HP OMEN X 15 Assembly instructions
EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP OMEN X by HP 15 Laptop
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[x] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps 15.6”
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw Driver
#1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Dis-fasten BASE Screw*6
2. Remove BASE and remove Battery connector
3. Dis-fasten SSD screw*2
4. Remove SSD*2 PCS and Ram*2PCS
5. Dis-fasten Battery and speaker screw*7
6. Remove Battery and Speaker
7. Dis-fasten IO BKT and DC BKT screw*4
8. Remove IO BKT and DC BKT
9. Dis-fasten Thermal model Screw*6 and Relase Thermal modle screw*7
10. Remove Thernal module and DC in Cable
11. Dis-fasten PCB screw *7 and 2nd panel DB screw*2
12. Release KB FPC/ 2nd panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB
13. Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2
14. Remove Cu Plate and KB FPC
15. Remove 2nd DB with 2nd Panel FPC / IR DB with IR FFC and Power DB
16. TOP remove release, dis-fasten Hinge screw *6 and remove LCD part
17. Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS
18. Dis-fasten Hinge screw*6
19. Remove Panel Easy pull Adhesive
20. Remove Panel and Hinge*2PCS
EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
21. Dis-fasten hinge bkt screw *6
22. Remove LVDS FPC/ Backlight module / Hinge BKT*2PCS /Camera module
23. Remove Antenna module and Backlight DB
24. END
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Dis-fasten BASE Screw*6
3.22 Remove BASE and remove Battery connector
3.23 Dis-fasten SSD screw*2
EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.30 Remove Thernal module and DC in Cable
3.31 Dis-fasten PCB screw *7 and 2nd panel DB screw*2
3.32 Release KB FPC/ 2nd panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB
EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.33 Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2
3.34 Remove Cu Plate and KB FPC
3.35 Remove 2nd DB with 2nd Panel FPC / IR DB with IR FFC and Power DB
EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.36 TOP remove release, dis-fasten Hinge screw *6 and remove LCD part
3.37 Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS
3.38 Dis-fasten Hinge screw*6
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