HPE FlexFabric 12902E Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE FlexFabric 12902E Switch Chassis(JH345A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
7
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Extract all of the part 2.
2. Unscrew the screws on part 3, and then remove part 3.
3. Extract all of the part 4.
4. Remove part 5 from chassis 1.
5. Remove part 13 from chassis 1.
6. Extract all of the part 14.
7. Unscrew the screws on part 6, and then remove part 6.
8. Extract all of the part 10.
9. Extract all of the part 11.
10. Unscrew the screws on part 7, and then remove part 7.
11. Remove part 8 from chassis 1.
12. Remove part 9 from chassis 1.
13. Remove pcb 12 from chassis 1.
14. Unscrew the screws on part 7-2, and then remove part 7-2.
15. Extract all of the part 7-1.
16. Remove part 7-3 from part 7-5.
17. Remove part 7-4 from part 7-5.
18. Remove part 7-3-2 from part 7-3-1 and remove pcb 7-3-3 from part 7-3-1.
19. Remove part 7-4-2 from part 7-4-1 and remove pcb 7-4-3 from part 7-4-1.
20. Remove part 7-5-1 from pcb 7-5-2 and remove pcb 7-5-2 from part 7-5-3.
21. Remove part 7-5-4 from part 7-5-5 and remove part 7-5-5.
22. Remove part 7-5-6 from pcb 7-5-7 and remove pcb 7-5-7 from part 7-5-8.
23. Remove part 7-5-9 from pcb 7-5-11 and remove part 7-5-10 from pcb 7-5-11.
24. Remove part 7-5-11 from part 7-5-12.
25. Unscrew the screws on pcb 11-1, and then remove pcb 11-1 from 11-5.
26. Remove part 11-2 from pcb 11-1.
27. Remove pcb 11-3 from part 11-5.
28. Remove pcb 11-4 from part 11-5.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 1 Treatments to the product (rear view)
Figure 2 Treatments to the product（front view）

MF877-00 Page 4
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 3 Treatments to the product（rear view）
Figure 4 Treatments to the product（front view）

MF877-00 Page 5
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 5 Treatments to part 7
Figure 6 Treatments to part 7-5

MF877-00 Page 6
Template Revision A
HPE instructions for this template are available at MF877-01
Figure 7 Treatments to part 11
3.3 Material of the facility built
Facility Components Material
Weight
(g)
Weight percentage
Selective treatment for materials
and components
Details
1
Fe
17364
56.80%
Fe recycling
2
Fe
30*4
0.39%
Fe recycling
3
Fe
800
2.62%
Fe recycling
4
Fe
50*2
0.33%
Fe recycling
5
Fe
2030
6.64%
Fe recycling
6
Fe
1240
4.06%
Fe recycling
7
7-1
Fe
1300
4.25%
Fe recycling
7-2
Fe
218
0.71%
Fe recycling
7-3
Fe,Complex PCB
989
3.24%
Fe recycling
7-4
Fe,Complex PCB
2877
9.41%
Fe recycling
7-5
Fe,Complex PCB
989
3.24%
Fe recycling
8
Fe
224
0.73%
Fe recycling
9
Fe
342
1.12%
Fe recycling
10
Cu
3*4
0.04%
Cu recycling
11
11-1
Complex PCB
260
0.85%
11-2
Fe
27
0.09%
Fe recycling
11-3
Complex PCB
80
0.26%
11-4
Complex PCB
80
0.26%
11-5
Fe
763
2.50%
Fe recycling
12
Complex PCB
570
1.77%
13
Fe
150
0.49%
Fe recycling
14 Zn,Fe 9*4 0.12%
Zn recycling
Fe recycling

MF877-00 Page 7
Template Revision A
HPE instructions for this template are available at MF877-01
4. Revised record
Date
Version
Author
Modify content
2016.9.20
V0
Pan.Yujiao
Initial version