Kontron ETX-LX2 User manual

The information contained in this document has been carefully researched and is, to the best
of our knowledge, accurate. However, we assume no liability for any product failures or
damages, immediate or consequential, resulting from the use of the information provided
herein. Our products are not intended for use in systems in which failures of product could
result in personal injury. All trademarks mentioned herein are property of their respective
owners. All specifications are subject to change without notice.
Manual
Kontron
ETX-LX2
-

Kontron User's Guide
ETX®-LX2
Document Revision 1.0

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Table of Contents
Kontron User's Guide ETX®-LX2
iv
Table of Contents
1User Information........................................................................................................ 8
1.1 About This Document .........................................................................................8
1.2 Copyright Notice ...............................................................................................8
1.3 Trademarks ......................................................................................................8
1.4 Standards ........................................................................................................8
1.5 Warranty .........................................................................................................8
1.6 Technical Support..............................................................................................9
2Introduction .............................................................................................................10
2.1 ETX®-LX ........................................................................................................10
2.2 ETX® Documentation .......................................................................................10
2.3 ETX® Benefits.................................................................................................10
3Specifications ...........................................................................................................12
3.1 Functional Specifications..................................................................................12
3.2 Mechanical Specifications .................................................................................14
3.2.1 Module dimensions..........................................................................................14
3.3 Memory.........................................................................................................14
3.4 Electrical Specifications....................................................................................14
3.4.1 Supply Voltage................................................................................................14
3.4.2 Supply Voltage Ripple ......................................................................................14
3.4.3 Supply Current 5 V_SB......................................................................................14
3.4.4 Supply Current................................................................................................15
3.4.5 CMOS Battery Power Consumption ......................................................................15
3.5 Environmental Specifications ............................................................................16
3.5.1 Temperature...................................................................................................16
3.5.2 Humidity .......................................................................................................16
3.6 MTBF.............................................................................................................16
4Connector X1 Subsystems ...........................................................................................17
4.1 PCI Bus..........................................................................................................17
4.2 USB ..............................................................................................................17
4.3 Audio............................................................................................................17
4.4 Serial IRQ ......................................................................................................17
4.5 3.3V Power Supply for External Components .........................................................17
5Connector X2 Subsystems ...........................................................................................19
5.1 ISA Bus Slot ...................................................................................................19
6Connector X3 Subsystems ...........................................................................................20

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6.1 VGA Output ....................................................................................................20
6.2 LVDS Flat Panel Interface (JILI)..........................................................................21
6.3 Digital Flat Panel Interface (JIDI).......................................................................21
6.4 Serial Ports (1 and 2) .......................................................................................21
6.5 PS/2 Keyboard................................................................................................21
6.6 PS/2 Mouse....................................................................................................21
6.7 IrDA..............................................................................................................22
6.8 Parallel Port ...................................................................................................22
6.9 Floppy...........................................................................................................22
7Connector X4 Subsystems ...........................................................................................23
7.1 IDE Ports .......................................................................................................23
7.2 Ethernet........................................................................................................23
7.3 Power Control.................................................................................................23
7.3.1 Power Good / Reset Input .................................................................................23
7.4 Power Management .........................................................................................23
7.4.1 ATX PS Control ................................................................................................23
7.5 Miscellaneous Circuits ......................................................................................24
7.5.1 Speaker.........................................................................................................24
7.5.2 Battery..........................................................................................................24
7.5.3 I2C Bus ..........................................................................................................24
7.5.4 SM Bus ..........................................................................................................24
8Special Features ........................................................................................................25
8.1 Watchdog Timer ..............................................................................................25
8.2 SATA.............................................................................................................26
9Design Considerations................................................................................................27
9.1 Thermal Management.......................................................................................27
9.2 Module Dimensions .........................................................................................28
Appendix A: block diagram ...........................................................................................29
10 Appendix B: System Resources ....................................................................................30
10.1 Interrupt Request (IRQ) Lines ............................................................................30
10.2 Direct Memory Access (DMA) Channels.................................................................30
10.3 Memory Area ..................................................................................................31
10.4 I/O Address Map .............................................................................................31
10.5 Peripheral Component Interconnect (PCI) Devices .................................................32
10.6 Inter-IC (I2C) Bus............................................................................................32
10.7 System Management (SM) Bus ...........................................................................32
10.8 JILI-I2C Bus....................................................................................................32
11 Appendix C: BIOS Operation ........................................................................................33

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11.1 Overview........................................................................................................33
11.2 Determining the BIOS Version............................................................................33
11.3 Setup Guide ...................................................................................................33
11.3.1 Starting the BIOS Setup Utility...........................................................................33
11.4 Main Menu .....................................................................................................33
11.4.1 Setup Items ...................................................................................................34
11.5 Standard CMOS Features ...................................................................................36
11.5.1 Primary Master and Slave Submenu.....................................................................37
11.6 Advanced BIOS Features ...................................................................................38
11.7 Advanced Chipset Features................................................................................40
11.8 Integrated Peripherals .....................................................................................42
11.9 Power Management Setup.................................................................................45
11.9.1 IRQ Wakeup Events ..........................................................................................46
11.10 PnP/PCI Configurations ....................................................................................47
11.11 PC Health Status .............................................................................................48
11.12 Load Fail-Safe Defaults.....................................................................................48
11.13 Load Optimized Defaults ...................................................................................48
11.14 Supervisor/User Password Setting ......................................................................48
11.15 Exit Selection .................................................................................................49
12 Appendix D: ETX® Connector Pinouts............................................................................50
12.1 Connector Locations ........................................................................................50
12.2 Signal Description ...........................................................................................51
12.3 Connector X1 (PCI Bus, USB, Audio)....................................................................51
12.3.1 Connector X1 (Signal Levels) .............................................................................52
12.4 Connector X2 (ISA Bus) ....................................................................................54
12.4.1 Connector X2 (Signal Levels) .............................................................................55
12.5 Connector X3 (VGA, LVDS, TTL, COM1 and COM2, LPT/Floppy, Mouse, Keyboard)...........57
12.5.1 Flat-Panel Interfaces........................................................................................57
12.5.2 Parallel Port / Floppy Interfaces .........................................................................58
12.5.3 Connector X3 (Signal Levels) .............................................................................59
12.6 Connector X4 (IDE 1, IDE 2, Ethernet, Miscellaneous) .............................................61
12.6.1 Connector X4 (Signal Levels) .............................................................................62
12.7 Serial ATA connectors.......................................................................................64
12.8 Compact Flash Socket.......................................................................................65
12.8.1 Compact Flash Socket pinout .............................................................................65
13 Appendix F: Limitations .............................................................................................66
13.1 BIOS Limitations .............................................................................................66
13.2 Hardware Limitations.......................................................................................66
13.3 Workaround for drop in supply voltage in AT/single supply mode ..............................67
14 Appendix E: JIDA Standard..........................................................................................68

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14.1 JIDA Information ............................................................................................68
15 Appendix F: PC Architecture Information ......................................................................69
15.1 Buses............................................................................................................69
15.1.1 ISA, Standard PS/2 –Connectors........................................................................69
15.1.2 PCI/104.........................................................................................................69
15.2 General PC Architecture ....................................................................................69
15.3 Ports.............................................................................................................70
15.3.1 RS-232 Serial .................................................................................................70
15.3.2 Serial ATA ......................................................................................................70
15.3.3 USB ..............................................................................................................70
15.4 Programming .................................................................................................70
16 Appendix G: Document-Revision History.......................................................................71

1 User Information
Kontron User's Guide ETX®-LX2
8
1User Information
1.1 About This Document
This document provides information about products from Kontron Embedded Modules GmbH and/or its
subsidiaries. No warranty of suitability, purpose, or fitness is implied. While every attempt has been
made to ensure that the information in this document is accurate, the information contained within is
supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or
other rights of third parties are concerned.
1.2 Copyright Notice
Copyright © 2003-2007 Kontron Embedded Modules GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a
retrieval system, or translated into any language or computer language, in any form or by any means
(electronic, mechanical, photocopying, recording, or otherwise), without the express written permission
of Kontron Embedded Modules GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress™, X-board®, DIMM-IO® and DIMM-BUS® are
trademarks or registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or
registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
äIBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business
Machines Corp.
äMicrosoft is a registered trademark of Microsoft Corp.
äIntel is a registered trademark of Intel Corp.
äAll other products and trademarks mentioned in this manual are trademarks of their
respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
1.5 Warranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and
workmanship for the warranty period from the date of shipment. During the warranty period, Kontron
Embedded Modules GmbH will at its discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are
observed.

1 User Information
Kontron User's Guide ETX®-LX2
9
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling
by the buyer, unauthorized modification or misuse, operation outside of the product’s environmental
specifications or improper installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products
not supplied by Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded
Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available
for technical support. We are committed to making our product easy to use and will help you use our
products in your systems.
Before contacting Kontron Embedded Modules GmbH technical support, please consult our Web site at
http://www.kontron-emea.com/emd for the latest product documentation, utilities, and drivers. If the
information does not help solve the problem, contact us by telephone or email.
Asia
Europe
North/South America
Kontron Asia Inc.
Kontron Embedded Modules GmbH
Kontron America
4F, No.415, Ti-Ding Blvd., NeiHu
District,
Taipei 114, Taiwan
Brunnwiesenstr. 16
94469 Deggendorf –Germany
14118 Stowe Drive
Poway, CA 92064-7147
Tel: [phone]
Tel: [phone]
Tel: [phone]
Fax: + 886 2 2799 7399
Fax: [phone]
Fax: [phone]
mailto:[email protected]
mailto:[email protected]
mailto:[email protected]

2 Introduction
Kontron User's Guide ETX®-LX2
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2Introduction
2.1 ETX®-LX
The ETX®-LX is an ETX® (Embedded Technology eXtended) form factor computer-on-module combining
the extremely low power consumption and high performance of the AMD Geode™ LX 800 Processor with
integrated Northbridge and the AMD CS5536 Companion Device. The LX 800 features a 128KB L2 Cache
and supports DDR400 SODIMM up to 1024 MB.
The ETX®-LX is fully compliant with the ETX® Component SBC™ Specification V3.0. This computer-on-
module features a 32-bit/33MHz PCI Bus Interface, IDE, serial ports, parallel port, Ethernet, Compact
Flash, USB v2.0, LVDS panel support, keyboard/mouse and AC’97 audio. The flexibility of the ETX®
computer-on-module concept allows the baseboard designer to optimize how each of these functions is
physically implemented.
2.2 ETX® Documentation
This product manual serves as one of three principal references for an ETX® design. It documents the
specifications and features of
ETX®-LX modules. The other two references, which are available from the
Kontron Web site, include:
The ETX® Specification defines the ETX® module form factor, pin out, and signals. You should read this
first.
The ETX® Design Guide serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a range of ETX® modules.
2.3 ETX® Benefits
Embedded technology extended (ETX®) modules are very compact (~100mm square, 12mm thick),
highly integrated computers. All ETX® modules feature a standardized form factor and a standardized
connector layout that carry a specified set of signals. This standardization allows designers to create a
single-system baseboard that can accept present and future ETX® modules.
äETX® modules include common personal computer (PC) peripheral functions such as:
äGraphics
äParallel, Serial, and USB ports
äKeyboard/mouse
äEthernet
äSound
äIDE
The baseboard designer can optimize exactly how each of these functions implements physically.
Designers can place connectors precisely where needed for the application on a baseboard designed to
optimally fit a system’s packaging.

2 Introduction
Kontron User's Guide ETX®-LX2
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Peripheral PCI or ISA buses can be implemented directly on the baseboard rather than on mechanically
unwieldy expansion cards. The ability to build a system on a single baseboard using the computer as one
plug-in component simplifies packaging, eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of ETX® modules. This flexibility can differentiate products at
various price/performance points, or to design future proof systems that have a built-in upgrade path.
The modularity of an ETX® solution also ensures against obsolescence as computer technology evolves.
A properly designed ETX® baseboard can work with several successive generations of ETX® modules.
An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.

3 Specifications
Kontron User's Guide ETX®-LX2
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3Specifications
3.1 Functional Specifications
Processor & Northbridge: AMD Geode™ LX 800 @ 500MHz
äAMD Geode™ LX 800 CPU, operates from 200MHz up to 500MHz
äCache: 64KB-I /64KB-D Cache, 128KB L2 Cache
äMMX and 3DNow
äGeodeLink™ Control Processor, Interface Units, Memory Controller, PCI Bridge
äPCI 2.2 compliant 33 MHz operation
äMemory: One unbuffered DDR 266/333/400 DDR SODIMM up to 1024MB
äPCI Bus: 32-bit/33MHz 4 PCI Masters (3,3V only)
äOnboard video graphics array (VGA): Integrated in LX 800
äCRT: 1920x1440x8bpp at 60Hz, 1600x1200x16bpp at 72Hz
äOne channel LVDS 87.5MHz with LVDS Transmitter NS DS90C385A
äLVDS: 1x24bpp (open LDI) or 1x18bpp
äTFT Resolution up to 1024x768 with LVDS variant and 1600x1200 with TTL variant
äReal-Time Clock (RTC) with CMOS RAM
äPower Management Controller —ACPI v2.0 compliant
Southbridge: AMD CS5536 Companion Device
äPrimary IDE: 1 Channel UDMA-66/100 IDE port
äUniversal Serial Bus (USB): 4x USB 2.0
äUSB 1.1 supported by one OHCI-based host controller
äUSB 2.0 supported by one EHCI-based host controller
äAudio Codec ‘97 (AC’97) Controller
äSystem Management Bus (SMB) Controller
äLPC Bus
äWatchdog Timer (WDT)
ISA Bus: Fintek LPC to ISA Bridge F85226FG
äSupports only 8/2x8 bit memory, I/O, IRQ slave feature
PCI to SATA Controller: VIA VT6421A
ä2 Channels Serial ATA Spec. Rev. 1.0, up to 150 MB/s per channel
äSecondary IDE: 1 Channel UDMA-66/100/133 IDE port

3 Specifications
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äOnboard Compact Flash socket (Master on secondary IDE)
Super I/O: Winbond W83627HF LPC Super I/O
äSerial Ports (COM1 and COM2)
äTwo high-speed 16550 compatible UARTs with 16-byte send/receive FIFOs
äTransistor-to-transistor (TTL) signals only
äInfrared Device Association (IrDA) 1.0 SIR interface
äParallel Port (LPT1) - Shared with floppy signals: Enhanced Parallel Port (EPP) and
Extended Capabilities Port (ECP) with bi-directional capability
äFloppy - shared with LPT signals: 360K/720K/1.2M/1.44M/2.88M format; 250K,
300K, 500K, 1M, 2M bps data transfer rate
äIrDA version 1.0 SIR protocol
äPS/2 Keyboard and Mouse
Onboard Ethernet: Davicom DM9102H
ä10BASE-T/100BASE-T LAN
Audio: Realtek ALC203
ä16-bit, full-duplex AC'97 Rev. 2.3 compatible audio CODEC
BIOS: Award, 512KB Flash BIOS
äBIOS support for external super I/O (COM3, COM4, LPT, and Floppy)

3 Specifications
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3.2 Mechanical Specifications
3.2.1 Module dimensions
ä95.0 mm x 114.0 mm (3.75” x 4.5”)
äHeight approx. 10 mm (0.4”)
3.3 Memory
äThe maximum recommended height of a memory module is 2.8mm. SO-DIMM DDR
memory modules not following this specification may cause mounting problems and
contact the heatspreader and/or the LPCtoISA Bridge
äRecommended memory:
256MB: Part No. 97007-2560-00-0
512MB: Part No. 97007-5120-00-0
1024MB: Part No. 97007-1024-00-0
3.4 Electrical Specifications
3.4.1 Supply Voltage
5V DC +/- 5%
3.4.2 Supply Voltage Ripple
Maximum 100 mV peak to peak 0 –20 MHz
3.4.3 Supply Current 5 V_SB
Typical 100 mA

3 Specifications
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3.4.4 Supply Current (preliminary)
Power-consumption tests were executed under DOS and WindowsXP with 512MB of RAM.
DOS:
CPU Clock
500MHz
Mode
Prompt
Standby
Suspend
Power
Consumption
1.5 A
7,4 W
1,3 A
6,45 W
1,3 A
6,45 W
Windows XP:
CPU Clock
500MHz
Mode
Full Load
Idle
Standby S1
Standby S3
Power
Consumption
1.55 A
7,8 W
1,3 A
6,50 W
1,00 A
5,00 W
0,35 W
3.4.5 CMOS Battery Power Consumption
RTC
Voltage
Current
Winbond W83627HF
2.5V
1.6 µA
3.0V
2.7 µA
CMOS battery power consumption was measured with an ETX®-LX module on a standard Kontron ETX®
evaluation board. The system was turned off and the battery was removed from the evaluation board.
The 2.5 V or 3.0 V of power was supplied from a DC power supply. Do not use these values to calculate the
CMOS battery lifetime.

3 Specifications
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3.5 Environmental Specifications
3.5.1 Temperature
Operating: (with Kontron Embedded Modules GmbH heat-spreader plate assembly):
äAmbient temperature: 0 to +60 C
äMaximum Heatspreader-plate temperature: 0 to +60 C (*)
Non-operating: -30 to +85 C
See the Thermal Management chapter for additional information.
Note: *The maximum operating temperature with the Heatspreader plate is the maximum measurable
temperature on any spot on the Heatspreader’s surface. You must maintain the temperature according to
the above specification.
3.5.2 Humidity
äOperating: 10% to 90% (non condensing)
äNon operating: 5% to 95% (non condensing)
3.6 MTBF
The following MTBF (Mean Time between Failure) values were calculated using a combination of
manufacturer’s test data, if the data was available, and a Bellcore calculation for the remaining parts.
The Bellcore calculation used is “Method 1 Case 1”. In that particular method the components are
assumed to be operating at a 50 % stress level in a 40° C ambient environment and the system is
assumed to have not been burned in. Manufacturer’s data has been used wherever possible. The
manufacturer’s data, when used, is specified at 50° C, so in that sense the following results are slightly
conservative. The MTBF values shown below are for a 40° C in an office or telecommunications
environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt
water exposure, etc.) lower MTBF values.
System MTBF (hours): tbd.
Notes: Fans usually shipped with Kontron Embedded Modules GmbH products have 50,000-hour typical operating
life. The above estimates assume no fan, but a passive heat sinking arrangement.
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above figures and
need to be considered for separately. Battery life depends on both temperature and operating conditions.
When the Kontron unit has external power; the only battery drain is from leakage paths.

4 Connector X1 Subsystems
Kontron User's Guide ETX®-LX2
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4Connector X1 Subsystems
4.1 PCI Bus
The implementation of this subsystem complies with the ETX® Specification . Implementation
information is provided in the
ETX® Design Guide . Refer to the documentation for additional
information.
4.2 USB
One OHCI and EHCI USB host controller each supporting both version 1.1 and 2.0 USB standards are on
the Geode™ CS5536 Companion Device. A total of 4 USB ports are provided.
Configuration
The USB controllers are PCI bus devices. The BIOS allocates required system resources during
configuration of the PCI bus.
4.3 Audio
The sound function on the ETX®-LX board comes from an AC’97 controller integrated in the Geode™
CS5536 Companion Device and a Realtek ALC203 AC‘97 Codec. The 20-bit DAC, 18-bit ADC, AC'97 2.3
compatible, full-duplex codec supports a Line In, a Stereo Line Out, and a Mono Microphone In
interface.
Configuration
The audio controller is a PCI bus device. The BIOS allocates required system resources during
configuration of the PCI device.
4.4 Serial IRQ
The serial IRQ pin offers a standardized interface to link interrupt request lines to a single wire.
Configuration
The serial IRQ machine is in “Quiet Mode”, the frame size is 21 frames and the start frame pulse width is
4 clocks.
4.5 3.3V Power Supply for External Components
The ETX®-LX offers the ability to connect external 3.3V devices to the onboard-generated supply
voltage. Pin 12 and Pin 16 of Connector X1 are used to connect to the +3.3V ±5% power supply. The
maximum external load is 500mA. Contact Kontron Embedded Systems Technical Support for help with
this feature.
Warning: Do not connect 3.3 V pins to an external 3.3 V supply!

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Kontron User's Guide ETX®-LX2
18
For additional information, refer to the
ETX® Design Guide , I2C application notes, and JIDA
specifications, all of which are available on the Kontron Embedded Systems Web site.

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5Connector X2 Subsystems
5.1 ISA Bus Slot
The implementation of this subsystem complies with the ETX® Specification . Implementation
information is provided in the
ETX® Design Guide . Refer to the documentation for additional
information.
äLPC type, only supports 8/2x8 bit memory, I/O, IRQ slave feature