCC
RoHS
Meet the requirements
Environmental parameters
Operating
temperature
5 ℃ ~ 40 ℃

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Working humidity
35% ~ 80%
Storage
temperature
-40℃ ~ 70℃
Storage humidity
Humidity: 20%~90% (including packaging)
Table 1- 4
2.2.2 System Architecture
SL series server products include 1U models (SL101-D04R, SL101-D10R), 2U models
(SL201-D08R, SL201-D12RE, SL201-D12R, SL201-D25RE, SL201-D08R-NV, SL201-D12R-NV)
4U models (SL401-D24RE, SL401-D36RE) bays, motherboard name: G4DCL-B, the models are
the same except for the hard disk connection method and the maximum number of compatible hard
disks.
The main board features are as follows:
The CPU adopts the third -generation Intel®ICE-Lake®scalable processor, LGA 4189
socket, TDP 270 W; single processor can reach up to 40 cores, providing excellent system
performance, the highest frequency is 3.2GHz, using Intel the largest single core that can
be achieved by the Turbo acceleration technology, the maximum overclocking (Max Turbo
Frequency) is 3.4GHz;
Supports Intel Hyper-Threading Technology, allowing multiple threads to run concurrently
on each processor core (up to 2 threads per core) to improve multi-threaded application
performance;
Each CPU supports 8 DDR4 channels , each channel supports 2 memory sticks,
RDIMM/LRDIMM;
Supports up to 32* 2400/2666/2933/3200 MHz DDR4 LRDIMM/RDIMM/ECC
memory, and supports a single capacity of 8GB, 16GB, 32GB, 64GB, 128GB, 256GB.
Supports Intel's second-generation Optane memory BPS (maximum 512GB per
DIMM);
There are 3 PCIE RISER slots on the board, among which: RISER1: 32 PCIE LANEs
all come from CPU0, RISER2: 32 PCIE LANEs all come from CPU1, RISER3: 16
PCIE LANEs come from CPU1;
Motherboard integrated AST2500 BMC chip, standard KVM function
G4DCL-B motherboard provides 2* M.2 Key M SSD slots, supports 2280 size, only
supports PCIe 4.0 X 4 signals;
2 Gigabit Ethernet ports are integrated on the motherboard, using 88E1512 chip from PCH;
South bridge PCH adopts INTEL LEWISBURG C620A series chipset;
Modular design of hard disk module, PCIE expansion module, power supply, fan and other
components, tool-free maintenance
PCH leads out 14 SATA Ports, maximum speed: 6Gb/s, compatible with SATA 1.5Gb/s,
3.0Gb/s; SATA Controller outputs 8 SATA PORTs, while SSATA outputs 6 SATA
PORTs, of which SATA PORT has 8 PORTs, according to Sequentially introduced into
2 SFF - 8643 connectors, while the first 4 PORTs of SSATA are introduced into a SFF -
8643 connector, and the latter 2 PORTs are introduced into 7PIN SATA connectors for
connecting SATA DOM and DVD;
The BMC chip in this single board adopts the AST2500 control chip of ASPEED
Company, which is used for IPMI remote management. VGA output port, dedicated
Gigabit RJ45 management network port, and connected to PCH via RMII/NCSI.
The system architecture motherboard block diagram is as follows:

15
Figure 2- 1
2.3 Introduction of system components
1U4 bay model
Product
name
SL101-D04R-G3
Processor
Supports one or two 3rd Generation Intel®Xeon®Scalable processors
MB model
G4DCL
Memory
Supports DDR4 RDIMM/LRDIMM server memory;
memory frequency supports 2400/2666/2933/3200MHz ;
Single CPU supports 8 DDR4 channels, each channel supports 2 DIMMs, and supports a
total of 32 DDR4 slots; single capacity: 16GB, 32GB, 64GB, 128GB, 256GB , and the
whole system supports a maximum memory capacity of 12TB
Note: In order to make the system more stable, it is recommended to use the AVL
MEMORY LIST
PCIe
expansion
Riser1: 1* PCIe4.0x16; Riser2: 1* PCIe4.0x16
Hard drive
Front 4 hot-swap 3.5/2.5-inch SAS/SATA hard drives
M.2 SSD
M.2 x 2 (NVMe protocol 2280)
LAN
On-board 2 Gigabit RJ45 data LAN ports
External
port
Front Port: 2 USB3.0, 1 VGA
Rear port: 1 VGA , 1 COM port , 2 USB3.0 , 1 RJ45 Gigabit management LAN port, 2
Gigabit RJ45 LAN ports
Management
On-board iBMC management module, supports IPMI, SOL, KVM Over IP, virtual media
and other management features
Fan
Supports 7* 7056 fans

16
Power
supply
Supports AC220V 550W, 800W, 1300W, 1600W, 2200W redundant power supply
(according to actual power adaptation)
Supports HVDC 240V ~ 336V 550W 800W 1300W
Supports LVDC -48V 550W 800W 1300W
Dimensions
1U rackmount, 748*433.4* 43.6mm
1U10 bay model
Product
name
SL101-D10R/NV-G3
Processor
Supports one or two 3rd Generation Intel®Xeon®Scalable processors
MB model
G4DCL
Memory
Supports DDR4 RDIMM/LRDIMM server memory;
memory frequency supports 2400/2666/2933/3200MHz ;
Single CPU supports 8 DDR4 channels, each channel supports 2 DIMMs, and supports
a total of 32 DDR4 slots; single capacity: 16GB, 32GB, 64GB, 128GB, 256GB , and the
whole system supports a maximum memory capacity of 12TB
Note: In order to make the system more stable, it is recommended to use the AVL
MEMORY LIST
PCIe
expansion
Riser1: 1* PCIe4.0x16; Riser2: 1* PCIe4.0x16
Hard drive
Front 10* hot-swap 2.5-inch SAS/SATA hard drives
M.2 SSD
M.2 x 2 (NVMe protocol 2280)
LAN
On-board 2 Gigabit RJ45 data LAN ports
External port
Front Port: 2 USB3.0, 1 VGA
Rear port: 1 VGA , 1 COM port , 2 USB3.0 , 1 RJ45 Gigabit management LAN port, 2
Gigabit RJ45 LAN ports
Management
On-board iBMC management module, supports IPMI, SOL, KVM Over IP, virtual
media and other management features
Fan
Supports 7* 7056 fans
Power supply
Supports AC220V 550W, 800W, 1300W, 1600W, 2200W redundant power supply
(according to actual power adaptation)
Supports HVDC 240V ~ 336V 550W 800W 1300W
Supports LVDC -48V 550W 800W 1300W
Dimensions
1U rackmount, 748*433.4* 43.6mm
2U8 bay model
Product
name
SL201-D08R-G3
SL201-D08R-NV-G3
Processor
Supports one or two 3rd Generation Intel®Xeon®Scalable processors
MB model
G4DCL

17
Memory
Supports DDR4 RDIMM/LRDIMM server memory;
memory frequency supports 2400/2666/2933/3200MHz ;
Single CPU supports 8 DDR4 channels, each channel supports 2 DIMMs, and supports a
total of 32 DDR4 slots; single capacity: 16GB, 32GB, 64GB, 128GB, 256GB , and the
whole system supports a maximum memory capacity of 12TB
Note: In order to make the system more stable, it is recommended to use the AVL
MEMORY LIST
PCIe
expansion
Riser1/2: 2*PCIe x16 or 1*PCIe x16, 2*PCIe x8 or 3*PCIe x8 or 1*PCIe x16, 1*PCIe x8
Riser3: 1*PCIe x16 or 1*PCIe x8+PCIe x8 (in x16 Slot)
Riser4: 1*PCIe x16 or 2*PCIe x8
Hard drive
Front 8* hot-swap 3.5/2.5-inch SAS/SATA/ U.2 hard disks; rear optional up to 2*
2×3.5-inch hard disk modules or 2* 2×2.5-inch hard disk modules
M.2 SSD
M.2 x 2 (NVMe protocol 2280)
LAN
On-board 2 Gigabit RJ45 data LAN ports
External
port
Front Port: 2 USB3.0, 1 VGA
Rear port: 1 VGA , 1 COM port , 2 USB3.0 , 1 RJ45 Gigabit management LAN port, 2
Gigabit RJ45 LAN ports
Management
On-board iBMC management module, supports IPMI, SOL, KVM Over IP, virtual media
and other management features
Fan
4* 8038 hot-swap N+1 redundant fans;
optional 8056 hot-swap N+1 redundant fans
Power
supply
Supports AC220V 550W, 800W, 1300W, 1600W, 2200W redundant power supply
(according to actual power adaptation)
Supports HVDC 240V ~ 336V 550W 800W 1300W
Supports LVDC -48V 550W 800W 1300W
Dimensions
2U rackmount, 748*433.4* 87.6mm
2U12 bay model
Product
name
SL201-D12R-G3
SL201-D12RE-G3
SL201-D12R-NV-G3
Processor
Supports one or two 3rd Generation Intel®Xeon®Scalable processors
MB model
G4DCL
Memory
Supports DDR4 RDIMM/LRDIMM server memory;
memory frequency supports 2400/2666/2933/3200MHz ;
Single CPU supports 8 DDR4 channels, each channel supports 2 DIMMs, and supports a
total of 32 DDR4 slots; single capacity: 16GB, 32GB, 64GB, 128GB, 256GB , and the
whole system supports a maximum memory capacity of 12TB
Note: In order to make the system more stable, it is recommended to use the AVL
MEMORY LIST
PCIe
expansion
Riser1/2：2*PCIe x16 or 1*PCIe x16, 2*PCIe x8 or 3*PCIe x8 or 1*PCIe x16, 1*PCIe x8
Riser3：1*PCIe x16 or 1*PCIe x8+PCIe x8 (in x16 Slot)
Riser4：1*PCIe x16 or 2*PCIe x8
Hard drive
Front 12* hot-swap 3.5/2.5-inch SAS/SATA/ U.2 hard disks; rear optional up to 2*
2×3.5-inch hard disk modules or 2* 2×2.5-inch hard disk modules
M.2 SSD
M.2 x 2 (NVMe protocol 2280)

18
LAN
On-board 2 Gigabit RJ45 data LAN ports
External
port
Front Port: 2 USB3.0, 1 VGA
Rear port: 1 VGA, 1 COM port, 2 USB3.0, 1 RJ45 Gigabit management LAN port, 2
Gigabit RJ45 LAN ports
Management
On-board iBMC management module, supports IPMI, SOL, KVM Over IP, virtual media
and other management features
Fan
4* 8038 hot-swap N+1 redundant fans;
optional 8056 hot-swap N+1 redundant fans
Power
supply
Supports AC220V 550W, 800W, 1300W, 1600W, 2200W redundant power supply
(according to actual power adaptation)
Supports HVDC 240V ~ 336V 550W 800W 1300W
Supports LVDC -48V 550W 800W 1300W
Dimensions
2U rackmount, 748*433.4* 87.6mm
2U25 bay model
Product
name
SL201-D25RE-G3
Processor
Supports one or two 3rd Generation Intel®Xeon®Scalable processors
MB model
G4DCL
Memory
Supports DDR4 RDIMM/LRDIMM server memory;
memory frequency supports 2400/2666/2933/3200MHz ;
Single CPU supports 8 DDR4 channels, each channel supports 2 DIMMs, and supports a
total of 32 DDR4 slots; single capacity: 16GB, 32GB, 64GB, 128GB, 256GB , and the
whole system supports a maximum memory capacity of 12TB
Note: In order to make the system more stable, it is recommended to use the AVL
MEMORY LIST
PCIe
expansion
Riser1/2：2*PCIe x16 or 1*PCIe x16, 2*PCIe x8 or 3*PCIe x8 or 1*PCIe x16, 1*PCIe x8
Riser3：1*PCIe x16 or 1*PCIe x8+PCIe x8 (in x16 Slot)
Riser4：1*PCIe x16 or 2*PCIe x8
Hard drive
Front 25* hot-swap 3.5/2.5-inch SAS/SATA/ U.2 hard disks; rear optional up to 2*
2×3.5-inch hard disk modules or 2* 2×2.5-inch hard disk modules
M.2 SSD
M.2 x 2 (NVMe protocol 2280)
LAN
On-board 2 Gigabit RJ45 data LAN ports
External
port
Front Port: 2 USB3.0, 1 VGA
Rear port: 1 VGA, 1 COM port, 2 USB3.0, 1 RJ45 Gigabit management LAN port, 2
Gigabit RJ45 LAN ports
Management
On-board iBMC management module, supports IPMI, SOL, KVM Over IP, virtual media
and other management features
Fan
4* 8038 hot-swap N+1 redundant fans;
optional 8056 hot-swap N+1 redundant fans
Power
supply
Supports AC220V 550W, 800W, 1300W, 1600W, 2200W redundant power supply
(according to actual power adaptation)
Supports HVDC 240V ~ 336V 550W 800W 1300W
Supports LVDC -48V 550W 800W 1300W
Dimensions
2U rackmount, 748*433.4* 87.6mm

19
2.3.1 Front Panel Components
1U4-bay model
Serial
number
Name
Serial
number
Name
1
Left ear
4
VGA port
2
Front Panel Indicators
5
Right ear
3
USB3.0 port
6
3.5 inch hard drive
1U10-bay model
Serial
number
Name
Serial
number
Name
1
left ear
4
USB3.0 port
2
Front Panel Indicators
5
2.5 Hard Disk
3
Right ear
2U8-bay model
Serial
number
Name
Serial
number
Name
1
DVD drive
3
USB3.0 port
2
VGA port
4
3.5 inch hard drive

20
2U12-bay model
Serial
number
Name
Serial
number
Name
1
3.5 inch hard drive
3
USB3.0 port
2
VGA port
Table 1- 9
2U25-bay model
Serial
number
Name
Serial
number
Name
1
2.5 inch hard drive
3
USB3.0 port
2
VGA port
4U24/36-bay model
Serial
number
Name
Serial
number
Name
1
3.5 inch hard drive
2
USB3.0 port