
HiLink E3231 HSPA+ USB Stick
Product Description
Contents
1 Overview..........................................................................................................................5
2 Features...........................................................................................................................6
2.1 Main Features .................................................................................................................................. 6
2.2 Technical Specifications ................................................................................................................... 7
2.2.1 Hardware................................................................................................................................. 7
2.2.2 Software Specifications ........................................................................................................... 8
3 Services and Applications .............................................................................................9
3.1 Packet Data Service......................................................................................................................... 9
4 System Architecture.....................................................................................................10
4.1 System Architecture ....................................................................................................................... 10
4.2 Functional Modules.........................................................................................................................11
5 Technical Reference.....................................................................................................12
5.1 Layer 1 Specifications (Physical) ................................................................................................... 12
5.2 Layer 2 Specifications (MAC/RLC)................................................................................................. 12
5.3 Layer 3 Specifications (RRC)......................................................................................................... 12
5.4 Layer 3 NAS/Core Network (MM/CM)............................................................................................ 12
5.5 General Specifications ................................................................................................................... 13
5.6 Performance/Test Specifications.................................................................................................... 13
5.7 SIM Specifications.......................................................................................................................... 13
6 Packing List...................................................................................................................14