Huawei FusionServer Pro CH121 V5 V100R005 Manual

FusionServer Pro XH321 V5 Server Node
V100R005
Maintenance and Service Guide
Issue 07
Date 2019-12-20
HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2019. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specied in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every eort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: https://e.huawei.com
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About This Document
Purpose
This document describes the physical structure, parts installation and removal
procedures, appearance, and specications of the XH321 V5 server node.
Intended Audience
This document is intended for:
● Huawei technical support engineers
● Technical support engineers from channel partners
● Enterprise administrators
Symbol Conventions
The symbols that may be found in this document are dened as follows.
Symbol Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if
not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not
avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not
avoided, could result in equipment damage, data loss,
performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to
personal injury.
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Symbol Description
Supplements the important information in the main
text.
NOTE is used to address information not related to
personal injury, equipment damage, and environment
deterioration.
Change History
Issue Date Description
07 2019-12-20 ● This issue is the seventh ocial release.
06 2019-08-10 ● Added the support for the Cascade Lake
processors.
05 2019-01-04 ● Added the description about X722 LOMs
and PCIe slots.
● Updated the technical specications.
● Added the description of the NC-SI feature.
04 2018-08-02 ● Added the temperature restrictions when
the M.2 is used with a PCIe RAID controller
card.
● Added information about the Avago
SAS3004 iMR RAID controller card.
03 2018-05-21 ● Rened the document for easy use.
02 2018-01-22 ● Optimized the processor installation
procedure.
01 2017-12-29 ● This issue is the rst ocial release.
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Contents
About This Document................................................................................................................ ii
1 Overview....................................................................................................................................1
1.1 Overview.................................................................................................................................................................................... 1
1.2 Physical Structure.................................................................................................................................................................... 2
1.3 Logical Structure......................................................................................................................................................................3
2 Hardware Description.............................................................................................................5
2.1 Front Panel................................................................................................................................................................................ 5
2.1.1 Appearance............................................................................................................................................................................ 5
2.1.2 Indicators and Buttons....................................................................................................................................................... 6
2.1.3 Ports..........................................................................................................................................................................................9
2.1.4 Installation Positions........................................................................................................................................................ 11
2.2 Processor.................................................................................................................................................................................. 11
2.3 Memory.................................................................................................................................................................................... 12
2.3.1 Memory Identier............................................................................................................................................................. 12
2.3.2 Memory Subsystem Architecture................................................................................................................................. 13
2.3.3 Memory Compatibility..................................................................................................................................................... 14
2.3.4 Memory Installation Guidelines................................................................................................................................... 16
2.3.5 Memory Installation Positions...................................................................................................................................... 16
2.3.6 Memory Protection Technologies................................................................................................................................ 18
2.4 Storage..................................................................................................................................................................................... 18
2.4.1 Drive Congurations.........................................................................................................................................................18
2.4.2 Drive Numbering............................................................................................................................................................... 19
2.4.3 RAID Controller Card........................................................................................................................................................19
2.5 I/O Expansion......................................................................................................................................................................... 20
2.5.1 PCIe Cards............................................................................................................................................................................ 20
2.5.2 PCIe Slots..............................................................................................................................................................................20
2.5.3 PCIe Slot Description........................................................................................................................................................ 20
2.6 Boards....................................................................................................................................................................................... 21
2.6.1 Mainboard............................................................................................................................................................................21
3 Product Specications.......................................................................................................... 23
3.1 Technical Specications...................................................................................................................................................... 23
3.2 Environmental Specications............................................................................................................................................27
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3.3 Physical Specications.........................................................................................................................................................28
4 Software and Hardware Compatibility............................................................................ 29
5 Safety Instructions................................................................................................................ 30
6 ESD............................................................................................................................................ 34
6.1 Preventing Electrostatic Discharge ................................................................................................................................ 34
6.2 Grounding Methods to Prevent Electrostatic Discharge......................................................................................... 35
7 Internal Cabling..................................................................................................................... 36
7.1 TPM Cabling........................................................................................................................................................................... 36
7.2 Screw-in RAID Controller Card Cabling......................................................................................................................... 37
7.3 Cabling of the SATA Controller Integrated in the Southbridge............................................................................ 38
7.4 PCIe Card Cabling................................................................................................................................................................. 39
8 Parts Replacement................................................................................................................ 40
8.1 Spare Parts Description.......................................................................................................................................................40
8.2 Obtaining Tools..................................................................................................................................................................... 41
8.3 Basic Operations....................................................................................................................................................................42
8.3.1 Power-On Procedure........................................................................................................................................................ 42
8.3.2 Power-O Procedure........................................................................................................................................................43
8.3.3 Removing an XH321 V5.................................................................................................................................................. 44
8.3.4 Installing an XH321 V5....................................................................................................................................................47
8.4 Field Replaceable Units.......................................................................................................................................................50
8.4.1 Removing an M.2 SSD..................................................................................................................................................... 51
8.4.2 Installing an M.2 SSD.......................................................................................................................................................52
8.4.3 Removing the Screw-in RAID Controller Card.........................................................................................................54
8.4.4 Installing the Screw-in RAID Controller Card.......................................................................................................... 56
8.4.5 Removing the Supercapacitor....................................................................................................................................... 58
8.4.6 Installing the Supercapacitor.........................................................................................................................................60
8.4.7 Removing the Avago SAS3004iMR PCIe RAID Control Card.............................................................................. 63
8.4.8 Installing the Avago SAS3004iMR PCIe RAID Control Card................................................................................64
8.4.9 Removing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card.......................................... 64
8.4.10 Installing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card......................................... 65
8.4.11 Removing a Processor................................................................................................................................................... 67
8.4.12 Installing a Processor.....................................................................................................................................................71
8.4.13 Removing a Memory Module..................................................................................................................................... 77
8.4.14 Installing a Memory Module.......................................................................................................................................78
8.4.15 Removing the TPM......................................................................................................................................................... 81
8.4.16 Installing the TPM...........................................................................................................................................................83
8.4.17 Removing the Battery....................................................................................................................................................86
8.4.18 Installing the Battery..................................................................................................................................................... 87
8.4.19 Removing a PCIe Card...................................................................................................................................................88
8.4.20 Installing a PCIe Card.................................................................................................................................................... 89
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8.4.21 Removing the PCIe Riser Module.............................................................................................................................. 91
8.4.22 Installing the PCIe Riser Module................................................................................................................................93
8.4.23 Removing the Air Duct..................................................................................................................................................96
8.4.24 Installing the Air Duct................................................................................................................................................... 97
8.4.25 Removing the Mainboard and Server Node Case................................................................................................98
8.4.26 Installing the Mainboard and Server Node Case...............................................................................................100
9 Troubleshooting...................................................................................................................103
10 Common Operations........................................................................................................ 104
10.1 Querying the iBMC IP Address.................................................................................................................................... 104
10.2 Logging In to the iBMC WebUI................................................................................................................................... 105
10.3 Logging In to the Desktop of a Server..................................................................................................................... 109
10.3.1 Using the Remote Virtual Console......................................................................................................................... 109
10.3.1.1 iBMC.............................................................................................................................................................................. 109
10.3.2 Using the Independent Remote Console..............................................................................................................111
10.3.2.1 Windows.......................................................................................................................................................................111
10.3.2.2 Ubuntu.......................................................................................................................................................................... 113
10.3.2.3 macOS........................................................................................................................................................................... 115
10.4 Logging In to the CLI...................................................................................................................................................... 117
10.4.1 Logging In to the CLI Using PuTTY over a Network Port...............................................................................118
10.4.2 Logging In to the CLI Using PuTTY over a Serial Port..................................................................................... 120
10.5 Accessing the BIOS.......................................................................................................................................................... 121
10.5.1 Accessing the BIOS (Skylake)...................................................................................................................................122
10.5.2 Accessing the BIOS (Cascade Lake)....................................................................................................................... 123
11 More Information............................................................................................................. 126
11.1 Technical Support.............................................................................................................................................................126
11.2 Product Information........................................................................................................................................................127
11.3 Product Conguration Resources............................................................................................................................... 128
11.4 Maintenance Tools...........................................................................................................................................................128
12 Software and Conguration Utilities...........................................................................130
12.1 iBMC..................................................................................................................................................................................... 130
12.2 BIOS...................................................................................................................................................................................... 131
12.3 FusionServer Tools SmartKit.........................................................................................................................................132
A Appendix............................................................................................................................... 135
A.1 Product SN............................................................................................................................................................................135
A.2 Operating Temperature Limitations............................................................................................................................ 136
A.2.1 Operating Temperature Limitations (Supercapacitor for the RAID Controller Card Congured)...... 136
A.2.2 Operating Temperature Limitations (Optical Modules Congured)............................................................ 138
A.2.3 Operating Temperature Limitations (Avago SAS3004iMR RAID Controller Card + M.2 FRU
Congured).................................................................................................................................................................................. 140
A.2.4 Operating Temperature Limitations (Dierent Models of Processors)........................................................142
A.3 RAS Features........................................................................................................................................................................ 143
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B Glossary................................................................................................................................. 146
B.1 A-E........................................................................................................................................................................................... 146
B.2 F-J.............................................................................................................................................................................................147
B.3 K-O.......................................................................................................................................................................................... 147
B.4 P-T............................................................................................................................................................................................ 147
B.5 U-Z...........................................................................................................................................................................................148
C Acronyms and Abbreviations........................................................................................... 149
C.1 A-E........................................................................................................................................................................................... 149
C.2 F-J............................................................................................................................................................................................ 150
C.3 K-O.......................................................................................................................................................................................... 151
C.4 P-T............................................................................................................................................................................................152
C.5 U-Z.......................................................................................................................................................................................... 154
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1 Overview
1.1 Overview
1.2 Physical Structure
1.3 Logical Structure
1.1 Overview
The XH321 V5 is a server node designed for Huawei X6000 servers. An X6000 can
house up to four XH321 V5 server nodes in a 2U chassis.
The XH321 V5 delivers supreme performance and high storage density in limited
space through innovative design. It is easy to manage and maintain.
The XH321 V5 supports six 2.5-inch SAS/SATA drives or NVMe drives, up to 16
DDR4 memory modules, and two PCIe cards.
The XH321 V5 is ideal for data center, cloud computing, Big Data, and Internet
applications.
● Intel SoftRAID is supported if no RAID controller card is congured.
● The OSs supporting Intel SoftRAID include RHEL 7.3, RHEL 7.4, Windows Server 2012 R2,
and Windows Server 2016.
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Figure 1-1 XH321 V5
1.2 Physical Structure
Figure 1-2 XH321 V5 physical structure
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1 Air duct 2 Air duct for the
supercapacitor
3 RAID controller card/PCIe
card
4 Supercapacitor
5 Narrow conjoined heat
sinks
6 Wide conjoined heat sinks
7 Battery 8 Mainboard
9 Processors 10 PCIe riser module
11 PCIe cards 12 Memory modules
13 Node case 14 M.2 SSD cards
15 TPM (with M.2 ports) - -
1.3 Logical Structure
Figure 1-3 XH321 V5 logical structure
● The server supports one or two Intel® Xeon® Scalable processors.
● The server supports up to 16 memory modules.
● The CPUs (processors) interconnect with each other through two UPI links at
a speed of up to 10.4 GT/s.
● The PCIe cards connected to the processors provide service ports.
● The RAID controller card connects to the mainboard using a SAS cable and
connects to the system backplane through a connector.
● The BMC chipset interconnects with the PCH through PCIe and LPC buses to
provide a management interface.
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● The BMC integrates the graphics card, video compression, and virtual media
component to provide device management functions, such as power control,
slot ID acquisition, power supply detection, and KVM over IP.
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2 Hardware Description
2.1 Front Panel
2.2 Processor
2.3 Memory
2.4 Storage
2.5 I/O Expansion
2.6 Boards
2.1 Front Panel
2.1.1 Appearance
Figure 2-1 Front view
1PCIe card (RAID controller
card not congured)
2 PCIe cards
3 Slide-out label plate (with
an SN label)
- -
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2.1.2 Indicators and Buttons
Positions
Figure 2-2 Indicators and buttons on the front panel
1 Data transmission rate
indicator for a 10GE
optical port
2 Connection status
indicator/Data
transmission status
indicator for a 10GE
optical port
3 Power button/indicator 4 Health status indicator
5 UID button/indicator 6 Data transmission status
indicator for a GE
electrical port
7 Connection status
indicator for a GE
electrical port
8 Data transmission status
indicator for the
management network
port
9 Connection status
indicator for the
management network
port
- -
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Indicator and Button Description
Table 2-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Description
Power
button/
indicator
Power indicator:
●O: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The power button is locked.
The power button is locked when the iBMC
is starting.
● Steady yellow: The device is ready to power
on.
Power button:
● When the device is powered on, you can
press this button to gracefully shut down
the OS.
● When the device is powered on, holding
down this button for 6 seconds will forcibly
power o the device.
● When the power indicator is steady green,
you can press this button to power on the
device.
Health status
indicator
●O: The device is powered o or is faulty.
● Blinking red at 1 Hz: A major alarm has
been generated on the system.
● Blinking red at 5 Hz: A critical alarm has
been generated on the system.
● Steady green: The device is operating
properly.
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Silkscreen Indicator/
Button
Description
UID button/
indicator
The UID button/indicator helps identify and
locate a device.
UID indicator:
●O: The device is not being located.
● Blinking blue: The device has been located
and is dierentiated from other devices that
have also been located.
● Steady blue: The device is being located.
UID button:
● You can turn on or o the UID indicator by
pressing the UID button on the panel or by
using the iBMC CLI or WebUI.
● You can press this button to turn on or o
the UID indicator.
● You can press and hold down this button for
4 to 6 seconds to reset the iBMC.
- Data
transmission
rate indicator
for a 10GE
optical port
●O: The network port is not connected.
● Steady green: The data transmission rate is
10 Gbit/s.
● Steady yellow: The data transmission rate is
1 Gbit/s.
- Connection
status
indicator/
Data
transmission
status
indicator for a
10GE optical
port
●O: The network port is not connected.
● Blinking green: Data is being transmitted.
● Steady green: The network port is properly
connected.
- Data
transmission
status
indicator for a
GE electrical
port
●O: The network port is not connected.
● Steady yellow: The network port is in active
status.
● Blinking yellow: Data is being transmitted.
- Connection
status
indicator for a
GE electrical
port
●O: The network port is not connected.
● Steady green: The network port is properly
connected.
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Silkscreen Indicator/
Button
Description
- Data
transmission
status
indicator for
the
management
network port
●O: No data is being transmitted.
● Blinking yellow: Data is being transmitted.
- Connection
status
indicator for
the
management
network port
●O: The network port is not connected.
● Steady green: The network port is properly
connected.
2.1.3 Ports
Port Positions
● Ports on the front panel
Figure 2-3 Ports on the front panel
1Universal connector port 2 LOM port 1 (10GE
optical port)
3 LOM port 2 (10GE
optical port)
4 LOM port 3 (GE
electrical port)
5 LOM port 4 (GE
electrical port)
6 Management network
port
● Ports on the multi-port cable
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Figure 2-4 Multi-port cable
1 VGA port 2 Two USB ports
3 Serial port 4 One USB port
5 Multi-port connector - -
Port Description
Table 2-2 Ports on the front panel
Port Type Quantity Description
Universal
connector
port
- 1 Used to connect a multi-port
cable, which provides one
DB-15 VGA port, three USB
2.0 ports, and one RJ45 serial
port.
Management
network port
RJ45 1 Used for server management.
NOTE
The management network port is
a GE port that supports 100
Mbit/s and 1000 Mbit/s auto-
negotiation.
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Table 2-3 LOM ports
Chip Model Port Type Rate
Negotiation
Mode
Supported
Rates
Rates Not
Supported
X722 10GE optical
port
Auto-
negotiation
10000 Mbit/s
(full duplex)
10000M 10/100/1000
M
GE electrical
port
Auto-
negotiation
1000 Mbit/s
(full duplex)
1000M 10/100M
● Use Intelligent Computing Compatibility Checker to obtain information
about the cables and optical modules supported by the LOM ports.
● The LOM ports do not support forced rates.
● The electrical LOM ports cannot be connected to power over Ethernet (PoE)
devices (such as a switch with PoE enabled). Connecting a LOM port to a PoE
device may cause link communication failure or even damage the NIC.
● The electrical LOM ports do not support SR-IOV.
● Forcibly powering o a server will cause intermittent NC-SI disconnection
and disable the Wake on LAN (WOL) function of the LOM ports. To restore
the NC-SI connection, refresh the iBMC WebUI.
2.1.4 Installation Positions
An X6000 can house a maximum of four XH321 V5 nodes in a 2U chassis.
Figure 2-5 Installation positions
2.2 Processor
● The server supports one or two processors.
● If only one processor is required:
– Install it in socket CPU1.
– NVMe SSDs are not supported.
● The processor heat sink varies depending on the processor power:
– If the maximum processor power is 165 W, use a narrow conjoined heat
sink.
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– If the processor power is higher than 165 W, use a wide conjoined heat
sink.
● The same model of processors must be used in a server.
● Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be used.
Figure 2-6 Processor positions
2.3 Memory
2.3.1 Memory Identier
You can determine the memory module properties based on the label attached to
the memory module.
Figure 2-7 Memory identier
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