HPE Synergy 12000 Assembly instructions

MF877-00 Page 1
Template Revision A
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE Synergy 12000 Frame
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
5
Batteries
All types including standard alkaline and lithium
coin or button style batteries Lithium Battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
3
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Electric Screw driver with bit T10, Torque: 5+/-0.5 in-lb
Electric Screw driver with bit T15, Torque: 2+/-0.5 in-lb
Electric Screw driver with bit T20, Torque: 10+/-0.5 in-lb
Electric Screw driver with bit T20, Torque: 7+/-0.5 in-lb
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove all of fan sets, power supplies, EM module, and any modules from rear cage
2. Remove CIM modules and front panel module from the front side of enclosure, and then loose 6 piece of thumbscrews
inside of enclosure.
3. Pull out rear cage till the safety latch catches. Free the safety latches and remove the rear cage. Loose 8 piece of
screws on the side, and 2 piece of screw on the top. Take up the middle plane out.
4. (1) Loose 14 pieces of screws on black frame and to remove the blank frame first. (2) Loose 42 pieces of screws on
metal frame and to remove the metal frame. (3) Keep the middle plane PCA alone.
5. (1) Loose 7 pieces of screws on the side of CIM, 1 piece of black screw besides of SSD, and 4 pieces of captive
screws on heat sink. Then take up the top cover of CIM. (2) Remove SSD, SO-DIMM, heat sink, and TPM module. (3)
Loose 1 piece of black screws. Open iLM to take out processor. Slide and take the CIM PCA up away. (4) Take out 1
Lithium battery from CIM board.
6. (1) Loose 4 pieces of screws on rear cage for fan interposer, and take 2 pieces of fan interposer out. (2) Loose 2
pieces of screws on fan interposer and take interposer PCA away.
7. (1) Take out the right front panel’s cover. (2) Press the red latch on front panel down and pull it out. (3) Loose 3 pieces
of screws on front panel module ant take front panel PCA up away.
8. (1) Loose 6 pieces of screws on the side of EM module. (2) Take out the front panel on EM module. Loose 3 pieces of
screws and take out EM board away.
9. Capacitors in 2650W power supply => 2.5 cm - Remove the power supply bracket from the system with a torx driver,
and remove the PSU from PSU bracket with a torx driver. With a #2 Philips screw driver remove the screws securing
the top cover then locate the capacitors and pry from the PCB with a flat head screw driver or Long Nose Plier and
dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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HPE instructions for this template are available at MF877-01
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