HP Omen X Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
OMEN X by HP Laptop PC 17
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
M/B , Audio Board, Power Board, DB ,TP BOARD
5
Batteries
All types including standard alkaline and lithium
coin or button style batteries Main Battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps 17.3"
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screwdriver
#1,#0
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dis-fasten D cover screw *10
2. Remove D cover
3. Dis-fasten centel hook screw *2
4. Pull out Battery cable
5. Dis-fasten battery screw *4
6. Remove Battery
7. Dis-fasten trunk assy screw *6
8. Remove Trunk assy
9. Dis-fasten Fan screw *3
10. Pull out Fan cable (Left side)
11. Remove Thermal Fan
12. Dis-fasten SSD screw *1(2)
13. Remove SSD
14. Dis-fasten Thermal module screw *11
15. Pull out Fan cable (Right side)
16. Remove Thermal module
17. Dis-fasten Speaker screw *2
18. Pull out Speaker cable
19. Remove Speaker -L & -R
20. Dis-fasten TP module screw *4
21. Pull out TP cable
22. Remove TP module
23. Pull out FFC/ Wire Cable ( DB, Audio, KB, BL,PW, HDD FFC , LCD/ LED/ DC cable Antenna Cable)
24. Remove HDD assy
25. Dis-fasten PCBA screw *7
26. Remove PCBA
27. Remove DC Cable
28. Dis-fasten Hinge Support BKT screw *12
29. Remove LED cable & Hinge support BKT
30. Dis-fasten Hinge screw *8
31. Remove Hinge support BKT
32. Dis-fasten Panel screw *4
33. Pull out LCD cable
34. Remove Panel
35. Dis-fasten Hinge BKT screw *6

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
36. Remove Hinge BKT L/R
37. Pull out Camera/ LED module Cable
38. Remove Antenna cable
39. Dis-fasten Hinge screw *6
40.
41.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove battery module
3.23 Remove service door (N/A)
3.24 LCD module set disassembly
Remove Hinge support Bkt

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Remove Bezel
Remove Panel
Remove Hinge BKT L/R
Remove Camera
Remove Hinge (LCD /Antenna Cable)

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.25 Top case disassembly
Remove center hook & Battery
Remove Trunk assy
Remove Thermal Fan / SSD / Thermal module /HDD

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Remove Speaker
Remove TP module /DC Jack / K-Lock BKT & PW /Audio Board & DB ,KB

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3.26 Thermal module and mother board disassembly
Remove Trunk assy

EL-MF877-00 Page 8
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PSG instructions for this template are available at EL-MF877-01
Remove Thermal Fan
Remove SSD
Remove Thermal Module

EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Remove PCBA
3.27 Bottom case disassembly