Intel Sr1425bk1 - entry server platform User manual

Intel®Server Chassis SC1400UP /

Intel®Server Platform SR1425BK1-E

Technical Product Specification

Intel order number C94051-001

Revision 1.0

October 2004

Enterprise Platforms and Services Marketing

Revision 1.0 ii

Revision History

Date Revision

Number

Modifications

February 2004 0.5 Updated to reflect Alpha – first external release

July 2004 0.8 Added CPU air duct, updated SATA and SCSI backplane info, added LCP

info, added riser card info,

October 2004 0.9 Updated P/S specification

October 2004 1.0 Final Release

Revision 1.0 iii

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express

or implied, by estoppel or otherwise, to any intellectual property rights is granted by this

document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel

assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to

sale and/or use of Intel products including liability or warranties relating to fitness for a particular

purpose, merchantability, or infringement of any patent, copyright or other intellectual property

right. Intel products are not intended for use in medical, life saving, or life sustaining

applications. Intel may make changes to specifications and product descriptions at any time,

without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked

"reserved" or "undefined." Intel reserves these for future definition and shall have no

responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not

finalize a design with this information. Revised information will be published when the product

is available. Verify with your local sales office that you have the latest datasheet before

finalizing a design.

The Intel® Server Chassis SC1400UP and Intel® Server Platform SR1425BK1-E may contain

design defects or errors known as errata which may cause the product to deviate from

published specifications. Current characterized errata are available on request.

This document and the software described in it is furnished under license and may only be used

or copied in accordance with the terms of the license. The information in this manual is

furnished for informational use only, is subject to change without notice, and should not be

construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or

liability for any errors or inaccuracies that may appear in this document or any software that may

be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a

retrieval system, or transmitted in any form or by any means without the express written consent

of Intel Corporation.

Intel, Pentium and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Revision 1.0 iv

Table of Contents

1. Intel® Server Chassis SC1400UP Feature Summary ..................................................- 13 -

1.1 Chassis Views ...................................................................................................- 13 -

1.2 Chassis Dimensions ..........................................................................................- 13 -

1.3 Intel® Server Chassis SC1400UP System Components...................................- 14 -

1.4 Rear Panel Components ...................................................................................- 15 -

1.5 Hard Drive and Peripheral Bays ........................................................................- 15 -

1.6 Control Panel .....................................................................................................- 16 -

1.7 Power Sub-system.............................................................................................- 17 -

1.8 System Cooling..................................................................................................- 18 -

1.9 Chassis Security ................................................................................................- 18 -

1.10 Rack and Cabinet Mounting Options .................................................................- 18 -

1.11 Front Bezels.......................................................................................................- 18 -

2. Cooling Sub-System ......................................................................................................- 20 -

2.1 System Fans......................................................................................................- 21 -

2.2 Power Supply Fans............................................................................................- 22 -

2.3 CPU/Memory Air Duct and Side Air Baffle.........................................................- 22 -

2.4 Hard Drive Bays.................................................................................................- 23 -

3. Peripheral and Hard Drive Support...............................................................................- 24 -

3.1 Slimline Drive Bay..............................................................................................- 24 -

3.1.1 Floppy Drive Support with or without Backplane present ..................................- 24 -

3.2 Hard Disk Drive Bays.........................................................................................- 27 -

3.2.1 Hot Swap Hard Disk Drive Trays .......................................................................- 28 -

3.2.2 Fixed Drive Trays...............................................................................................- 28 -

3.2.3 Drive Blanks.......................................................................................................- 28 -

3.3 Hot-Swap SCSI Backplane................................................................................- 29 -

3.3.1 Hot-Swap SCSI Backplane Board Layout .........................................................- 29 -

3.3.2 SCSI Backplane Functional Architecture...........................................................- 30 -

3.3.3 SCSI Backplane Connector Definitions .............................................................- 33 -

3.4 Hot-Swap SATA Backplane...............................................................................- 36 -

3.4.1 SATA Backplane Layout....................................................................................- 37 -

3.4.2 SATA Backplane Functional Architecture..........................................................- 37 -

3.4.3 SATA Backplane Connector Definitions ............................................................- 40 -

4. Standard Control Panel .................................................................................................- 42 -

4.1 Control Panel Buttons.......................................................................................- 42 -

Revision 1.0 v

4.2 Control Panel LED Indicators ............................................................................- 43 -

4.2.1 Power / Sleep LED ............................................................................................- 44 -

4.2.2 System Status LED............................................................................................- 44 -

4.2.3 Drive Activity LED ..............................................................................................- 45 -

4.2.4 System Identification LED..................................................................................- 45 -

4.3 Control Panel Connectors..................................................................................- 46 -

4.4 Internal Control Panel Assembly Headers.........................................................- 46 -

5. PCI Riser Cards and Assembly.....................................................................................- 48 -

5.1 Riser Card Options ............................................................................................- 48 -

6. Power Sub-system .........................................................................................................- 50 -

6.1 Mechanical Specifications .................................................................................- 50 -

6.2 Airflow Requirements.........................................................................................- 51 -

6.3 Acoustics ...........................................................................................................- 51 -

6.4 Temperature ......................................................................................................- 52 -

6.5 Output Connectors.............................................................................................- 52 -

6.5.1 P1 Main power connector ..................................................................................- 52 -

6.5.2 P2 Processor Power Connector ........................................................................- 53 -

6.5.3 P3-P5 Peripheral Connectors ............................................................................- 53 -

6.6 AC Inlet Connector ............................................................................................- 54 -

6.7 Marking and Identification..................................................................................- 54 -

6.8 AC Input Voltage................................................................................................- 54 -

6.9 AC Line Transient Specification.........................................................................- 54 -

6.10 Susceptibility......................................................................................................- 55 -

6.10.1 Electrostatic Discharge Susceptibility ................................................................- 55 -

6.10.2 Fast Transient/Burst ..........................................................................................- 55 -

6.10.3 Radiated Immunity.............................................................................................- 55 -

6.10.4 Surge Immunity..................................................................................................- 55 -

6.11 AC Line Fast Transient (EFT) Specification ......................................................- 56 -

6.12 AC Line Dropout / Holdup..................................................................................- 56 -

6.12.1 AC Line 5VSB Holdup .......................................................................................- 56 -

6.13 Power Recovery ................................................................................................- 56 -

6.13.1 Voltage Brown Out.............................................................................................- 56 -

6.13.2 Voltage Interruptions..........................................................................................- 56 -

6.14 AC Line Inrush ...................................................................................................- 57 -

6.15 AC Line Isolation Requirements ........................................................................- 57 -

6.16 AC Line Leakage Current ..................................................................................- 57 -

6.17 AC Line Fuse .....................................................................................................- 57 -

Revision 1.0 vi

6.18 Power Factor Correction....................................................................................- 57 -

6.19 Efficiency ...........................................................................................................- 57 -

6.20 Grounding ..........................................................................................................- 58 -

6.21 Remote Sense ...................................................................................................- 58 -

6.22 Output Power / Currents ....................................................................................- 58 -

6.22.1 Standby Outputs ................................................................................................- 59 -

6.22.2 Fan-less Operation ............................................................................................- 59 -

6.23 Voltage Regulation ............................................................................................- 59 -

6.23.1 Dynamic Loading ...............................................................................................- 59 -

6.24 Capacitive Loading ............................................................................................- 60 -

6.25 Closed loop stability...........................................................................................- 60 -

6.26 Common Mode Noise ........................................................................................- 60 -

6.27 Ripple / Noise ....................................................................................................- 61 -

6.28 Soft Starting .......................................................................................................- 61 -

6.29 Zero Load Stability Requirements .....................................................................- 61 -

6.30 Timing Requirements.........................................................................................- 61 -

6.31 Residual Voltage Immunity in Standby mode ....................................................- 63 -

6.32 Protection Circuits..............................................................................................- 63 -

6.33 Current Limit (OCP) .........................................................................................- 63 -

6.34 Over Voltage Protection (OVP).........................................................................- 64 -

6.35 Over Temperature Protection (OTP).................................................................- 64 -

6.36 Control and Indicator Functions.........................................................................- 64 -

6.37 PSON# Input Signal ..........................................................................................- 65 -

6.38 PWOK (Power OK) Output Signal .....................................................................- 65 -

6.39 Environmental Requirements ............................................................................- 66 -

6.40 Temperature ......................................................................................................- 66 -

6.41 Humidity.............................................................................................................- 66 -

6.42 Altitude...............................................................................................................- 66 -

6.43 Mechanical Shock..............................................................................................- 66 -

6.44 Random Vibration ..............................................................................................- 67 -

6.45 Thermal Shock (Shipping) .................................................................................- 67 -

6.46 Ecological Requirements ...................................................................................- 67 -

6.47 Catastrophic Failure...........................................................................................- 67 -

7. Electromagnetic Compatibility......................................................................................- 68 -

7.1 EMI ....................................................................................................................- 68 -

7.2 Input Line Current Harmonic Content (PFC) ....................................................- 68 -

7.3 Magnetic Leakage Fields...................................................................................- 68 -

Revision 1.0 vii

7.4 Voltage Fluctuations and Flicker........................................................................- 69 -

7.5 Reliability / Warranty / Service...........................................................................- 69 -

7.6 Component De-rating ........................................................................................- 69 -

7.7 Component Life requirement .............................................................................- 69 -

7.8 Mean Time Between Failures (MTBF)...............................................................- 69 -

7.9 Warranty Period.................................................................................................- 69 -

7.10 Serviceability......................................................................................................- 69 -

7.11 Power Supply Returned for Repair ....................................................................- 69 -

7.12 Modifications / Change Control..........................................................................- 70 -

7.13 Power Supply Compliance Overview.................................................................- 70 -

7.14 Power Supplies Compliance Information...........................................................- 70 -

7.15 EMC Compliance Information............................................................................- 71 -

7.16 Immunity Compliance Information .....................................................................- 71 -

7.17 Harmonics & Voltage Flicker Compliance Information ......................................- 71 -

7.18 Environmental / Ecology Compliance Information .............................................- 71 -

7.19 Other Safety Requirement Notations.................................................................- 72 -

7.19.1 Certification Conditions......................................................................................- 72 -

7.19.2 Isolation Between Primary - Secondary.............................................................- 72 -

7.19.3 Creepage & Clearance Requirements...............................................................- 72 -

7.19.4 Leakage Current Maximums..............................................................................- 72 -

7.19.5 Max Surface Temperatures ...............................................................................- 72 -

7.19.6 Date Coded Serial Numbers..............................................................................- 73 -

7.19.7 Power Input Electrical Ratings...........................................................................- 73 -

7.19.8 Maximum Allowable Temperatures on Inlet Receptacles..................................- 73 -

7.19.9 Maximum Allowable Temperatures on Power Cords.........................................- 73 -

8. Supported Intel® Server Boards...................................................................................- 74 -

8.1 Intel® Server Board SE7221BK1-E Feature Set ...............................................- 74 -

9. Regulatory, Environmentals, and Specifications........................................................- 76 -

9.1 Product Regulatory Compliance ........................................................................- 76 -

9.1.1 Product Safety Compliance ...............................................................................- 76 -

9.1.2 Product EMC Compliance .................................................................................- 76 -

9.1.3 Product Regulatory Compliance Markings ........................................................- 76 -

9.2 Electromagnetic Compatibility Notices ..............................................................- 77 -

9.2.1 USA ...................................................................................................................- 77 -

9.2.2 FCC Verification Statement ...............................................................................- 77 -

9.2.3 ICES-003 (Canada) ...........................................................................................- 78 -

9.2.4 Europe (CE Declaration of Conformity) .............................................................- 78 -

Revision 1.0 viii

9.2.5 Japan EMC Compatibility ..................................................................................- 78 -

9.2.6 BSMI (Taiwan) ...................................................................................................- 78 -

9.3 Replacing the Back up Battery ..........................................................................- 78 -

9.4 System Level Environmental Limits...................................................................- 79 -

9.5 Serviceability......................................................................................................- 80 -

Appendix A: Intel® Server Chassis SC1400UP Integration and Usage Tips.......................... I

Glossary....................................................................................................................................... II

Revision 1.0 ix

List of Figures

Figure 1. Front and Rear Chassis Views ................................................................................- 13 -

Figure 2. Major Chassis Components.....................................................................................- 14 -

Figure 3. Back Panel Feature Overview .................................................................................- 15 -

Figure 4. Front Panel Feature Overview.................................................................................- 16 -

Figure 5. Control Panel Module ..............................................................................................- 16 -

Figure 6. Standard Control Panel Overview ...........................................................................- 17 -

Figure 7. Optional Front Bezel ................................................................................................- 18 -

Figure 8. Front Bezel Options .................................................................................................- 19 -

Figure 9. Intel® Server Chassis SC1400UP Cooling Subsystem ...........................................- 20 -

Figure 10. Intel® Server Chassis SC1400UP System Fans 4, 5, 6, 7, 8 ................................- 21 -

Figure 11. Intel® Server Platform SE7221BK1-E System Fan headers 4, 5, 6, 7, 8 ..............- 21 -

Figure 12. Air Baffle ................................................................................................................- 22 -

Figure 13. CPU/Memory Air Duct ...........................................................................................- 23 -

Figure 14. Intel® Server Chassis SC1400UP Peripheral Bay Configuration Options.............- 24 -

Figure 15. View of Slim-Line Drive Bay ..................................................................................- 24 -

Figure 16. Optional Floppy Drive Configuration......................................................................- 25 -

Figure 17. Hard Drive Tray Assembly.....................................................................................- 28 -

Figure 18. Drive Tray with Drive Blank ...................................................................................- 29 -

Figure 19. Hot-Swap SCSI Backplane Layout ........................................................................- 30 -

Figure 20. Hot-Swap SCSI Backplane Functional Diagram....................................................- 30 -

Figure 21. Intel® Server Chassis SC1400UP 1U SCSI HSBP I2C Bus Connection Diagram- 32 -

Figure 22. 68-Pin SCSI Cable Connector ...............................................................................- 33 -

Figure 23. 80-pin SCA2 SCSI Interface ..................................................................................- 34 -

Figure 24. SATA Backplane Layout........................................................................................- 37 -

Figure 25. SATA Backplane Layout........................................................................................- 37 -

Figure 26. SATA Backplane Functional Block Diagram..........................................................- 38 -

Figure 27. Intel® Server Chassis SC1400UP 1U SATA HSBP I2C Bus Connection Diagram- 39 -

Figure 28. Standard Control Panel Assembly Module ............................................................- 42 -

Figure 29. Control Panel Buttons............................................................................................- 42 -

Figure 31. PCI Riser bracket and optional PCI-X and PCI-Express risers .............................- 48 -

Figure 32. 1U Full Height PCI-X Riser Card Mechanical Drawing..........................................- 49 -

Figure 33. 1U Full Height PCI-Express Riser Card Mechanical Drawing ...............................- 49 -

Figure 34. Power Supply Enclosure Drawing .........................................................................- 50 -

Figure 35. Airflow Characteristics ...........................................................................................- 51 -

Revision 1.0 x

Figure 36. Output Voltage Timing ...........................................................................................- 62 -

Figure 37. Turn On/Off Timing (Power Supply Signals)..........................................................- 63 -

Figure 38. PSON# Required Signal Characteristic. ................................................................- 65 -

Figure 39. SE7221BK1-E Board Layout .................................................................................- 75 -

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