Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
#2 Phillips Screwdriver
2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the access panel.(see Figure 1 below)
2. Disconnect the cables from the board.(see Figure 2-7 below)
3. Remove the HDD、slim ODD、ODD from cage.(see Figure 8-10 below)
4. Remove the Memory from the board.(see Figure 11 below)
5. Remove the CPU HeatSink from the board(see Figure 12&13 below)
6. Remove the fan from CPU HeatSink(see Figure 14&15 below)
7. Remove the CPU from the board.(see Figure 16&17 below))
8. Remove the battery from the system board.(see Figure 18 below)
9. Remove M/B from chassis.(see Figure 19&20 below)
10. Remove system fan from chassis.(see Figure 21&22 below)
11. Remove PSU from chassis.(see Figure 23-25 below)
12. Remove Speaker from chassis .(see Figure 26&27 below)
13. Remove front bezel.(see Figure 28 below)
14. Remove Front I/O and power LED cable.(see Figure 29-31 below)
15. Remove PSU cover.(see Figure 32&33 below)
16. Remove PSU PCA,and disconnect power cables.(see Figure 34&35 below)
17. Remove the Electrolytic Capacitors.(see Figure 36-38 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
