HP EliteBook 850 G6 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP EliteBook 850 G6
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm 1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ x ] screws
[ x ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
2 (Main
battery and
RTC
battery)
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps (15”)
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
0

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
Cross
Screwdriver
T8
Disassemble stick
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Disassemble base cover
2. Disassemble batteries
3. Disassemble modules (DDR/NFC/WWAN/SSD)
4. Disassemble Power FFC /LVDS CABLE
5. Separate LCM & System
6. Disassemble KB/FAN
7. Disassemble MB
8. Disassemble USB/B & Power/B
9. Disassemble pick button and Clickpad
10. Disassemble Bezel and Panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).

制表：
審核：骆 飞
MANUFACTURING PROCESS INSTRUCTIONS
MECHANICAL ASSEMBLY
1.00
Station
Version
Station
Version
Station
Version
Station
Version
Station
Version
Station
Version
1 1.00 11 1.00 21 1.00
2 1.00 12 1.00 22 1.00
3 1.00 13 1.00 23 1.00
4 1.00 14 1.00 24 1.00
5 1.00 15 1.00 25 1.00
6 1.00 16 1.00 26 1.00
7 1.00 17 1.00 27 1.00
8 1.00 18 1.00
9 1.00 19 1.00
10 1.00 20 1.00
Station
Ver.
ALL 1.**
Page:
1 of 28
Sub-assembly name:
Crescent15 disassembly SOP
Document No.:
Crescent15 disassembly SOP
A.Current station version list:
B.Version Modify list:
Date
Content
Design
Written by:
蔡美国
Revision:
Date:
2019/4/10
2019/4/10
Disassembly SOP
蔡美国
MODEL : Computron & Trypticon
朱亚

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Remove the self-contained screws
1. Remove the self-contained screws*10
Torque：2.0 ±0.2 kgf．cm
No stripped screws
1(1/1)
Screwdriver (Cross) 1
1
2
3
4
9
5 6
10
8
7

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Disassemble BASE 2(1/1)
1. Separate base with cable management rod
步骤: Inserted the cable bar into the gap
between TOP and BASE intermediate area,
and then slid cable bar to separate the TOP
from the BASE.
Disassemble stick 1

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Disassemble battery 3(1/1)
1. Pull out the battery CNTR
2. Remove battery screw T8*4
Torque：2.0 ±0.2 kgf．cm
No stripped screws
3. remove the battery
lift the upper side first, then pull
the battery out
Screwdriver (T8) 1

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Disassemble DDR & NFC Moudle 4(1/1)
1. Disassemble DDR, Picture 1
2. Disassemble NFC FFC, NFC MODULE, NFC
ANTENNA

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
5(1/1)
1. Disassemble WWAN/WAN CABLE,
remove from the hook in turn，picture 1
2. Disassemble screws of WWAN/WLAN
CARD/SSD, and take out WWAN、WLAN
CARD、SSD. Picture 2.
Torque：1.5 ±0.2 kgf．cm
No stripped screws
Screwdriver (Cross) 1
WWAN WLAN
SSD
Disassemble WWAN/WLAN/SSD

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Disassemble Power FFC /LVDS CABLE 6(1/1)
1. Disassemble Power FFC/FAN cable,
2. Disassemble LVDS Cable, CCD Cable
Power FFC Fan cable
LVDS & Camera cable

SOP
Document No. :Crescent 15 disassembly SOP Station:
Title : Ver. : 1.00 Date : 2019/4/10
Tool List Count Tool List Count
Steps：
Note: If there is any abnormality, please inform the foreman or assistant immediately.
Dept.：Lister：朱亚工業工程課
Separate LCM & System 7(1/1)
1. Open Top to 90 degrees
2. Disassemble Hinge screws M2.5*5.0
Torque：3.0 ±0.2 kgf．cm
No stripped screws
3. Take out TOP
Screwdriver (Cross) 1
1
2
3
4
5