HP Elite Tower 600 G9 Assembly instructions

EL-MF877-00 Page 1
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Desktops
Marketing Name / Model
[List multiple models if applicable.]
HP Elite Tower 600 G9 Desktop PC; HP Elite Tower 680 G9 Desktop PC; HP Elite Tower 800 G9 Desktop PC; HP Elite Tower 880 G9
Desktop PC; HP Z1 G9 Tower Desktop PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment,
please contact HP’s Sustainability Contact.
1.0
Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the product
contains the component or part requiring selective treatment
Item Description Components and parts requiring selective treatments
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) with a surface greater than 10 sq cm
☒
Main board (MB) PCB
☒
Solid state drive (SSD) PCB
☐
Wireless WAN module (WWAN) PCB
☐
Touch module PCB
☒
Power supply PCB
☒
External Keyboard (KB)
☒
External Mouse
☒
Others: HDD PCB, Memory PCB
8
Batteries, excluding Li-Ion batteries. This includes
standard alkaline, coin or button style batteries
☒
RTC/CMOS battery
☐
Others: _____________
1
Li
-
Ion batter
ies
. Include
s
all
Li
-
Ion
batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, etc.)
Li
-
ion b
attery(ies) are attached to the
product by
:
☐
screws
☐
snaps
☐
adhesive
☐
other. Explain
0
Mercury-containing components. For example,
mercury in lamps, display backlights, scanner lamps,
switches,
batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm. Includes background illuminated
displays with gas discharge lamps
☐
Panel LCD 0

EL-MF877-00 Page 2
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Item Description Components and parts requiring selective treatments
Quantity of
items
included in
product
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
☒ Power Supply capacitor(s) or condenser(s) 1
External electrical cables and cords ☒ AC power cord
☐ Audio, video or data cables
☐ Other: _________
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants (not
including external electrical cables and cords, PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner.
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
Components containing chlorofluorocarbons (CFC),
hydrochlorofluorocarbons (HCFC) or
hydrofluorocarbons (HFC), hydrocarbons (HC)
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver T-15
Crisscross Screw Driver
PH1
S
oldering Iron
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including
the required steps to remove the external enclosure.
1. Use T-15 screw driver to loose thumb screw and remove access panel.
2. Disconnect ODD power cable and ODD SATA cable from ODD.

EL-MF877-00 Page 3
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
3. Press the ODD’s latch on ODD cage
4. Remove the ODD from ODD cage
5. Remove Front Bezel from chassis
6. Disconnect HDD power cable and HDD SATA cable from HDD.
7. Remove the driver cage from Chassis
8. Use T-15 screw driver to loose the screws of HDD and release HDD latch
9. Remove HDD from HDD cage
10. Disconnect system fan cable from MB
11. Disconnect Cooler Fan cable from MB
12. Use T-15 screw driver to loose the cooler screws and remove cooler from MB
13. Use T-15 screw driver to loose the screws and remove the fan
14. Separate the fan from CPU heat sink
15. Remove memory from the MB
16. Rotate the handle and open it up
17. Remove the CPU from the board
18. Remove SSD M.2 Card
19. Remove WLAN M.2 Card
20. Remove the battery from the system board
21. Use T-15 screw driver to loose the screws of MB from board
22. Remove MB from chassis
23. Remove speaker from Chassis
24. Remove System fan
25. Remove Front Antenna cable
26. Remove Rear Antenna cable
27. Use T-15 screw driver to loose the screws of PSU
28. Press the PSU’s latch on chassis
29. Remove the PSU from chassis
30. Remove four screws covered
31. Remove the screw and open case
32. Use PH1 screw driver to remove FG screw
33. Disconnect fan connector and inlet connector
34. Loose screws and remove PCB from case
35. Loose screws and remove PSU fan
36. Use Soldering Iron to remove Ele-Cap from PCBA
3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts or
components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external
accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the
following URL: End-of-Life Product Disassembly Instructions (hp.com)
Step1 Use T-15 screwdriver to Loose thumb screw and
remove access panel
Step2 Disconnect ODD power cable and ODD SATA cable
from ODD

EL-MF877-00 Page 4
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step3 Press the ODD’s latch on ODD cage Step4 Remove the ODD from ODD cage
Step5 Remove front bezel from chassis
Step6 Loose the screws of Graphic card holder and rotate
it up.

EL-MF877-00 Page 5
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step7 Remove the SATA cable and Power cable from cage Step8 Use T-15 screwdriver to loose the screws of HDD and
release HDD latch.
Step9 Remove HDD from HDD cage. Step10 Disconnect system fan cable from MB
Step11 Disconnect Cooler Fan cable from MB Step12 Use T-15 screw driver to loose the cooler screws and
remove cooler from MB

EL-MF877-00 Page 6
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step13 Use T-15 screwdriver to loose the screws and
remove the fan
Step14 Separate the fan from CPU heat sink
Step15 Remove memory from the MB
Step16 Rotate the handle and open it up
Step17 Remove
the CPU from the board
Step18 Remove SSD M.2 Card
Memory*2

EL-MF877-00 Page 7
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step19 Remove WLAN M.2 Card
Step20 Remove the battery from the system board
Step21 Use T-15 screwdriver to loose the screws of MB
from board
Step22 Remove MB from chassis
SSD PCB

EL-MF877-00 Page 8
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step23 Remove speaker from Chassis Step24 Remove System fan
Step25 Remove Front Antenna cable Step26 Remove Rear Antenna cable

EL-MF877-00 Page 9
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step27 Use T-15 screwdriver to loose the screws of Power
supply
Step28 Press the PSU’s latch on chassis
Step29 Remove the PSU from chassis
Step30 Remove screws covered

EL-MF877-00 Page 10
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step31 Remove PSU Cover
Step32 Use PH1 screw driver to remove FG screw
Step33 Disconnect fan connector and inlet connector
Step34 Loose screws and remove PCB from case

EL-MF877-00 Page 11
Template Revision D
last updated May-2022
HP Inc. instructions for this template are available at EL-MF877-01
Step35 Loose fan screws and remove PSU fan Step36 Heat the solder of the Ele-Cap of greater than 2.5cm in
diameter or height and Remove it from PCBA