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HP Engage Go Mobile System Assembly instructions

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EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: External Options
Marketing Name / Model
[List multiple models if applicable.]
HP Engage Go Mobile System
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[6] screws
[X] snaps
[X] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1(Main
battery)
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps (12.3”LED)
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
Excluding B&S parts (EPS)
0
EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing refractory
ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Electric screwdriver (Cross)
#1
Electric screwdriver (Trox)
T8
Plastic stick
M/B Support Fixture
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Follow steps described in Disassembly instruction (file attached)
2. If parts can be removed without using a tool, remove it first
3. Use correct screwdriver and torque value before unlock the screw.
4. Disconnect RTC battery cable and remove battery from M/B.
5. Dispose of all removed components according to regulation requirements.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
制表:审核: 楊洋 陈燕淋
Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver. Sta. Ver.
1 0.10 9 0.10 17 0.10 24 0.10
2 0.10 10 0.10 18 0.10 25 0.10
3 0.10 11 0.10 19 0.10 26 0.10
4 0.10 12 0.10 20 0.10 27 0.10
5 0.10 13 0.10 21 0.10 28 0.10
6 0.10 14 0.10 22 0.10
7 0.10 15 0.10 23 0.10
8 0.10 16 0.10 24 0.10
Sta. Ver.
ALL 0.1*
2018/4/4
首份SOP制作
陳博
A.Current station version list:
B.Version Modify list:
Date
Content
Design
Written by:
陳博
Date:
2018/4/4
Page:
1 of 42
Sub-assembly name:
CNNB 拆机 SOP
Document No.:
CNNB 拆机 SOP
Revision:
0.10
MANUFACTURING PROCESS INSTRUCTIONS
MECHANICAL ASSEMBLY
MODEL : CNNB
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期 :
發行部門:制表: 陈燕淋 工業工程課
1(1/1)
0.10
1. pull up the belt
2. hold against the belt cover (shown as the
red arrow)(Pics1)
3. push it out, remove the cover and put
away(pics 1)
Dis-assembly Hand Strap Cover 2018/4/4
Cover(black)
6053B1546401 black
6053B1573201 white
cover disassemble fixture 1
图一
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期 :
發行部門:制表: 陈燕淋 工業工程課
1. Remove the screws(6052B0101901
M2*L4)*2(pics2)
2. Remove the sheet metal*2 (pics2)
3. Remove the belt
Dis-assembly Hand Strap BRKT
2(1/1)
0.10 2018/4/4
tips:
❖torque:1.5±0.5 kg/cm
❖no screw stripped, cannot drop into the
system
❖screw tighten order:pics shown
❖vertical fasten,no tilt
Black item
6051B1234701 belt
6053B1547701 Sheet metal
White item
6051B1253701 belt
6053B1572901 Sheet metal
#1screw driver 1
Pics 1
12
Pics 2
sheet metal
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期 :
發行部門:制表: 陈燕淋 工業工程課
1. Remove screw(6052B0159001 M2*L3)*2(PICS1)
2. Push down A cove,take off A cover(pics2 )
3. Remove FPR FFC & Pogo FPC(pics3)
4. Remove A cover
Dis-assemblyA cover
3(1/1)
0.10 2018/4/4
2
1
Pics 1
Pics 2
Pics 3
tips:
❖torque:1.5±0.5 kg/cm
❖no screw stripped, cannot drop into the
system
❖ ❖vertical fasten,no tilt
❖cannot pull up A cover,would cause
damage
#1screw drive 1
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期:
發行部門:制表: 陈燕淋 工業工程課
4(1/1)
0.10
1. remove(6053B1547901)screws6052B01200
01 M2*L2.5)*2 (pics 2)
2. Remove FFC(6035B0182801) (pics2)
3. Take off FPR(6042B0383501) (pics1)
Dis-assembly FPR 2018/4/4
tips:
❖torque:1.5±0.5 kg/cm
❖no screw stripped, cannot drop into the
system
❖screw tighten order:pics shown
❖vertical fasten,no tilt
#1screw driver 1
有FPR才需要此站
1 2
Pics 1
Pics 2
FPC
Sheet
metal
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期 :
發行部門:制表: 陈燕淋 工業工程課
Dis-assembly Pogo
1. Put A Cover on the fixture(pics 1)
2. Remove (6052B0120001 M2*L2.5 )*8(
pics 2)
3. Take off Pogo,put A Cover and Pogo
away
1
34
2
56
78
5(1/2)
0.10 2018/4/4
#1screw driver 1
A cover support fixture 1
Pics 1
Pics 2
tips:
❖torque:2.0±0.5 kg/cm
❖no screw stripped, cannot drop into the
system
❖screw tighten order:pics shown
❖vertical fasten,no tilt
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期 :
發行部門:制表: 陈燕淋 工業工程課
5(2/2)
0.10 2018/4/4
A Cover(black)
6070B1294601 W/Finger + W/NFC
6070B1294501
W/O Finger + W/NFC
6070B1294801
W/Finger + W/O NFC
6070B1294701
W/O Finger + W/O NFC
Tips:
•Visual inspect the incoming matl if defect
•Check if the matl PN is correct
W or w/o NFC,would
has different printing
A Cover(white)
6070B1294602 W/Finger + W/NFC
6070B1294502
W/O Finger + W/NFC
6070B1294802
W/Finger + W/O NFC
6070B1294702
W/O Finger + W/O NFC
Dis-assembly Pogo
注意事项︰PCB板需轻拿轻放,不得碰触板上之零件,如有不良,请立即通知领班或助理。
作 業 指 導 書
治具清单(治具规格)数量 治具清单(治具规格)数量
步骤:
Document No. : CNNB 拆机SOP 站 別 :
作 業 名 稱 : Ver. : 编辑日期:
發行部門:制表: 陈燕淋 工業工程課
6(1/1)
0.10
1. Take apart battery connection(pics1)
2. Disassembly LCM FPC(pics1)
3. Disassembly touch control board FFC(
pics1)
Dis-assembly FPC 2018/4/4
tips:
•Carefully handle the matl, watch the direct
to avoid crash
•Be sure ESD protection is workable
Plug off
power at first
Pics 1