Intel Columbus II User manual

Columbus II Chassis
Subassembly Product Guide
Order Number: 695450-001

If an FCC declaration of conformity marking is present on the board, the following statement applies:
FCC Declaration of Conformity
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Canadian Department of Communications Compliance Statement:
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set
out in the Radio Interference Regulations of the Canadian Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux
appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par
le ministére des Communications du Canada.
Disclaimer
Intel Corporation (Intel) makes no warranty of any kind with regard to this material, including, but not limited
to, the implied warranties of merchantability and fitness for a particular purpose. Intel assumes no
responsibility for any errors that may appear in this document. Intel makes no commitment to update nor to
keep current the information contained in this document. No part of this document may be copied or
reproduced in any form or by any means without prior written consent of Intel.
An Intel product, when used in accordance with its associated documentation, is "Year 2000 Capable" when,
upon installation, it accurately stores, displays, processes, provides, and/or receives date data from, into, and
between the twentieth and twenty-first centuries, including leap year calculations, provided that all other
technology used in combination with said product properly exchanges date data with it.
†Third-party brands and trademarks are the property of their respective owners.
Copyright 1998 Intel Corporation. All rights reserved.

iii
Contents
1 System Description
Chassis Feature Summary................................................................................................... 7
Chassis Front Controls and Indicators......................................................................... 8
Chassis Back I/O Ports and Features.......................................................................... 9
Chassis Side View......................................................................................................10
Peripherals..........................................................................................................................11
Internal Bay for 3.5-inch Drives...................................................................................11
External Bays for 5.25-inch Removable Media Devices..............................................11
Power Supply......................................................................................................................12
300 Watt Power Supply..............................................................................................12
275 Watt Power Supply..............................................................................................12
System Cooling...................................................................................................................12
System Security..................................................................................................................13
Security with Mechanical Locks and Monitoring..........................................................13
2 Working Inside the System
Tools and Supplies Needed ................................................................................................15
Safety: Before You Remove the Side Cover.......................................................................15
Warnings and Cautions.......................................................................................................15
Side Cover ..........................................................................................................................16
Removing the Side Cover...........................................................................................16
Installing the Side Cover.............................................................................................17
Front Cover.........................................................................................................................18
Removing the Front Cover..........................................................................................18
Installing the Front Cover............................................................................................18
Add-in Boards .....................................................................................................................19
Installing an Add-in Board...........................................................................................19
Removing an Add-in Board.........................................................................................20
Diskette Drive......................................................................................................................21
Removing the Diskette Drive ......................................................................................21
Installing the Diskette Drive ........................................................................................22
Hard Drives.........................................................................................................................22
Drive Cabling Considerations .....................................................................................22
IDE Requirements........................................................................................23
SCSI Requirements......................................................................................23
Installing a 5.25-inch Peripheral Device......................................................................23
Removing a 5.25-inch Peripheral Device....................................................................26
Installing a Hard Drive in the Internal Bay...................................................................27
Removing a Hard Drive from the Internal Bay.............................................................28
Fans 29
Removing a Fan.........................................................................................................29
Installing a Fan...........................................................................................................30

iv
Front Panel Board...............................................................................................................31
Removing the Front Panel Board................................................................................31
Installing the Front Panel Board..................................................................................32
Server Board.......................................................................................................................33
Removing the Server Board........................................................................................33
Installing the Server Board .........................................................................................34
3 Technical Reference
300 Watt Power Supply Specifications................................................................................35
Input Voltages.............................................................................................................35
Output Voltages..........................................................................................................35
275 Watt Power Supply Specifications................................................................................36
Input Voltages.............................................................................................................36
Output Voltages..........................................................................................................36
Environmental Specifications ..............................................................................................37
4 Regulatory Information
Regulatory Compliance.......................................................................................................39
Safety Standards........................................................................................................39
UL 1950 - CSA 950-95, 3rd Edition, July 28, 1995.........................................39
EN 60 950, 2nd Edition, 1992 (with Amendments 1, 2, and 3).......................39
IEC 950, 2nd edition, 1991 (with Amendments 1, 2, 3 and 4).........................39
EMKO-TSE (74-SEC) 207/94.......................................................................39
EMC Regulations FCC Class B ..................................................................................40
CISPR 22, 2nd Edition, 1993, Amendment 1, 1995........................................40
EN 55 022, 1995..........................................................................................40
EN 50 082-1, 1992.......................................................................................40
VCCI Class B (ITE) ......................................................................................40
ICES-003, Issue 2........................................................................................40
Australian Communication Authority (ACA)..................................................40
New Zealand Ministry of Commerce.............................................................40
Regulatory Compliance Markings...............................................................................41
Electromagnetic Compatibility Notice (USA)........................................................................41
FCC Declaration of Conformity...................................................................................42
Electromagnetic Compatibility Notices (International)..........................................................42
Installation Safety Instructions....................................................................................43
Use Only for Intended Applications.............................................................................44
A Equipment Log and Worksheets
Equipment Log....................................................................................................................45
Current Usage.....................................................................................................................47
Calculating Power Usage............................................................................................47
Worksheet, Calculating DC Power Usage....................................................47
Worksheet, Total Combined Power Used by the System.............................48
Warnings.............................................................................................................................49

v
Figures
1. Front Controls and Indicators ...................................................................................... 8
2. Back I/O Ports and Features ....................................................................................... 9
3. Chassis Side View......................................................................................................10
4. System Security .........................................................................................................13
5. Removing the Side Cover...........................................................................................17
6. Removing the Front Cover..........................................................................................18
7. Installing an Add-in Board...........................................................................................20
8. Removing the Diskette Drive from the Chassis...........................................................21
9. Removing the Diskette Drive from the Carrier ............................................................22
10. IDE Cable Dimensions................................................................................................23
11. Remove Filler Panels and EMI Shields.......................................................................24
12. Snap-in plastic slide rails............................................................................................25
13. Installing a Removable Media Device.........................................................................26
14. Removing the Internal 3.5-inch Drive Bay...................................................................27
15. Installing and Cabling a 3.5-inch SCSI Device in the Internal Bay..............................28
16. Removing the Fan Housing Assembly........................................................................29
17. Installing Fan..............................................................................................................30
18. Removing The Front Panel Board ..............................................................................32
19. Removing the Server Board .......................................................................................34
Tables
1. Chassis Feature Summary.......................................................................................... 7
2. Power Supply Output Voltages...................................................................................35
3. Power Supply Output Voltages...................................................................................36
4. Environmental Specifications......................................................................................37
5. Power Usage Worksheet 1.........................................................................................47
6. Power Usage Worksheet 2.........................................................................................48

vi

7
1 System Description
Chassis Feature Summary
The Columbus II's galvanized metal chassis minimizes EMI and radio frequency interference
(RFI). The removable side cover is attached to the chassis with three screws and provides easy
access to the server board and power supply. You can secure this cover to the chassis with a
padlock (not provided, see page 13 for padlock size). The removable front panel provides access
to the 3.5- and 5.25-inch peripheral bays in the front of the chassis.
Table 1. Chassis Feature Summary
Feature Description
Drives One 3.5-inch diskette drive bay, accessible from front.
Three 5.25-inch-wide bays that are externally accessible, designed to hold
half-height standard removable media devices; the bays can be converted
into a single full-height bay.
Internal bay for 3.5-inch hard disk drives: space for up to six 1-inch-high
drives or up to three 1.6-inch-high drives.
Expansion slot covers Up to eight expansion slot can be used; every slot opening that does not have
an add-in board installed must have a slot cover installed.
Server board Server AT†form-factor, 12 ×13 inches, ATX I/O.
Power supply 275-watt or 300-watt power supply, integrated cooling fan.
Detachable AC power cord.
Cooling Two system fans inside the chassis and one power supply fan provide cooling
and airflow.

8 System Description
Chassis Front Controls and Indicators
OM05066
C
B
A
D
E
G
F
Figure 1. Front Controls and Indicators
A. Diskette ejector button*
B. Diskette drive activity LED*
C. CD-ROM drive*
D. System power on LED
E. Power button
F. Reset button
G. Hard drive LED
* Items shown may not be included in the chassis.

9
Chassis Back I/O Ports and Features
OM06421
H I
J
K
L
F
D
G
C
B
A
E
Figure 2. Back I/O Ports and Features
A. Network LEDs*
B. Network connector port*
C. VGA†monitor connector*
D. Serial port A, COM1*
E. Mouse and keyboard connectors*
F. Serial port B, COM2 (extended via ribbon cable from back panel to server board)*
G. Parallel port*
H. Power supply fan
I. AC input power connector
J. Side cover grip handle
K. Loop for padlock (padlock not supplied, see page 13 for padlock size)
L. Eight slot covers
* Typical baseboard I/O connectors shown

10 System Description
Chassis Side View
OM08224
A
B
C
D
E
F
Figure 3. Chassis Side View
A. 5.25-inch external bays
B. 3.5-inch diskette drive
C. Plastic front bezel
D. Plastic fan housing and card guide assembly
E. 3.5-inch internal peripheral bay
F. Power supply (behind the 3.5-inch peripheral bay)

11
Peripherals
Internal Bay for 3.5-inch Drives
An internal bay is provided for drives that are 3.5 inches wide and either 1 inch or 1.6 inches high.
The possible combinations (height and quantity) are as follows:
• Up to a total of six drives, each 1 inch high
• Up to a total of three drives, each 1.6 inches high
• Up to a total of four drives, two that are 1.6 inches high plus two that are 1 inch high
The side cover provides easy access to drives in the internal bay. The bay swings out and can be
removed.
Drives can consume up to 11 watts of power. Drives must be specified to run at a maximum
ambient temperature of 50 °C.
The system was designed to allow the user to install a Redundant Array of Independent Disks
(RAID). A software implementation with onboard SCSI or an add-in board can be used to set up
RAID applications.
External Bays for 5.25-inch Removable Media Devices
The chassis has three 5.25-inch half-height bays that are accessible from the front of the system.
These bays are intended to provide space for tape backup or other removable devices. As shipped,
a CD-ROM drive may be installed in the lowest of the three bays.
You can convert the 5.25-inch bays to a single full-height bay. We recommend that you do not use
these bays for hard disk drives, because they generate EMI, ESD susceptibility increases, and the
drive will not be adequately cooled.

12 System Description
Power Supply
Your chassis includes either a 300 watt or a 275 watt power supply
300 Watt Power Supply
The 300 watt universal-type power supply is designed to minimize EMI and RFI. The supply
operates within the following voltage ranges and is rated as follows:
• 100-120 V∼at 50/60 Hertz (Hz); 4.6 A maximum
• 200-240 V∼at 50/60 Hz; 2.3 A maximum
The DC output voltages of the power supply are +5 V, +12 V, +3.3 V, -5 V, -12 V, and
+5 V standby. Power to the server board is provided through the power cable to the 24-pin main
power connector. The Auxiliary power connector provides the interface to the IMB bus and
sensing signals for the Baseboard Management Controller on the server board. Through this
interface, LANDesk®Server Manager can monitor the power supply.
275 Watt Power Supply
The 275 watt universal-type power supply is designed to minimize EMI and RFI. The supply
operates within the following voltage ranges and is rated as follows:
• 100-120 V∼at 50/60 Hertz (Hz); 6.3 A maximum
• 200-240 V∼at 50/60 Hz; 3.15 A maximum
The DC output voltages of the power supply are +5 V, +12 V, +3.3 V, -5 V, -12 V, and
+5 V standby. Power to the server board is provided through the power cable to the 24-pin main
power connector. The Auxiliary power connector provides the interface to the IMB bus and
sensing signals for the Baseboard Management Controller on the server board.
System Cooling
The chassis includes three fans for cooling and airflow. One of these is the integrated fan in the
power supply.
✏NOTE
The side cover must be on the system for proper cooling.

13
System Security
To help prevent unauthorized entry or use of the system, the chassis includes a physical padlock
loop and a chassis intrusion switch that can be monitored by Server Management software.
Security with Mechanical Locks and Monitoring
Secure the side cover to the chassis by inserting a padlock (not provided) through the metal loop
protruding through the slot in the back edge of the side cover.
• A padlock loop on the rear of the system side cover can be used to prevent access to the
microprocessors, memory, and add-in cards. A variety of lock sizes can be accommodated by
the .300 diameter loop.
Activate the side cover intrusion alarm switch. When the side door is opened, the switch transmits
an alarm signal to the server board, where server management software processes the signal. The
system can be programmed to respond to an intrusion by powering down or by locking the
keyboard, for example.
OM06420
A
Figure 4. System Security
A. Padlock loop

14

15
2 Working Inside the System
Tools and Supplies Needed
• Phillips (cross-head) screwdriver (#2 bit)
• Antistatic wrist strap (recommended)
Safety: Before You Remove the Side Cover
Before removing the system side cover to work inside the system, observe these safety guidelines.
1. Turn off all peripheral devices connected to the system.
2. Turn off the system by using the push-button on/off power switch on the front of the system.
Then unplug the AC power cord from the system or wall outlet.
3. Label and disconnect all peripheral cables and all telecommunication lines connected to I/O
connectors or ports on the back of the system.
4. Provide some electrostatic discharge (ESD) protection by wearing an antistatic wrist strap
attached to chassis ground of the system—any unpainted metal surface—when handling
components.
Warnings and Cautions
These warnings and cautions apply whenever you remove the side cover of the system to access
components inside the system. Only a technically qualified person should integrate and configure
the system.
WARNINGS
System power on/off: The on/off button (a convex button) on the front
panel DOES NOT turn off the system AC power. To remove power
from system, you must unplug the AC power cord from the wall outlet
or the system.
Hazardous conditions, power supply: Hazardous voltage, current, and
energy levels are present inside the power supply. There are no user
serviceable parts inside it; servicing should be done by technically
qualified personnel.
Hazardous conditions, devices and cables: Hazardous electrical
conditions may be present on power, telephone, and communication
cables. Turn off the system and disconnect the power cords,
telecommunications systems, networks, and modems attached to the
system before opening it. Otherwise, personal injury or equipment
damage can result.

16 Working Inside the System
CAUTIONS
Electrostatic discharge (ESD) and ESD protection: ESD can
damage disk drives, boards, and other parts. We recommend that you do all
procedures in this chapter only at an ESD workstation. If one is not
available, provide some ESD protection by wearing an antistatic wrist strap
attached to chassis groundany unpainted metal surfaceon your system
when handling parts.
ESD and handling boards: Always handle boards carefully. They can
be extremely sensitive to ESD. Hold boards only by their edges. After
removing a board from its protective wrapper or from the system, place it
component-side up on a grounded, static-free surface. If you place the
server board on a conductive surface, the battery leads may short out. If
they do, this will result in a loss of CMOS data and will drain the battery.
Use a conductive foam pad if available but not the board wrapper. Do not
slide board over any surface.
Cooling and airflow: For proper cooling and airflow, always install the
chassis side cover before turning on the system. Operating it without the
cover in place can damage system parts.
Side Cover
Removing the Side Cover
You need to remove the system side cover and in some cases the front cover to gain access to
components inside the system.
1. Observe the safety and ESD precautions at the beginning of this chapter.
2. Turn off all peripheral devices connected to the system.
3. Turn off the system by using the power on/off switch on the front panel, AND unplug the AC
power cord.
4. Label and disconnect all peripheral cables attached to the I/O panel on the back of the system.
5. If there is a padlock installed on the back of the system, unlock and remove it.
6. Remove and save the three screws from the side cover; you will need them later to reattach the
cover.
7. Place the fingertips of your left hand under the built-in handle on the back of the cover.
8. Using an even pull, slide the cover backward, about an inch, until it stops.
9. Using your left hand, pull the back end of the cover toward you to disengage its bottom row of
tabs from the notches in the chassis.
10. Using both hands, lift the cover upward to disengage the top row of tabs from the notches in
the top edge of the chassis. Set the cover aside.

17
OM06410
A
C
B
Figure 5. Removing the Side Cover
A. Built-in handle
B. Metal loop (for padlock)
C. Retaining screws (3)
Installing the Side Cover
CAUTION
Do not damage EMI strips: When you install the side cover, do not damage
the EMI gaskets mounted on the cover. Replace any damaged strips, or your
system may not meet EMI requirements.
1. Before replacing a side cover, check that you have not left loose tools or parts inside the
system.
2. Check that cables, add-in boards, and other components are properly installed.
3. Position the cover over the chassis so that the top row of tabs aligns with slots in the top of the
chassis. Slide the cover toward the front of the system until the cover tabs firmly engage in the
chassis.
4. Attach the cover to the chassis with the three screws you removed earlier, and tighten them
firmly.
5. To prevent unauthorized access inside the system, insert and lock a padlock through the metal
loop protruding through the slot in the back of the side cover.
6. Connect all external cables and the power cord to the system.

18 Working Inside the System
Front Cover
Removing the Front Cover
1. Remove side cover.
2. Remove and save the screw from the front cover; you will need it later to reattach the cover.
3. Squeeze the two plastic tabs inside the front cover, and push them through the chassis slots.
4. Pull the left side of the cover out slightly, about 15°, until the cover clears the power and reset
buttons. Slide the cover to the right until the tabs disengage from the chassis slots. Set the
cover aside.
OM06411
A
B
Figure 6. Removing the Front Cover
A. Retaining screw
B. Plastic tab (2)
Installing the Front Cover
1. Before replacing the front cover, make sure you did not leave any tools or loose parts inside
the chassis.
2. Insert the plastic tabs on the front cover into the slots on the right of the chassis. Squeeze the
front panel and chassis together along the left side until the plastic tabs snap into their slots.
3. Reinstall and tighten the screw.

19
Add-in Boards
Installing an Add-in Board
CAUTIONS
Do not overload server board: Do not overload the server board by
installing add-in boards that draw excessive current.
ESD and handling boards: Add-in boards can be extremely sensitive to
ESD and always require careful handling. After removing the board from its
protective wrapper or from the server board, place it component-side up on a
grounded, static-free surface or conductive foam pad—if available. Do not
slide the board over any surface.
1. Remove side cover.
2. Remove and save the expansion slot screw and cover.
3. Remove add-in board from its protective wrapper. Be careful not to touch the components or
gold edge connectors. Place board component-side up on an antistatic surface.
4. Record the serial number of the add-in board in your equipment log.
5. Set jumpers or switches according to the manufacturer’s instructions.
6. Hold board by its top edge or upper corners. Firmly press it into an expansion slot on the
server board. The tapered foot of the board retaining bracket must fit into the mating slot in
the expansion slot frame.
• Install an ISA board component-side UP.
• Install a PCI board component-side DOWN.
7. Align the rounded notch in the retaining bracket with the threaded hole in the frame. The
bracket fits the space that was occupied by the slot cover.
8. Use the screw removed earlier. Insert it into the threaded hole, and push the rounded notch
against the screw. Tighten it firmly to prevent the bracket from interfering with adjacent
brackets. Attach cables if necessary.
9. Reinstall the side cover.

20 Working Inside the System
OM06425
A
B
Figure 7. Installing an Add-in Board
A. Expansion slot cover and screw
B. Add-in board, use same screw
Removing an Add-in Board
CAUTION
Slot covers must be installed on all vacant expansion slots. This maintains
the electromagnetic emissions characteristics of the system and ensures
proper cooling of system components.
1. Observe the safety and ESD precautions at the beginning of this chapter.
2. Disconnect any cables attached to the board you are removing.
3. Remove and save the screw from the board retaining bracket.
4. Holding the board by its top edge or upper corners, carefully pull it out. Do not scrape the
board against other components.
5. Store board in an antistatic protective wrapper.
6. If you are not reinstalling a board in the same slot, install a slot cover over the vacant slot. The
tapered foot of the cover must fit into the mating slot in the expansion slot frame.