Infineon TLE4966 MS2GO User manual

TLE4966 MS2GO
Quick Start
V1.0.0

Document Contents
Description
Content
Use-Cases
Hardware description & design
Software Installation Process
Software features
1
2
3
4
5
6
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Agenda
Description
Content
Use-Cases
Hardware description & design
Software Installation Process
Software features
1
2
3
4
5
6
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Description
›The TLI4966 MS2GO Evaluationkit is a budgetary priced kit that
is enabling the evaluation of the TLE4966G lateral Hall latch and
TLE4966V-1G vertical Hall latch.
›The TLE4966 MS2GO Evaluation kit is offered in one version
combining both sensors above mentioned.
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General Sensor Description
›The TLE4966G and the TLE4966V-1G are integrated circuit
double Hall-effect sensor designed specifically for highly accurate
applications. Precise magnetic switching points and high
temperature stability are achieved by active compensation
circuits and chopper techniques on chip. They provide a speed
signal at Q2 for every magnetic pole pair and a direction
information at Q1, which is provided before the speed signal.
TLE4966V-1G TLE4966G
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Agenda
Description
Content
Use-Cases
Hardware description & design
Software Installation Process
Software features
1
2
3
4
5
6
6
2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Content –TLE4966 MS2GO
›TLE4966 MS2GO content:
–Evaluation board equipped with XMC1100 as target microcontroller, XMC4200 as debugger
microcontroller, TLE4966G, TLE4966V-1G, TLI493D-W2BW as magnetic probe, auxiliary circuitry.
–Ferrite block magnet FE-Q-07-07-05 for easy magnetic basic evaluation.
–Paper container box
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Content –Optional Mechanics
›TLE4966 MS2GO was designed to be compatible mechanical-
wise with Infineon Out-Of-Shaft 3D sensor control. The Out-Of-
Shaft 3D sensor control is not included in the evaluation kit
content, therefore has to be ordered separately.
›The Out-Of-Shaft 3D sensor control ordering code: SP003475178
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Agenda
Description
Content
Use-Cases
Hardware description & design
Software Installation Process
Software features
1
2
3
4
5
6
9
2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Use case 1: TLE4966 MS2GO–vertical placement
–This use-case highlights the vertical Hall technology used in
TLE4966V-1G sensor.
–The magnet placement for this application is highlighted using
as example the Out-Of-Shaft 3D Sensor control.
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Use case 2: TLE4966 MS2GO–lateral placement
–This use-case highlights the lateral Hall technology used in
TLE4966G sensor.
–The magnet placement for this application is highlighted using
as example the Out-Of-Shaft 3D Sensor control.
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Use case 3: standalone sensor evaluation
–In this use case, the user may disconnect the sensor PCB (by
cutting the PCB across the milled line) and electrically connect it
remotely to the remaining PCB or to his own electrical setup.
–In this use-case, the user loses connectivity to the 3D Sensor
magnetic probe.
–The side pin-header slots are directly connected to sensor
outputs
Cut across this line
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2020-10-08 Copyright © Infineon Technologies AG 2020. All rights reserved.

Agenda
Description
Content
Use-Cases
Hardware description & design
Software Installation Process
Software features
1
2
3
4
5
6
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Pinout Description
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Hardware Description
›The TLE4966 MS2GO Evaluation Kit can be connected
directly to a PC via the micro-USB port (1).
›The TLE4966 MS2GO evaluation kit board consists of:
–One XMC4200 microcontroller running a SEGGER
Jlink license for debugging (2)
–One XMC1100 microcontroller used as target MCU
(3)
–2x dual NMOS transistors (4) used for switching
on/off LEDs. The transistors are used to buffer the
outputs of the sensors and are not controlled by
MCU.
–Two BSL308PE dual package PMOS transistors (5)
used for powering up the TLE4966G (10) and
TLE4966V-1G (12) sensors
–One PMOS BSS84P (6) used to power up the 3D
sensor magnetic probe TLI493D W2BW (11)
–4 x LEDs for checking visually the sensor output
states (7)
–Mounting hole for lateral placement use-case (8)
–Mounting hole for vertical placement use-case (9)
GND
S2_VDD
S2_Q2
S2_Q1
GND
S2_VDD
S2_Q2
S2_Q1
GND
S1_VDD
S1_Q2
S1_Q1
GND
S1_VDD
S1_Q2
S1_Q1
2
1
3
4 4
5
6
7 7
8
9
10
11
12
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Hardware design–schematic overview (1/2)
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Hardware design –schematic overview (2/2)
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Detailled schematic: Power supply
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Detailled schematic: On-board Debugger
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Detailled schematic: XMC1100 pins
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