Kingston Technology KHX16C10B1RK2/16X User manual

DESCRIPTION
Kingston's KHX16C10B1RK2/16X is a kit of two 1G x 64-bit
(8GB) DDR3-1600 CL10 SDRAM (Synchronous DRAM) 2Rx8
memory modules, based on sixteen 512M x 8-bit DDR3 FBGA
components per module. Each module kit supports Intel®XMP
(Extreme Memory Profiles). Total kit capacity is 16GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 10-10-10 at 1.5V. The SPDs are programmed
to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
Document No. 4806495-001.A00 08/16/12 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.460 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0oC to 85oC
Storage Temperature -55oC to +100oC
*Power will vary depending on the SDRAM used.
FEATURES
•JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
•VDDQ = 1.5V (1.425V ~ 1.575V)
•667MHz fCK for 1333Mb/sec/pin
•8 independent internal bank
•Programmable CAS Latency: 9, 8, 7, 6
•Posted CAS
•Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
•Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
•8-bit pre-fetch
•Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
•Bi-directional Differential Data Strobe
•Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
•On Die Termination using ODT pin
•Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
•Asynchronous Reset
•PCB : Height 1.180” (30.00mm), double sided component
Memory Module Specifications
KHX16C10B1RK2/16X
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-1600 CL10 240-Pin DIMM Kit
Continued >>
XMP TIMING PARAMETERS
•JEDEC: DDR3-1333 CL9-9-9 @1.5V
•XMP Profile #1: D3-1600 CL10-10-10 @1.5V

Document No. 4806495-001.A00 Page 2
continued HyperX
MODULE WITH HEAT SPREADER
MODULE DIMENSIONS
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
Units: millimeters
30.00
18.80
15.80
11.00
8.00
0.00
133.35
0.00
54.70
TECHNOLOGY