Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL S AND DESIGN GUIDELINES... User manual

Document Number #: 324644-002
2nd Generation Intel® Core™
Processor Family Desktop and
LGA1155 Socket
Thermal Mechanical Specifications and Design Guidelines (TMSDG)
Supporting the Intel® Core™ i7, i5 and i3 Desktop Processor
January 2011

2Thermal/Mechanical Specifications and Design Guidelines
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Copyright © 2011 Intel Corporation.

Thermal/Mechanical Specifications and Design Guidelines 3
Contents
1Introduction..............................................................................................................9
1.1 References ....................................................................................................... 10
1.2 Definition of Terms ............................................................................................ 10
2 Package Mechanical & Storage Specifications.......................................................... 13
2.1 Package Mechanical Specifications ....................................................................... 13
2.1.1 Package Mechanical Drawing.................................................................... 14
2.1.2 Processor Component Keep-Out Zones...................................................... 14
2.1.3 Package Loading Specifications ................................................................ 15
2.1.4 Package Handling Guidelines.................................................................... 15
2.1.5 Package Insertion Specifications............................................................... 15
2.1.6 Processor Mass Specification.................................................................... 15
2.1.7 Processor Materials................................................................................. 16
2.1.8 Processor Markings................................................................................. 16
2.1.9 Processor Land Coordinates ..................................................................... 17
2.2 Processor Storage Specifications ......................................................................... 18
3 LGA1155 Socket ...................................................................................................... 19
3.1 Board Layout .................................................................................................... 20
3.1.1 Suggested Silkscreen Marking for Socket Identification................................ 22
3.2 Attachment to Motherboard ................................................................................ 22
3.3 Socket Components........................................................................................... 23
3.3.1 Socket Body Housing .............................................................................. 23
3.3.2 Solder Balls ........................................................................................... 23
3.3.3 Contacts ............................................................................................... 23
3.3.4 Pick and Place Cover............................................................................... 23
3.4 Package Installation / Removal ........................................................................... 24
3.4.1 Socket Standoffs and Package Seating Plane.............................................. 25
3.5 Durability ......................................................................................................... 25
3.6 Markings .......................................................................................................... 25
3.7 Component Insertion Forces ............................................................................... 26
3.8 Socket Size ...................................................................................................... 26
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Design Concept................................................................................................. 27
4.1.1 ILM Assembly Design Overview ................................................................ 27
4.1.2 ILM Back Plate Design Overview............................................................... 28
4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 29
4.2 Assembly of ILM to a Motherboard....................................................................... 30
4.3 ILM Interchangeability ....................................................................................... 32
4.4 Markings .......................................................................................................... 32
4.5 ILM Cover ........................................................................................................ 33
5 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 37
5.1 Component Mass............................................................................................... 37
5.2 Package/Socket Stackup Height .......................................................................... 37
5.3 Loading Specifications........................................................................................ 38
5.4 Electrical Requirements...................................................................................... 39
5.5 Environmental Requirements .............................................................................. 40
6 Thermal Specifications ............................................................................................ 41
6.1 Thermal Specifications ....................................................................................... 41
6.1.1 Intel® Core™ i7-2000 and i5-2000 Desktop Processor Series
(Quad Core 95W) Thermal Profile ............................................................. 43

4Thermal/Mechanical Specifications and Design Guidelines
6.1.2 Intel® Core™ i7-2000 and i5-2000 Desktop Processor Series
(Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor Series
(Dual Core 65W) Thermal Profile..............................................................44
6.1.3 Intel® Core™ i5-2000 desktop processor series (Quad Core 45W)
Thermal Profile .......................................................................................46
6.1.4 Intel® Core™ i5-2000 and i3-2000 Desktop Processor Series
(Dual Core 35W) Thermal Profile...............................................................47
6.1.5 Processor Specification for Operation Where Digital Thermal Sensor
Exceeds TCONTROL ...................................................................................48
6.1.6 Thermal Metrology..................................................................................52
6.2 Processor Thermal Features ................................................................................53
6.2.1 Processor Temperature............................................................................53
6.2.2 Adaptive Thermal Monitor ........................................................................53
6.2.2.1 Frequency/VID Control...............................................................54
6.2.2.2 Clock Modulation .......................................................................55
6.2.2.3 Immediate Transition to combined TM1 and TM2 ...........................55
6.2.2.4 Critical Temperature Flag ...........................................................56
6.2.2.5 PROCHOT# Signal .....................................................................56
6.2.3 THERMTRIP# Signal ................................................................................56
6.3 Intel®Turbo Boost Technology ............................................................................57
6.3.1 Intel® Turbo Boost Technology Frequency..................................................57
6.3.2 Intel® Turbo Boost Technology Graphics Frequency ....................................57
6.4 Thermal Considerations ......................................................................................58
6.4.1 Intel®Turbo Boost Technology Power Control and Reporting ........................58
6.4.2 Package Power Control ............................................................................59
6.4.3 Power Plane Control ................................................................................60
6.4.4 Turbo Time Parameter.............................................................................60
7 PECI Interface .........................................................................................................61
7.1 Platform Environment Control Interface (PECI) ......................................................61
7.1.1 Introduction...........................................................................................61
7.1.1.1 Fan Speed Control with Digital Thermal Sensor .............................61
8 Sensor Based Thermal Specification Design Guidance..............................................63
8.1 Sensor Based Specification Overview (DTS 1.0) .....................................................63
8.2 Sensor Based Thermal Specification .....................................................................65
8.2.1 TTV Thermal Profile.................................................................................65
8.2.2 Specification When DTS value is Greater than TCONTROL.............................66
8.3 Thermal Solution Design Process .........................................................................66
8.3.1 Boundary Condition Definition ..................................................................67
8.3.2 Thermal Design and Modelling ..................................................................68
8.3.3 Thermal Solution Validation......................................................................68
8.3.3.1 Test for Compliance to the TTV Thermal Profile..............................68
8.3.3.2 Thermal Solution Characterization for Fan Speed Control ................68
8.4 Fan Speed Control (FSC) Design Process...............................................................69
8.4.1 Fan Speed Control Algorithm without TAMBIENT Data..................................70
8.4.2 Fan Speed Control Algorithm with TAMBIENT Data ......................................71
8.4.3 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data ............73
8.4.4 Fan Speed Control Implementation Details .................................................75
8.5 System Validation..............................................................................................76
8.6 Thermal Solution Characterization........................................................................77
9 ATX Reference Thermal Solution..............................................................................79
9.1 Heatsink Thermal Solution ..................................................................................79
9.2 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design..............81
9.3 Reference Design Components ............................................................................82
9.3.1 Extrusion...............................................................................................82

Thermal/Mechanical Specifications and Design Guidelines 5
9.3.2 Clip ...................................................................................................... 82
9.3.3 Core ..................................................................................................... 83
9.4 Mechanical Interface to the Reference Attach Mechanism........................................ 84
9.5 Heatsink Mass & Center of Gravity....................................................................... 86
9.6 Thermal Interface Material.................................................................................. 86
9.7 Heat Pipe Thermal Considerations........................................................................ 87
10 Thermal Solution Quality and Reliability Requirements............................................ 89
10.1 Reference Heatsink Thermal Verification ............................................................... 89
10.2 Mechanical Environmental Testing ....................................................................... 89
10.2.1 Recommended Test Sequence.................................................................. 90
10.2.2 Post-Test Pass Criteria ............................................................................ 90
10.2.3 Recommended BIOS/Processor/Memory Test Procedures ............................. 90
10.3 Material and Recycling Requirements ................................................................... 91
11 Boxed Processor Specifications ............................................................................... 93
11.1 Introduction ..................................................................................................... 93
11.2 Mechanical Specifications ................................................................................... 94
11.2.1 Boxed Processor Cooling Solution Dimensions ............................................ 94
11.2.2 Boxed Processor Fan Heatsink Weight ....................................................... 96
11.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly ..... 96
11.3 Electrical Requirements ...................................................................................... 96
11.3.1 Fan Heatsink Power Supply...................................................................... 96
11.4 Thermal Specifications ....................................................................................... 98
11.4.1 Boxed Processor Cooling Requirements ..................................................... 98
11.4.2 Variable Speed Fan............................................................................... 100
Figures
2-1 Processor Package Assembly Sketch ........................................................................ 13
2-2 Package View ....................................................................................................... 14
2-3 Processor Top-Side Markings .................................................................................. 16
2-4 Processor Package Lands Coordinates ...................................................................... 17
3-1 LGA1155 Socket with Pick and Place Cover ............................................................... 19
3-2 LGA1155 Socket Contact Numbering (Top View of Socket).......................................... 20
3-3 LGA1155 Socket Land Pattern (Top View of Board) .................................................... 21
3-4 Suggested Board Marking....................................................................................... 22
3-5 Attachment to Motherboard .................................................................................... 22
3-6 Pick and Place Cover.............................................................................................. 24
3-7 Package Installation / Removal Features................................................................... 25
4-1 ILM Assembly with Installed Processor ..................................................................... 28
4-2 Back Plate ............................................................................................................ 29
4-3 Shoulder Screw..................................................................................................... 30
4-4 ILM Assembly ....................................................................................................... 31
4-5 Pin1 and ILM Lever................................................................................................ 32
4-6 ILM Cover ............................................................................................................ 34
4-7 ILM Cover and PnP Cover Interference ..................................................................... 35
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................. 40
6-1 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
Processor Series (Quad Core 95W) .......................................................................... 43
6-2 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
Processor Series (Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor
Series (Dual Core 65W) ........................................................................................ 44
6-3 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 Desktop Processor
Series (Quad Core 45W) ........................................................................................ 46

6Thermal/Mechanical Specifications and Design Guidelines
6-4 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 and i3-2000 Desktop
Processor Series (Dual Core 35W) ...........................................................................47
6-5 TTV Case Temperature (TCASE) Measurement Location ..............................................52
6-6 Frequency and Voltage Ordering ..............................................................................55
6-7 Package Power Control ...........................................................................................59
8-1 Comparison of Case Temperature versus Sensor Based Specification ............................64
8-2 Intel® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
Thermal Profile......................................................................................................65
8-3 Thermal solution Performance .................................................................................66
8-4 Example: Required YCA for Various TAMBIENT Conditions ...........................................67
8-5 Thermal Solution Performance versus Fan Speed .......................................................69
8-6 Fan Response Without TAMBIENT Data .....................................................................71
8-7 Fan Response with TAMBIENT Aware FSC..................................................................72
8-8 DTS 1.1 Definition Points ........................................................................................74
8-9 Fan Response Comparison with Various Fan Speed Control Options ..............................76
9-1 ATX Heatsink Reference Design Assembly .................................................................80
9-2 ATX KOZ 3-D Model Primary (Top) Side ....................................................................81
9-3 RCBFH Extrusion ...................................................................................................82
9-4 Clip for Existing Solutions to straddle LGA1155 Socket................................................83
9-5 Core ....................................................................................................................84
9-6 Clip Core and Extrusion Assembly ............................................................................85
9-7 Critical Parameters for Interface to the Reference Clip ................................................85
9-8 Critical Core Dimensions .........................................................................................86
9-9 TTV Die Size and Orientation ...................................................................................87
11-1 Mechanical Representation of the Boxed Processor .....................................................94
11-2 Space Requirements for the Boxed Processor (side view) ............................................95
11-3 Space Requirements for the Boxed Processor (top view) .............................................95
11-4 Space Requirements for the Boxed Processor (overall view) ........................................96
11-5 Boxed Processor Fan Heatsink Power Cable Connector Description................................97
11-6 Baseboard Power Header Placement Relative to Processor Socket.................................98
11-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) .....................99
11-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)....................99
11-9 Boxed Processor Fan Heatsink Set Points ................................................................ 100

Thermal/Mechanical Specifications and Design Guidelines 7
Tables
1-1 Reference Documents ............................................................................................. 10
1-2 Terms and Descriptions........................................................................................... 10
2-1 Processor Loading Specifications .............................................................................. 15
2-2 Package Handling Guidelines.................................................................................... 15
2-3 Processor Materials................................................................................................. 16
2-4 Storage Conditions ................................................................................................. 18
5-1 Socket Component Mass ......................................................................................... 37
5-2 1155-land Package and LGA1155 Socket Stackup Height ............................................. 37
5-3 Socket & ILM Mechanical Specifications ..................................................................... 38
5-4 Electrical Requirements for LGA1155 Socket .............................................................. 39
6-1 Processor Thermal Specifications.............................................................................. 42
6-2 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
Processor Series (Quad Core 95W) ........................................................................... 43
6-3 Thermal Test Vehicle Thermal Profile for Intel® Core™ i7-2000 and i5-2000 Desktop
Processor Series (Quad Core 65W) and Intel® Core™ i3-2000 Desktop Processor Series
(Dual Core 65W) .................................................................................................. 45
6-4 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 Desktop Processor
Series (Quad Core 45W) ......................................................................................... 46
6-5 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 and i3-2000 Desktop
Processor Series (Dual Core 35W) ........................................................................... 47
6-6 Thermal Solution Performance above TCONTROL for the Intel® Core™ i7-2000 and
i5-2000 Desktop Processor Series (Quad Core 95W) ................................................... 48
6-7 Thermal Solution Performance above TCONTROL for the Intel® Core™ i7-2000 and
i5-2000 Desktop Processor Series (Quad Core 65W) and Intel® Core™ i3-2000
Desktop Processor Series (Dual Core 65W) ............................................................... 49
6-8 Thermal Solution Performance above TCONTROL for the Intel® Core™ i5-2000
Desktop Processor Series (Quad Core 45W) ............................................................... 50
6-9 Thermal Solution Performance above TCONTROL for the Intel® Core™ i5-2000 and
i3-2000 Desktop Processor Series (Dual Core 35W) .................................................... 51
8-1 DTS 1.1 Thermal Solution Performance above TCONTROL............................................ 74
8-2 Fan Speed control example for 95W TDP processor1 ................................................... 75
8-3 Thermal Solution Performance above TCONTROL ........................................................ 77
9-1 Reference Thermal Solutions ................................................................................... 79
10-1 Use Conditions (Board Level) ................................................................................... 89
11-1 Fan Heatsink Power and Signal Specifications............................................................. 97
11-2 Fan Heatsink Power and Signal Specifications........................................................... 101

8Thermal/Mechanical Specifications and Design Guidelines
Revision History
§
Revision
Number Description Revision Date
001 • Initial release January 2011
002 • Minor edits for clarity January 2011

Thermal/Mechanical Specifications and Design Guidelines 9
Introduction
1Introduction
The goal of this document is to provide thermal and mechanical specifications for the
processor and the associated socket. The usual design guidance is also included.
The components described in this document include:
• The thermal and mechanical specifications for the following Intel®desktop
processors:
—Intel
® Core™ i7-2000 desktop processor series
—Intel
® Core™ i5-2000 desktop processor series
—Intel
® Core™ i3-2000 desktop processor series
• The LGA1155 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The reference design thermal solution (heatsink) for the processors and associated
retention hardware.
The Intel® Core™ i7-2000, i5-2000 and i3-2000 desktop processor series has the
different thermal specifications. When required for clarity, this document will use:
—Intel
® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)
—Intel
® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 65W)
—Intel
® Core™ i3-2000 desktop processor series (Dual Core 65W)
—Intel
® Core™ i5-2000 desktop processor series (Quad Core 45W)
—Intel
® Core™ i5-2000 and i3-2000 desktop processor series (Dual Core 35W)
Note: When the information is applicable to all products the this document will use
“processor” or “processors” to simplify the document.

Introduction
10 Thermal/Mechanical Specifications and Design Guidelines
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Location Notes
2nd Generation Intel®Core™ Processor Family Desktop Datasheet,
Volume 1 http://
download.intel.com/
design/processor/
datashts/324641.pdf
2nd Generation Intel®Core™ Processor Family Desktop Datasheet,
Volume 2 http://
download.intel.com/
design/processor/
datashts/324642.pdf
2nd Generation Intel®Core™ Processor Family Desktop Specification
Update http://
download.intel.com/
design/processor/
specupdt/324643.pdf
4-Wire Pulse Width Modulation (PWM) Controlled Fans Available at http://
www.formfactors.org/
Table 1-2. Terms and Descriptions
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this
example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest
surface.
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal
performance of the package. Component thermal solutions interface with the processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the
socket contacts.
PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and
Intel® Flexible Display Interface (Intel® FDI).
LGA1155 socket The processor mates with the system board through this surface mount, 1155-land socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication
channel between Intel processor and chipset components to external monitoring devices.
CA Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance
using total package power. Defined as (TCASE – TLA) / Total Package Power. The heat source should always
be specified for measurements.
CS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance
using total package power. Defined as (TCASE – TS) / Total Package Power.
SA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using
total package power. Defined as (TS– TLA) / Total Package Power.
TCASE or TCThe case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.
TCASE_MAX The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock
modulation and/or operating frequency and input voltage adjustment when the die temperature is very
near its operating limits.

Thermal/Mechanical Specifications and Design Guidelines 11
Introduction
§
TCONTROL Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan
speed control. When DTS > Tcontrol, the processor must comply to the TTV thermal profile.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not
the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum
operating temperature.
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor
case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor
case to the heatsink.
TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to
evaluate thermal solutions.
TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be
measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is usually measured
at the chassis air inlets.
Table 1-2. Terms and Descriptions (Continued)
Term Description

Introduction
12 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 13
Package Mechanical & Storage Specifications
2Package Mechanical & Storage
Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1155 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package
components and how they are assembled together. Refer to Chapter 3 and Chapter 4
for complete details on the LGA1155 socket.
The package components shown in Figure 2-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM not shown.
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
Core (die) TIM
LGA1155 Socket

Package Mechanical & Storage Specifications
14 Thermal/Mechanical Specifications and Design Guidelines
2.1.1 Package Mechanical Drawing
Figure 2-2 shows the basic package layout and dimensions. The detailed package
mechanical drawings are in Appendix D. The drawings include dimensions necessary to
design a thermal solution for the processor. These dimensions include:
1. Package reference with tolerances (total height, length, width, and so on)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keep-
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
Figure 2-2. Package View
37.5
37.5

Thermal/Mechanical Specifications and Design Guidelines 15
Package Mechanical & Storage Specifications
2.1.3 Package Loading Specifications
Ta b l e 2 - 1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum
thermal solution.
2.1.4 Package Handling Guidelines
Ta b l e 2 - 2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from an LGA1155 socket 15 times. The
socket should meet the LGA1155 socket requirements detailed in Chapter 5.
2.1.6 Processor Mass Specification
The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all
the components that are included in the package.
Table 2-1. Processor Loading Specifications
Parameter Minimum Maximum Notes
Static Compressive Load - 600 N [135 lbf] 1, 2, 3
Dynamic Compressive Load - 712 N [160 lbf] 1, 3, 4
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 311 N [70 lbf] 1, 4
Tensile 111 N [25 lbf] 2, 4
Torque 3.95 N-m [35 lbf-in] 3, 4

Package Mechanical & Storage Specifications
16 Thermal/Mechanical Specifications and Design Guidelines
2.1.7 Processor Materials
Tab l e 2 - 3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-3. Processor Top-Side Markings
Sample (QDF):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
Production (SSPEC):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: COUNTRY OF ORIGIN
GRP1LINE5: {FPO} {e4}
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
S/N

Thermal/Mechanical Specifications and Design Guidelines 17
Package Mechanical & Storage Specifications
2.1.9 Processor Land Coordinates
Figure 2-4 shows the bottom view of the processor package.
.
Figure 2-4. Processor Package Lands Coordinates
AY
AV
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
N
R
K
J
G
E
C
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39
2 4 6 8 101214 1618202224 2628303234 36 38 40

Package Mechanical & Storage Specifications
18 Thermal/Mechanical Specifications and Design Guidelines
2.2 Processor Storage Specifications
Tab l e 2 - 4 includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by
applicable JEDEC standard Non-adherence may affect processor reliability.
3. TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags or desiccant.
4. Intel branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by TSUSTAINED STORAGE and customer shelf life in applicable intel box and bags.
§
Table 2-4. Storage Conditions
Parameter Description Min Max Notes
TABSOLUTE STORAGE The non-operating device storage temperature.
Damage (latent or otherwise) may occur when
subjected to for any length of time.
-55 °C 125 °C 1, 2, 3
TSUSTAINED STORAGE The ambient storage temperature limit (in
shipping media) for a sustained period of time. -5 °C 40 °C 4, 5
RHSUSTAINED STORAGE The maximum device storage relative humidity
for a sustained period of time. 60% @ 24 °C 5, 6
TIMESUSTAINED STORAGE A prolonged or extended period of time; typically
associated with customer shelf life.
0
Months
6
Months 6

Thermal/Mechanical Specifications and Design Guidelines 19
LGA1155 Socket
3LGA1155 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power and ground contacts. The socket contains
1155 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate which is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in Chapter 5.
Figure 3-1. LGA1155 Socket with Pick and Place Cover

LGA1155 Socket
20 Thermal/Mechanical Specifications and Design Guidelines
3.1 Board Layout
The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package
land to PCB land offset which ensures a single PCB layout for socket designs from the
multiple vendors.
Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
10
16
12
14
18
24
20
22
26
28
30
15
11
13
17
23
19
21
25
31
27
29
33
39
35
37
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40