Huawei FusionServer Pro 2288H V5 User manual

Huawei FusionServer Pro 2288H V5 Server
V100R005
Technical White Paper
Issue 12
Date 2020-04-20
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2020. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specied in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every eort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: https://e.huawei.com
Issue 12 (2020-04-20) Copyright © Huawei Technologies Co., Ltd. i

About This Document
Purpose
This document describes the 2288H V5 rack server in terms of features, structure,
specications, and component compatibility.
Intended Audience
This document is intended for:
● Huawei presales engineers
● Channel partner presales engineers
● Enterprise presales engineers
Symbol Conventions
The symbols that may be found in this document are dened as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
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Symbol Description
Supplements the important information in the main
text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Change History
Issue Date Description
12 2020-04-20 ● This issue is the twelfth ocial release.
11 2019-08-10 ● Rened the document for easy use.
10 2019-04-05 ● Added information about Cascade Lake
processors.
09 2018-10-30 ● Rened the document for easy use.
08 2018-09-06 ● Added drive congurations.
07 2018-05-14 ● Updated the description of video cards.
06 2018-04-18 ● Added TPM specications.
● Added built-in drive specications.
●Modied operating temperature
specications.
05 2018-02-07 ● Added the NVMe conguration.
04 2017-11-30 ● Added the specications of the GPU and
Broadcom SAS3508 RAID controller cards.
03 2017-08-18 ● Added the description of the maximum
resolution supported by the video card
integrated on the mainboard.
02 2017-08-07 ● Added the memory module with a
maximum speed of 2666 MT/s.
01 2017-07-20 ● This issue is the rst ocial release.
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Contents
About This Document................................................................................................................ ii
1 Overview....................................................................................................................................1
2 Features..................................................................................................................................... 2
3 Physical Structure....................................................................................................................5
4 Logical Structure......................................................................................................................7
5 Hardware Description.............................................................................................................9
5.1 Front Panel................................................................................................................................................................................ 9
5.1.1 Appearance............................................................................................................................................................................ 9
5.1.2 Indicators and Buttons.....................................................................................................................................................11
5.1.3 Ports....................................................................................................................................................................................... 15
5.2 Rear Panel............................................................................................................................................................................... 17
5.2.1 Appearance.......................................................................................................................................................................... 18
5.2.2 Indicators.............................................................................................................................................................................. 18
5.2.3 Ports....................................................................................................................................................................................... 21
5.3 Processor.................................................................................................................................................................................. 24
5.4 Memory.................................................................................................................................................................................... 25
5.4.1 Memory Identier............................................................................................................................................................. 25
5.4.2 Memory Subsystem Architecture................................................................................................................................. 26
5.4.3 Memory Compatibility..................................................................................................................................................... 27
5.4.4 Memory Installation Guidelines................................................................................................................................... 29
5.4.5 Memory Installation Positions...................................................................................................................................... 30
5.4.6 Memory Protection Technologies................................................................................................................................ 31
5.5 Storage..................................................................................................................................................................................... 32
5.5.1 Drive Congurations.........................................................................................................................................................32
5.5.2 Drive Numbering............................................................................................................................................................... 38
5.5.3 Drive Indicators.................................................................................................................................................................. 42
5.5.4 RAID Controller Card........................................................................................................................................................44
5.6 Network................................................................................................................................................................................... 44
5.6.1 FlexIO Cards........................................................................................................................................................................ 44
5.7 I/O Expansion......................................................................................................................................................................... 47
5.7.1 PCIe Cards............................................................................................................................................................................ 48
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5.7.2 PCIe Slots..............................................................................................................................................................................48
5.7.3 PCIe Slot Description........................................................................................................................................................ 51
5.8 PSUs...........................................................................................................................................................................................54
5.9 Fans............................................................................................................................................................................................55
5.10 Boards.....................................................................................................................................................................................56
5.10.1 Mainboard......................................................................................................................................................................... 56
5.10.2 Drive Backplane............................................................................................................................................................... 58
6 Product Specications.......................................................................................................... 64
6.1 Technical Specications...................................................................................................................................................... 64
6.2 Environmental Specications............................................................................................................................................69
6.3 Physical Specications.........................................................................................................................................................71
7 Software and Hardware Compatibility............................................................................ 73
8 Safety Instructions................................................................................................................ 74
8.1 Safety Instructions................................................................................................................................................................ 74
8.2 Maintenance and Warranty.............................................................................................................................................. 77
9 System Management............................................................................................................78
10 Certications........................................................................................................................ 80
A Appendix................................................................................................................................. 82
A.1 Product SN.............................................................................................................................................................................. 82
A.2 Operating Temperature Limitations...............................................................................................................................84
A.3 Nameplate ............................................................................................................................................................................. 86
A.4 RAS Features.......................................................................................................................................................................... 86
A.5 Sensor List............................................................................................................................................................................... 88
B Glossary................................................................................................................................... 95
B.1 A-E............................................................................................................................................................................................. 95
B.2 F-J............................................................................................................................................................................................... 96
B.3 K-O.............................................................................................................................................................................................96
B.4 P-T.............................................................................................................................................................................................. 96
B.5 U-Z............................................................................................................................................................................................. 97
C Acronyms and Abbreviations..............................................................................................98
C.1 A-E............................................................................................................................................................................................. 98
C.2 F-J............................................................................................................................................................................................... 99
C.3 K-O.......................................................................................................................................................................................... 100
C.4 P-T............................................................................................................................................................................................101
C.5 U-Z.......................................................................................................................................................................................... 103
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1 Overview
Huawei FusionServer Pro 2288H V5 (2288H V5) is a new-generation 2U 2-socket
rack server designed for Internet, Internet Data Center (IDC), cloud computing,
enterprise, and telecom applications.
The 2288H V5 is ideal for IT core services, cloud computing, high-performance
computing, distributed storage, big data processing, enterprise or telecom
applications, and other complex workloads.
The reliable 2288H V5 features low power consumption, high scalability, easy
deployment, and simplied management.
For details about the 2288H V5 nameplate information, see A.3 Nameplate .
Figure 1-1 2288H V5 (with 12 drives)
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2 Features
Performance and Scalability
● Powered by two Intel® Xeon® Scalable Skylake or Cascade Lake processors, the
server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and
two 10.4 GT/s UPI links between the processors, which deliver supreme
processing performance.
– It supports up to two processors with 56 cores and 112 threads to
maximize the concurrent execution of multithreaded applications.
– An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and
at least 1.375 MB of L3 cache.
– Intel Turbo Boost Technology 2.0 allows processor cores to run faster
than the frequency specied in the Thermal Design Power (TDP)
conguration if they are operating below power, current, and
temperature specication limits.
– Intel Hyper-Threading Technology enables each processor core to run up
to two threads, improving parallel computation capability.
– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address
virtualization workloads.
– Intel® Advanced Vector Extensions 512 (Intel AVX-512) signicantly
accelerates oating-point performance for computing-intensive
applications.
– The Cascade Lake processors support Intel® Deep Learning Boost vector
neural network instructions (VNNI) to improve the performance of deep
learning applications.
● The server supports double data rate 4 (DDR4) registered dual in-line
memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error
checking and correcting (ECC). A server fully congured with twenty-four
2933 MT/s memory modules (only available with Cascade Lake processors)
provides 3072 GB memory space and the maximum theoretical memory
bandwidth of 249.9375 GB/s.
● Flexible drive congurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● The use of all solid-state drives (SSDs) is supported. An SSD supports up to
100 times more I/O operations per second (IOPS) than a typical hard disk
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drive (HDD). The use of all SSDs provides higher I/O performance than the
use of all HDDs or a combination of HDDs and SSDs.
● The LANs on motherboard (LOMs) and FlexIO cards provide a variety of ports
to meet dierent networking requirements.
● With Intel integrated I/O, the Intel® Xeon® Scalable processors integrate the
PCIe 3.0 controller to shortens I/O latency and improve overall system
performance.
● The server supports up to eight PCIe 3.0 slots.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA/NVMe drives. It supports RAID 0, 1,
1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also
uses a supercapacitor to protect the RAID cache data against power failures.
● The SSDs oer better reliability than HDDs, ensuring continued system
performance.
● The server provides simplied O&M and ecient troubleshooting through the
UID/HLY indicators on the front panel, fault diagnosis LED, and iBMC web
interface.
● The built-in iBMC monitors system parameters in real time, triggers alarms,
and performs recovery actions to minimize the system downtime.
● Huawei provides a three-year warranty for parts replacement and onsite
repair for the servers used in China. Huawei provides a 10-hour-a-day, 7-day-
a-week support program. Service requests will be handled the next business
day. Optional service upgrades are available.
● Huawei provides a three-year warranty for parts replacement and repair for
the servers used outside China. Huawei provides a 9-hour-a-day, 5-day-a-
week support program. Service requests will be handled the next business day.
Huawei delivers the repaired or new parts within 45 calendar days after
receiving the defective parts.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● A password is required for accessing the BIOS, ensuring system boot and
management security.
● The Network Controller Sideband Interface (NC-SI) allows a network port to
serve as a management port and a service port for maximized return on
investment (ROI) for customers. The NC-SI feature is disabled by default and
can be enabled through the iBMC or BIOS.
● The integrated Unied Extensible Firmware Interface (UEFI) improves setup,
conguration, and update eciency and simplies fault handling.
● Lockable server chassis panel ensures security of local data.
● The Advanced Encryption Standard–New Instruction (AES NI) algorithm
allows faster and stronger encryption.
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● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buer overow attacks when working with a supported OS.
● Intel Trusted Execution Technology enhances security using hardware-based
defense against malicious software attacks, allowing applications to run
independently.
● The trusted platform module (TPM) and trusted cryptography module (TCM)
provide advanced encryption functions, such as digital signatures and remote
authentication.
The service port with NC-SI enabled supports the following conguration:
●Conguring any port on the FlexIO card or PCIe NIC as the service port with NC-SI
enabled. Host port 1 is congured by default.
● Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The
VLAN ID is 0 and disabled by default.
●Conguring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6
addresses (IPv6 address, prex length, and gateway) for this port.
Energy Eciency
● The 80 Plus Platinum power supply units (PSUs) of multiple power ratings
provide 94% power eciency at 50% load.
● The server supports active/standby power supplies and high-voltage DC
(HVDC) for improved power supply eciency.
●Ecient voltage regulator-down (VRD) power supplies for boards minimize
the energy loss from DC/DC power conversion.
● Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation
and reduce overall system power consumption.
● The improved thermal design with energy-ecient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spin-up for drives reduces the server boot power consumption.
● Intel® Intelligent Power Capability allows a processor to be powered on or o
based on requirements.
● Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
● SSDs consume 80% less power than HDDs.
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3 Physical Structure
Figure 3-1 Physical structure of a 2288H V5 with 12 x 3.5" drives (example)
1 I/O module 1 2 I/O module 2
3 PSUs 4 I/O module 3
5 Chassis 6 Supercapacitor holders
7 Air duct 8 Front-drive backplane
9 Fan module brackets 10 Fan modules
11 Front drives 12 FlexIO card
13 Mainboard 14 Screw-in RAID controller
card
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15 TPM/TCM 16 Memory modules
17 Processors 18 Heat sinks
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4 Logical Structure
Figure 4-1 2288H V5 logical structure
● The server supports one or two Intel® Xeon® Scalable processors.
● The server supports up to 24 memory modules.
● The CPUs (processors) interconnect with each other through two UPI links at
a speed of up to 10.4 GT/s.
● Three PCIe riser cards connect to the processors through PCIe buses to provide
ease of expandability and connection.
● The RAID controller card on the mainboard connects to CPU 1 through PCIe
buses, and connects to the drive backplane through SAS signal cables. A
variety of drive backplanes are provided to support dierent local storage
congurations.
● The LBG-2 Platform Controller Hub (PCH) supports:
– Two 10GE optical LOM ports or two 10GE electrical LOM ports
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– Two GE electrical LOM ports
● The server uses Hi1710 management chip and supports a video graphic array
(VGA) port, a management network port, and a debug serial port.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processor
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fans
5.10 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive conguration
Figure 5-1 Front view
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1 Drives 2 (Optional) Built-in DVD
drive
3 Slide-out label plate
(with an SN label)
- -
● 12 x 3.5" drive conguration
Figure 5-2 Front view
1 Drives 2 Slide-out label plate
(with an SN label)
● 20 x 2.5" (8 x SAS/SATA + 12 x NVMe) drive conguration
Figure 5-3 Front view
1Drives 2 Filler module
3 Slide-out label plate
(with an SN label)
- -
● 24 x 2.5" drive conguration
Figure 5-4 Front view
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1 Drives 2 Slide-out label plate
(with an SN label)
● 25 x 2.5" drive conguration
Figure 5-5 Front view
1 Drives 2 Slide-out label plate
(with an SN label)
5.1.2 Indicators and Buttons
Positions
● 8 x 2.5" drive conguration
Figure 5-6 Indicators and buttons on the front panel
110GE LOM port 1
connection status
indicator
2 10GE LOM port 2
connection status
indicator
3 GE LOM port 1
connection status
indicator
4 GE LOM port 2
connection status
indicator
5 Non-Maskable Interrupt
(NMI) button
6 Fault diagnosis LED
7 Health status indicator 8 UID button/indicator
9 Power button/indicator - -
● 12 x 3.5" drive conguration
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Figure 5-7 Indicators and buttons on the front panel
1 10GE LOM port 1
connection status
indicator
2 10GE LOM port 2
connection status
indicator
3 GE LOM port 1
connection status
indicator
4 GE LOM port 2
connection status
indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
● 20 x 2.5" (8 x SAS/SATA + 12 x NVMe) drive conguration
Figure 5-8 Indicators and buttons on the front panel
110GE LOM port 1
connection status
indicator
2 10GE LOM port 2
connection status
indicator
3 GE LOM port 1
connection status
indicator
4 GE LOM port 2
connection status
indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
● 24 x 2.5" drive conguration
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Figure 5-9 Indicators and buttons on the front panel
1 10GE LOM port 1
connection status
indicator
2 10GE LOM port 2
connection status
indicator
3 GE LOM port 1
connection status
indicator
4 GE LOM port 2
connection status
indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
9 NMI button - -
● 25 x 2.5" drive conguration
Figure 5-10 Indicators and buttons on the front panel
110GE LOM port 1
connection status
indicator
2 10GE LOM port 2
connection status
indicator
3 GE LOM port 1
connection status
indicator
4 GE LOM port 2
connection status
indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
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Indicator and Button Description
Table 5-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Description
Fault
diagnosis LED
● ---: The device is operating normally.
● Fault code: A component is faulty.
For details about error codes, see
FusionServer Pro Rack Server iBMC Alarm
Handling.
Power
button/
indicator
Power indicator:
●O: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The power button is locked.
The power button is locked when the iBMC
is starting.
● Steady yellow: The device is ready to power
on.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down
the OS.
● When the device is powered on, holding
down this button for 6 seconds will forcibly
power o the device.
● When the power indicator is steady green,
you can press this button to power on the
device.
UID button/
indicator
The UID button/indicator helps identify and
locate a device.
UID indicator:
●O: The device is not being located.
● Blinking blue: The device has been located
and is distinguished from other devices that
have also been located.
● Steady blue: The device is being located.
UID button:
● You can turn on or o the UID indicator by
pressing the UID button on the panel or by
using the iBMC CLI or WebUI.
● You can press this button to turn on or o
the UID indicator.
● You can press and hold down this button for
4 to 6 seconds to reset the iBMC.
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