HP 280 G1 ST Business Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 G1 ST Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
NA
Cathode Ray Tubes (CRT)
NA
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
2
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

Tool Description
Tool Size (if
applicable)
Description #1 Torx screw driver
T15
Description #2 Cross screw driver
6mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unfix system side cover screw*1 then remove side cover.
2. Remove front panel from system.
3. Displug all cable connector from motherboard and all devices.
4. Unfix Front IO cable screw*1 then remove it.
5. Unfix PSU screw*4 then remove it
6. Unfix MB screw*8 then remove it from chassis
7. Remove coin cell battery on MB.
8. Remove WLAN cards
9. Remove Memory
10. Remove H/S screw*4 then remove it from MB
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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PSG instructions for this template are available at EL-MF877-01
1. Remove side cover
1. Release thumb screw on the access panel
2. Griping the tab at the end of access panel, pull towards the rear and remove from unit.

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2. Remove main bezel
1. Release 3 main bezel hooks.
2. Take out main bezel.

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PSG instructions for this template are available at EL-MF877-01
3. Unplug all cable
1. Power cable (24 pin)
2. Heat sink cable
3. 12V power cable (4 pin)
4. Audio cable
5. Front USB and card reader
6. HDD SATA and power cable
7. ODD SATA and power cable
8. WLAN antenna cable
9. Power SW/LED cable
10. SATA cable
11. Cable tie
1
2
3
4
8
7
6
10
5
9
11

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PSG instructions for this template are available at EL-MF877-01
4. Remove Front I/O
1. Unfix 1 screw from chassis
2. Remove Front I/O

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PSG instructions for this template are available at EL-MF877-01
5. Remove PSU
1. Unfix 4 screw front chassis.
2. Remove PSU from chassis
3. Remove O/P Cable tie.
4. Unscrew from cover.
5. Slide cover to the left.
6. Slide cover to the down.
7. Remove L/N from PCB.
8. Remove Fan wire from PCB.
9. Unscrew & remove PCB from chassis.
10. Remove Electrolytic Capacitor
Release latch

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PSG instructions for this template are available at EL-MF877-01
6. Remove Mother board
1. Unfix 4 screws from chassis
2. Remove M/B from chassis
4
1
3
2

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PSG instructions for this template are available at EL-MF877-01
7. Remove WLAN card
1. Unfix 1screw and remove WLAN card
2. Remove WLAN card
Photo2

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PSG instructions for this template are available at EL-MF877-01
8. Remove Memory
1. Release memory socket
2. Remove Memory
9. Remove Heat Sink
1. Unfix 4 screws from Heat Sink
2. Remove Heat Sink