HP OMEN Obelisk 873 Installation instructions
EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computer
Marketing Name / Model
[List multiple models if applicable.]
OMEN by HP Obelisk Desktop PC 873
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
0
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[1] snaps
[ ] adhesive
[X] other. Explain Coin Battery
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries NA
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps NA
0
Cathode Ray Tubes (CRT)
NA
0
Capacitors / condensers (Containing PCB/PCT)
NA
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
NA
0
External electrical cables and cords
DC Cable for External Power Supply
0
Gas Discharge Lamps
NA
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
NA
0
EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
0
Components and waste containing asbestos
NA
0
Components, parts and materials containing
refractory ceramic fibers
NA
0
Components, parts and materials containing
radioactive substances
NA
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description T15 screw driver (Disassemble 2 pcs screws for PCI bkt)
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 2 pcs screws for PC board )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 8 pcs screws for MB )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for FAN )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for PSU )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 2 pcs screws for LCS Brkt )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for LCS )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 4 pcs screws for LCS CPU )
T15 3.0~4.0
kgf-cm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Push button to remove Panel from housing.
2. Pull off HDD SATA con &HDD power con.
3. Remove HDD from housing
4. Remove front bezel from housing
5. Loosen 2 screw on main bkt
6. Remove PCI card from housing
7. Pull off all cables on MB then Loosen 8 screw
8. Loosen 4 screws on bkt then remove Fan module
9. Loosen 4 screws on bkt then remove PSU module
EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).
1.Push button to remove Panel from housing.
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