Intel H2000 Series Configuration guide

Intel®Server Chassis H2000 Family
Technical Product Specification
Intel order number: G59059-006
Revision 1.5
April, 2015
Enterprise Platforms and Services Division

Revision History Intel®Server Chassis H2000 Family TPS
Revision History
Date
Revision Number
Modifications
February, 2012 1.0 Initial release.
July, 2012 1.1 Updated safety notice for rail kit.
August, 2012 1.2 Updated power redundancy mode.
November, 2012 1.3
Updated link to Rail Specification.
Updated warning message on PSU configuration.
July, 2013
1.4
Updated chassis usage model.
April, 2015 1.5 Updated LAN (i350 Dual NIC) LED behavior.
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Intel®Server Chassis H2000 Family TPS Disclaimers
Disclaimers
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO
ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL®'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
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OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL®PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT.
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result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE
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SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF
THE INTEL®PRODUCT OR ANY OF ITS PARTS.
Intel®may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined". Intel®reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this
information.
The products described in this document may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and
before placing your product order.
Copies of documents which have an order number and are referenced in this document, or
other Intel®literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.
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Table of Contents Intel®Server Chassis H2000 Family TPS
Table of Contents
1. Introduction ........................................................................................................................1
1.1 Chapter Outline......................................................................................................1
1.2 Server Board Use Disclaimer.................................................................................2
2. Product Overview...............................................................................................................3
2.1 Chassis Views........................................................................................................4
2.2 Chassis Dimensions...............................................................................................5
2.3 System Level Environmental Limits........................................................................5
2.4 Chassis Parts.........................................................................................................6
2.5 Hard Drive and Peripheral Bays.............................................................................7
2.6 Front Bezel Support ...............................................................................................8
2.7 Rack and Cabinet Mounting Options......................................................................8
3. Power Sub-System...........................................................................................................10
3.1 Mechanical Overview...........................................................................................10
3.1.1 AC Power Supply Unit Dimension Overview ........................................................10
3.1.2 AC Power Supply Unit General Data....................................................................11
3.1.3 AC input connector...............................................................................................11
3.1.4 AC Power Cord Specification Requirements ........................................................11
3.1.5 Power Supply Unit DC Output Connector.............................................................11
3.1.6 Handle Retention .................................................................................................12
3.1.7 LED Marking and Identification.............................................................................12
3.1.8 Power Cage with Power Distribution Board..........................................................13
3.1.9 Power Cage Output Pin Assignment....................................................................14
3.2 AC Input Specification..........................................................................................16
3.2.1 Input Voltage And Frequency...............................................................................16
3.2.2 AC input Power Factor.........................................................................................16
3.2.3 Efficiency..............................................................................................................17
3.2.4 AC Line Fuse .......................................................................................................17
3.2.5 AC Line Inrush .....................................................................................................17
3.2.6 AC Line Dropout/Holdup ......................................................................................18
3.2.7 AC Line Fast Transient (EFT) Specification..........................................................18
3.2.8 Hot Plug...............................................................................................................18
3.2.9 Susceptability Requirements................................................................................18
3.2.10 Electrostatic Discharge Susceptibility...................................................................19
3.2.11 Fast Transient/Burst.............................................................................................19
3.2.12 Radiated Immunity ...............................................................................................19
3.2.13 Surge Immunity....................................................................................................19
3.2.14 AC Line Transient Specification ...........................................................................19
3.2.15 Power Recovery...................................................................................................20
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Intel®Server Chassis H2000 Family TPS Table of Contents
3.2.16 Voltage Interruptions............................................................................................20
3.2.17 AC Line Isolation..................................................................................................20
3.2.18 AC Power Inlet.....................................................................................................21
3.3 DC Ouput Specification........................................................................................21
3.3.1 Output Power/Currents.........................................................................................21
3.3.2 Standby Output....................................................................................................22
3.3.3 Voltage Regulation...............................................................................................22
3.3.4 Dynamic Loading .................................................................................................22
3.3.5 Capacitive Loading...............................................................................................23
3.3.6 Ripple/Noise.........................................................................................................23
3.3.7 Grounding............................................................................................................23
3.3.8 Closed Loop Stability............................................................................................24
3.3.9 Residual Voltage Immunity in Standby Mode .......................................................24
3.3.10 Common Mode Noise...........................................................................................24
3.3.11 Soft Starting.........................................................................................................24
3.3.12 Zero Load Stability Requirement..........................................................................24
3.3.13 Hot Swap Requirement........................................................................................24
3.3.14 Forced Load Sharing............................................................................................25
3.3.15 Timing Requirement.............................................................................................25
3.4 Power Supply Cold Redundancy Support.............................................................26
3.4.11200W CRPS Cold Redundancy..........................................................................27
3.4.2 1600W CRPS Cold Redundancy..........................................................................28
3.5 Control And Indicator Functions ...........................................................................28
3.5.1 PSON# Input Signal.............................................................................................28
3.5.2 PWOK(power good) Output Signal.......................................................................28
3.5.3 SMBAlert# Signal.................................................................................................29
3.6 Protection circuits.................................................................................................30
3.6.1 Current Limit (OCP)..............................................................................................30
3.6.2 Over Voltage Protection (OVP) ............................................................................30
3.6.3 Over Thermal protection.......................................................................................30
3.7 PMBus*................................................................................................................31
3.7.1 PSU Address Lines A0.........................................................................................31
3.7.2 Accuracy..............................................................................................................32
3.8 Power Management Policy...................................................................................33
4. Cooling Sub-System.........................................................................................................35
4.1 Power Supply Fan................................................................................................35
4.2 Drive Bay Population Requirement.......................................................................35
5. Hard Disk Drive Support..................................................................................................36
5.1 Hard Disk Drive Bays Scheme.............................................................................36
5.2 Hard Drive Carrier................................................................................................37
5.3 Hot-Swap Hard Drive Support..............................................................................37
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Table of Contents Intel®Server Chassis H2000 Family TPS
5.3.1 Backplane Feature set: ........................................................................................38
5.3.2 Backplane Block Diagram ....................................................................................38
5.3.3 3.5" Hot Swap Backplane Connector scheme......................................................39
5.3.4 2.5" Hot Swap Backplane Connector scheme......................................................40
5.3.5 Backplane LED Support.......................................................................................42
5.3.6 Backplane Connector Definition ...........................................................................43
6. Front Panel Control and Indicators.................................................................................48
6.1 Control Panel Button............................................................................................49
6.2 Control Panel LED Indicators...............................................................................49
6.2.1 Power/Sleep LED.................................................................................................50
6.2.2 System Status LED..............................................................................................50
6.2.3 System Status LED – BMC Initialization...............................................................52
Appendix A: Integration and Usage Tips ..............................................................................53
Glossary ..................................................................................................................................54
Reference Documents............................................................................................................57
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Intel®Server Chassis H2000 Family TPS List of Figures
List of Figures
Figure 1. Chassis Overview (H2312xx SKU)...............................................................................4
Figure 2. Power Supply Scheme (Rear View) .............................................................................4
Figure 3. Dummy Tray Cover......................................................................................................4
Figure 4. Major Chassis Parts.....................................................................................................7
Figure 5. Intel®Server Chassis H2312xx Drive Bay Front View ..................................................8
Figure 6. Intel®Server Chassis H2216xx Drive Bay Front View ..................................................8
Figure 7. Chassis Bezel Front View ............................................................................................8
Figure 8. AC Power Supply Unit Dimension Overview ..............................................................10
Figure 9. Power Cage Overview ...............................................................................................14
Figure 10. Power distribution board...........................................................................................15
Figure 11. AC Power Cord Specification...................................................................................21
Figure 12. Turn On/Off Timing (Power Supply Signals).............................................................26
Figure 13. Power Supply Device Address.................................................................................31
Figure 14. PMBus Monitoring Accuracy ....................................................................................33
Figure 15. HDD Scheme for H2312xx.......................................................................................36
Figure 16. HDD Scheme for H2216xx.......................................................................................36
Figure 17. 3.5" HDD Assembly Overview..................................................................................37
Figure 18. 2.5" HDD Assembly Overview..................................................................................37
Figure 19. Passive Backplane Block Diagram (for one node)....................................................39
Figure 20. 3.5" Backplane Component and Connectors (Front View)........................................39
Figure 21. 3.5" Backplane Component and Connectors (Back View)........................................40
Figure 22. 2.5" Backplane Component and Connectors (Front View)........................................41
Figure 23. 2.5" Backplane Component and Connectors (Back View)........................................41
Figure 24. Hard Drive Carrier LED............................................................................................42
Figure 25. Front Control Panel..................................................................................................49
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List of Tables Intel®Server Chassis H2000 Family TPS
List of Tables
Table 1. Chassis Feature Set......................................................................................................3
Table 2. Chassis SKU Matrix ......................................................................................................3
Table 3. Chassis Dimension (SKU: H2312xxJR/KR)...................................................................5
Table 4. Chassis Dimension (SKU: H2216xxJR/KR)...................................................................5
Table 5. System Environmental Limits Summary........................................................................5
Table 6. Specification Data for AC Power Supply Unit ..............................................................11
Table 7. AC power cord specification........................................................................................11
Table 8. DC Output Power Connector.......................................................................................11
Table 9. Power Supply Status LED...........................................................................................13
Table 10. Pin assignment of power ouput connector.................................................................15
Table 11. Pin assignment of control signal connector................................................................16
Table 12. AC input rating ..........................................................................................................16
Table 13. Typical power factor..................................................................................................17
Table 14. Platinum Efficiency Requirement...............................................................................17
Table 15. AC Power Holdup Reuqirement.................................................................................18
Table 16. Performance Criteria.................................................................................................19
Table 17. AC Line Sag Transient Performance.........................................................................20
Table 18. AC Line Surge Transient Performance......................................................................20
Table 19. Load Ratings for single power supply unit .................................................................21
Table 20. Voltage Regulation Limits..........................................................................................22
Table 21. Transient Load Requirements ...................................................................................22
Table 22. Capacitive Loading Conditions..................................................................................23
Table 23. Ripple and Noise.......................................................................................................23
Table 24. Timing Requirement..................................................................................................25
Table 25. 1200W CRPS Cold Redundancy Threshold..............................................................27
Table 26. 1600W CRPS Cold Redundancy Threshold..............................................................28
Table 27. PSON# Signal Characteristics...................................................................................28
Table 28. PWOK Signal Characteristics....................................................................................29
Table 29. SMBAlert# Signal Characteristics..............................................................................29
Table 30. Over Current Protection.............................................................................................30
Table 31. Over Voltage Protection (OVP) Limits .......................................................................30
Table 32. PSU addressing ........................................................................................................32
Table 33. PMBus Accuracy.......................................................................................................32
Table 34. Power Management Policy........................................................................................33
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Intel®Server Chassis H2000 Family TPS List of Tables
Table 35. Hard Drive Carrier Status LED Functions..................................................................42
Table 36. Hard Drive Carrier Activity LED Functions.................................................................42
Table 37. Backplane Input Power Connector Pin-out................................................................43
Table 38. 2-Blade Compute Node Power Connector Pin-out.....................................................43
Table 39. 2x40 Pin Connector Pin-out for Node Bridge Board...................................................44
Table 40. Front Panel Connector Pin-out..................................................................................46
Table 41. Power Supply Control Connector Pin-out ..................................................................47
Table 42. Front Control Button Function....................................................................................49
Table 43. Front LED Indicator Functions...................................................................................49
Table 44. Power LED Operation ...............................................................................................50
Table 45. System Status LED Operation...................................................................................50
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List of Tables Intel®Server Chassis H2000 Family TPS
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Intel®Server Chassis H2000 Family TPS Introduction
1. Introduction
This Technical Product Specification (TPS) provides system specific information detailing the
features, functionality, and high-level architecture of the Intel®Server Chassis H2000 family.
You should also reference the Intel® Server System H2000JF, H2000WP, H2000LP Family
Technical Product Specification to obtain greater detail of functionality and architecture of the
server board integrated in this server system.
In addition, you can obtain design-level information for specific sub-systems by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-
system. EPS and EDS documents are not publicly available. They are only made available
under NDA with Intel®and must be ordered through your local Intel®representative. For a
complete list of available documents, refer to the Reference Documents section at the end of
this document.
The Intel®Server Chassis H2000 may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Refer to the Intel®Server Board
S2600JF/Intel®Server System H2000JF Specification Update for published errata.
1.1
Chapter Outline
This document is divided into the following chapters:
Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Power Sub-System
Chapter 4 – Cooling Sub-System
Chapter 5 – Hard Disk Drive Support
Chapter 6 – Front Panel Control and Indicators
Appendix A – Integration and Usage Tips
Glossary
Reference Documents
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Introduction Intel®Server Chassis H2000 Family TPS
1.2
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density
VLSI and power delivery components that need adequate airflow to cool. Intel®ensures through
its own chassis development and testing that when Intel®server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel®
developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or
non-operating limits.
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Intel®Server Chassis H2000 Family TPS Product Overview
2. Product Overview
The Intel®Server Chassis H2000 family includes two major SKUs: H2312xxJR/KR and
H2216xxJR/KR, which are supporting rack mount 2U 4-node server systems, purpose-built for
high-density and lowest total cost of ownership in dense computing applications, such as HPC
and IPDC. The chassis can be used to integrate with four units of node trays which are built with
Intel®Server Board S2600JF, S2600WP or S2400LP, supports up to twelve 3.5" or sixteen 2.5"
hot-swap SAS or SATA hard drives, with 1200 Watts or 1600 Watts Common Redundant Power
Supply(CRPS) capability .
This chapter provides a high-level overview of the chassis features. The following chapters
provide greater detail for each major chassis component or feature.
Table 1. Chassis Feature Set
Feature
Description
Hard Disk Drive
Supported
12x 3.5-inch SATA/SAS HDD bays or 16x 2.5-inch SATA/SAS HDD bays.
System Power
1200w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting
CRPS configuration, or
1600w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting
CRPS configuration. Chassis.
Table 2. Chassis SKU Matrix
Chassis SKU
3.5"HDD support
2.5"HDD support
1200W CRPS
H2312xxJR
H2216xxJR
1600W CRPS
H2312xxKR
H2216xxKR
Caution: Installing two Power Supply Units with different wattage ratings on a system is not
supported. This will not provide Power Supply Redundancy and causes the system to log
multiple errors.
The Intel®Server Chassis H2000 family supports node trays which are built with Intel®Server
Board S2600JF, S2600WP, or S2400LP.
The Intel®Server Chassis H2000 family also supports different node quantity in the same
chassis. The compute node quantity can be at least 1, and up to 4 in one chassis.
Caution: The chassis doesn’t support mixed node configuration, for example, compute nodes
based on different Intel®Server Board S2600JF, S2600WP, or S2400LP cannot be installed in
the same chassis.
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Product Overview Intel®Server Chassis H2000 Family TPS
2.1
Chassis Views
Figure 1. Chassis Overview (H2312xx SKU)
Figure 2. Power Supply Scheme (Rear View)
Figure 3. Dummy Tray Cover
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Intel®Server Chassis H2000 Family TPS Product Overview
2.2
Chassis Dimensions
Table 3. Chassis Dimension (SKU: H2312xxJR/KR)
Height
87.9 mm
3.46"
Width
438 mm
17.24"
Depth
771 mm
30.35"
Table 4. Chassis Dimension (SKU: H2216xxJR/KR)
Height
87.9 mm
3.46"
Width
438 mm
17.24"
Depth
733 mm
28.86"
2.3
System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 5. System Environmental Limits Summary
Parameter
Limits
Temperature
Operating 10ºC to 35ºC (50ºF to 95ºF) with the maximum rate of change not to exceed 10°C
per hour
Non-Operating -40º C to 70º C (-40º F to 149º F)
Humidity
Non-Operating 50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures
from 25°C to 35°C)
Shock
Operating Half sine, 2g, 11 mSec
Unpackaged Trapezoidal, 25g, velocity change is based on packaged weight
Packaged Product Weight: ≥ 40 to < 80
Non-palletized Free Fall Height = 18 inches
Palletized (single product) Free Fall Height = NA
Vibration
Unpackaged 5 Hz to 500 Hz 2.20 g RMS random
Packaged 5 Hz to 500 Hz 1.09 g RMS random
AC-DC
Voltage 90 V to 132 V and 180 V to 264 V
Frequency 47 Hz to 63 Hz
Source
Interrupt No loss of data for power line drop-out of 12 mSec
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Product Overview Intel®Server Chassis H2000 Family TPS
Parameter
Limits
Surge Non-
operating and
operating
Unidirectional
Line to earth
Only AC Leads 2.0 kV
I/O Leads 1.0 kV
DC Leads 0.5 kV
ESD
Air Discharged 12.0 kV
Contact
Discharge 8.0 kV
Altitude
Operating
-16 to 3048 m (-50 to 10,000 ft.) Note: For altitudes above 2950 feet, the
maximum operating temperature is de-rated 1°F/550 ft.
Storage -16 to 10,600 m (-50 to 35,000 ft.)
Disclaimer Note: Intel®ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
2.4
Chassis Parts
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Intel®Server Chassis H2000 Family TPS Product Overview
A Front Control Panel
B HDD bays
C Upper and Lower Power Distribution Boards
D Common Redundant Power Supply
E Hot Swap Back Plane
Note: Not shown - Rack slide rail, and top cover.
Figure 4. Major Chassis Parts
2.5
Hard Drive and Peripheral Bays
Intel®Server System H2312xx
Intel®Server System H2216xx
Slim-line SATA Optical Drive
Not Supported
Not Supported
Internal USB Floppy Drive
Not Supported
Not Supported
SATA/SAS Hard Disk Drives (3.5-inch)
Up to Twelve
Not Supported
SATA/SAS Hard Disk Drives (2.5-inch)
Not Supported
Up to Sixteen
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Product Overview Intel®Server Chassis H2000 Family TPS
Figure 5. Intel®Server Chassis H2312xx Drive Bay Front View
Figure 6. Intel®Server Chassis H2216xx Drive Bay Front View
2.6
Front Bezel Support
Intel®Server Chassis H2000 family provides front panel bezel. The bezel provides protection to
system HDD bays with a lock to chassis. The front view of the bezel is as below.
Figure 7. Chassis Bezel Front View
2.7
Rack and Cabinet Mounting Options
The chassis was designed to support 19 inches wide by up to 30 inches deep server cabinets.
The system bundles with the following Intel®rack mount option:
A basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the
chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible
server cabinet.
Caution: THE MAXIMUM RECOMMENDED SERVER WEIGHT FOR THE RACK RAILS CAN
BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm.
EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE
SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Use of a
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Intel®Server Chassis H2000 Family TPS Product Overview
mechanical assist to install and align server into the rack rails is recommended.
Advisory Note: The AXXELVRAIL value rack mount rail kit is not designed to support shipment
of the server system while installed in a rack.
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Power Sub-System Intel®Server Chassis H2000 Family TPS
3. Power Sub-System
The system supports AC 1+1 hot swap power supply module and two power distribution board
which can support 2U rack high density server system. Two different power supply units are
supported: 1200W and 1600W. The single power supply module has Platinum level energy
efficiency, demonstrating climate saver with silver rating.
3.1
Mechanical Overview
The power supply module has a simple retention mechanism to retain the module self once it is
inserted. This mechanism shall withstand the specified mechanical shock and vibration
requirements. The power distribution board will be fixed in the chassis with screws. This
specification defines a 1+1 hot swap redundancy power supply that supports 2U server system.
Using existing power supply module provided by vendor with updated PMBus* and custom-
made power connector board to support four computing nodes. The power supply shall have
two outputs: 12V and 12VSB. The input shall be auto ranging and power factor corrected. The
PMBus* features included in this specification are requirements for AC silver rated box power
supply for use in server systems based on Intel®Server Chassis H2000 Family. This
specification is based on the PMBus* Specifications part I and II, revision 1.1.
3.1.1
AC Power Supply Unit Dimension Overview
The casing dimension is W 73.5mm x L 265.0mm x H 39/40mm. The power supply contains a
single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card
edge connector in the system. The AC plugs directly into the external face of the power supply.
Figure 8. AC Power Supply Unit Dimension Overview
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