Huawei FusionServer Pro 2488 V5 Quick reference guide

Huawei FusionServer Pro 2488 V5 Server
V100R005
Technical White Paper
Issue 11
Date 2020-09-03
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2020. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
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and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specied in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every eort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
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Shenzhen 518129
People's Republic of China
Website: https://e.huawei.com
Issue 11 (2020-09-03) Copyright © Huawei Technologies Co., Ltd. i

About This Document
Purpose
This document describes the 2488 V5 rack server in terms of features, structure,
specications, and component compatibility.
Intended Audience
This document is intended for:
● Huawei presales engineers
● Channel partner presales engineers
● Enterprise presales engineers
Symbol Conventions
The symbols that may be found in this document are dened as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
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Symbol Description
Supplements the important information in the main
text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Change History
Issue Date Description
11 2020-09-03 ● This issue is the eleventh ocial release.
10 2020-07-31 ● This issue is the tenth ocial release.
09 2020-06-05 ● This issue is the ninth ocial release.
08 2020-04-20 ● This issue is the eighth ocial release.
07 2019-11-15 ● This issue is the seventh ocial release.
06 2019-08-23 ● Added the support for Cascade Lake
processors.
05 2018-11-30 ● This issue is the fth ocial release.
04 2018-07-23 ● This issue is the fourth ocial release.
03 2018-05-08 ● This issue is the third ocial release.
02 2018-02-24 ● This issue is the second ocial release.
01 2017-09-20 ● This issue is the rst ocial release.
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Contents
About This Document................................................................................................................ ii
1 Overview....................................................................................................................................1
2 Features..................................................................................................................................... 2
3 Physical Structure....................................................................................................................5
4 Logical Structure......................................................................................................................7
5 Hardware Description.............................................................................................................9
5.1 Front Panel................................................................................................................................................................................ 9
5.1.1 Appearance............................................................................................................................................................................ 9
5.1.2 Indicators and Buttons.....................................................................................................................................................10
5.1.3 Ports....................................................................................................................................................................................... 14
5.2 Rear Panel............................................................................................................................................................................... 16
5.2.1 Appearance.......................................................................................................................................................................... 16
5.2.2 Indicators.............................................................................................................................................................................. 17
5.2.3 Ports....................................................................................................................................................................................... 19
5.3 Processor.................................................................................................................................................................................. 22
5.4 Memory.................................................................................................................................................................................... 22
5.4.1 Memory Identier............................................................................................................................................................. 22
5.4.2 Memory Subsystem Architecture................................................................................................................................. 24
5.4.3 Memory Compatibility..................................................................................................................................................... 25
5.4.4 Memory Installation Guidelines................................................................................................................................... 27
5.4.5 Memory Installation Positions...................................................................................................................................... 27
5.4.6 Memory Protection Technologies................................................................................................................................ 29
5.5 Storage..................................................................................................................................................................................... 30
5.5.1 Drive Congurations.........................................................................................................................................................30
5.5.2 Drive Numbering............................................................................................................................................................... 30
5.5.3 Drive Indicators.................................................................................................................................................................. 31
5.5.4 RAID Controller Card........................................................................................................................................................32
5.6 I/O Expansion......................................................................................................................................................................... 33
5.6.1 PCIe Cards............................................................................................................................................................................ 33
5.6.2 PCIe Slots..............................................................................................................................................................................33
5.6.3 PCIe Slot Description........................................................................................................................................................ 33
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5.7 PSUs...........................................................................................................................................................................................34
5.8 Fans............................................................................................................................................................................................35
5.9 LCD.............................................................................................................................................................................................36
5.10 Boards.....................................................................................................................................................................................37
5.10.1 Mainboard......................................................................................................................................................................... 38
5.10.2 Drive Backplane............................................................................................................................................................... 39
6 Product Specications.......................................................................................................... 42
6.1 Technical Specications...................................................................................................................................................... 42
6.2 Environmental Specications............................................................................................................................................47
6.3 Physical Specications.........................................................................................................................................................49
7 Software and Hardware Compatibility............................................................................ 50
8 Safety Instructions................................................................................................................ 51
8.1 Safety Instructions................................................................................................................................................................ 51
8.2 Maintenance and Warranty.............................................................................................................................................. 54
9 System Management............................................................................................................55
10 Certications........................................................................................................................ 57
A Appendix................................................................................................................................. 59
A.1 Product SN.............................................................................................................................................................................. 59
A.2 Operating Temperature Limitations...............................................................................................................................60
A.3 RAS Features.......................................................................................................................................................................... 61
A.4 Sensor List............................................................................................................................................................................... 64
B Glossary................................................................................................................................... 70
B.1 A-E............................................................................................................................................................................................. 70
B.2 F-J............................................................................................................................................................................................... 71
B.3 K-O.............................................................................................................................................................................................71
B.4 P-T.............................................................................................................................................................................................. 71
B.5 U-Z............................................................................................................................................................................................. 72
C Acronyms and Abbreviations..............................................................................................73
C.1 A-E............................................................................................................................................................................................. 73
C.2 F-J............................................................................................................................................................................................... 74
C.3 K-O.............................................................................................................................................................................................75
C.4 P-T.............................................................................................................................................................................................. 76
C.5 U-Z............................................................................................................................................................................................. 78
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1 Overview
Huawei FusionServer Pro 2488 V5 (marked as H24M-05 on the nameplate, 2488
V5 for short) is a new-generation 2U 4-socket rack server designed for Internet,
Internet Data Center (IDC), cloud computing, enterprise, and telecom applications.
The 2488 V5 is ideal for applications such as databases, cloud computing,
virtualization, and in-memory computing.
The 2488 V5 is a secure, highly expandable server delivering high-performance
computing, large storage capacity, and low power consumption. It is easy to
deploy and manage and supports virtualization.
Figure 1-1 2488 V5
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2 Features
Performance and Scalability
● Powered by Intel® Xeon® Scalable Skylake or Cascade Lake processors, the
server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and
three 10.4 GT/s UPI links between the processors, which deliver supreme
processing performance.
– It supports four processors with 112 cores and 224 threads to maximize
the concurrent execution of multithreaded applications.
– The layered architecture of the processor cache is optimized. The L2
cache capacity is increased to process memory data directly, which greatly
improves the memory access performance. Each core can exclusively use
1 MB of L2 cache, reducing the load on L3 cache. A single processor can
share a maximum of 38.5 MB L3 cache.
– Intel Turbo Boost Technology 2.0 allows processor cores to run faster
than the frequency specied in the Thermal Design Power (TDP)
conguration if they are operating below power, current, and
temperature specication limits.
– Intel Hyper-Threading Technology enables each processor core to run up
to two threads, improving parallel computation capability.
– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) vendors to better use hardware to address
virtualization workloads.
– With Intel® Advanced Vector Extensions 512 (AVX-512), applications can
pack 32 double-precision and 64 single-precision oating-point
operations per second in a clock cycle within the 512-bit vectors, as well
as eight 64-bit and sixteen 32-bit integers, with up to two 512-bit fused
multiply-add (FMA) units. Compared with Intel® Advanced Vector
Extensions 2.0 (Intel® AVX2), Intel® AVX-512 doubles the width and
number of data registers and the width of FMA units.
– The Cascade Lake processors support Intel® Deep Learning Boost vector
neural network instructions (VNNI) to improve the performance of deep
learning applications.
● The server supports double data rate 4 (DDR4) registered dual in-line
memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error
checking and correcting (ECC). A server fully congured with thirty-two 2933
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MT/s memory modules (only available with Cascade Lake processors)
provides 4096 GB memory space and the maximum theoretical memory
bandwidth of 549.9 GB/s.
● Flexible drive congurations cater to a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● The use of all solid-state drives (SSDs) is supported. An SSD supports up to
100 times more I/O operations per second (IOPS) than a typical hard disk
drive (HDD). The use of all SSDs provides higher I/O performance than the
use of all HDDs or a combination of HDDs and SSDs.
● The use of 12 Gbit/s SCSI (SAS) serial connection for internal storage provides
2x data transmission rate than the use of 6 Gbit/s SAS connection,
maximizing the performance of I/O-intensive applications.
● With Intel integrated I/O, the Intel® Xeon® Scalable processors integrate the
PCIe 3.0 controller to shortens I/O latency and improve overall system
performance.
● The server supports up to nine PCIe 3.0 slots.
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server uses hot-swappable SAS/SATA/NVMe drives. It supports RAID 0, 1,
1E, 10, 5, 50, 6, and 60, depending on the RAID controller card used. It also
uses a supercapacitor to protect the RAID cache data against power failures.
● The server provides simplied O&M and ecient troubleshooting through the
UID/HLY indicators on the front panel, fault diagnosis LED, touch LCD
diagnosis panel, and iBMC web interface.
● The SSDs oer better reliability than HDDs, ensuring continued system
performance.
● The built-in iBMC monitors system parameters in real time, triggers alarms,
and performs recovery actions to minimize the system downtime.
● Huawei provides a three-year warranty for parts replacement and onsite
repair for the servers used in China. Huawei provides a 10-hour-a-day, 7-day-
a-week support program. Service requests will be handled the next business
day. Optional service upgrades are available.
● Huawei provides a three-year warranty for parts replacement and repair for
the servers used outside China. Huawei provides a 9-hour-a-day, 5-day-a-
week support program. Service requests will be handled the next business day.
Huawei delivers the repaired or new parts within 45 calendar days after
receiving the defective parts.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
● A password is required for accessing the BIOS, ensuring system boot and
management security.
● The Network Controller Sideband Interface (NC-SI) allows a network port to
serve as a management port and a service port for maximized return on
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investment (ROI) for customers. The NC-SI feature is disabled by default and
can be enabled through the iBMC or BIOS.
● The integrated Unied Extensible Firmware Interface (UEFI) improves setup,
conguration, and update eciency and simplies fault handling.
● Lockable server chassis panel ensures security of local data.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buer overow attacks when working with a supported OS.
● Intel Trusted Execution Technology enhances security using hardware-based
defense against malicious software attacks, allowing applications to run
independently.
● The trusted platform module (TPM) and trusted cryptography module (TCM)
provide advanced encryption functions, such as digital signatures and remote
authentication.
NO TE
The service port with NC-SI enabled supports the following conguration:
●Conguring any LOM port of the server as the service port with NC-SI enabled. Host
port 1 is congured by default.
● Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The
VLAN ID is 0 and disabled by default.
●Conguring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6
addresses (IPv6 address, prex length, and gateway) for this port.
Energy Eciency
● The 80 Plus Platinum power supply units (PSUs) of multiple power ratings
provide 94% power eciency at 50% load.
●Ecient voltage regulator-down (VRD) power supplies for boards minimize
the energy loss from DC/DC power conversion.
● Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation
and reduce overall system power consumption.
● The improved thermal design with energy-ecient fans ensures optimal heat
dissipation and reduces system power consumption.
● The server is protected with power capping and power control measures.
● Staggered spin-up for drives reduces the server boot power consumption.
● Intel® Intelligent Power Capability allows a processor to be powered on or o
based on requirements.
●Low-voltage Intel® Xeon® Scalable processors consume less energy, ideally
suited for data centers and telecommunications environments constrained by
power and thermal limitations.
● SSDs consume 80% less power than HDDs.
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3 Physical Structure
Figure 3-1 Physical structure of a 2488 V5 with 8 x 2.5" drives (example)
1 Riser card 2 PCIe cards
3 PSUs 4 PSU backplane
5 Cable organizer 6 Chassis
7 Air duct 8 Drive backplane
9 Fan module brackets 10 Drives
11 DVD drive (or LCD) 12 Fan modules
13 VGA board 14 Processors
15 Mainboard 16 TPM/TCM
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17 DIMMs 18 Heat sinks
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4 Logical Structure
Figure 4-1 2488 V5 logical structure
●The server supports two or four Intel® Xeon® Scalable processors.
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● The server supports up to 32 memory modules.
● The CPUs (processors) interconnect with each other through three UPI links at
a speed of up to 10.4 GT/s.
● The server provides nine standard PCIe 3.0 slots of various specications.
● The server provides low-speed I/O ports, such as the VGA port, USB 3.0 ports,
and serial ports (RJ45).
● The server provides four LOM ports, including two 10GE optical ports and two
GE electrical ports.
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processor
5.4 Memory
5.5 Storage
5.6 I/O Expansion
5.7 PSUs
5.8 Fans
5.9 LCD
5.10 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" SAS/SATA drive conguration
Figure 5-1 Front view
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1 Drives 2 Built-in DVD drive or
touchable LCD
3 Slide-out label plate
(with an SN label)
- -
● 24 x 2.5" (16 x SAS/SATA + 8 x NVMe) drive conguration
Figure 5-2 Front view
1 Drives 2 Slide-out label plate (with an
SN label)
● 25 x 2.5" SAS/SATA drive conguration
Figure 5-3 Front view
1Drives 2 Slide-out label plate
(with an SN label)
5.1.2 Indicators and Buttons
Positions
● 8 x 2.5" SAS/SATA drive conguration
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Figure 5-4 Indicators and buttons on the front panel
1 LOM port 1 connection
status indicator
2 LOM port 2 connection
status indicator
3 LOM port 3 connection
status indicator
4 LOM port 4 connection
status indicator
5 Non-Maskable Interrupt
(NMI) button
6 Fault diagnosis LED
7 Health status indicator 8 UID button/indicator
9 Power button/indicator - -
● 24 x 2.5" (16 x SAS/SATA + 8 x NVMe) drive conguration
Figure 5-5 Indicators and buttons on the front panel
1LOM port 1 connection
status indicator
2 LOM port 2 connection
status indicator
3 LOM port 3 connection
status indicator
4 LOM port 4 connection
status indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
9 NMI button - -
Note: There are eight NVMe drives (four NVMe drives on the left and right
sides).
● 25 x 2.5" SAS/SATA drive conguration
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Figure 5-6 Indicators and buttons on the front panel
1 LOM port 1 connection
status indicator
2 LOM port 2 connection
status indicator
3 LOM port 3 connection
status indicator
4 LOM port 4 connection
status indicator
5 Fault diagnosis LED 6 Health status indicator
7 UID button/indicator 8 Power button/indicator
Indicator and Button Description
Table 5-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Description
Fault
diagnosis LED
● ---: The device is operating normally.
● Fault code: A component is faulty.
For details about error codes, see
FusionServer Pro Rack Server iBMC Alarm
Handling.
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Silkscreen Indicator/
Button
Description
Power
button/
indicator
Power indicator:
●O: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The power button is locked.
The power button is locked when the iBMC
is starting.
● Steady yellow: The device is ready to power
on.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down
the OS.
● When the device is powered on, holding
down this button for 6 seconds will forcibly
power o the device.
● When the power indicator is steady green,
you can press this button to power on the
device.
UID button/
indicator
The UID button/indicator helps identify and
locate a device.
UID indicator:
●O: The device is not being located.
● Blinking blue: The device has been located
and is distinguished from other devices that
have also been located.
● Steady blue: The device is being located.
UID button:
● You can turn on or o the UID indicator by
pressing the UID button on the panel or by
using the iBMC CLI or WebUI.
● You can press this button to turn on or o
the UID indicator.
● You can press and hold down this button for
4 to 6 seconds to reset the iBMC.
Health status
indicator
●O: The device is powered o or is faulty.
● Blinking red at 1 Hz: A major alarm has
been generated on the system.
● Blinking red at 5 Hz: A critical alarm has
been generated on the system.
● Steady green: The device is operating
properly.
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Silkscreen Indicator/
Button
Description
NMI button A non-maskable interrupt (NMI) is generally
triggered to stop the OS for debugging. To
trigger an NMI, press this button or click the
button on the iBMC WebUI.
NOTICE
● Press the NMI button only when the OS is
abnormal. Do not press this button when the
server is operating properly. An NMI does not
gracefully shut down the OS and causes service
interruption and data loss.
● Before pressing the NMI button, ensure that the
OS has the NMI processing program. Otherwise,
the OS may crash. Exercise caution when pressing
this button.
LOM port
connection
status
indicator
Each indicator shows the connection status of
an Ethernet LOM port.
●O: The network port is not in use or has
failed.
● Steady green: The network port is properly
connected.
NOTE
● The indicators correspond to two 10GE and two
GE network ports on the mainboard.
● The LOM has a standby power supply and will
not be powered o even if the service system is
powered o. As long as the LOM ports are
properly connected to other working network
devices, the network ports will remain connected
and the indicators are on.
5.1.3 Ports
Port Positions
● 8 x 2.5" SAS/SATA drive conguration
Figure 5-7 Ports on the front panel
1USB 2.0 ports 2 USB 3.0 port
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