HP Pavilion 23 TouchSmart Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion 23 TouchSmart All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB, Webcam, converter board, Wlan card, DSP
board
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries
7
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

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Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw Driver
2# X10
Screw Driver
1# X10
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Please refer to the 3.2.2 disassemble rear cover
2. Please refer to the 3.2.3 disassemble the stand
3. Please refer to the 3.2.4 disassemble MB Shielding
4. Please refer to the 3.2.5 disassemble HDD & ODD
5. Please refer to the 3.2.6 disassemble Speaker
6. Please refer to the 3.2.7 disassemble CPU thermal module
7. Please refer to the 3.2.8 disassemble FAN Module
8. Please refer to the 3.2.9 disassemble converter board
9. Please refer to the 3.2.10 disassemble Webcam
10. Please refer to the 3.2.11 disassemble Wireless card
11. Please refer to the 3.2.12 disassemble the cables connected to MB and Base pan
12. Please refer to the 3.2.13 disassemble MB and MB battery
13. Please refer to the 3.2.14 disassemble CPU and DDR
14. Please refer to the 3.2.15 separate Base pan and front bezel and panel
15. Please refer to the 3.2.16 remove Mouse/Keyboard Battery/MB
16. Please refer to the 3.2.17 remove power supply
17.
18.
19.
20.
21.
22.
23.
24.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1, Place the system
2. Disassemble rear cover
Remove 3pcs screws with circle in yellow.
3. Disassemble stand
Remove 4pcs screws on both left and right so you can remove stand.

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4. Disassemble MB shielding
Remove 3pcs screws with circles in yellow for Alloy.
5. Disassemble HDD & ODD
Remove 1pcs screw from HDD and pull backward to disengage the HDD from base pan.
Remove 1pcs screw and push ODD forward to slide from ODD cage.

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6. Disassemble speaker
Remove 4pcs screws from left and right,
Also remove the speaker cable in order to take out two speakers from system.
7, Disassemble FAN Module
Remove 3pcs screws and remove the cable to disassemble the fan.
8, Disassemble converter board
Remove two cables and 2pcs screws to remove the converter board.

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9, Disassemble Webcam
Remove the cable and screw in order to disengage the webcam module and mechanical parts.
10, Disassemble Wireless card
Remove one or two cables and 1pcs screw in order to remove wireless card.
11, Disassemble the cables connected to MB and Base pan.

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(1), Remove the HDD /ODD cable
Remove the cable with circles in red and remove 4pcs screws with circles in yellow.
Unplug the SATA cable on MB connector.
(2) Remove converter cable/LVDS cable/TS USB cable connected to MB and take away converter cable/TS USB
cable
-Converter cable
-LVDS cable

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-TS USB cable
(3), Remove antenna cable on the Base pan and take away the cable.
(4)Remove TS USB cable connected to DSP board.

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12. Disassemble DSP board
(1) Remove FFC cable*3 as below yellow.
(2) Remove 3pcs screws with circles in yellow.
13. Disassemble MB and MB battery
Remove 9pcs screws to disassemble Alloy MB
Pull backward the clip to release the battery

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14, Disassemble DDR
Pull both clicks outward that holding the memory to remove the DDR.
15, Separate Base pan and front bezel and panel
Remove 16 pcs screws with circles in red and 4pcs screws with circles in yellow to separate base pan and front bezel.
[BOE/LG/Samsung panel]
16.Remove backlight cable/LVDS cable/FFC cable and LCD bracket.
-backlight cable

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-LVDS cable
FFC cable and bracket
It is needed to release screw as yellow field under bracket.
16, Remove Mouse/Keyboard Battery/MB

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17, Remove power supply