Kontron COMe-mAL10 User manual


USER GUIDE
COMe-mAL10
Doc. User Guide, Rev. 1.3
Doc. ID: 1061-1952

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
COME
-MAL10 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue
1.0 Initial version 2017-May-29
1.1 Updated BIOS setup options in chapters 3.3.2 Using an External SPI Flash
and 6.5.1: Updating Procedure
Corrected eDP maximum resolution value
Removed NMI, SMI and SCI functions in Table 18
Added MTBF information in chapter 2.7 Standards and Certifications
Added chapter 3.7: GPIO
Updated pin-B 101 comments, company name to Kontron S&T AG, and
port information for Kontron’s security solution
2018-Jan-31
1.2 Corrected product description 34008
‐
0832
‐
11
‐
4/34008
‐
0800
‐
11
‐
4.
Removed part number 34099-0000-99-2.
Included heatsink 34099-0000-99-0/34099-0000-99-1.
Included metal heat slug dimensions and information in Ch.2.5.1 and 2.8.3
2018-May-23
1.3 Updated SLC information in Chapters 2.3.13 and 3.1. 2019-Apr-01
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide.
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam from an electrical device. Eye
protection per manufacturer notice shall review before servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron’s Technical Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version,
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack the product in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements where possible. Many of the
components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled.
Final disposition of this product after its service life must be accomplished in accordance with applicable country,
state, or local laws or regulations.
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE

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Table of Contents
Symbols.................................................................................................................................................................................................................6
Table of Contents.............................................................................................................................................................................................10
List of Tables .....................................................................................................................................................................................................12
List of Figures....................................................................................................................................................................................................12
1/ Introduction .........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................13
1.3. COM Express® Documentation.............................................................................................................................................................13
1.4. COM Express® Functionality .................................................................................................................................................................14
1.5. COM Express® Benefits...........................................................................................................................................................................14
2/ Product Specification .......................................................................................................................................................................15
2.1. Module Variants ........................................................................................................................................................................................15
2.1.1. Commercial Grade Modules (0°C to +60°C)...................................................................................................................................15
2.1.2. Industrial Temperature Grade Modules (E2, -40°C to +85°C) ................................................................................................15
2.2. Accessories.................................................................................................................................................................................................16
2.3. Functional Specifications.......................................................................................................................................................................17
2.3.1. Block Diagram COMe-mAL10 .............................................................................................................................................................17
2.3.2. Processors...............................................................................................................................................................................................18
2.3.3. Platform Controller Hub (PCH).........................................................................................................................................................19
2.3.4. System Memory ....................................................................................................................................................................................19
2.3.5. Graphics....................................................................................................................................................................................................19
2.3.6. LVDS..........................................................................................................................................................................................................20
2.3.7. Audio.........................................................................................................................................................................................................20
2.3.8. PCI Express (PCIE) Lanes [0-3]........................................................................................................................................................20
2.3.9. USB.............................................................................................................................................................................................................21
2.3.10. SATA.........................................................................................................................................................................................................21
2.3.11. Ethernet..................................................................................................................................................................................................22
2.3.12. COMe High-speed Serial Interfaces Overview .........................................................................................................................22
2.3.13. Storage Features................................................................................................................................................................................23
2.3.14. BIOS/Software Features..................................................................................................................................................................23
2.3.15. COMe Features....................................................................................................................................................................................23
2.3.16. Kontron Features................................................................................................................................................................................23
2.4. Electrical Specification ..........................................................................................................................................................................24
2.4.1. Power Supply Voltage Specification ..............................................................................................................................................24
2.4.2. Power Management ...........................................................................................................................................................................24
2.4.3. Power Supply Control Settings ....................................................................................................................................................... 25
2.4.4. Power Supply Modes.......................................................................................................................................................................... 25
2.5. Thermal Management ........................................................................................................................................................................... 27
2.5.1. Heatspreader Plate (HSP) Assembly and Metal Heat Slug..................................................................................................... 27
2.5.2. Active/Passive Cooling Solutions................................................................................................................................................... 27
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly.............................................................................................. 27
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly....................................................................................... 27
2.5.5. On-board Fan Connector ................................................................................................................................................................... 27
2.6. Environmental Specification................................................................................................................................................................29
2.6.1. Humidity...................................................................................................................................................................................................29
2.7. Standards and Certifications ...............................................................................................................................................................30
2.8. Mechanical Specification.......................................................................................................................................................................31

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2.8.1. Module Dimensions ..............................................................................................................................................................................31
2.8.2. Module Height........................................................................................................................................................................................31
2.8.3. Heatspreader Dimensions .................................................................................................................................................................31
3/ Features and Interfaces .................................................................................................................................................................33
3.1. eMMC Flash Memory.............................................................................................................................................................................. 33
3.2. LPC................................................................................................................................................................................................................33
3.3. Serial Peripheral Interface (SPI) .........................................................................................................................................................33
3.3.1. SPI boot ....................................................................................................................................................................................................34
3.3.2. Using an External SPI Flash..............................................................................................................................................................34
3.3.3. External SPI Flash on Modules with Intel® Management Engine ........................................................................................ 35
3.4. Fast I2C .......................................................................................................................................................................................................35
3.5. UART.............................................................................................................................................................................................................35
3.6. Dual Staged Watchdog Timer (WTD)................................................................................................................................................ 35
3.6.1. Watchdog Timer Signal.......................................................................................................................................................................36
3.7. GPIO..............................................................................................................................................................................................................36
3.8. Real Time Clock (RTC)............................................................................................................................................................................36
3.9. Trusted Platform Module (TPM 2.0).................................................................................................................................................36
3.10. Kontron Security Solution................................................................................................................................................................... 37
3.11. SpeedStep™ Technology..................................................................................................................................................................... 37
4/ System Resources ............................................................................................................................................................................38
4.1. Interrupt Request (IRQ) Lines ..............................................................................................................................................................38
4.2. Memory Area ............................................................................................................................................................................................38
4.3. I/O Address Map......................................................................................................................................................................................39
4.4. Peripheral Component Interconnect (PCI) Devices .....................................................................................................................40
4.5. I2C Bus.........................................................................................................................................................................................................40
4.6. System Management (SM) Bus...........................................................................................................................................................41
5/ COMe Interface Connector.............................................................................................................................................................42
5.1. X1A Signals..................................................................................................................................................................................................42
5.1.1. Connector X1A Row A 1 - A110............................................................................................................................................................44
5.1.2. Connector X1A Row B1 – B110 ...........................................................................................................................................................48
6/ uEFI BIOS .............................................................................................................................................................................................. 52
6.1. Starting the uEFI BIOS............................................................................................................................................................................. 52
6.2. Setup Menus .............................................................................................................................................................................................53
6.2.1. Main Setup Menu..................................................................................................................................................................................54
6.2.2. Advanced Setup Menu........................................................................................................................................................................ 55
6.2.3. Chipset Setup Menu ............................................................................................................................................................................62
6.2.4. Security Setup Menu........................................................................................................................................................................... 72
6.2.5. Boot Setup Menu..................................................................................................................................................................................74
6.2.6. Save and Exit Setup Menu..................................................................................................................................................................75
6.3. The uEFI Shell............................................................................................................................................................................................ 76
6.3.1. Basic Operation of the uEFI Shell .................................................................................................................................................... 76
6.4. uEFI Shell Scripting..................................................................................................................................................................................77
6.4.1. Startup Scripting....................................................................................................................................................................................77
6.4.2. Create a Startup Script........................................................................................................................................................................77
6.4.3. Example of Startup Scripts................................................................................................................................................................77
6.5. Firmware Update......................................................................................................................................................................................77
6.5.1. Updating Procedure ..............................................................................................................................................................................77
About Kontron ..................................................................................................................................................................................................80

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List of Tables
Table 1: Type 10 and COMe-mAL10 Functionality ..................................................................................................................................14
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................15
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)................................................................ 15
Table 4: Product Specific Accessories.......................................................................................................................................................16
Table 5: COMe Type 10 Accessories ...........................................................................................................................................................16
Table 6: General COMe Accessories...........................................................................................................................................................16
Table 7: Specification of the COMe-mAL10 Processor Variants .......................................................................................................18
Table 8: ATX Mode Settings .........................................................................................................................................................................26
Table 9: Single Supply Mode Settings ......................................................................................................................................................26
Table 10: Heatspreader Temperature Specifications.......................................................................................................................... 27
Table 11: 3-Pin Fan Connector Pin Assignment .....................................................................................................................................28
Table 12: Electrical Characteristics of the Fan Connector .................................................................................................................28
Table 13: Temperature Grade Specifications .........................................................................................................................................29
Table 14: Humidity Specification ................................................................................................................................................................29
Table 15: Supported BIOS Features ...........................................................................................................................................................33
Table 16: SPI Boot Pin Configuration .........................................................................................................................................................34
Table 17: Supported SPI Boot Flash Types for 8-SOIC Package.......................................................................................................34
Table 18: Dual Staged Watchdog Timer- Time-Out Events...............................................................................................................36
Table 19: Interrupt Requests........................................................................................................................................................................38
Table 20: Designated Memory Location..................................................................................................................................................38
Table 21: Designated I/O Port Address .................................................................................................................................................... 39
Table 22: I2C Bus Port Address...................................................................................................................................................................40
Table 23: SMBus Address ..............................................................................................................................................................................41
Table 24: General Signal Description........................................................................................................................................................43
Table 25: Connector X1A Row A Pin Assignment (A1-A110) ...............................................................................................................44
Table 26: Connector X1A Row B Pin Assignment (B1-B110)...............................................................................................................48
Table 27: Navigation Hot Keys Available in the Legend Bar.............................................................................................................. 52
Table 28: Main Setup Menu Sub-screens and Functions ..................................................................................................................54
Table 29: Advanced Setup menu Sub-screens and Functions......................................................................................................... 55
Table 30: Chipset Set > North Bridge Sub-screens and Function ...................................................................................................62
Table 31: Chipset Set> South Bridge Sub-screens and Functions................................................................................................... 63
Table 32: Chipset Set> Uncore Configuration Sub-screens and Functions ................................................................................. 65
Table 33: Chipset>South Cluster Configuration Sub-screens and Functions ............................................................................. 67
Table 34: Security Setup Menu Sub-screens and Functions ............................................................................................................ 72
Table 35: Boot Setup Menu Sub-screens and Functions ................................................................................................................... 74
Table 36: Save and Exit Setup Menu Sub-screens and Functions ...................................................................................................75
Table 37: List of Acronyms .......................................................................................................................................................................... 79
List of Figures
Figure 1: Block Diagram COMe-mAL10.......................................................................................................................................................17
Figure 2: Module Dimensions.......................................................................................................................................................................31
Figure 3: Heatspreader and Metal Heat Slug Dimensions.................................................................................................................32
Figure 4: X1A COMe Interface Connector .................................................................................................................................................42
Figure 5: Main Setup Menu Initial Screen ................................................................................................................................................ 54
Figure 6: Advanced Setup Menu Initial Screen ...................................................................................................................................... 55
Figure 7: Chipset > North Bridge Menu Initial Screen.......................................................................................................................... 62
Figure 8: Chipset>South Bridge Menu Initial Screen............................................................................................................................63
Figure 9: Chipset>Uncore Configuration Menu Initial Screens.........................................................................................................64
Figure 10: Chipset>South Cluster Configuration Menu Initial Screen ............................................................................................ 67
Figure 11: Security Setup Menu Initial Screen......................................................................................................................................... 72
Figure 12: Boot Setup Menu Initial Screen...............................................................................................................................................74
Figure 13: Save and Exit Setup Menu Initial Screen...............................................................................................................................75

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1/ Introduction
1.1. Product Description
The COMe-mAL10 is small form factor COM Express® Type 10 Computer On-Module based on the Intel® Apollo Lake®
series of processors Atom™, Pentium® and Celeron®, with an integrated chipset. The COMe-mAL10 combines
increased efficiency and performance with TDP as low as 6 W and no more than 12 W, with Intel’s® extensive HD
Graphics capabilities.
The main COMe-mAL10 features are:
Intel® Apollo Lake® series of processors with integrated chipset
Small form factor COM Express® Mini Type 10 pinout, compatible with the PICMG COM.0 Rev 2.1 specification
Up to 8 GByte DDR3L memory down (non-ECC for commercial variants /ECC for Industrial variants)
High-speed connectivity 4x PCI Express, 1x 1 Gb Ethernet, 2x USB 3.0 (incl. USB 2.0) + 6x USB 2.0, 2x SATA Gen.3
Support for both commercial and Industrial temperature grade environments
1.2. Product Naming Clarification
COM Express® defines a Computer-on-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product name for Kontron COM Express® Computer-On-Modules
consists of:
Industry standard short form
COMe-
Module form factor
b=basic (125mm x 95mm)
c=compact (95mm x 95mm)
m=mini (84mm x 55mm)
Intel’s processor code name
AL = Apollo Lake
Pinout type
Type 10
Type 6
Available temperature variants
Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S)
Processor Identifier
Chipset identifier (if chipset assembled)
Memory size
Memory module (#G) / eMMC pseudo SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. For more
information about the COM Express® specification, visit the PICMG® website.

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1.4. COM Express® Functionality
All Kontron COM Express® mini modules contain one 220-pin connector containing two rows called row A & row B.
The COM Express® mini Computer-On-Module (COM) features the following maximum amount of interfaces
according to the PCI Industrial Computer Manufacturers Group (PICMG) module pinout type.
Table 1: Type 10 and COMe-mAL10 Functionality
Feature Type 10 COMe-mAL10
HD Audio 1x 1x
Gbit Ethernet 1x 1x
Serial ATA 2x 2x
Parallel ATA
PCI
PCI Express x 1 4x Up to 4x
PCI Express x16 (PEG)
USB Client 1x 1x (Port 7 is dual role Client/Host)
USB 2x USB 3.0
8x USB 2.0
2x USB 3.0 (Including USB 2.0)
6x USB 2.0
LVDS (eDP) Single channel Single channel LVDS with optional eDP overlay
DP++ (DP/HDMI/DVI) 1x 1x
LPC 1x 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
SDIO shared w/GPIO 1x optional 1x
UART (2-wire COM) 2x 2x
FAN PWM out 1x 1x
Express Card 2x 2x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as highly integrated computer. All Kontron COM Express® modules are very compact and feature
a standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is
based on the COM Express® specification. This standardization allows designers to create a single-system baseboard
that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market

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2/ Product Specification
2.1. Module Variants
The COMe-mAL10 is available in different processor, memory and temperature variants to cover demands in
performance, price and power. The following tables list the module variants for the commercial and industrial
temperature grade.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number Product Name Description
34008
‐
0832
‐
11
‐
4 COMe-mAL10 N4200 8G/32S COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Pentium® N4200, 8GB DDR3L memory down,
32GB eMMC pSLC, commercial temperature
34008
‐
0800
‐
11
‐
4 COMe-mAL10 N4200 8G COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Pentium® N4200, 8GB DDR3L memory down,
commercial temperature
34008
‐
0408
‐
11
‐
2 COMe-mAL10 N3350 4G/8S COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Celeron® N3350, 4GB DDR3L memory down,
8GB eMMC pSLC, commercial temperature
34008
‐
0400
‐
11
‐
2 COMe-mAL10 N3350 4G COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Celeron® N3350, 4GB DDR3L memory down,
commercial temperature
2.1.2. Industrial Temperature Grade Modules (E2, -40°C to +85°C)
Table 3: Product Number for Industrial Grade Modules (-40°C to +85°C operating)
Product Number Product Name Description
34009
‐
0832
‐
16
‐
7 COMe-mAL10 E2 E3950
8E/32S
COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x7 E3950, 8GB DDR3L ECC memory
down, 32GB eMMC pSLC, industrial temperature
34009
‐
0800
‐
16
‐
7 COMe-mAL10 E2 E3950 8E COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x7 E3950, 8GB DDR3L ECC memory
down, industrial temperature
34009
‐
0832
‐
16
‐
5 COMe-mAL10 E2 E3940
8E/32S
COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x5 E3940, 8GB DDR3L ECC memory
down, 32GB eMMC pSLC, industrial temperature
34009
‐
0400
‐
16
‐
5 COMe-mAL10 E2 E3940 4E COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x5 E3940, 4GB DDR3L ECC memory
down, industrial temperature
34009
‐
0408
‐
13
‐
5 COMe-mAL10 E2 E3930
4E/8S
COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x5 E3930, 4GB DDR3L ECC memory
down, 8GB eMMC pSLC, industrial temperature
34009
‐
0400
‐
13
‐
5 COMe-mAL10 E2 E3930 4E COM Express® mini pin-out type 10 Computer-on-Module
with Intel® Atom™ x5 E3930, 4GB DDR3L ECC memory
down, industrial temperature

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2.2. Accessories
Accessories are either COMe-mAL10 product specific, Type 10 COMe pinout specific, or general COMe accessories. For
more information, contact your local Kontron sales representative or Kontron Inside Sales.
Table 4: Product Specific Accessories
Part Number
Heatspreader Description
34009
‐
0000
‐
99
‐
0 HSP COMe-mAL10 E2 thread Heatspreader for COMe-mAL10 commercial and
industrial grade, threaded mounting holes
34009
‐
0000
‐
99
‐
1 HSP COMe-mAL10 E2 through Heatspreader for COMe-mAL10 commercial and
industrial grade, through holes
34009
‐
0000
‐
99
‐
2 HSP COMe-mAL10 E2 slim thread Slimline heatspreader 6.5mm for COMe-mAL10
commercial and industrial grade, threaded
mounting holes
34009
‐
0000
‐
99
‐
3 HSP COMe-mAL10 E2 slim through Slimline heatspreader 6.5mm for COMe-mAL10
commercial and industrial grade, through holes
Table 5: COMe Type 10 Accessories
Part Number COMe Carrier Description
34105-0000-00-x COM Express®
Reference Carrier-i Type 10 TNIx
nITX carrier for industrial temperature
34101-0000-00-2 COM Express®
Eval Carrier Type 10 Gen 2
ATX Carrier with 8 mm COMe connector
Part Number COMe Adapter / Card Description
96007-0000-00-8 ADA-Type10-Mezzanine COMe mini stand-alone carrier or adapter card
96006-0000-00-1 COMe POST T10 POST Code / Debug Card
38019-0000-00-1 ADA-COMe-Height-single Height Adapter
Table 6: General COMe Accessories
Part Number Cooling Solutions Description
34099-0000-99-0 COMe-mini Active Uni cooler Heatsink, to be mounted on HSP
34099-0000-99-1 COMe-mini Passive Uni cooler Heatsink, to be mounted on HSP
Part Number Mounting Description
34017-0000-00-0 COMe mount KIT 5/8 mm 1 set Mounting Kit for 1 module including screws for
5 mm and 8 mm connectors

COMe-mAL10 – User Guide, Rev. 1.3
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2.3. Functional Specifications
2.3.1. Block Diagram COMe-mAL10
The following figure displays the system block diagram applicable to all COMe-mAL10 modules.
Figure 1: Block Diagram COMe-mAL10

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2.3.2. Processors
The Intel® Apollo Lake® series of processors use the 14 nm process technology, with 24 mm x 31 mm package size,
FCBGA 1296.
In general, the Intel® Apollo Lake® series of processors support the following technologies:
Intel® 64 Architecture
Idle States
Intel® Virtualization Technology (VT-x) and Virtualization Technology for Directed I/O (VT-d)
Secure Boot
Enhanced Intel Speedstep® Technology
Thermal Monitoring Technologies
Intel® HD Audio Technology
Intel® Identity Protection Technology
Intel® AES New Instructions
Secure Key
The following table lists the Intel® Apollo Lake processors specifications compatible with the COMe-mAL10.
Table 7: Specification of the COMe-mAL10 Processor Variants
Intel® Atom™ Atom® Atom™ Pentium® Celeron®
x7 E3950 x5 E3940 x5 E3930 N4200 N3350
# of Cores 4 4 2 4 2
# of Threads 4 4 2 4 2
Processor Base
Frequency
1.6 GHz 1.6 GHz 1.3 GHz 1.1 GHz 1.1 GHz
Burst Frequency 2 GHz 1.8 GHz 1.8 GHz 2.5 GHz 2.4 GHz
Thermal Design
Power (TDP)
12 W 9.5 W 6.5 W 6 W 6 W
Memory Types DDR3L-1600 DDR3L-1600 DDR3L-1600 DDR3L-1866 DDR3L-1866
Max.#
Memory Channels
2 2 2 2 2
Max. Memory
Size
8 GB 8 GB 8 GB 8 GB 8 GB
Max. Memory
Bandwidth
25.60 GB/s 25.60 GB/s 25.60 GB/s 29.86 GB/s 29.86 GB/s
ECC Memory
Supported Supported Supported Not supported Not supported
Graphics HD Graphics
505
HD Graphics
500
HD Graphics
500
HD Graphics
505
HD Graphics
500
PCIe Express
Configurations
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
4 x1
2 x1 + 1 x2
2 x2
1 x4
Max. # PCIe Lanes 4 4 4 4 4

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2.3.3. Platform Controller Hub (PCH)
The Intel® Apollo Lake® processor family is a System on Chip (SoC) solution, including an integrated chipset.
The following table lists specific PCH features.
USB 2x USB 3.0 (Including USB 2.0)
6x USB 2.0
VT-d Supported
SATA RAID Not supported
2.3.4. System Memory
The system memory supports a single DDR3L memory down configuration with a capacity of up to 8 GB. The
maximum data transfer rate is 1866 MT/s for commercial temperature graded variants (non ECC). For industrial
variants (ECC), the transfer rate is limited to 1600 MT/s.
The following table lists specific system memory features.
Memory Down 4 GB and 8 GB - DDR3L
Non ECC (for commercial temperature grade)
ECC (for industrial temperature grade)
Peak Bandwidth 29.86 GB/s (for commercial temperature grade)
25.60 GB/s (for Industrial temperature grade)
2.3.5. Graphics
2.3.5.1. Digital Display Interfaces
Using DP 1.2 ‘Multi Media Stream Transport’ it is possible to have two independent displays on DDIO. In total, a
maximum of three independent displays are possible if including LVDS.
The COMe-mAL10 supports the following digital display interfaces (DDIs):
2x DP 1.2 on DDIO
1x eDP 1.4/LVDS
For the DP++ interface, it is recommended to use DP-to-HDMI and DP-to-DVI dongles that
are compliant to the VESA DisplayPort Dual-Mode Standard only.
Otherwise there might be display detection issues, if dongles are used with FET level shifter
for DDC translation.

COMe-mAL10 – User Guide, Rev. 1.3
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2.3.5.2. Display Resolution
The following table lists the maximum display resolution of the supported display interfaces.
Display Interfaces Maximum Resolution
eDP 3840 x 2160 @ 60 Hz
DP 1.2 (++) 4096 x 2160 @ 60 Hz
HDMI 1.4 3840 x 2160 @ 30 Hz
DVI-D 3840 x 2160 @ 30 Hz
At 4K/UHD resolution, to increase link margin a DP redriver on the carrier is recommended.
2.3.6. LVDS
Single channel LVDS with one pixel per clock and up to 24-bit color is available. The eDP to LVDS bridge is only
necessary for LVDS support and can be removed if LVDS signals are optionally overlaid with eDP signals.
The following table lists the basic LVDS features.
LVD Channels 1x
LVDS Bits / Pixel 24-bit color
LVDS Maximum Resolution Depending on available panels (up to 1920 x 1280)
PWM Backlight Control Supported
Supported Panel Data JILI / EDID / VESA DisplayID
2.3.7. Audio
The Intel HDA link allows for a maximum of one codec to be connected.
2.3.8. PCI Express (PCIE) Lanes [0-3]
Four high-speed PCI Express Gen2.0 lanes support the PCIe lane configurations options (4 x1), (2 x1 + 1 x2), (2 x2), and
(1 x4) allowing for up to four separate external PCI devices.
The default configuration is (4x1) and supports four separate PCI devices if LAN is not supported. If LAN is supported,
only three external PCI devices can be used, as LAN uses the fourth PCIe lane (PCIe #4).
The following table lists the supported PCI Express lane configurations.
COMe
Lane
SoC High-speed
I/O Port
Configuration 1(*)
(4 x1)
Configuration 2
(2 x1 + 1 x2)
Configuration 3
(2 x2)
Configuration 4
(1 x4)
PCIE_0 PCIe #0 x1 x1 x2 x4
PCIE_1 PCIe #1 x1 x1
PCIE_2 PCIe #2 x1 x2 x2
PCIE_3 PCIe #3 x1
GBEO_MDI# PCIE #4 LAN (*) LAN LAN LAN
(
*
) In Configuration 1, if LAN is implemented only three external PCIe devices can be used at the same time.