Huawei FusionServer Pro 2488H V6 Quick reference guide

Huawei FusionServer Pro 2488H V6 Server
Technical White Paper
Issue 03
Date 2021-02-01
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2021. All rights reserved.
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Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
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Website: https://e.huawei.com
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About This Document
Purpose
This document describes the 2488H V6 rack server in terms of features, structure,
specications, and component hardware and software compatibility.
Intended Audience
This document is intended for:
● Huawei presales engineers
● Channel partner presales engineers
● Enterprise presales engineers
Symbol Conventions
The symbols that may be found in this document are dened as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper About This Document
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Symbol Description
Supplements the important information in the main
text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Change History
Issue Date Description
03 2021-02-01 This issue is the third ocial release.
02 2020-12-09 This issue is the second ocial release.
01 2020-10-21 This issue is the rst ocial release.
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper About This Document
Issue 03 (2021-02-01) Copyright © Huawei Technologies Co., Ltd. iii

Contents
About This Document................................................................................................................ ii
1 Overview....................................................................................................................................1
2 Features..................................................................................................................................... 2
3 Physical Structure....................................................................................................................6
4 Logical Structure......................................................................................................................8
5 Hardware Description.............................................................................................................9
5.1 Front Panel................................................................................................................................................................................ 9
5.1.1 Appearance............................................................................................................................................................................ 9
5.1.2 Indicators and Buttons.....................................................................................................................................................11
5.1.3 Ports....................................................................................................................................................................................... 15
5.2 Rear Panel............................................................................................................................................................................... 17
5.2.1 Appearance.......................................................................................................................................................................... 18
5.2.2 Indicators and Buttons.....................................................................................................................................................18
5.2.3 Ports....................................................................................................................................................................................... 21
5.3 Processor.................................................................................................................................................................................. 22
5.4 Memory.................................................................................................................................................................................... 23
5.4.1 DDR4 Memory.................................................................................................................................................................... 23
5.4.1.1 Memory Identier.......................................................................................................................................................... 23
5.4.1.2 Memory Subsystem Architecture..............................................................................................................................24
5.4.1.3 Memory Compatibility................................................................................................................................................. 26
5.4.1.4 Memory Installation Guidelines................................................................................................................................ 28
5.4.1.5 Memory Installation Positions................................................................................................................................... 28
5.4.1.6 Memory Protection Technologies............................................................................................................................. 30
5.4.2 PMem.................................................................................................................................................................................... 31
5.4.2.1 Memory Identier.......................................................................................................................................................... 31
5.4.2.2 Memory Subsystem Architecture..............................................................................................................................31
5.4.2.3 Memory Compatibility................................................................................................................................................. 33
5.4.2.4 Memory Installation Guidelines................................................................................................................................ 34
5.4.2.5 Memory Installation Positions................................................................................................................................... 35
5.4.2.6 Memory Protection Technologies............................................................................................................................. 38
5.5 Storage..................................................................................................................................................................................... 39
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5.5.1 Drive Congurations.........................................................................................................................................................40
5.5.2 Drive Numbering............................................................................................................................................................... 49
5.5.3 Drive Indicators.................................................................................................................................................................. 54
5.5.4 RAID Controller Card........................................................................................................................................................56
5.6 Network................................................................................................................................................................................... 56
5.6.1 OCP 3.0 Network Adapter.............................................................................................................................................. 56
5.7 I/O Expansion......................................................................................................................................................................... 56
5.7.1 PCIe Cards............................................................................................................................................................................ 57
5.7.2 PCIe Slots..............................................................................................................................................................................57
5.7.3 PCIe Slot Description........................................................................................................................................................ 59
5.8 PSUs...........................................................................................................................................................................................61
5.9 Fan Modules........................................................................................................................................................................... 62
5.10 LCD.......................................................................................................................................................................................... 63
5.11 Boards.....................................................................................................................................................................................64
5.11.1 Mainboard......................................................................................................................................................................... 65
5.11.2 Drive Backplane............................................................................................................................................................... 67
5.11.3 PSU Backplane................................................................................................................................................................. 70
6 Product Specications.......................................................................................................... 71
6.1 Technical Specications...................................................................................................................................................... 71
6.2 Environmental Specications............................................................................................................................................75
6.3 Physical Specications.........................................................................................................................................................77
7 Software and Hardware Compatibility............................................................................ 79
8 Safety Instructions................................................................................................................ 80
8.1 Safety Instructions................................................................................................................................................................ 80
8.2 Maintenance and Warranty.............................................................................................................................................. 83
9 System Management............................................................................................................84
10 Certications........................................................................................................................ 86
A Appendix................................................................................................................................. 88
A.1 Product SN.............................................................................................................................................................................. 88
A.2 Operating Temperature Limitations ............................................................................................................................. 89
A.3 Nameplate.............................................................................................................................................................................. 92
A.4 RAS Features.......................................................................................................................................................................... 92
A.5 Sensor List............................................................................................................................................................................... 92
B Glossary................................................................................................................................... 99
B.1 A-E............................................................................................................................................................................................. 99
B.2 F-J.............................................................................................................................................................................................100
B.3 K-O.......................................................................................................................................................................................... 100
B.4 P-T............................................................................................................................................................................................ 100
B.5 U-Z...........................................................................................................................................................................................101
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C Acronyms and Abbreviations........................................................................................... 102
C.1 A-E........................................................................................................................................................................................... 102
C.2 F-J............................................................................................................................................................................................ 103
C.3 K-O.......................................................................................................................................................................................... 104
C.4 P-T............................................................................................................................................................................................105
C.5 U-Z.......................................................................................................................................................................................... 107
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper Contents
Issue 03 (2021-02-01) Copyright © Huawei Technologies Co., Ltd. vi

1 Overview
Huawei FusionServer Pro 2488H V6 (2488H V6) is a new-generation 2U 4-socket
rack server designed for Internet, Internet Data Center (IDC), cloud computing,
enterprise, and telecom applications.
The 2488H V6 is ideal for applications such as databases, cloud computing,
virtualization, in-memory computing, and deep learning.
The secure, compact 2488H V6 is a highly expandable server delivering high-
performance computing, large storage capacity and low power consumption. It is
easy to deploy and manage and supports virtualization.
NO TE
For details about the 2488H V6 nameplate information, see A.3 Nameplate.
Figure 1-1 Physical structure of a 2488H V6 with 8 x 2.5" drives (example)
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper 1 Overview
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2 Features
Performance and Scalability
● Powered by the third-generation Intel® Xeon® Scalable Cooper Lake
processors, the server provides up to 28 physical cores, 3.9 GHz frequency, a
38.5 MB L3 cache, and six 10.4 GT/s UPI links between the processors, which
deliver supreme processing performance.
– It supports four processors with 112 cores and 224 threads to maximize
the concurrent execution of multithreaded applications.
– The layered architecture of the processor cache is optimized. The L2
cache capacity is increased to process memory data directly, which greatly
improves the memory access performance. Each core can exclusively use
1 MB of L2 cache, reducing the load on L3 cache. A single processor can
share a maximum of 38.5 MB L3 cache.
– Intel Turbo Boost Technology 2.0 allows processor cores to run faster
than the frequency specied in the Thermal Design Power (TDP)
conguration if they are operating below power, current, and
temperature specication limits.
– Intel Hyper-Threading Technology enables each processor core to run up
to two threads, improving parallel computation capability.
– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows
operating system (OS) to better use hardware to address virtualization
workloads.
– Intel Deep Learning Boost (Intel DL Boost) works with the latest boat16
instruction set and Vector Neural Network Instructions (VNNI) to
accelerate AI training and inference performance of the CPU.
– With Intel® Advanced Vector Extensions 512 (AVX-512), applications can
pack 32 double-precision and 64 single-precision oating-point
operations per second in a clock cycle within the 512-bit vectors, as well
as eight 64-bit and sixteen 32-bit integers, with up to two 512-bit fused
multiply-add (FMA) units. Compared with Intel® Advanced Vector
Extensions 2.0 (Intel® AVX2), Intel® AVX-512 doubles the width and
number of data registers and the width of FMA units.
● The server supports a maximum of 48 DDR4 ECC 3200 MT/s DIMMs. The
DDR4 ECC DIMMs support registered DIMMs (RDIMM) and load-reduced
DIMMs (LRDIMMs), which provide high speed and availability.
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Technical White Paper 2 Features
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● The server supports a maximum of 24 Intel® OptaneTM Persistent Memory
Module 200 series (PMem modules for short). When the DDR4 memory
modules are used together, the server supports a maximum of 18 TB memory
capacity (calculated based on a maximum of 256 GB capacity per DDR4
memory module and a maximum of 512 GB capacity per PMem module).
● Flexible drive congurations meet a variety of business requirements and
ensure high elasticity and scalability of storage resources.
● The use of all solid-state drives (SSDs) is supported. An SSD supports up to
100 times more I/O operations per second (IOPS) than a typical hard disk
drive (HDD). The use of all SSDs provides higher I/O performance than the
use of all HDDs or a combination of HDDs and SSDs.
● The use of 12 Gbit/s SCSI (SAS) serial connection for internal storage provides
2x data transmission rate than the use of 6 Gbit/s SAS connection,
maximizing the performance of I/O-intensive applications.
● With Intel integrated I/O, the third-generation Intel® Xeon® Scalable processors
integrate the PCIe 3.0 controller to shorten I/O latency and improve overall
system performance.
● The server supports a maximum of 11 PCIe 3.0 expansion slots, including one
FlexIO card slot dedicated for the OCP 3.0 network adapter.
● The server supports one FlexIO card (applicable only to the OCP 3.0 network
adapter) with exible conguration of GE/10GE/25GE/100GE network
adapters, which are hot swappable and support network controller sideband
interface (NC-SI), HTTPS boot, preboot execution environment (PXE), and
Wake on LAN (WoL).
Availability and Serviceability
● Carrier-class components with process expertise ensure high system reliability
and availability.
● The server supports hot-swappable SAS/SATA/NVMe drives. SAS/SATA drives
support RAID 0, 1, 10, 5, 50, 6, and 60, depending on the RAID controller card
used. It also uses a supercapacitor to protect the RAID cache data against
power failures.
● SSDs oer better reliability than HDDs, prolonging system uptime.
● The server provides simplied O&M and ecient troubleshooting through the
UID/HLY indicators on the front panel, fault diagnosis LED, touch LCD
diagnosis panel, and iBMC web interface.
● The mounting ears provide iBMC direct connect management ports to support
local iBMC O&M, improving O&M eciency.
● A server provides two hot-swappable PSUs in 1+1 redundancy mode and six
hot-swappable fan modules in N+1 redundancy mode, improving system
availability.
● The built-in iBMC monitors system parameters in real time, triggers alarms,
and performs recovery actions to minimize the system downtime.
● For details about the warranty policy, visit Warranty Service.
Manageability and Security
● The built-in iBMC monitors server operating status and provides remote
management.
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Technical White Paper 2 Features
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● A password is required for accessing the BIOS, ensuring system boot and
management security.
● The NC-SI feature allows a network port to serve as a management port and
a service port. The NC-SI feature is disabled by default and can be enabled
through the iBMC or BIOS.
● The integrated Unied Extensible Firmware Interface (UEFI) improves setup,
conguration, and update eciency and simplies fault handling.
● Lockable server chassis panel ensures security of local data.
● Chassis cover opening detection is supported to enhance security.
● Intel Execute Disable Bit (EDB) function prevents certain types of malicious
buer overow attacks when working with a supported OS.
● The Intel Converged Boot Guard & Trusted Execution Technology (Intel CBnT)
prevents malicious software attacks based on hardware, prevents the
rmware from being maliciously modied, and prevents the execution of
unauthorized boot blocks. It also allows applications to run in their own
independent space without being aected by other software running in the
system, thereby enhancing security.
● The trusted platform module (TPM) and trusted cryptography module (TCM)
provide advanced encryption functions, such as digital signatures and remote
authentication.
● The secure boot based on the BMC chip RoT implements level-by-level
rmware verication and builds a secure boot chain, ensuring system security.
● The following requirements in NIST SP 800-147B are met:
– The BIOS rmware digital signature update mechanism is supported.
During the upgrade, the digital signature is veried to prevent
unauthorized BIOS rmware upgrade.
– The ash security protection mechanism is supported to prevent
unauthorized modication of the ash memory in the OS.
NO TE
The service port with NC-SI enabled supports the following conguration:
●Conguring any port on the OCP 3.0 network adapter or other network adapters that
support the NC-SI feature as the service port with NC-SI enabled.
● Enabling, disabling, and setting a virtual local area network (VLAN) ID for this port. The
VLAN ID is 0 and disabled by default.
●Conguring IPv4 addresses (IPv4 address, subnet mask, and gateway) and IPv6
addresses (IPv6 address, prex length, and gateway) for this port.
Energy Eciency
● The server supports 80 Plus Platinum/Titanium PSUs of dierent energy
eciency levels. The PSU eciency reaches 96% at 50% load.
●Ecient voltage regulator-down (VRD) power supplies for boards minimize
the energy loss from DC/DC power conversion.
● Area-based, Proportional-Integral-Derivative (PID) intelligent fan speed
adjustment and intelligent CPU frequency scaling optimize heat dissipation
and reduce overall system power consumption.
● The improved thermal design with energy-ecient fans ensures optimal heat
dissipation and reduces system power consumption.
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Technical White Paper 2 Features
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● The server is protected with power capping and power control measures.
● Staggered spin-up of drives reduces the server boot power consumption.
● Intel Intelligent Power Capability allows the processor logic unit to be
powered on or o based on requirements.
● The low-voltage third-generation Intel® Xeon® Scalable Cooper Lake
processors consume less energy, ideally suited for data centers and
telecommunications environments constrained by power and thermal
limitations.
● SSDs consume 80% less power than HDDs.
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3 Physical Structure
Figure 3-1 Physical structure of a 2488H V6 with 8 x 2.5" drives (example)
1 PCIe riser module 1 2 PCIe cards
3 PCIe riser module 2 4 PSUs
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Technical White Paper 3 Physical Structure
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5 PSU backplane 6 Chassis
7Supercapacitora8 Intrusion sensor
9 Primary air duct 10 Secondary air ductsb
11 Drive backplane 12 Fan module bracket
13 Fan modules 14 Drives
15 Processors 16 Processor heat sinks
17 Cable organizers 18 M.2 SSDc
19 Mainboard 20 OCP 3.0 network adapter
21 Memory modules - -
a: The server supports only PCIe RAID controller cards, which can be congured
with a supercapacitor. For details about the slots for installing PCIe RAID
controller cards, see 5.5.1 Drive Congurations.
b: Secondary air ducts are not required when full-length PCIe cards are
congured.
c: If an M.2 SSD adapter card is congured, two M.2 SSDs can be congured in
slot 10. If an Avago SAS3004iMR RAID controller card is congured, two M.2
FRUs can be congured in slot 1. For details, see 5.5.1 Drive Congurations.
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper 3 Physical Structure
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4 Logical Structure
Figure 4-1 2488H V6 logical structure
● The server supports two or four third-generation Intel® Xeon® Scalable
processors.
● The server supports up to 48 memory modules.
● The CPUs (processors) interconnect with each other through six UPI links at a
speed of up to 10.4 GT/s.
● The server supports a maximum of 11 PCIe 3.0 expansion slots, including one
slot dedicated for the OCP 3.0 network adapter.
● The LBG-R Platform Controller Hub (PCH) is integrated on the mainboard to
support ve USB 3.0 ports and two SATA 3.0 ports.
● The Hi1711 management chip integrated on the mainboard supports a video
graphic array (VGA) port, a management network port, and a serial port.
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper 4 Logical Structure
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5 Hardware Description
5.1 Front Panel
5.2 Rear Panel
5.3 Processor
5.4 Memory
5.5 Storage
5.6 Network
5.7 I/O Expansion
5.8 PSUs
5.9 Fan Modules
5.10 LCD
5.11 Boards
5.1 Front Panel
5.1.1 Appearance
● 8 x 2.5" drive pass-through conguration (8 x SAS/SATA)
Figure 5-1 Front view
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Technical White Paper 5 Hardware Description
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1 SAS/SATA drives 2 (Optional) Built-in DVD
drive (or LCD module)
3 Slide-out label plate
(with an SN label)
- -
● 12 x 2.5" drive pass-through conguration (4 x SAS/SATA + 8 x NVMe)
Figure 5-2 Front view
1 SAS/SATA drives 2 NVMe drives
3 Slide-out label plate
(with an SN label)
- -
● 20 x 2.5" drive pass-through conguration (4 x SAS/SATA + 16 x NVMe)
Figure 5-3 Front view
1SAS/SATA drives 2 NVMe drives
3 Filler panel in drive slot
NOTE
The slot cannot hold
drives.
4 Slide-out label plate
(with an SN label)
● 24 x 2.5" drive pass-through conguration (24 x SAS/SATA)
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Technical White Paper 5 Hardware Description
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Figure 5-4 Front view
1 SAS/SATA drives 2 Filler panel in drive slot
NOTE
The slot cannot hold
drives.
3 Slide-out label plate
(with an SN label)
- -
● 25 x 2.5" drive EXP conguration (25 x SAS/SATA)
Figure 5-5 Front view
1SAS/SATA drives 2 Slide-out label plate
(with an SN label)
5.1.2 Indicators and Buttons
● 8 x 2.5" drive pass-through conguration (8 x SAS/SATA)
Figure 5-6 Indicators and buttons on the front panel
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Technical White Paper 5 Hardware Description
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1 Fault diagnosis LED 2 Power button/indicator
3 Health status indicator 4 UID button/indicator
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 12 x 2.5" drive pass-through conguration (4 x SAS/SATA + 8 x NVMe)
Figure 5-7 Indicators and buttons on the front panel
1 Fault diagnosis LED 2 Power button/indicator
3 Health status indicator 4 UID button/indicator
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 20 x 2.5" drive pass-through conguration (4 x SAS/SATA + 16 x NVMe)
Figure 5-8 Indicators and buttons on the front panel
1Fault diagnosis LED 2 Power button/indicator
3 Health status indicator 4 UID button/indicator
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 24 x 2.5" drive pass-through conguration (24 x SAS/SATA)
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper 5 Hardware Description
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Figure 5-9 Indicators and buttons on the front panel
1 Fault diagnosis LED 2 Power button/indicator
3 Health status indicator 4 UID button/indicator
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
● 25 x 2.5" drive EXP conguration (25 x SAS/SATA)
Figure 5-10 Indicators and buttons on the front panel
1Fault diagnosis LED 2 Power button/indicator
3 Health status indicator 4 UID button/indicator
5 FlexIO card presence
indicator
6 iBMC direct connect
management port
indicator
Indicator and Button Description
Table 5-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Description
Fault
diagnosis LED
● ---: The device is operating properly.
● Error code: A component is faulty.
For details about error codes, see
FusionServer Pro Rack Server iBMC Alarm
Handling .
Huawei FusionServer Pro 2488H V6 Server
Technical White Paper 5 Hardware Description
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