Kontron COMe-bKL6 User manual


USER GUIDE
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COMe-bKL6
Doc. User Guide Rev.1.2
Doc. ID: 1061-1954

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
COME
-BKL6 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

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Revision History
Revision Brief Description of Changes Date of Issue
1.0 Initial version 2017-July-05
1.1 Updated BIOS set up option information in Chapters 3.2.2 and 6.5.1
Updated test Information in Chapter Standards and Certifications
2017-Aug-22
1.2 Updated Kontron to Kontron S&T AG, added a GPIO Chapter and
Updated the BIOS Setup information in Advanced menu and Chipset
menu.
2018-Jan-23
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products
. Failure to observe the precautions indicated and/or
prescribed by the law may endanger your life/health and/or result in
damage to your
material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols .................................................................................................................................................................................................................6
For Your Safety....................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ...............................................................................................................................................................................................9
List of Tables.......................................................................................................................................................................................................11
List of Figures ....................................................................................................................................................................................................12
1/ Introduction..........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................13
1.3. COM Express® Documentation.............................................................................................................................................................13
1.4. COM Express® Functionality .................................................................................................................................................................14
1.5. COM Express® Benefits...........................................................................................................................................................................14
2/ Product Specification ........................................................................................................................................................................15
2.1. Module Variants ........................................................................................................................................................................................15
2.1.1. Commercial Grade Modules (0°C to +60°C)...................................................................................................................................15
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C) ...................................................................................................15
2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C)..............................................................................................16
2.2. Accessories.................................................................................................................................................................................................16
2.3. Functional Specifications.......................................................................................................................................................................19
2.3.1. Block Diagram COMe-bKL6 ................................................................................................................................................................19
2.3.2. Processor................................................................................................................................................................................................20
2.3.3. Platform Controller Hub .....................................................................................................................................................................21
2.3.4. System Memory ....................................................................................................................................................................................21
2.3.5. Graphics...................................................................................................................................................................................................22
2.3.6. LVDS..........................................................................................................................................................................................................22
2.3.7. Audio.........................................................................................................................................................................................................23
2.3.8. PCI Express (PCIE) Configuration....................................................................................................................................................23
2.3.9. USB............................................................................................................................................................................................................ 25
2.3.10. SATA........................................................................................................................................................................................................25
2.3.11. Ethernet..................................................................................................................................................................................................25
2.3.12. COMe High-speed Serial Interfaces Overview .........................................................................................................................26
2.3.13. Storage Features................................................................................................................................................................................ 27
2.3.14. BIOS/Software Features.................................................................................................................................................................. 27
2.3.15. COMe Features.................................................................................................................................................................................... 27
2.3.16. Kontron Features................................................................................................................................................................................ 27
2.4. Electrical Specification ..........................................................................................................................................................................28
2.4.1. Power Supply Voltage Specifications............................................................................................................................................28
2.4.2. Power Management ...........................................................................................................................................................................28
2.4.3. Power Supply Control Settings .......................................................................................................................................................29
2.4.4. Power Supply Modes..........................................................................................................................................................................29

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2.5. Thermal Management ............................................................................................................................................................................31
2.5.1. Heatspreader and Active or Passive Cooling Solutions............................................................................................................31
2.5.2. Active or Passive Cooling Solutions................................................................................................................................................31
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly...............................................................................................31
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly........................................................................................31
2.5.5. On Board Fan Connector ....................................................................................................................................................................32
2.6. Environmental Specification................................................................................................................................................................ 33
2.6.1. Temperature...........................................................................................................................................................................................33
2.6.2. Humidity..................................................................................................................................................................................................33
2.7. Standards and Certifications ...............................................................................................................................................................34
2.8. Mechanical Specification...................................................................................................................................................................... 35
2.8.1. Dimensions ............................................................................................................................................................................................. 35
2.8.2. Height.......................................................................................................................................................................................................35
2.8.3. Heatspreader Dimensions ................................................................................................................................................................ 36
3/ Features and Interfaces.................................................................................................................................................................. 37
3.1. LPC................................................................................................................................................................................................................. 37
3.2. Serial Peripheral Interface (SPI) ......................................................................................................................................................... 37
3.2.1. SPI boot ....................................................................................................................................................................................................38
3.2.2. Using an External SPI Flash..............................................................................................................................................................38
3.2.3. External SPI flash on Modules with Intel® ME...........................................................................................................................39
3.3. Fast I2C........................................................................................................................................................................................................39
3.4. UART ............................................................................................................................................................................................................39
3.5. Dual Staged Watchdog Timer (WTD)................................................................................................................................................39
3.5.1. WDT Signal..............................................................................................................................................................................................40
3.6. Real Time Clock (RTC)............................................................................................................................................................................40
3.7. GPIO..............................................................................................................................................................................................................40
3.8. Trusted Platform Module (TPM 2.0)..................................................................................................................................................41
3.9. Kontron Security Solution......................................................................................................................................................................41
3.10. SpeedStep® Technology.......................................................................................................................................................................41
3.11. Intel® Optane™ Memory.......................................................................................................................................................................41
4/ System Resources.............................................................................................................................................................................43
4.1. Interrupt Request (IRQ) Lines ..............................................................................................................................................................43
4.2. Memory Area ............................................................................................................................................................................................43
4.3. I/O Address Map......................................................................................................................................................................................44
4.4. Peripheral Component Interconnect (PCI) Devices .....................................................................................................................45
4.5. I2C Bus.........................................................................................................................................................................................................45
4.6. System Management (SM) Bus..........................................................................................................................................................46
5/ COMe Interface Connectors...........................................................................................................................................................47
5.1. X1A and X1B Signals .................................................................................................................................................................................47
5.2. X1A and X1B Pin Assignment................................................................................................................................................................48
5.2.1. Connector X1A Row A1 - A110 ............................................................................................................................................................49
5.2.2. Connector X1A Row B1 - B100 .......................................................................................................................................................... 52
5.2.3. Connector X1B Row C1 - C110............................................................................................................................................................ 55
5.2.4. Connector X1B Row D1 - D110...........................................................................................................................................................58
6/ uEFI BIOS................................................................................................................................................................................................61
6.1. Starting the uEFI BIOS..............................................................................................................................................................................61
6.2. Setup Menus .............................................................................................................................................................................................62
6.2.1. Main Setup Menu..................................................................................................................................................................................63
6.2.2. Advanced Setup Menu........................................................................................................................................................................ 65

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6.2.3. Chipset Setup Menu ............................................................................................................................................................................ 76
6.2.4. Security Setup Menu...........................................................................................................................................................................86
6.2.5. Boot Setup Menu..................................................................................................................................................................................87
6.2.6. Save and Exit Setup Menu.................................................................................................................................................................88
6.3. The uEFI Shell............................................................................................................................................................................................90
6.3.1. Basic Operation of the uEFI Shell ....................................................................................................................................................90
6.4. uEFI Shell Scripting..................................................................................................................................................................................91
6.4.1. Startup Scripting....................................................................................................................................................................................91
6.4.2. Create a Startup Script........................................................................................................................................................................91
6.4.3. Examples of Startup Scripts .............................................................................................................................................................91
6.5. Firmware Update.....................................................................................................................................................................................92
6.5.1. Updating Procedure .............................................................................................................................................................................92
About Kontron .................................................................................................................................................................................................. 95
List of Tables
Table 1: Pin Assignment of Type 6 and COMe-bKL6 .............................................................................................................................14
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)................................................................15
Table 3: Product Number for Industrial Grade Modules including Rapid Shutdown (R E2S, -40°C to +85°C operating)16
Table 4: Product Accessories - COMe-bKL6............................................................................................................................................16
Table 5: COMe Type 6 Accessories .............................................................................................................................................................16
Table 6: General Accessories........................................................................................................................................................................17
Table 7: Memory Modules - COMe-bKL6..................................................................................................................................................18
Table 8: Processor Specifications..............................................................................................................................................................20
Table 9: Heatspreader Test Temperature Specifications...................................................................................................................31
Table 10: 3-Pin Fan Connector Pin Assignment..................................................................................................................................... 32
Table 11: Electrical Characteristics of the Fan Connector .................................................................................................................. 32
Table 12: Temperature Grade Specifications ......................................................................................................................................... 33
Table 13: Humidity Specification................................................................................................................................................................. 33
Table 14: Standards and Certification Compliance ..............................................................................................................................34
Table 15: Supported BIOS Features ........................................................................................................................................................... 37
Table 16: SPI Boot Pin Configuration.........................................................................................................................................................38
Table 17: Supported SPI Boot Flash Types for 8-SOIC Package.......................................................................................................38
Table 18: Dual Stage Watchdog Timer- Time-out Events .................................................................................................................40
Table 19: Interrupt Requests........................................................................................................................................................................43
Table 20: Designated Memory Locations................................................................................................................................................43
Table 21: Designated I/O Port Address Ranges.....................................................................................................................................44
Table 22: I2C Bus Port Addresses ..............................................................................................................................................................45
Table 23: SMBus Addresses.........................................................................................................................................................................46
Table 24: General Signal Description........................................................................................................................................................48
Table 25: Connector X1A Row A Pin Assignment (A1-A110) ...............................................................................................................49
Table 26: Connector X1A Row B Pin Assignment (B1-B110)............................................................................................................... 52
Table 27: Connector X1B Row C Pin Assignment (C1-C110)................................................................................................................ 55
Table 28: Connector X1B Row D Pin Assignment (D1-D110) ..............................................................................................................58
Table 29: Navigation Hot Keys Available in the Legend Bar...............................................................................................................61
Table 30: Main Setup Menu Sub-screens ...............................................................................................................................................64
Table 31: Advanced Setup menu Sub-screens and Functions.......................................................................................................... 65
Table 32: Chipset Set > System Agent Configuration Sub-screens and Functions................................................................... 76
Table 33: Chipset Set > PCH-IO Configuration Sub-screens and Functions ................................................................................80
Table 34: Security Setup Menu Functions...............................................................................................................................................86
Table 35: Boot Setup Menu Functions...................................................................................................................................................... 87
Table 36: Save and Exit Setup Menu Functions.....................................................................................................................................88
Table 37: List of Acronyms ..........................................................................................................................................................................93

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List of Figures
Figure 1: COMe-bKL6 Functional Block Diagram....................................................................................................................................19
Figure 2: Module Dimensions...................................................................................................................................................................... 35
Figure 3: Module Height ................................................................................................................................................................................ 35
Figure 4: Heatspreader Location and Dimensions ............................................................................................................................... 36
Figure 5: X1A and X1B COMe Interface Connectors...............................................................................................................................47
Figure 6: Main Setup Menu Initial Screens.............................................................................................................................................. 63
Figure 7: Advanced Setup Menu Initial Screen....................................................................................................................................... 65
Figure 8: System Agent Configuration Menu Initial Screen............................................................................................................... 76
Figure 9: PCH-IO Configuration Menu Initial Screen............................................................................................................................80
Figure 10: Security Setup Menu Initial Screen........................................................................................................................................86
Figure 11: Boot Setup Menu Initial Screen................................................................................................................................................87
Figure 12: Save and Exit Setup Menu Initial Screen..............................................................................................................................88

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1/ Introduction
1.1. Product Description
The COMe-bKL6 is a basic form factor COM Express® type 6 Computer-On-Module based on the Intel® 7th Generation
Core™ series family of processors, known as Kaby Lake-H within this user guide. The COMe-bKL6 supports additional
communication interfaces via a separate chipset Intel’s® mobile (CM238 or QM175). The Kaby Lake–H combines
increased efficiency and performance with TDP as low as 25 W, and no more then 45 W, with Intel’s ® HD Graphics
Gen9 capabilities.
Basic COMe-bKL6 features are:
Intel® 7th Generation Core™ series, Kaby Lake-H family with CM238/QM175
Up to 32 GByte with 2 x DDR4-2400 SO-DIMM (non-ECC/ECC)
High-speed connectivity 8x PCIe x1, 1x PEG x16, 1x 1 Gb Ethernet, 4x USB 3.0 (incl. USB 2.0) + 4x USB 2.0
Support for both commercial and Industrial temperature grade environments
1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules
consist of:
Short form of the industry standard
COMe-
Module form factor
b=basic (125mm x 95mm)
c=compact (95mm x 95mm)
m=mini (84mm x 55mm)
Intel’s® processor code name
KL = Kaby Lake
Pinout type
Type 6
Type10
Available temperature variants
Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)
Processor Identifier
Chipset identifier (if chipset assembled)
Memory size
Memory module (#G) / eMMC SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available on the PICMG® website.

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1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220 pin connectors. Each connector has two rows
called Row A & B on the primary connector and Row C & D on the secondary connector. COM Express® Computer-On-
Modules feature the following maximum amount of interfaces according to the PICMG module pinout type.
Table 1: Pin Assignment of Type 6 and COMe-bKL6
Feature Type 6 Pinout COMe-bKL6 Pinout
HD Audio 1x 1x
Gbit Ethernet 1x 1x
Serial ATA 4x 4x
PCI Express x 1 8x 8x
PCI Express x16 (PEG) 1x 1x
USB Client 1x (optional) 1x (optional)
USB 4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
VGA 1x 1x optional DP to VGA converter
LVDS (eDP) Dual Channel Dual Channel LVDS with option to
overlay (eDP)
DP++ (DP/HDMI/DVI) 3x 3x
LPC 1x 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
SDIO shared w/GPIO
UART (2-wire COM) 2x 2x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM is based on the COM Express® specification. This standardization allows designers to create a single-system
baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

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2/ Product Specification
2.1. Module Variants
The COMe-bKL6 is available in different processor, chipset and temperature variants to cover demands in
performance, price and power.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Table 2: Product Number for Commercial Grade Modules (0°C to +60°C operating)
Product Number Product Name Description
38032-0000-30-4 COMe-bKL6 E3-1505M CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505M v6, 4x3.0GHz,
CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-22-4 COMe-bKL6 E3-1505L CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505L v6, 4x2.2GHz,
CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-30-7 COMe-bKL6 i7-7820EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i7-7820EQ, 4x3.0GHz, QM175
PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-29-5 COMe-bKL6 i5-7440EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i5-7440EQ, 4x2.9GHz, QM175
PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-21-5 COMe-bKL6 i5-7442EQ QM175 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i5-7442EQ, 4x2.1GHz, QM175
PCH, GT2, 2x DDR4 non-ECC SO-DIMM
38032-0000-29-3 COMe-bKL6 i3-7100E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7100E, 2x2.9 GHz, CM238
PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
38032-0000-21-3 COMe-bKL6 i3-7102E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7102E, 2x2.1 GHz, CM238
PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C)
Extended temperature grade modules (E1, -25°C to +75°C) are available as a standard product number, on request.
Contact your local sales representative to find out more about available extended temperature variants.

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2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C)
Industrial temperature grade modules (E2S, -40°C to +85 °C) are available as a project based custom product number.
For further information, contact your local sales representative. Alternatively, consider using the R E2S variants.
2.1.3.1. Rapid Shutdown Industrial Temperature Grade Modules (R E2S, -40°C to +85°C)
The following table lists R E2S modules available with Kontron Rapid Shutdown support and E2 industrial
temperature grade (-40°C to +85°C) by screening.
For Further information regarding the screening process, contact Kontron Support.
Table 3: Product Number for Industrial Grade Modules including Rapid Shutdown (R E2S, -40°C to +85°C operating)
Product Number Product Name Description
38033-0000-30-4 COMe-bKL6R E2S E3-1505M CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505M v6, 4x3.0GHz,
CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM,
Rapid Shutdown, industrial temperature grade
38033-0000-22-4 COMe-bKL6R E2S E3-1505L CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Xeon® E3-1505L v6, 4x2.2GHz,
CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM,
Rapid Shutdown, industrial temperature grade
38033-0000-29-3 COMe-bKL6R E2S i3-7100E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7100E, 2x2.9 GHz,
CM238 PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM,
Rapid Shutdown, industrial temperature grade
38033-0000-21-3 COMe-bKL6R E2S i3-7102E CM238 COM Express® basic pin-out type 6 Computer-on-
Module with Intel® Core™ i3-7102E, 2x2.1 GHz, CM238
PCH, GT2, 2x DDR4 non-ECC/ECC SO-DIMM, Rapid
Shutdown, industrial temperature grade
2.2. Accessories
Accessories are either COMe-bKL6 product specific, type 6 COMe pinout specific, or general accessories including
memory modules. For more information, contact your local Kontron sales representative or Kontron Inside Sales.
Table 4: Product Accessories - COMe-bKL6
Part Number Heatspreader Description
38030-0000-99-0 HSP COMe-bSL6/bKL6 Cu-core threaded For all CPUs and temperature grades
38030-0000-99-1 HSP COMe-bSL6/bKL6 Cu-core through For all CPUs and temperature grades
Table 5: COMe Type 6 Accessories
Part Number COMe Carrier Project
Code
Description
38115-0000-00-x COM Express®
Reference Carrier-i Type 6
ADTI Thin-mITX Carrier with 5 mm COMe
connector
38114-0000-00-0 COM Express®
Reference Carrier Type 6
ADAS mITX Carrier with 8 mm COMe connector
38106-0000-00-0 COM Express®
Eval Carrier Type 6
Topanga
Canyon
ATX Carrier with 5 mm COMe connector

COMe-bKL6 – User Guide Rev.1.2
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Part Number COMe Adapter / Card Project
Code
Description
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for Evaluation
Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (Sandwich) Adapter Card for 3x
DisplayPort
96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
Part Number COMe Starter kit Project
Code
Description
38114-0000-00-S COMe Ref. Starter kit T6 ADAS Starter kit with COMe Reference Carrier T6
38106-0000-00-S COMe Eval. Starter kit T6 Topanga
Canyon
Starter kit with COMe Evaluation Carrier T6
Table 6: General Accessories
Part Number Cooling Solutions Description
38025-0000-99-
0C05
HSK COMe-bHL6/bBL6/bSL6/bKL6 active
(w/o HSP)
For all CPUs and commercial temperature
grade usage, to be mounted on HSP
38025-0000-99-
0C06
HSK COMe-bHL6/bBL6/bSL6/bKL6 passive
(w/o HSP)
For all CPUs and commercial temperature
grade usage, to be mounted on HSP
Part Number Mounting Description
38017-0000-00-5 COMe Mount KIT 5 mm 1 set Mounting Kit for 1 module including screws
for 5 mm connectors
38017-0100-00-5 COMe Mount KIT 5 mm 100 sets Mounting Kit for 100 modules including
screws for 5 mm connectors
38017-0000-00-0 COMe Mount KIT 8 mm 1 set Mounting Kit for 1 module including screws
for 8 mm connectors
38017-0100-00-0 COMe Mount KIT 8 mm 100 sets Mounting Kit for 100 modules including
screws for 8 mm connectors
Part Number Display Adapter Description
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Description
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect fan to module
(COMe basic/compact)
96079-0000-00-2 KAB-HSP 40 mm Cable adapter to connect fan to module
(COMe basic/compact)

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Table 7: Memory Modules - COMe-bKL6
Part Number Memory (validated reference types)
97017-4096-24-0 DDR4-2400 SODIMM 4 GB_COM DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-8192-24-0 DDR4-2400 SODIMM 8 GB_COM DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-1600-24-0 DDR4-2400 SODIMM 16 GB_COM DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SO-
DIMM
97017-4096-24-2 DDR4-2400 SODIMM 4 GB E2_COM DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400
SO-DIMM
97017-8192-24-2 DDR4-2400 SODIMM 8 GB E2_COM DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400
SO-DIMM
97017-1600-24-2 DDR4-2400 SODIMM 16 GB E2_COM DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400
SODIMM
Part Number Memory ECC (validated reference types)
97018-4096-24-0 DDR4-2400 SODIMM 4 GB ECC_COM DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-8192-24-0 DDR4-2400 SODIMM 8 GB ECC_COM DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-1600-24-0 DDR4-2400 SODIMM 16 GB ECC_COM DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400
SO-DIMM
97018-4096-24-2 DDR4-2400 SODIMM 4 GB ECC
E2_COM
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-
2400 SO-DIMM
97018-8192-24-2 DDR4-2400 SODIMM 8 GB ECC
E2_COM
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-
2400 SO-DIMM
97018-1600-24-2 DDR4-2400 SODIMM 16 GB ECC
E2_COM
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-
2400 SO-DIMM

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2.3. Functional Specifications
2.3.1. Block Diagram COMe-bKL6
The following figure displays the system block diagram applicable to all COMe-bKL6 modules.
Figure 1: COMe-bKL6 Functional Block Diagram
LVDS
VGA
SMB
GPIO
Ctrl
Mgmt
HDA
USB
SATA#0-3
SPI
Intel® Mobile CM238 / QM175 PCH
GPIO
PCIe #6-7
PEG x16
USB #0-3
(USB3.0)
PwrCtrl
SysMgmt
PCIe
USB #0-3
(USB2.0)
PWM
FAN2
I2C SER0
SER1
eDP x2
USB #4-7
(USB 2.0)
PCIe #0-5
Intel® 7th Generation Core /
Intel® Xeon E3 v6 Family
Kaby Lake-H Series
LID
Sleep
SPI
BIOS Flash
Connector Option
Standard
component
GB LAN
Embedded Controller
HWM
Gen9
iGFX
FAN1
eDP2
LVDS
COM Express® connector AB – Pinout Type 6
GBLan
Intel® I219LM
VCC
5VSB
VBAT
HWM
SMB
Power sequencing
Watchdog
LPC2I2C GPIO Buffer
I2C
S5eco
EEPROM
TPM
UART
COM Express® connector CD – Pinout Type 6
DDR4 SODIMM
ECC/non-ECC
VCC
DDR4 SODIMM
ECC/non-ECC
xHCI
DP++
CONFIG
x16/x8/x4
PEG Config
CPLD
JTAG
SPD
GBE MAC
Security
Chip
LPC
xHCI
DP2
VGA

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2.3.2. Processor
The Intel® 7th Generation Kaby Lake – H product series of Intel® Xeon® and Core™ processors uses the 14 nm
processor technology with 42 mm x 28 mm package size and BGA 1440.
General processor specifications shared by the Intel® Core™ and Celeron® processor variants are:
Intel® 64 Architecture
Idle States
Intel® Virtualization Technology (VT-x)
Virtualization Technology for Directed I/O (VT-d)
Enhanced Intel Speedstep® Technology
Thermal Monitoring Technology
Intel® AES New Instructions (AES-NI)
OS Guard
Execute Disable Bit
The following table lists the general Intel® Xeon® and Core™ Kaby Lake- H processor specifications.
Not all the items specified in Table 8: Processor Specifications are compatible with the
COMe-bKL6 functional specification. For more information on features supported by the
COMe-bKL6, see the relevant subheading in Chapter 2.3 Functional Specifications.
Table 8: Processor Specifications
Intel®
Kaby lake-H
Processor
Xeon® Xeon® Core™ Core™ Core™ Core™ Core™
E3-1505L
v6
E3-1505M
v6
i7 –
7820EQ
i5-
7442EQ
i5-
7440EQ
i3-
7100E
i3-
7102E
# of Cores 4 4 4 4 4 2 2
# of Threads 8 8 8 4 4 4 4
Processor
Base
Frequency
2.2 GHz 3 GHz 3 GHz 2.1 GHz 2.9 GHz 2.9 GHz 2.1 GHz
Max Turbo
Frequency
3 GHz 4 GHz 3.7 GHz 2.9 GHz 3.6 GHz 2.9 GHZ 2.1 GHz
Thermal
Design
Power (TDP)
25 W 45 W 45 W 25 W 45 W 35 W 25 W
TDP down 35 W 35 W 35 W
Cache 8 MB 8 MB 8 MB 6 MB 6 MB 3 MB 3 MB
Memory
Types
DDR4-2400 DDR4-2400
LPDDR-2133
DDR3L-1600
DDR4-2400 DDR4-2400 DDR4-2400 DDR4-2400 DDR4-2400
Max.# Mem.
Channels
2 2 2 2 2 2 2
Max. Memory
Size
64 GB 64 GB 64 GB 64 GB 64 GB 64 GB 64 GB