Intel P67 User manual

USER'S MANUAL
Of
Intel P67 Express Chipset
Based
M/B for Intel LGA 1155 Processors
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
NO. G03-HI08-F
Rev: 1.0
Release in: December, 2010

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
ENVIROMENTAL SAFETY INSTRUCTION .............................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEN CHECK LIST ...................................................................................................................iv
COOLING SOLUTIONS ............................................................................................................iv
CHAPTER 1 INTRODUCTION OF P67 EXPRESS CHIPSET MOTHERBOARDS
1-1 MOTHERBOARD SPECIFICATION...........................................................................1
1-2 SPECIAL FEATURES OF MOTHERBOARD.............................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS.......................................................................4
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................4
2-3 INSTALLING CPU.......................................................................................................5
2-3-1 ABOUT INTEL LGA 1155 CPU SOCKET ....................................................5
2-3-2 LGA 1155 CPU INSTALLATION GUIDE......................................................6
2-3-3 INTEL REFERENCE THERMAL SOLUTION ASSEMBLY..........................7
2-4 INSTALL MEMORY ....................................................................................................8
2-5 EXPANSION CARDS INSTALLATION ......................................................................9
2-5-1 EXPANSION SLOTS.....................................................................................9
2-5-2 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................9
2-5-3 INSTALLING CROSSFIRE/SLI CARD BRIDGE...........................................10
2-6 CONNECTORS AND HEADERS................................................................................11
2-6-1 I/O BACK PANEL CONNECTORS...............................................................12
2-6-2 INTERNAL CONNECTORS..........................................................................14
2-6-3 INTERNAL HEADERS AND OTHERS.........................................................14
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................17
3-2 BIOS MENU SCREEN ................................................................................................17
3-3 FUNCTION KEYS .......................................................................................................18
3-4 GETTING HELP ..........................................................................................................18
3-5 MAIN BAR...................................................................................................................18
3-6 MAIN MENU................................................................................................................18
3-7 ADVANCED MENU.....................................................................................................19
3-8 CHIPSET MENU..........................................................................................................23
3-9 BOOT MENU...............................................................................................................25
3-10 SECURITY MENU.......................................................................................................26
3-11 SAVE & EXIT MENU...................................................................................................26
3-12 HOW TO UPDATE BIOS ............................................................................................27
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
4-1 INSTALLATION INSTRUCTION....................................................................................28
4-2 AHCI/RAID INSTALL INTEL AHCI /RAID DRIVER ......................................................29
4-3 JETWAY HAMMER UNIQUE OVERLOCK TOOL........................................................30
4-3-1 FUNCTION LAYOUT.............................................................................................30
4-3-2 UPDATE ZONE......................................................................................................30
4-3-3 HOW TO USE JETWAY HAMMER UNIQUE OVERLOCK UTILITY....................31
4-3-4 MONITOR ZONE....................................................................................................32
4-3-5 INFORMATION ZONE...........................................................................................33
TABLE OF CONTENT

iii
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THESE
MOTHER-BOARDS TO MEET THE USER’S REQUIREMENTS. BUT IT WILL CHANGE, CORRECT
AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition December, 2010
Item Checklist
5Intel P67 Expresschipset based motherboard
5User’s manual
5DVD for motherboard utilities
5Cable Package
5SLI Bridge
5I/O Back Panel Shield
Intel Core Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial while building computer systems.
Maintaining the proper thermal environment is the key to reliable, long-term system
operation. The overall goal in providing the proper thermal environment is keeping the
processor below its specified maximum case temperature. Heat sinks induce
improved processor heat dissipation through increased surface area and
concentrated airflow from attached fans. In addition, interface materials allow effective
transfers of heat from the processor to the heat sink. For optimum heat transfer, Intel
recommends the use of thermal grease and mounting clips to attach the heat sink to
the processor.
When selecting a thermal solution for your system, please refer to Intel official website
for collection of heat sinks evaluated and recommended by Intel.

1
Chapter 1
Introduction of P67 Express Chipset Motherboards
1-1 Motherboard Specification
Spec Description
Design zATX form factor; PCB size: 30.5x24.5cm
Chipset zIntel P67 Express Chipset
CPU Socket
zIntel LGA 1155 socket Intel® Core™ i7 Processor, Intel® Core™ i5
Processor, Intel® Core™ i3 Processor
* for detailed CPU support information please visit our website
Memory Sockets
zDDRIII module sockets x 4
zSupport 4pcs DDRIII1066/ DDRIII 1333 MHz memory modules
expandable to 16GB.
zSupport Dual- channel function
Expansion Slots
z1 psc* PCI-Express2.0 x1 slot
z1 psc* PCI-Express 2.0 x16 slot by 16 lane
z1 psc* PCI-Express 2.0 x16 slot by 8 lane
z1 psc* PCI-Express 2.0 x16 slot by 4 lane
z2 pcs *32-bit PCI slot
SATA2 & SATA3
zSupports four internal Serial ATAII ports providing 3.0 Gb/sec data
transfer rate and two SATAIII devices providing 6.0 Gb/sec data
transfer rate
zSupport RAID 0,1,5,10
Gigabit LAN Chip
zIntegrated Gigabit LAN chip
zSupports Fast Ethernet LAN function provide10Mb/100Mb/ 1Gb /s
data transfer rate
8-CH HD Audio z8-channel HD Audio Codec integrated
zSupport 8-channel 3D surround & Positioning Audio
zAudio driver and utility included
BIOS zAMI 64 MB Flash ROM
Multi I/O
zOptical S/PDIF Out connector x1
zCoaxial S/PDIF Out connector x1
zPS/2 keyboard connector x1
zRJ-45 LAN connector x1
zUSB 2.0 port x 8 and headers x 2
zUSB 3.0 port x 2
zAudio connector x1 (8-CH Audio)
zFront panel audio header x1
zCDIN header x1
zHDMI-SPDIF header x1
zParallel port header x1
zSerial Port header x1
zFront panel header x1
zPower LED header x1
zSpeaker header x 1

2
1-2 Special Features of motherboard
CPU Smart Fan—The Noise Management System
It’s never been a good idea to gain the performance of your system by sacrificing its acoustics. CPU
Smart Fan Noise Management System is the answer to control the noise level needed for now-a-day’s
high performance computing system. The system will automatically increase the fan speed when CPU
operating loading is high, after the CPU is in normal operating condition, the system will low down the
fan speed for the silent operating environment. The system can provide the much longer life cycle for
both CPU and the system fans for game use and business requirements.
CPU Vcore 7-Shift—Shift to Higher Performance
The CPU voltage can be adjusted up by 7 stages for the precisely over-clocking of extra demanding
computing performance.
Debug Port—The Professional Hardware Diagnosis System
Being bugged of abnormal system failure through the tossed and turned nights no more, the embedded
Hardware Debug Port offers you the real-time visual system healthy for the demanding usage of
computing. No more bugging by unknown system failure and no more time wasted in the first moment
of 24-hour nonstop ping business computing, the embedded Debug Port will turn you into a well
training hardware professional with the seeing system situation. (The Post Code please refer
Appendix)
OC-CON Solid Capacitors—High-polymer Solid Electrolysis Aluminum Capacitors
OC-CON solid capacitors make it possible for motherboard to work from 55 degrees Centigrade below
zero to 125 degrees centigrade. OC-CON capacitors possess superior physical characteristics to
prolong product life ten times than corresponding motherboard without capacitors every time working
temperature increases 20 degrees. Life of product of motherboard with solid capacitors declines only
10% of those without solid capacitors as well under same conditions.
E.R.P. Standards—Energy Using Product Standards
The full name of E.R.P. Standards is Energy Using Product Standards, obviously technology utilized to
low power consumption. ERP is a technology with remarkable power saving function.
3D Audio—3D Audio Sound Effect
OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances bass effect under
the 100MHz range to perfect audio effect, brings you stunning shock experience in video game,
true-to-life simulated feeling when watching films and the greatest touch as that in the concert. There is
a 3D Audio button integrated on the board. Press down the button to enable 3D audio effect or press
again to disabled it.
DIY Clear
This CMOS Buttons (CMOS1) is to facilitate the clear COMS process for power user overclocking
function. The user can easily clear or restore COMS settings by pressing down the button, without
taking trouble to remove the case and locate the jumper for clear CMOS. （Please remove or turn off
the power supply before COMS clear）
Power on Button
You can easily start the computer by pressing down this button for a few seconds, without troubling
yourself to locate the front panel jumpers to find the Power on jumper.
Reset Button
You can easily restart the computer by pressing down this button for a few seconds, without troubling
yourself to locate the front panel jumpers to find the reset jumper.

3
1-3 Layout Diagram
CPU Socket
A
TX Power Conn.
PCI Slot
CPUFAN1
CDIN Header
Power LED Heade
r
S
p
eake
r
Heade
r
HDMI-SPDIF
Heade
r
Front Panel
Audio Header
USB 2.0
Headers Front Panel Header
3D Audio Button
Line-OUT
Serial-ATA2
Connector
ATX 12V
Power Connector
RJ-45 LAN Port Line-IN
MIC-IN
RS-OUT
CS-OUT
DDR3 Socket x 4
(DIMM1~DIMM4)
SS-OUT
USB 2.0 Ports
Over PS/2 Keyboar
d
Port
Coaxial
SPDIF_OUT
PCI Express 2.0 x16 by 16 Lane
Reset Button
JBAT
Gigabit LAN Chip
8-CH HD
Audio Connecto
r
POWER＿CAP
USB 2.0 Ports
USB 3.0 Port
PS/2 Keyboard Port
Intel P67 Chipset
64MB Flash ROM
8-CH HD
Audio Chip
PCI Express2.0 x1
SYSFAN
RJ-45 Ove
r
USB 2.0 Ports
G.P.I. LED
Debug port
CMOS Clea
r
Button
Optical
S/PDIF OUT
Coaxial
S/PDIF_OUT
CMOS Clear
Button
Optical
S/PDIF_OUT
USB 3.0 Port
s
USB 2.0 Port
s
SYSFAN
Parallel Port Header
Serial Port Header
JP1
PCI Ex
p
res
s
2.0
x
16 b
y
8 Lane
PCI Express 2.0 x16 by 4 Lane
PCI Slot
USB 2.0 Ports
USB 2.0 Ports
Serial-ATA3
Connector

4
Chapter 2
Hardware Installation
WARNING! Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect hard disk and front panel /back panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) CMOS RAM Clear (3-pin): JBAT
A battery must be used to retain the motherboard configuration in CMOS RAM
short 1-2 pins of JBAT to store the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power.
2. Remove ATX power cable from ATX power connector.
3. Locate JBAT and short pins 2-3 for a few seconds.
4. Return JBAT to its normal setting by shorting pins 1-2.
5. Connect ATX power cable back to ATX power connector.
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
CMOS RAM Clear Setting
2-3 Closed: Clear CMOS
JBATJBAT
1-2 Closed: Normal

5
(2) KB/MS Power on Function Enabled/Disabled: JP1
KB/MS Power On Setting
2-3 Closed: KB/MS Power ON Enabled
JP1
JP1
1-2 Closed: KB/MS Power ON Disable (Default)
2-3 Installing CPU
2-3-1 About Intel LGA 1155 CPU Socket
This motherboard provides an 1155-pin DIP, LGA 1155 Land Grid Array socket,
referred to as the LGA 1155 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTED! Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA 1155
socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the CPU
has a corner pin for two of the four corners, the CPU will only fit in the orientation as
shown.
When you install the CPU into the LGA 1155 socket, there’s no force required CPU
insertion; then press the level to locate position slightly without any extra force.
Pin-1
Indicator
Alignment key