HP Compaq Presario M2000 Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq Presario M2000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 2
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials
containing refractory ceramic fibers 0

HP-00007-01, Appendix 3 13-Oct-2004
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Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-cross #1 (JIS B 4633-1987)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 or 12 cell main battery from system bottom.
2 Remove two M2.5*5L screws on HDD door, then remove HDD.
3 Remove a M2.5*6L screw on BASE cover, then remove ODD.
4 Remove three M2.5*5L screws on BASE cover, then remove RAM door and MINIPCI
door.
5 Remove two M2.5*4L screws to remove the keyboard cover.
6 Remove three M2.5*3L and one M2.5*6L screws to remove the keyboard and release out
the T/P module FFC.
7 Remove two M2.5*6L screws to remove the led board.
8 Remove four M2.5*6L screws, then remove LCD assy.
9 Remove five M2.5*6L, three M2.5*4L screws on top side and seven M2.5*6L, five
M2.5*15L, six M2.5*4L screws on bottom side to remove base cover and speaker box.
10 Remove two M2.5*4L screw and then remove daughter board.
11 Remove two M2.5*4L screws and then remove the battery board.
12 Remove two M2.5*4L screws and then remove the DC board.
13 Remove three M2.5*4L screws and then remove MB
14 Remove four M2.0 spring screw and one M2.5*4L screw and then remove thermal
module.
15 Remove six M2.5*5L screws and then remove LCD bezel.
16 Remove six M2.5*5L and four M2*3L screws to remove LCD panel and inverter board.
17 Divide from connecter and remove RTC coin cell battery on MB for selective treatment
18 Disassemble LCD panel and remove mercury bulb for selective treatment.

HP-00007-01, Appendix 3 13-Oct-2004
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3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below: