IBASE Technology ET875 Series User manual

ET875 Series
COM Express Type 10 Module
With Intel®Atom™ x7/x5
/ Pentium®QC / Celeron®DC
User’s Manual
Version 1.0
(May 2019)

ii
ET875 Series User’s Manual
Copyright
©2019 IBASE Technology, Inc. All rights reserved.
No part of this publication may be reproduced, copied, stored in a retrieval
system, translated into any language or transmitted in any form or by any
means, electronic, mechanical, photocopying, or otherwise, without the prior
written consent of IBASE Technology, Inc. (hereinafter referred to as
“IBASE”).
Disclaimer
IBASE reserves the right to make changes and improvements to the
products described in this document without prior notice. Every effort has
been made to ensure the information in the document is correct; however,
IBASE does not guarantee this document is error-free.
IBASE assumes no liability for incidental or consequential damages arising
from misapplication or inability to use the product or the information
contained herein, nor for any infringements of rights of third parties, which
may result from its use.
Trademarks
All the trademarks, registrations and brands mentioned herein are used for
identification purposes only and may be trademarks and/or registered
trademarks of their respective owners.

ET875 Series User’s Manual
iii
Compliance
This product has passed CE tests for environmental specifications and
limits. This product is in accordance with the directives of the European
Union (EU). In a domestic environment, this product may cause radio
interference in which case users may be required to take adequate
measures.
This product has been tested and found to comply with the limits for a Class
B device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with manufacturer’s
instructions, may cause harmful interference to radio communications.
WEEE
This product must not be disposed of as normal household
waste, in accordance with the EU directive of for waste
electrical and electronic equipment (WEEE - 2012/19/EU).
Instead, it should be disposed of by returning it to a
municipal recycling collection point. Check local
regulations for disposal of electronic products.
Green IBASE
This product is compliant with the current RoHS
restrictions and prohibits use of the following substances
in concentrations exceeding 0.1% by weight (1000 ppm)
except for cadmium, limited to 0.01% by weight (100 ppm).
•Lead (Pb)
•Mercury (Hg)
•Cadmium (Cd)
•Hexavalent chromium (Cr6+)
•Polybrominated biphenyls (PBB)
•Polybrominated diphenyl ether (PBDE)

iv
ET875 Series User’s Manual
Important Safety Information
Carefully read the precautions before using the board.
Environmental conditions:
•Use this product in environments with ambient temperatures between
-20˚C and 60˚C.
•Do not leave this product in an environment where the storage
temperature may be below 40°C or above 85°C. To prevent from
damages, the product must be used in a controlled environment.
Care for your IBASE products:
•Before cleaning the PCB, unplug all cables and remove the battery.
•Clean the PCB with a circuit board cleaner, degreaser or use cotton
swabs and alcohol.
•Vacuum the dust with a computer vacuum cleaner to prevent the fan
from being clogged.
WARNING
Attention during use:
•Do not use this product near water.
•Do not spill water or any other liquids on this product.
•Do not place heavy objects on the top of this product.
Anti-static precautions
•Wear an anti-static wrist strap to avoid electrostatic discharge.
•Place the PCB on an anti-static kit or mat.
•Hold the edges of PCB when handling.
•Touch the edges of non-metallic components of the product instead of
the surface of the PCB.
•Ground yourself by touching a grounded conductor or a grounded bit of
metal frequently to discharge any static.
CAUTION
Danger of explosion if the internal lithium-ion battery is replaced by an
incorrect type. Replace only with the same or equivalent type recommended
by the manufacturer. Dispose of used batteries according to the
manufacturer’s instructions or recycle them at a local recycling facility or
battery collection point.

ET875 Series User’s Manual
v
Warranty Policy
•IBASE standard products:
24-month (2-year) warranty from the date of shipment. If the date of
shipment cannot be ascertained, the product serial numbers can be
used to determine the approximate shipping date.
•3rd-party parts:
12-month (1-year) warranty from delivery for the 3rd-party parts that are
not manufactured by IBASE, such as CPU, CPU cooler, memory,
storage devices, power adapter, panel and touchscreen.
＊PRODUCTS, HOWEVER, THAT FAIL DUE TO MISUSE, ACCIDENT,
IMPROPERINSTALLATION OR UNAUTHORIZED REPAIR SHALL BE
TREATED AS OUT OF WARRANTY AND CUSTOMERS SHALL BE
BILLED FOR REPAIR AND SHIPPING CHARGES.
Technical Support & Services
1. Visit the IBASE website at www.ibase.com.tw to find the latest
information about the product.
2. If you need any further assistance from your distributor or sales
representative, prepare the following information of your product and
elaborate upon the problem.
•Product model name
•Product serial number
•Detailed description of the problem
•The error messages in text or in screenshots if there is any
•The arrangement of the peripherals
•Software in use (such as OS and application software, including the
version numbers)
3. If repair service is required, you can download the RMA form at
http://www.ibase.com.tw/english/Supports/RMAService/. Fill out the
form and contact your distributor or sales representative.

vi
ET875 Series User’s Manual
Table of Contents
Compliance.....................................................................................iii
Important Safety Information........................................................iv
Warranty Policy ...............................................................................v
Technical Support & Services .......................................................v
Chapter 1 General Information.............................................1
1.1 Introduction .........................................................................................2
1.2 Features..............................................................................................2
1.3 Packing List.........................................................................................3
1.4 Optional Accessories...........................................................................3
1.5 Specifications......................................................................................3
1.6 Block Diagram.....................................................................................5
1.7 Overview.............................................................................................6
1.8 Dimensions .........................................................................................6
Chapter 2 HardwareConfiguration..........................................7
2.1 Connector Location .............................................................................8
2.1.1 COMe Module Type 10 Connector (RECS1).........................8
Chapter 3 Drivers Installation.............................................11
3.1 Introduction .......................................................................................12
3.2 Intel®Chipset Software Installation Utility..........................................12
3.3 Graphics Driver Installation ...............................................................14
3.4 HD Audio Driver Installation...............................................................15
3.5 Intel®Trusted Execution Engine Drivers............................................16
3.6 Intel®Serial IO Drivers ......................................................................17
3.7 LAN Driver Installation.......................................................................18
Chapter 4 BIOS Setup..........................................................21
4.1 Introduction .......................................................................................22
4.2 BIOS Setup.......................................................................................22
4.3 Main Settings ....................................................................................23
4.4 Advanced Settings ............................................................................24
4.4.1 Trusted Computing...............................................................25

ET875 Series User’s Manual
vii
4.4.2 ACPI Settings.......................................................................26
4.4.3 DP to LVDS Configuration....................................................26
4.4.4 F81964 Super IO Configuration............................................27
4.4.5 F81804SEC Super IO Configuration.....................................28
4.4.6 F81804 Hardware Monitor ....................................................29
4.4.7 CPU Configuration................................................................30
4.4.8 Network Stack Configuration ................................................31
4.4.9 CSM Configuration ...............................................................32
4.4.10 USB Configuration................................................................33
4.5 Chipset Settings ................................................................................34
4.5.1 PCI Express Configuration....................................................35
4.5.2 SATA Drives.........................................................................36
4.5.3 SCC Configuration................................................................36
4.5.4 USB Configuration................................................................37
4.6 Security Settings................................................................................38
4.7 Boot Settings.....................................................................................39
4.8 Save & Exit Settings ..........................................................................40
Appendix ........................................................................................41
A. I/O Port Address Map ........................................................................42
B. Interrupt Request Lines (IRQ)............................................................45
C. Watchdog Timer Configuration ..........................................................47

viii
ET875 Series User’s Manual
This page is intentionally left blank.

1
Chapter 1
General Information
The information provided in this chapter includes:
•Features
•Packing List
•Optional Accessories
•Specifications
•Block Diagram
•Board Overview
•Board Dimensions

2
ET875 Series User’s Manual
1.1 Introduction
ET875 is a COM Express Type 10 module with Intel®Atom™x7/x5 /
Pentium®QC / Celeron®DC processor. It comes with type 10 pinouts and
complies with the PICMG COM.0 Rev.3.0 specifications for ultra-low power
consumption. This product features LPDDR4 memory slots, provides DDI
display and LVDS or eDP interface connection, and high-speed I/O such as
USB 3.0, SATA III and PCIe.
Photo of ET875
1.2 Features
•COM Express module type 10 with onboard Intel®Atom™x7 or x5 /
Pentium®QC / Celeron®DC
•Onboard LPDDR4 Max. 8 GB, non-ECC
•Intel®I210IT PCIe Gigabit LAN
•LVDS or eDP, 2 x USB 3.0, 8 x USB 2.0 via the carrier board (IP417)
•4 x PCIe (x1) lanes
•Compliant with TPM 2.0 and eMMC 5.0 (Optional)
•Configurable watchdog timer
•Wide-range operating temperature

General Information
ET875 Series User’s Manual
3
1
1.3 Packing List
Your product package should include the items listed below. If any of the
items below is missing, contact the distributor or dealer from whom you
purchased the product.
•ET875 COM Express Module
•DVD Disk (including drivers and flash memory utility)
•This User’s Manual
1.4 Optional Accessories
IBASE provides optional accessories as follows. Please contact us or your
dealer if you need any.
•Heat Spreader (H051HSET87001000AP)
1.5 Specifications
Product Name
ET875
Operating
System
•Windows 10 (64-bit)
•Linux (Ubuntu)
CPU
•Intel®Atom™QC x7 E3950 at 2 GHz, 2MB cache
•Intel®Atom™QC x5 E3940 at 1.8 GHz, 2MB cache
•Intel®Atom™DC x5 E3930 at 1.8 GHz, 2MB cache
•Intel®Pentium®QC N4200 at 2.5 GHz, 2 MB cache
•Intel®Celeron®DC N3350 at 2.4 GHz, 2 MB cache
Chipset
Integrated
Memory
Onboard LPDDR4 1866 MHz, dual channel, expandable up to
8 GB, non-ECC
Graphics
Intel®SoC integrated Gen9-LP graphics
Display
•1 x DDI
•1 x eDP (4096 x 2160 at 60 Hz) or 1 x LVDS (1920 x
1200 at
60 Hz)

4
ET875 Series User’s Manual
Audio
Intel®Atom™SoC built-in HD Audio
Network
Intel®I210IT PCIe GbE LAN
Super I/O
Fintek F81804U-I
Max. Power
Requirement
+12V, +5VSB
TPM
2.0
eMMC
5.0, up to 32 GB (Optional)
I2C
Supported
Watchdog
Timer
Yes (256 segments, 0, 1, 2…255 sec / min)
BIOS
AMI BIOS
H/W Monitor
Yes
Dimensions
84 x 55 mm (3.35” x 2.17”)
RoHS
Yes
Certification
CE, FCC Class B, LVD
I/O Ports (via carrier board)
Display
1 x DDI for LVDS or eDP (Optional)
LAN
1 x GbE LAN
USB
•2 x USB 3.0
•8 x USB 2.0
Serial
2 x UART (TX and RX only)
SATA
2 x SATA III via carrier board
Expansion
Slots
4 x PCIe (x1) lanes
Environment
Temperature
•Operating:
With Intel®Pentium®N4200/N3350: -20 ~ 60°C (-4 ~ 140°F)
With Intel®Atom™x7/x5: -40 ~ 85°C (-40 ~ 185°F)
•Storage: -40 ~ 90 °C (-40 ~ 194°F)
Relative
Humidity
90 %, non-condensing at 60°C
All specifications are subject to change without prior notice.

General Information
ET875 Series User’s Manual
5
1
1.6 Block Diagram

6
ET875 Series User’s Manual
1.7 Overview
Top View
Bottom View
Photos of ET875
＊The photos above are for reference only. Some minor components may
differ.
1.8 Dimensions
Unit: mm

7
Chapter 2
Hardware Configuration
This section provides information on jumper settings and
connectors on the ET870 in order to set up a workable system.
On top of that, you will also need to install crucial pieces such as
the CPU and the memory before using the product. The topics
covered are:
•Connector location
•Information of connector

8
ET875 Series User’s Manual
2.1 Connector Location
Board diagram of ET875
2.1.1 COMe Module Type 10 Connector (RECS1)
A1
B1
A110
B110
Row A
Row B
Row A
Row B
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A1
GND (FIXED)
B1
GND (FIXED)
A56
RSVD
B56
RSVD
A2
GBE0_MDI3-
B2
GBE0_ACT#
A57
GND
B57
GPO2
A3
GBE0_MDI3+
B3
LPC_FRAME#
A58
PCIE_TX3+
B58
PCIE_RX3+
A4
GBE0_LINK100#
B4
LPC_AD0
A59
PCIE_TX3-
B59
PCIE_RX3-
A5
GBE0_LINK1000#
B5
LPC_AD1
A60
GND (FIXED)
B60
GND (FIXED)
A6
GBE0_MDI2-
B6
LPC_AD2
A61
PCIE_TX2+
B61
PCIE_RX2+
A7
GBE0_MDI2+
B7
LPC_AD3
A62
PCIE_TX2-
B62
PCIE_RX2-
A8
GBE0_LINK#
B8
LPC_DRQ0#
A63
GPI1
B63
GPO3
A9
GBE0_MDI1-
B9
LPC_DRQ1#
A64
PCIE_TX1+
B64
PCIE_RX1+
A10
GBE0_MDI1+
B10
LPC_CLK
A65
PCIE_TX1-
B65
PCIE_RX1-
A11
GND (FIXED)
B11
GND (FIXED)
A66
GND
B66
WAKE0#
A12
GBE0_MDI0-
B12
PWRBTN#
A67
GPI2
B67
WAKE1#
A13
GBE0_MDI0+
B13
SMB_CK
A68
PCIE_TX0+
B68
PCIE_RX0+
A14
GBE0_CTREF
B14
SMB_DAT
A69
PCIE_TX0-
B69
PCIE_RX0-
A15
SUS_S3#
B15
SMB_ALERT#
A70
GND (FIXED)
B70
GND (FIXED)
A16
SATA0_TX+
B16
SATA1_TX+
A71
LVDS_A0+
B71
DD 0_PAIR0+
A17
SATA0_TX-
B17
SATA1_TX-
A72
LVDS_A0-
B72
DD 0_PAIR0-

Hardware Configuration
ET875 Series User’s Manual
9
2
Row A
Row B
Row A
Row B
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A18
SUS_S4#
B18
SUS_STAT#
A73
LVDS_A1+
B73
DD 0_PAIR1+
A19
SATA0_RX+
B19
SATA1_RX+
A74
LVDS_A1-
B74
DD 0_PAIR1-
A20
SATA0_RX-
B20
SATA1_RX-
A75
LVDS_A2+
B75
DD 0_PAIR2+
A21
GND (FIXED)
B21
GND (FIXED)
A76
LVDS_A2-
B76
DD 0_PAIR2-
A22
USB_SSRX0-
B22
USB_SSTX0-
A77
LVDS_VDD_EN
B77
DD 0_PAIR4+
A23
USB_SSRX0+
B23
USB_SSTX0+
A78
LVDS_A3+
B78
DD 0_PAIR4-
A24
SUS_S5#
B24
PWR_OK
A79
LVDS_A3-
B79
LVDS_BKLT_EN
A25
USB_SSRX1
B25
USB_SSTX1
A80
GND (FIXED)
B80
GND (FIXED)
A26
USB_SSRX1
B26
USB_SSTX1
A81
LVDS_A_CK+
B81
DD 0_PAIR3+
A27
BATLOW#
B27
WDT
A82
LVDS_A_CK-
B82
DD 0_PAIR3-
A28
(S)ATA_ACT#
B28
HDA_SDIN2
A83
LVDS_I2C_CK
B83
LVDS_BKLT_CTR
L
A29
HDA_SYNC
B29
HDA_SDIN1
A84
LVDS_I2C_DAT
B84
VCC_5V_SBY
A30
HDA_RST#
B30
HDA_SDIN0
A85
GPI3
B85
VCC_5V_SBY
A31
GND (FIXED)
B31
GND (FIXED)
A86
RSVD
B86
VCC_5V_SBY
A32
HDA_BITCLK
B32
SPKR
A87
eDP_HPD
B87
VCC_5V_SBY
A33
HDA_SDOUT
B33
I2C_CK
A88
PCIE_CLK_REF+
B88
BIOS_DIS1#
A34
BIOS_DIS0#
B34
I2C_DAT
A89
PCIE_CLK_REF-
B89
0DI0_HPD
A35
THRMTRIP#
B35
THRM#
A90
GND (FIXED)
B90
GND (FIXED)
A36
USB6-
B36
USB7-
A91
SPI_POWER
B91
DD 0_PAIR5+
A37
USB6+
B37
USB7+
A92
SPI_MISO
B92
DD 0_PAIR5-
A38
USB_6_7_OC#
B38
USB_4_5_OC#
A93
GPO0
B93
DD 0_PAIR6+
A39
USB4-
B39
USB5-
A94
SPI_CLK
B94
DD 0_PAIR6-
A40
USB4+
B40
USB5+
A95
SPI_MOSI
B95
DD 0_DDC_AUX_
SEL
A41
GND (FIXED)
B41
GND (FIXED)
A96
TPM_PP
B96
USB7_HOST_PRS
NT
A42
USB2-
B42
USB3-
A97
TYPE10#
B97
SPI_CS#
A43
USB2+
B43
USB3+
A98
SER0_TX
B98
DD 0_CTRLCLK_
AUX+
A44
USB_2_3_OC#
B44
USB_0_1_OC#
A99
SER0_RX
B99
DD 0_CTRLDATA_
AUX-
A45
USB0-
B45
USB1-
A100
GND (FIXED)
B100
GND (FIXED)
A46
USB0+
B46
USB1+
A101
SER1_TX
B101
FAN_PWMOUT
A47
VCC_RTC
B47
ESPI_EN#
A102
SER1_RX
B102
FAN_TACHIN
A48
RSVD
B48
USB0_HOST_PR
SNT
A103
LID#
B103
SLEEP#
A49
GBE0_SDP
B49
SYS_RESET#
A104
VCC_12V
B104
VCC_12V
A50
LPC_SERIRQ
B50
CB_RESET#
A105
VCC_12V
B105
VCC_12V
A51
GND (FIXED)
B51
GND (FIXED)
A106
VCC_12V
B106
VCC_12V
A52
RSVD
B52
RSVD
A107
VCC_12V
B107
VCC_12V
A53
RSVD
B53
RSVD
A108
VCC_12V
B108
VCC_12V
A54
GPI0
B54
GPO1
A109
VCC_12V
B109
VCC_12V
A55
RSVD
B55
RSVD
A110
GND (FIXED)
B110
GND (FIXED)

10
ET875 Series User’s Manual
This page is intentionally left blank.

11
Chapter 3
Drivers Installation
This chapter introduces installation of the following drivers:
•Intel®Chipset Software Installation Utility
•Graphics Driver
•HD Audio Driver
•Intel®Trusted Execution Engine Drivers
•Intel®Serial I/O Drivers
•LAN Driver

12
ET875 Series User’s Manual
3.1 Introduction
This section describes the installation procedures for software and drivers.
The software and drivers are included with the motherboard. If you find
anything missing, please contact the distributor where you made the
purchase. The contents of this section include the following:
Note: After installing your Windows operating system, you must install the
Intel®Chipset Software Installation Utility first before proceeding with
the drivers installation.
3.2 Intel®Chipset Software Installation Utility
The Intel®Chipset drivers should be installed first before the software drivers
to install INF files for Plug & Play function for Intel chipset components.
Follow the instructions below to complete the installation.
1. Insert the disk enclosed in the package with the board. Click Intel on the
left pane and then Intel(R) Apollolake Chipset Drivers on the right pane.
2. Click Intel(R) Chipset Software Installation Utility.