HP EliteDesk 705 G3 Assembly instructions
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category:
Desktop
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G3 Desktop Mini Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver Torx #15
Screwdriver Philips #3
Screwdriver Philip #2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel
2. Remove HDD and HDD FAN for Dolomite and Hood Sensor
3. Remove system fan
4. Remove heat sink from M/B
5. Remove WLAN Card from M/B
6. Remove ambient sensor fly cable and Speaker cable
7. Remove M/B and battery
8. Remove Memory
9. Remove Rear IO (HDMI/DP/SERIAL) card and M.2 card
10. Remove front bezel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
1.Remove access panel
1
Release 1 thumb
screw on the access
panel as photo1
shown
(Screwdriver Philips
#3)
2.
Handle the chassis
and push access
panel as the
direction then
remove the access
panel as photo2
shown
Photo1
Photo2
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
2 .Remove HDD and HDD FAN for Dolomite and Hood
Sensor
1
Lift HDD latch up
then press HDD the
forward for escaping
from cage as photo1
shown
2.
Pull the connector
first then pull HDD
SATA FFC cable out
of motherboard as
photo2 shown
Photo1
Photo2
Push the latch
PUSH
PULL
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
5. Remove WLAN Card from M/B
1
Pull out antenna
from WLAN card as
photo1 shown
2
3
Release 1 screws
from M/B as photo2
shown
(Screwdriver Philips
#2)
Remove WLAN card
as photo3 shown
Photo1
Photo2
Photo3
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
7. Remove M/B and battery
1
Release 4 screws by
order 4 to 1 to free
M/B from chassis as
photo1 shown
(Screwdriver Torx
#15)
2
3
Follow the direction
to drag M/B out of
chassis as photo2
shown
Remove battery from
M/B by loosing the
clip outwards as
direction shown
Photo1
Photo2
Photo3
EL-MF877-00 Page 12
Template Revision B
PSG instructions for this template are available at EL-MF877-01
9. RemoveRear IO (HDMI/DP/SERIAL) card and M.2 card
1
Rear IO card
Release 2 screws
then remove Rear
IO card as photo1
shown
(Screwdriver Philips
#3)
M.2 card
2
3
Release 1 screws
from M/B as photo2
shown
(Screwdriver Philips
#3)
Remove M.2 (SSD)
card as photo3
shown
Photo1
Photo2
Photo3
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