Kontron COMe-mCT10 User manual

COMe-mCT10
Document Revision 110
If it's embedded it's Kontron

» Table of Contents «
1User Information.................................................................................................6
1.1 About This Document............................................................................................6
1.2 Co yright Notice.................................................................................................. 6
1.3 Trademarks......................................................................................................... 6
1.4 Standards...........................................................................................................6
1.5 Warranty............................................................................................................7
1.6 Technical Su ort................................................................................................7
2Introduction.......................................................................................................8
2.1 Product Descri tion..............................................................................................8
2.2 Naming clarification.............................................................................................8
2.3 Understanding COM Ex ress® Functionality...............................................................8
2.4 COM Ex ress® Documentation................................................................................9
2.5 COM Ex ress® Benefits..........................................................................................9
3Product S ecification..........................................................................................10
3.1 Modules & Accessories.........................................................................................10
3.2 Functional S ecification......................................................................................12
3.3 Block Diagram................................................................................................... 16
3.4 Electrical S ecification........................................................................................17
3.4.1 Su ly Voltage...................................................................................................17
3.4.2 Power Su ly Rise Time........................................................................................17
3.4.3 Su ly Voltage Ri le..........................................................................................17
3.4.4 Power Consum tion............................................................................................17
3.4.5 ATX Mode.......................................................................................................... 18
3.4.6 Single Su ly Mode.............................................................................................18
3.5 Power Control.................................................................................................... 19
3.6 Environmental S ecification.................................................................................20
3.6.1 Tem erature......................................................................................................20
3.6.2 Humidity..........................................................................................................20
3.7 Standards and Certifications.................................................................................21
3.8 MTBF............................................................................................................... 23
3.9 Mechanical S ecification......................................................................................24
3.9.1 Module Dimension..............................................................................................24
3.9.2 Height on To ....................................................................................................24
3.9.3 Height on Bottom...............................................................................................24
www.kontron.com

3.9.4 Mechanical Drawing............................................................................................ 24
3.10 Thermal Management..........................................................................................25
3.11 Heats reader.....................................................................................................25
3.12 Onboard Fan Connector.......................................................................................26
4Features and Interfaces.......................................................................................27
4.1 Onboard SSD..................................................................................................... 27
4.2 S5 Eco Mode...................................................................................................... 28
4.3 LPC.................................................................................................................. 29
4.4 Serial Peri heral Interface (SPI)............................................................................30
4.5 SPI boot...........................................................................................................30
4.6 M.A.R.S............................................................................................................31
4.7 Fast I2C............................................................................................................32
4.8 EAPI, JIDA & PLD Driver.......................................................................................33
4.9 K-Station 2....................................................................................................... 34
4.10 GPIO - General Pur ose In ut and Out ut.................................................................35
4.11 Dual Staged Watchdog Timer.................................................................................36
4.12 S eedste Technology......................................................................................... 37
4.13 C-States...........................................................................................................38
4.14 Hy er Threading.................................................................................................39
4.15 ACPI Sus end Modes and Resume Events..................................................................40
5System Resources...............................................................................................41
5.1 Interru t Request (IRQ) Lines...............................................................................41
5.2 Memory Area..................................................................................................... 41
5.3 I/O Address Ma .................................................................................................42
5.4 Peri heral Com onent Interconnect (PCI) Devices.....................................................42
5.5 I2C Bus............................................................................................................ 42
5.6 JILI I2C Bus.......................................................................................................42
5.7 SDVO I2C Bus.....................................................................................................43
5.8 System Management (SM) Bus...............................................................................43
5.9 Pinout List........................................................................................................ 44
5.9.1 General Signal Descri tion...................................................................................44
5.9.2 Connector X1A Row A..........................................................................................45
5.9.3 Connector X1A Row B...........................................................................................47
6BIOS O eration..................................................................................................49
4

6.1 Determining the BIOS Version...............................................................................49
6.2 U dating the BIOS..............................................................................................49
6.3 Setu Guide...................................................................................................... 50
6.3.1 Start AMI® A tio Setu Utility..............................................................................50
6.4 BIOS Setu ....................................................................................................... 52
6.4.1 Main Menu........................................................................................................52
6.4.2 Advanced......................................................................................................... 54
6.4.3 Chi set............................................................................................................ 80
6.4.4 Boot................................................................................................................ 88
6.4.5 Security........................................................................................................... 89
6.4.6 Save & Exit........................................................................................................91
5

1 User Information
1.1 About This Document
This document rovides information about roducts from Kontron Embedded Modules GmbH and/or its subsidiaries. No
warranty of suitability, ur ose, or fitness is im lied. While every attem t has been made to ensure that the information
in this document is accurate, the information contained within is su lied “as-is” and is subject to change without notice.
For the circuits, descri tions and tables indicated, Kontron assumes no res onsibility as far as atents or other rights of
third arties are concerned.
1.2 Copyright Notice
Co yright © 2003-2012 Kontron Embedded Modules GmbH
All rights reserved. No art of this document may be re roduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or com uter language, in any form or by any means (electronic, mechanical, hotoco ying,
recording, or otherwise), without the ex ress written ermission of Kontron Embedded Modules GmbH.
DIMM-PC®, PISA®, ETX®, ETXex ress®, microETXex ress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of com onents used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines Cor .
» Microsoft is a registered trademark of Microsoft Cor .
» Intel is a registered trademark of Intel Cor .
» All other roducts and trademarks mentioned in this manual are trademarks of their res ective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
6

1.5 arranty
This Kontron Embedded Modules GmbH roduct is warranted against defects in material and workmanshi for the
warranty eriod from the date of shi ment. During the warranty eriod, Kontron Embedded Modules GmbH will at its
discretion decide to re air or re lace defective roducts.
Within the warranty eriod, the re air of roducts is free of charge as long as warranty conditions are observed.
The warranty does not a ly to defects resulting from im ro er or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, o eration outside of the roduct’s environmental s ecifications or im ro er
installation or maintenance.
Kontron Embedded Modules GmbH will not be res onsible for any defects or damages to other roducts not su lied by
Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH roduct.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical
su ort. We are committed to making our roduct easy to use and will hel you use our roducts in your systems.
Please consult our Web site at htt ://www.kontron.com/su ort for the latest roduct documentation, utilities, drivers
and su ort contacts. Consult our customer section htt ://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Su ort Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board su lier for technical su ort.
7

2 Introduction
2.1 Product Description
The first credit card sized (55mm x 84 mm) COM Ex ress® mini COM based on Intel® 32nm Dual Core technology. Three
erformance versions are availabe from 2x 1.6 GHz u to 2x 1.86 GHz. With onboard memory and o tional flash as well as
divesified gra hics interfaces, the Kontron COMe-mCT10 series is o timized for the Industrial Automation, Infotainment
and Medical markets to deliver outstanding gra hics erformance.
2.2 Naming clarification
COM Ex ress® defines a Com uter-On-Module, or COM, with all com onents necessary for a bootable host com uter,
ackaged as a su er com onent.
» COMe-bXX# modules are Kontron's COM Ex ress® modules in basic form factor (125mm x 95mm), formerly known
as ETXex ress®
» COMe-cXX# modules are Kontron's COM Ex ress® modules in com act form factor (95mm x 95mm), formerly known
as microETXex ress®
» COMe-mXX# modules are Kontron's COM Ex ress® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXex ress
The roduct names for Kontron COM Ex ress® Com uter-on-Modules consist of a short form of the industry standard
(COMe-), the form factor (b=basic, c=com act, m=mini), the ca ital letters for the CPU and Chi set Codenames (XX) and
the in-out ty e (#) followed by the CPU Name.
2.3 Understanding COM Express® Functionality
All Kontron COM Ex ress® basic and com act modules contain two 220 in connectors; each of it has two rows called Row
A & B on rimary connector and Row C & D on secondary connector. COM Ex ress® Com uter-on-modules feature the
following maximum amount of interfaces according to the PICMG module Pin-out ty e:
Feature in-Out Type 1 in-Out Type 10 in-Out Type 2 in-Out Type 6
HD Audio 1x 1x 1x 1x
Gbit Ethernet 1x 1x 1x 1x
Serial ATA 4x 4x 4x 4x
arallel ATA - - 1x -
CI - - 1x -
CI Express x1 6x 6x 6x 8x
CI Express x16 ( EG) - - 1x 1x
USB Client 1x 1x - -
USB 2.0 8x 8x 8x 8x
USB 3.0 - 2x - 4x
VGA 1x - 1x 1x
LVDS Dual Channel Single Channel Dual Channel Dual Channel
D ++ (SDVO/D /HDMI/DVI) 1x o tional 1x 3x shared with PEG 3x
L C 1x 1x 1x 1x
External SMB 1x 1x 1x 1x
External I2C 1x 1x 1x 1x
G IO 8x 8x 8x 8x
SDIO 1x o tional 1x o tional - -
UART (2-wire COM) - 2x - 2x
FAN WM out - 1x - 1x
8

2.4 COM Express® Documentation
This roduct manual serves as one of three rinci al references for a COM Ex ress® design. It documents the
s ecifications and features of COMe-mCT10. Additional references are are available from your Kontron Su ort or from
PICMG®:
» The COM Ex ress® S ecification defines the COM Ex ress® module form factor, in-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The COM Ex ress® Design Guide by PICMG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of COM Ex ress® modules.
Some of the information contained within this roduct manual a lies only to certain
roduct revisions (CE: xxx). If certain information a lies to s ecific roduct revisions (CE:
xxx) it will be stated. Please check the roduct revision of your module to see if this
information is a licable.
2.5 COM Express® Benefits
COM Ex ress® modules are very com act, highly integrated com uters. All Kontron COM Ex ress® modules feature a
standardized form factor and a standardized connector layout that carry a s ecified set of signals. Each COM is based on
the COM Ex ress® s ecification. This standardization allows designers to create a single-system baseboard that can
acce t resent and future COM Ex ress® modules.
The baseboard designer can o timize exactly how each of these functions im lements hysically. Designers can lace
connectors recisely where needed for the a lication on a baseboard designed to o timally fit a system’s ackaging.
A single baseboard design can use a range of COM Ex ress® modules with different size and in-out. This flexibility can
differentiate roducts at various rice/ erformance oints, or to design future roof systems that have a built-in u grade
ath. The modularity of a COM Ex ress® solution also ensures against obsolescence as com uter technology evolves. A
ro erly designed COM Ex ress® baseboard can work with several successive generations of COM Ex ress® modules.
A COM Ex ress® baseboard design has many advantages of a custom, com uter-board design but delivers better
obsolescence rotection, greatly reduced engineering effort, and faster time to market.
9

3 roduct Specification
3.1 Modules & Accessories
The COM Ex ress® mini sized Com uter-on-Module COMe-mCT10 (NUP1) follows in-out Ty e 10 and is com atible to
PICMG s ecification COM.0 Rev 2.0. The COMe-mCT10, based on Intel's Cedar Trail latform, is available in different
variants to cover the demand of different erformance, rice and ower:
Commercial grade modules (0°C to 60°C operating)
roduct Number roduct Name rocessor CH and Features
34005-2040-19-6 COMe-mCT10 D2550 2GB/4GB Cedarview-D Intel® Atom™ D2550 NM10, 3xPCIe, 2GB DDR3, 4GB SLC SSD
34005-2000-19-6 COMe-mCT10 D2550 2GB Cedarview-D Intel® Atom™ D2550 NM10, 3xPCIe, 2GB DDR3, without SSD
34005-1000-19-6 COMe-mCT10 D2550 1GB Cedarview-D Intel® Atom™ D2550 NM10, 3xPCIe, 1GB DDR3, without SSD
34005-1040-19-2 COMe-mCT10 N2800 1GB/4GB Cedarview-M Intel® Atom™ N2800 NM10, 3xPCIe, 1GB DDR3, 4GB SLC SSD
34005-1000-19-2 COMe-mCT10 N2800 1GB Cedarview-M Intel® Atom™ N2800 NM10, 3xPCIe, 1GB DDR3, without SSD
34005-1040-16-2 COMe-mCT10 N2600 1GB/4GB Cedarview-M Intel® Atom™ N2600 NM10, 3xPCIe, 1GB DDR3, 4GB SLC SSD
34005-1000-16-2 COMe-mCT10 N2600 1GB Cedarview-M Intel® Atom™ N2600 NM10, 3xPCIe, 1GB DDR3, without SSD
Extended temperature modules (E1, -25°C to 75°C operating)
roduct Number roduct Name rocessor CH and Features
34005-2040-19-6EXT COMe-mCT10 D2550 2/4GB E1 Cedarview-D Intel® Atom™ D2550 NM10, 3xPCIe, 2GB DDR3, 4GB SLC SSD,
E1
Memory and onboard Flash configurations 34005-MMFF-xx-2:
» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chi s)
» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chi s)
» MM = 40: 4096MB DDR2 Memory (8 x 4Gb chi s)
» FF = 00: without SATA SSD
» FF = 20: 2GB onboard SATA SSD
» FF = 40: 4GB onboard SATA SSD
» FF = 80: 8GB onboard SATA SSD
» FF = 16: 16GB onboard SATA SSD
» FF = 32: 32GB onboard SATA SSD
» FF = 64: 64GB onboard SATA SSD
O tional hardware features:
» TPM
» SDIO
» 2x UART
O tional BIOS features:
» Secure Flash U date
» Secure Boot
» CSM O tOut
10

Accessories
roduct Number Carrier Boards
34101-0000-00-1 COM Ex ress® Eval Carrier Ty e 10
34104-0000-00-0 COM Ex ress® Reference Carrier-i Ty e 10
roduct Number Cooling & Mounting
34005-0000-99-0 HSP COMe-mCT10 thread (11mm)
34005-0000-99-1 HSP COMe-mCT10 through (11mm)
34005-0000-99-2 HSP COMe-mCT10 slim thread (6.5mm)
34005-0000-99-3 HSP COMe-mCT10 slim though (6.5mm)
34099-0000-99-0 COMe mini Active Uni Cooler (for CPUs u to 10W) (Note1)
34099-0000-99-1 COMe mini Passive Uni Cooler (for CPUs u to 5W)
34099-0000-99-2 COMe mini Passive Uni Cooler Slim (for CPUs u to 3-5W)
34017-0000-00-0 COMe mMount Kit 5/8mm 1set
roduct Number Adapter & Cables
96007-0000-00-1 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
96006-0000-00-8 ADA-DP-LVDS (DP to LVDS ada ter)
96082-0000-00-0 KAB-ADAPT-DP-DVI (DP to DVI ada ter cable)
96083-0000-00-0 KAB-ADAPT-DP-VGA (DP to VGA ada ter cable)
96084-0000-00-0 KAB-ADAPT-DP-HDMI (DP to HDMI ada ter cable)
34120-0000-00-2 ADA-COMe-T10-T2 (Ty 1/10 Module to Ty e 2 ada ter)
38019-0000-00-1 ADA-COMe-Height-single (Height ada ter)
Note1: No FAN connector on variants with N2600 CPU
11

3.2 Functional Specification
rocessor
The 32nm Intel® ATOM™ (Cedarview) CPU family su orts:
» Intel® Hy er-Threading Technology
» Intel® 64
» Enhanced Intel S eedSte ® Technology (N2xxx only)
» Thermal Monitoring Technologies
» Execute Disable Bit
» 2 Dis lay Pi es for dual inde endent dis lays
C U specifications
C U Intel® Atom™ D2550 Intel® Atom™ N2800 Intel® Atom™ N2600
Cores 2 2 2
Threads 4 4 4
Clock 1866MHz 1866MHz 1600MHz
Memory Speed DDR3-1066 DDR3-1066 DDR3-800
Max Memory u to 4GB u to 4GB u to 2GB
Cache 1MB 1MB 1MB
C-States C0/C1 C0-C6 / C1E-C4E C0-C6 / C1E-C4E
EIST - YES YES
C U Thermal Management TM1 TM1 & TM2 TM1 & TM2
GFX GMA3650 GMA3650 GMA3600
GFX frequency 640MHz 640MHz 400MHz
LVDS 1×18/24bit 1×18/24bit 1×18/24bit
LVDS Resolution u to 1440×900, 60Hz u to 1366×768, 60Hz u to 1366×768, 60Hz
D Resolution u to 2560×1600, 60Hz u to 1600×1200, 60Hz u to 1600×1200, 60Hz
HDMI/DVI Resolution u to 1920×1200, 60Hz u to 1920×1200, 60Hz u to 1920×1200, 60Hz
AV 1.1 1.1 -
HDC 1.3 1.3 -
Blu-Ray 2.0 layback Yes Yes -
TD 10W 6.5W 3.5W
Memory
Sockets memory down
Memory Type DDR3-800 / 1066
Maximum Size 4GB
Technology Single Channel (64bit)
12

Graphics Core
The integrated SGX545 core based Intel® GMA 3650 / 3600 su orts:
Graphics Core Render Clock 640MHz @ GMA3650 (D2700/N2800), 400MHz @ GMA3600 (N2600),
Execution Units / ixel ipelines 4
Max Graphics Memory 1024MB
GFX Memory Bandwidth (GB/s) 6.4 / 8.5
GFX Memory Technology DVMT
A I (DirectX/OpenGL) 9.0c / 3.0
Shader Model 3.0
Hardware accelerated Video H.264,MPEG2,VC1, Blu-ray
Independent/Simultaneous Displays 2
Display ort DP / eDP 1.1
HDC support HDCP 1.3a / PAVP 1.1c
Monitor output
CRT max Resolution -
TV out: -
LVDS
LVDS Bits/ ixel 1x18 / 1x24
LVDS Bits/ ixel with dithering -
LVDS max Resolution: 1366x768 / 1440x900, 112MHz
WM Backlight Control: YES
Supported anel Data: JILI2/JILI3/EDID/DID
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 DP++
Digital Display Interface DDI2 -
Digital Display Interface DDI3 -
Maximum Resolution on DDI 2560x1600
CH: Intel® NM10 Express Chipset
The 130nm Intel Platform Controller Hub Tiger oint su orts:
» PCI Ex ress Gen 1.0 S eed
» USB 2.0
» HD Audio
» SATA 3Gb/s
Storage
onboard SSD 2-32GB SLC, 2-64GB MLC
SD Card support JMB389A PCIe2SDIO o tional
IDE Interface -
Serial-ATA u to 2x SATA 3Gb/s
SATA AHCI YES
SATA RAID -
With onboard SATA drive only 1 external SATA interface (SATA 0) is available
13

Connectivity
USB 8x USB 2.0
USB Client -
CI -
CI External Masters -
CI Express 3x PCIe x1 Gen1
Max CI Express 4x PCIe x1 without LAN
CI Express x2/x4 configuration YES
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 82574L (Hartwell)
Ethernet
The Intel® 82574L (Hartwell) ethernet su orts:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Audio HD Audio
Onboard Hardware Monitor Nuvoton NCT7802Y
Trusted latform Module Infineon TPM 1.2 SLB9635TT o tional
Miscellaneous 2x UART o tional / PWM FAN
Kontron Features
External I2C Bus Fast I2C, MultiMaster ca able
M.A.R.S. support YES
Embedded A I PICMG EAPI / JIDA32
Custom BIOS Settings / Flash Backup YES
Watchdog support Dual Staged
Additional features
» All solid ca acitors (POSCAP). No tantalum ca acitors used.
» O timized RTC Battery monitoring to secure highest longevity
» Real fast I2C with transfer rates u to 40kB/s.
» Discharge logic on all onboard voltages for highest reliability
14

ower Features
Singly Supply Support YES
Supply Voltage 4.75 - 14V
AC I ACPI 3.0
S-States S0, S3, S4, S5
S5 Eco Mode YES
Misc ower Management DPST 4.0
ower Consumption and erformance
Full Load ower Consumption 6.2 - 12.4W
Kontron erformance Index 2729 - 3734
Kontron erformance/Watt 302 - 437
Detailed Power Consum tion measurements in all states and bechmarks for CPU, Gra hics
and Memory erformance are available in A lication Note KEMAP054 at EMD Customer
Section.
Supported Operating Systems
The COMe-mCT10 su orts:
» Microsoft Windows XP x86
» Microsoft Windows XPembedded
» Microsoft Windows 7 x86
» Microsoft Windows Embedded Standard 7 (WES7)
» Linux
» WindRiver VxWorks
15

3.3 Block Diagram
16

3.4 Electrical Specification
3.4.1 Supply Voltage
Following su ly voltage is s ecified at the COM Ex ress® connector:
VCC: 4.75 - 14V
Standby: 5V DC +/- 5%
- 5V Standby voltage is not mandatory for o eration.
- Extended Tem erature (E1) variants are validated for 12V su ly only
3.4.2 Power Supply Rise Time
» The in ut voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ram of each DC in ut voltage from 10% to 90% of its final set- oint
following the ATX s ecification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV eak to eak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power Consum tion of the different COMe-mCT10 variants is 6.2 - 12.4W (100% CPU load on all cores; 90°C
CPU tem erature). Further information with detailed measurements are available in A lication Note KEMAP054 available
on EMD Customer Section. Information there is available after registration.
17

3.4.5 ATX Mode
By connecting an ATX ower su ly with VCC and 5VSB, PWR_OK is set to low level and VCC is off. Press the Power Button to
enable the ATX PSU setting PWR_OK to high level and owering on VCC. The ATX PSU is controlled by the PS_ON# signal
which is generated by SUS_S3# via inversion. VCC can be 4.75 - 14V in ATX Mode. On Com uter-on-Modules su orting a
wide range in ut down to 4.75V the in ut voltage shall always be higher than 5V Standby (VCC > 5VSB).
State WRBTN# WR_OK V5_StdBy S_ON# VCC
G3 x x 0V x 0V
S5 high low 5V high 0V
S5 S0 →PWRBTN Event low high →5V high low →0 V VCC →
S0 high high 5V low VCC
3.4.6 Single Supply Mode
In single su ly mode (or automatic ower on after ower loss) without 5V Standby the module will start automatically
when VCC ower is connected and Power Good in ut is o en or at high level (internal PU to 3.3V). PS_ON# is not used in
this mode and VCC can be 4.75 - 14V.
To ower on the module from S5 state ress the ower button or reconnect VCC. Sus end/Standby States are not
su orted in Single Su ly Mode.
State WRBTN# WR_OK V5_StdBy VCC
G3 x x x 0
G3 S0 →high o en / high x connecting VCC
S5 high o en / high x VCC
S5 S0 →PWRBTN Event o en / high x reconnecting VCC
Signals marked with “x” are not im ortant for the s ecific ower state. There is no
difference if connected or o en.
All ground ins have to be tied to the ground lane of the carrier board.
18

3.5 Power Control
ower Supply
The COMe-mCT10 su orts a ower in ut from 4.75 - 14V. The su ly voltage is a lied through the VCC ins (VCC) of the
module connector.
ower Button ( WRBTN#)
The ower button (Pin B12) is available through the module connector described in the inout list. To start the module via
Power Button the PWRBTN# signal must be at least 50ms (50ms ≤ t < 4s, ty ical 400ms) at low level (Power Button Event).
Pressing the ower button for at least 4seconds will turn off ower to the module (Power Button Override).
ower Good ( WR_OK)
The COMe-mCT10 rovides an external in ut for a ower-good signal (Pin B24). The im lementation of this subsystem
com lies with the COM Ex ress® S ecification. PWR_OK is internally ulled u to 3.3V and must be high level to ower on
the module.
Reset Button (SYS_RESET#)
The reset button (Pin B49) is available through the module connector described in the inout list. The module will stay in
reset as long as SYS_RESET# is grounded. If available, the BIOS setting for “Reset Behavior” must be set to “Power Cycle”.
Modules with Intel® Chi set and active Management Engine does not allow to hold the
module in Reset out of S0 for a long time. At about 10s holding the reset button the ME will
reboot the module automatically
SM-Bus Alert (SMB_ALERT#)
With an external battery manager resent and SMB_ALERT# (Pin B15) connected the module always owers on even if
BIOS switch “After Power Fail” is set to “Stay Off”.
19

3.6 Environmental Specification
3.6.1 Temperature
General Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended (E1) -25°C to +75°C -30°C to +85°C
Industrial grade (E2) -40°C to +85°C -40°C to +85°C
See available module variants in cha ter Product S ecification
With Kontron Embedded Modules GmbH heatspreader plate assembly
The o erating tem erature defines two requirements:
» the maximum ambient tem erature with ambient being the air surrounding the module.
» the maximum measurable tem erature on any s ot on the heats reader's surface
Without Kontron Embedded Modules GmbH heatspreader plate assembly
The o erating tem erature is the maximum measurable tem erature on any s ot on the module's surface.
3.6.2 Humidity
» O erating: 10% to 90% (non condensing)
» Non o erating: 5% to 95% (non condensing)
20