HPE Apollo 2000 Gen10 Plus System Assembly instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Apollo 2000 Gen10 Plus System
HPE Apollo n2400 Gen10 Plus SFF CTO Chassis
HPE Apollo n2600 Gen10 Plus SFF CTO Chassis
HPE Apollo n2800 Gen10 Plus SFF CTO Chassis
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
15
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Depending on Power Supply
7
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
There’s no containing Brominated Flame
Retardants
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T10/T15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. PCA-Remove all of PCAs with screwdriver
2. Megacell Module– Remove the top cover and locate the megacell on the system. Remove the megacell and
dispose of properly.
3. Capacitors>2.5 cm-Removing the Node module from chassis, removing the node cover by pressing down cover latch,
locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1-15 - PCA Pictures
Attachment 16 – Megacell Module Location
Attachment 17-20 – Super Cap Location in PSU

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 1 HPPN: P13604-001 Attachment 2 HPPN: P17564-001
Attachment 3 HPPN: P13610-001 Attachment 4 HPPN: P13616-001
Attachment 5 HPPN: P17570-001
Attachment 6 HPPN: P22340-001

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 7 HPPN: P17567-001
Attachment 8 HPPN: P22336-001 Attachment 9 HPPN: P13573-001
Attachment 10 HPPN: P13575-001
Attachment 11 HPPN: P13571-001

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 12 HPPN: P13621-001
Attachment 13 HPPN: P13614-001
Attachment 14 HPPN: P17560-001

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 15 HPPN: P13623-001
Attachment 16 Remove Megacell Module

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 17:Model: HSTNS-PR62
Remove capacitor
Attachment 18 Model: HSTNS-PL62
Remove capacitor

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Attachment 19 Model: 2200W HICKORY
Remove capacitor
Attachment 20 Model: 3000W DIGGER
Remove capacitor