HPE FF 12904E Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP FF 12904E Spare Fan Tray Assy(JH265A)
HPE 12904E High Speed Fan Tray Assy(JH448A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove all of the labels 2.
2. Remove shielding fingers 3.
3. Unscrew the screws on part 4&5&6, and then remove part 4&5&6.
4. Unscrew the screws on part 6-1&6-2, and then remove part 6-1&6-2.
5. Remove insulating plate 6-3.
6. Unscrew the screws on part 7, and then remove part 7.
7. Remove conductive fabric 8.
8. Remove shading foam 9.
9. Unscrew the screws on part 7-2, and then remove fan 7-1.
10. Unscrew the screws on part 1, and then remove handle 10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 Treatments to the product（front view）

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 2 Treatments to the product (rear view)
Figure 3 Treatments to the product (rear view)

MF877-00 Page 4
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 4 Treatments to the fan
Figure 5Treatments to the handle