Kontron COMe-bSL6 User manual


USER GUIDE
COMe-bSL6
Doc. User Guide Rev. 1.4
Doc. ID: 1060-7484

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 2
This page has been intentionally left blank

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 3

COME
-BSL6
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee
on the part of Kontron with respect to technical processes described in the user guide or any product characteristics
set out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s),
conveys no license or title under any patent, copyright or mask work rights to these products and makes no
representations or warranties that these products are free from patent, copyright or mask work right infringement
unless otherwise specified. Applications that are described in this user guide are for illustration purposes only.
Kontron makes no representation or warranty that such application will be suitable for the specified use without
further testing or modification. Kontron expressly informs the user that this user guide only contains a general
description of processes and instructions which may not be applicable in every individual case. In cases of doubt,
please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products
and thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2018 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 4
High Risk Applications Hazard Notice
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 5
Revision History
Revision Brief Description of Changes Date of Issue
1.0 Initial version 2016-Dec-08
1.1 Updated memory modules part number, added MTBF data and
updated certification information
2017-Jan-31
1.2 New COMe interface connector figure 2017-Mar-16
1.3 Removed LVDS-DVI display adapters, added SATA, updates VGA to
optional, updated BIOS tables with >, and updated BIOS instructions in
Chapter 3.2.2 and Chapter 6.5.1.1.
2017-Aug-22
1.4 Added GPIO feature information, added Kontron S&T AG, updated BIOS
setup Advanced menu & Chipset menu, and changed pin A52/A53 text.
2018-Apr-24
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order
Terms & Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 6
Symbols
The following symbols may be used in this user guide.
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive
to static electricity. Care must therefore be taken during all handling operations and
inspections of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam from an electrical device. Eye
protection per manufacturer notice shall review before servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 7
For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform to the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while the product is not used for operational purposes
unless the product is otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 8
Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 9
Table of Contents
Symbols.................................................................................................................................................................................................................6
Table of Contents...............................................................................................................................................................................................9
List of Tables ......................................................................................................................................................................................................11
List of Figures.....................................................................................................................................................................................................11
1/ Introduction .........................................................................................................................................................................................13
1.1. Product Description...................................................................................................................................................................................13
1.2. Product Naming Clarification ................................................................................................................................................................13
1.3. COM Express® Documentation.............................................................................................................................................................13
1.4. COM Express® Functionality .................................................................................................................................................................14
1.5. COM Express® Benefits...........................................................................................................................................................................14
2/ Product Specification .......................................................................................................................................................................15
2.1. Module Variants ........................................................................................................................................................................................15
2.1.1. Commercial Temperature Grade Modules (0°C to +60°C)........................................................................................................15
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C) ...................................................................................................15
2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C)..............................................................................................16
2.2. Accessories.................................................................................................................................................................................................17
2.3. Functional Specification.........................................................................................................................................................................19
2.3.1. Block Diagram COMe-bSL6.................................................................................................................................................................19
2.3.2. Processor................................................................................................................................................................................................20
2.3.3. Chipset.....................................................................................................................................................................................................23
2.3.4. System Memory ...................................................................................................................................................................................23
2.3.5. Graphics...................................................................................................................................................................................................24
2.3.6. LVDS..........................................................................................................................................................................................................24
2.3.7. Audio......................................................................................................................................................................................................... 25
2.3.8. PCI Express (PCIE) Configuration.................................................................................................................................................... 25
2.3.9. USB............................................................................................................................................................................................................ 27
2.3.10. SATA........................................................................................................................................................................................................ 27
2.3.11. Ethernet..................................................................................................................................................................................................28
2.3.12. COMe High Speed Interfaces ..........................................................................................................................................................29
2.3.13. Storage Features................................................................................................................................................................................29
2.3.14. BIOS/Software Features..................................................................................................................................................................29
2.3.15. COMe Features....................................................................................................................................................................................30
2.3.16. Kontron Features................................................................................................................................................................................30
2.4. Electrical Specification ...........................................................................................................................................................................31
2.4.1. Power Supply Voltage..........................................................................................................................................................................31
2.4.2. Power Supply Rise Time.....................................................................................................................................................................31
2.4.3. Power Supply Voltage Ripple............................................................................................................................................................31
2.4.4. Power Consumption ............................................................................................................................................................................31
2.4.6. Power Supply Control Settings .......................................................................................................................................................32
2.4.7. Power Supply Modes..........................................................................................................................................................................33
2.5. Thermal Management ...........................................................................................................................................................................34
2.5.1. Heatspreader and Cooling Solutions..............................................................................................................................................34
2.5.2. Operating with Kontron Heatspreader Plate (HSP) Assembly .............................................................................................34
2.5.3. Operating without Kontron Heatspreader Plate Assembly...................................................................................................34
2.5.4. On-board Fan Connector................................................................................................................................................................... 35
2.6. Environmental Specification................................................................................................................................................................36
2.6.1. Temperature...........................................................................................................................................................................................36

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 10
2.6.2. Humidity..................................................................................................................................................................................................36
2.7. Standards and Certifications ............................................................................................................................................................... 37
2.8. MTBF............................................................................................................................................................................................................38
2.9. Mechanical Specification......................................................................................................................................................................39
2.9.1. Dimensions .............................................................................................................................................................................................39
2.9.2. Height.......................................................................................................................................................................................................39
3/ Features and Interfaces .................................................................................................................................................................40
3.1. LPC.................................................................................................................................................................................................................40
3.2. Serial Peripheral Interface (SPI)..........................................................................................................................................................40
3.2.1. SPI boot ....................................................................................................................................................................................................40
3.2.2. Using an External SPI Flash...............................................................................................................................................................41
3.2.3. External SPI flash on Modules with Intel® ME – in the PRD ..................................................................................................42
3.3. M.A.R.S.........................................................................................................................................................................................................42
3.4. Fast I2C .......................................................................................................................................................................................................42
3.5. UART.............................................................................................................................................................................................................42
3.6. Triple Staged Watchdog Timer (WTD) .............................................................................................................................................43
3.6.1. Basics........................................................................................................................................................................................................43
3.6.2. WDT Signal.............................................................................................................................................................................................43
3.7. GPIO..............................................................................................................................................................................................................44
3.8. Real Time Clock (RTC)............................................................................................................................................................................44
3.9. Trusted Platform Module (TPM 2.0).................................................................................................................................................44
3.10. Kontron Security Solution...................................................................................................................................................................44
3.11. SpeedStep™ Technology.....................................................................................................................................................................44
4/ System Resources ............................................................................................................................................................................46
4.1. Interrupt Request (IRQ) Lines ..............................................................................................................................................................46
4.2. Memory Area ............................................................................................................................................................................................46
4.3. I/O Address Map......................................................................................................................................................................................47
4.4. Peripheral Component Interconnect (PCI) Devices .....................................................................................................................49
4.5. I2C Bus.........................................................................................................................................................................................................49
4.6. System Management (SM) Bus..........................................................................................................................................................49
5/ Interface Connectors X1A and X1B ..............................................................................................................................................50
5.1. X1A and X1B Signals .................................................................................................................................................................................50
5.2. X1A and X1B Pin Assignment.................................................................................................................................................................51
5.2.1. Connector X1A Row A........................................................................................................................................................................... 52
5.2.2. Connector X1A Row B.......................................................................................................................................................................... 55
5.2.3. Connector X1B Row C ..........................................................................................................................................................................58
5.2.4. Connector X1B Row D ..........................................................................................................................................................................61
6/ uEFI BIOS ..............................................................................................................................................................................................64
6.1. Starting the uEFI BIOS.............................................................................................................................................................................64
6.2. Setup Menus .............................................................................................................................................................................................65
6.2.1. Main Setup Menu..................................................................................................................................................................................66
6.2.2. Advanced Setup Menu........................................................................................................................................................................ 67
6.2.3. Chipset Setup Menu ............................................................................................................................................................................78
6.2.4. Security Setup Menu...........................................................................................................................................................................88
6.2.5. Boot Setup Menu..................................................................................................................................................................................89
6.2.6. Save and Exit Setup Menu.................................................................................................................................................................90
6.3. The uEFI Shell............................................................................................................................................................................................92
6.3.1. Basic Operation of the uEFI Shell ....................................................................................................................................................92
6.4. uEFI Shell Scripting.................................................................................................................................................................................93

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 11
6.4.1. Startup Scripting...................................................................................................................................................................................93
6.4.2. Create a Startup Script....................................................................................................................................................................... 93
6.4.3. Examples of Startup Scripts ............................................................................................................................................................93
6.5. Firmware Update.....................................................................................................................................................................................94
List of Tables
Table 1: Pin Assignment of Type 6 and COMe-bSL6 .............................................................................................................................14
Table 2: Product Number for Commercial Temperature Grade Modules (0°C to +60°C operating)..................................... 15
Table 3: R E2S Modules (R E2S, -40°C to +85°C)....................................................................................................................................16
Table 4: Product Specific Accessories.......................................................................................................................................................17
Table 5: COMe Type 6 Specific Accessories.............................................................................................................................................17
Table 6: General Accessories........................................................................................................................................................................17
Table 7: Memory Modules .............................................................................................................................................................................18
Table 8: Specifications of the COMe-bSL6 Processor Variants........................................................................................................21
Table 9: General Purpose PCI-Express lanes......................................................................................................................................... 25
Table 10: PCI-Express Graphics x16 (PEG) Port Bifurcation and Lane Mapping......................................................................... 26
Table 11: PCI-Express Graphics x16 (PEG) Port Bifurcation and Lane Reversal Mapping........................................................ 26
Table 12: COMe USB 3.0 Ports and USB 2.0 Ports................................................................................................................................. 27
Table 13: COMe Connector PCH High Speed I/O Port Interfaces...................................................................................................... 29
Table 14: ATX Mode Settings ....................................................................................................................................................................... 33
Table 15: Single Supply Mode Settings.....................................................................................................................................................33
Table 16: Heatspreader Test Temperature Specifications ................................................................................................................34
Table 17: 3-Pin Fan Connector Pin Assignment: .................................................................................................................................... 35
Table 18: Electrical Characteristics of the Fan Connector ................................................................................................................. 35
Table 19: Temperature Grade Specifications .........................................................................................................................................36
Table 20: Humidity Specifications .............................................................................................................................................................36
Table 21: Standards and Certifications..................................................................................................................................................... 37
Table 22: MTBF Temperature de-Rating.................................................................................................................................................38
Table 23: Supported BIOS Features...........................................................................................................................................................40
Table 24: SPI Boot Pin Configuration ........................................................................................................................................................40
Table 25: Supported SPI Boot Flash Types for 8-SOIC Package .......................................................................................................41
Table 26: Reserved SM-Bus Addresses for Smart Battery Solutions on the Carrier ...............................................................42
Table 27: Triple Stage Watchdog Timer- Time-out Events...............................................................................................................43
Table 28: General Signal Description.........................................................................................................................................................51
Table 29: Connector X1A Row A Pinout List ............................................................................................................................................ 52
Table 30: Connector X1A Row B Pinout List............................................................................................................................................ 55
Table 31: Connector X1B Row C Pinout List .............................................................................................................................................58
Table 32: Connector X1B Row D Pinout List.............................................................................................................................................61
Table 33: Navigation Hot Keys Available in the Legend Bar..............................................................................................................64
Table 34: Main Setup Menu Sub-screens and Functions .................................................................................................................. 66
Table 35: Advanced Setup menu Sub-screens and Functions ......................................................................................................... 67
Table 36: Chipset Set > System Agent Configuration Sub-screens and Functions................................................................... 78
Table 37: Chipset Set > PCH-IO Configuration Sub-screens and Functions................................................................................82
Table 38: Security Setup Menu Functions...............................................................................................................................................88
Table 39: Boot Setup Menu Functions......................................................................................................................................................89
Table 40: Save and Exit Setup Menu Functions ....................................................................................................................................90
Table 41: List of Acronyms...........................................................................................................................................................................95
List of Figures
Figure 1: Block Diagram COMe-bSL6 ..........................................................................................................................................................19
Figure 2: Module Dimensions......................................................................................................................................................................39
Figure 3: Module Height ................................................................................................................................................................................39
Figure 4: X1A and X1B COMe Interface Connectors ..............................................................................................................................50

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 12
Figure 5: Advanced Setup Menu Initial Screen....................................................................................................................................... 67
Figure 6: System Agent Configuration Menu Initial Screen............................................................................................................... 78
Figure 7: PCH-IO Configuration Menu Initial Screen ............................................................................................................................82
Figure 8: Security Setup Menu Initial Screen..........................................................................................................................................88
Figure 9: Boot Setup Menu Initial Screen.................................................................................................................................................89
Figure 10: Save and Exit Setup Menu Initial Screen..............................................................................................................................90

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 13
1/ Introduction
1.1. Product Description
Kontron's Computer-on-Module COMe-bSL6 is a COM Express® Basic Type 6 pinout based on the Intel® 6th Generation
Core ™ / Xeon® E3 v5 family processors, known as Skylake-H in this user guide. The COMe-bSL6 supports additional
communication interfaces via a separate Chipset (CM236/QM170 PCH). Due to Intel’s 14nm technology, the Skylake–H
offers increased efficiency and performance with TDP as low as 25 W, and no more than 45W. The Skylake- H
features either Intel® Iris™ Pro Graphics or Intel ® HD Graphics.
Basic COMe-bSL6 features are:
Intel® 6th Generation Core series, Xeon® E3 v5 family with CM236/QM170 PCH
2 x DDR4-2133 SO-DIMM, up to 2x 16 GByte (non-ECC/ECC)
High-speed connectivity includes 8x PCIe x1, 1x PEG x16, 1x 1 GbE
Support for the Industrial temperature environment
1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules
consist of:
Short form of the industry standard
COMe-
Module form factor
b=basic (125 mm x 95 mm)
c=compact (9 5mm x 95 mm)
m=mini (84 mm x 55 mm)
Intel’s processor code name
SL = Skylake
Pinout type
Type 6
Type10
Temperature variants
Commercial
Extended (E1)
Industrial (E2)
Screened industrial (E2S) and Rapid shutdown screened industrial (R E2S)
Processor Identifier
Chipset identifier (if chipset assembled)
Memory size
Memory Down + DIMM memory (#GB) / eMMC SLC memory (#S)
1.3. COM Express® Documentation
The COM Express® Specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available at the PICMG® website.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 14
1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220-pin connectors; each of which has two rows
called row A & B on the primary connector and row C & D on the secondary connector. The COM Express® Computer-
On-Module (COM) features the following maximum amount of interfaces according to the PCI Industrial Computer
Manufacturers Group (PICMG) module pinout type.
Table 1: Pin Assignment of Type 6 and COMe-bSL6
Feature Type 6 Pinout COMe-bSL6 Pinout
HD Audio 1x 1x
Gbit Ethernet 1x 1x
Serial ATA 4x 4x
Parallel ATA
PCI
PCI Express x 1 8x 8x
PCI Express x16 (PEG) 1x 1x
USB Client
USB 4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
4x USB 3.0 (Incl. USB 2.0)
+ 4x USB 2.0
VGA 1x 1x Optional
LVDS Dual Channel Dual Channel LVDS with option to overlay
with embedded Display port (eDP)
DP++ (eDP/DP/HDMI/DVI/VGA) 3x 3x
LPC 1x 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
SDIO shared w/GPIO 1x optional
UART (2-wire COM) 2x 2x
FAN PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® modules are very compact, highly integrated computers. All Kontron COM Express® modules feature a
standardized form factor and a standardized connector layout that carry a specified set of signals. Each COM is based
on the COM Express® specification. This standardization allows designers to create a single-system baseboard that
can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 15
2/ Product Specification
2.1. Module Variants
The COM Express® basic sized, Computer-on-Module COMe-bSL6, uses pinout Type 6 and is compatible with the
PICMG specification COM.0 Rev 2.1. The COMe-bSL6 is available in different variants to cover demands in
performance, price and power.
2.1.1. Commercial Temperature Grade Modules (0°C to +60°C)
The following table provides a list of modules available for the commercial temperature grade.
Table 2: Product Number for Commercial Temperature Grade Modules (0°C to +60°C operating)
Product Number Product Name Comment
38030-0000-20-4 COMe-bSL6 E3-1505L CM236 Xeon™ E3-1505L, 4x 2.0 GHz, CM236, GT2,
25 W, vPro™, non-ECC/ECC
38030-0000-28-4 COMe-bSL6 E3-1505M CM236 Xeon™ E3-1505M, 4x 2.8GHz, CM236, GT2,
45 W/35 W, vPro™, non-ECC/ECC
38030-0000-28-8 COMe-bSL6 E3-1515M CM236 Xeon™ E3-1515M, 4x2.8 GHz, CM236, GT4e,
45 W/35 W, vPro™, non-ECC/ECC
38030-0000-20-7 COMe-bSL6 i7-6822EQ QM170 Core™ i7-6822EQ, 4x 2.0 GHz, QM170, GT2,
25 W, vPro™, non ECC
38030-0000-28-7 COMe-bSL6 i7-6820EQ QM170 Core™ i7-6820EQ, 4x 2.8 GHz, QM170, GT2,
45W, vPro™, non ECC
38030-0000-19-5 COMe-bSL6 i5-6442EQ QM170 Core™ i5-6442EQ, 4x1.9 GHz, QM170, GT2,
25W, vPro™, non ECC
36030-0000-27-5 COMe-bSL6 i5-6440EQ QM170 Core™ i5-6440EQ, 4x2.7 GHz, QM170, GT2,
45 W, vPro™, non ECC
38030-0000-19-3 COMe-bSL6 i3-6102E CM236 Core™ i3-6102E, 2x 1.9 GHz, CM236, GT2,
25 W, non-ECC/ECC
38030-0000-27-3 COMe-bSL6 i3-6100E CM236 Core™ i3-6100E, 2x 2.7 GHz, CM236, GT2,
35 W, non-ECC/ECC
38030-0000-16-2 COMe-bSL6 G3902E CM236 Celeron™ 3902E, 2x 1.6 GHz, CM236, GT1,
25 W, non-ECC/ECC
38030-0000-24-2 COMe-bSL6 G3900E CM236 Celeron™ 3900E, 2x 2.4 GHz, CM236, GT1,
35W, non-ECC/ECC
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C)
Extended temperature grade modules (E1, -25°C to +75°C) are available as a standard product number, on request.
Contact your local sales representative to find out more about available extended temperature variants.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 16
2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C)
Industrial temperature grade modules (E2S, -40°C to +85 °C) are available as a project based custom product number.
For further information, contact your local sales representative. Alternatively, consider using the R E2S variants.
2.1.3.1. R E2S Modules (R E2S, -40°C to +85°C)
The following table provides a list of R E2S modules available with Kontron Rapid Shutdown support and E2
temperature grade (-40°C to +85°C) by screening.
For Further information regarding the screening process contact Kontron Support
Table 3: R E2S Modules (R E2S, -40°C to +85°C)
Product Number Product Name Comment
38031-0000-16-2 COMe-bSL6R E2S G3902E CM236 Celeron™ 3902E, 2x 1.6 GHz, CM236, GT1,
25 W, non-ECC/ECC
38031-0000-24-2 COMe-bSL6R E2S G3900E CM236 Celeron™ 3900E, 2x 2.4 GHz, CM236, GT1,
35 W, non-ECC/ECC
38031-0000-19-3 COMe-bSL6R E2S i3-6102E CM236 Core™ i3-6102E, 2x 1.9 GHz, CM236, GT2,
25 W, non-ECC/ECC
38031-0000-27-3 COMe-bSL6R E2S i3-6100E CM236 Core™ i3-6100E, 2x 2.7 GHz, CM236, GT2,
35 W, non-ECC/ECC
38031-0000-20-4 COMe-bSL6R E2S E3-1505L CM236 Xeon™ E3-1505L, 4x 2.0 GHz, CM236, GT2,
25 W, vPro™, non-ECC/ECC
38031-0000-28-4 COMe-bSL6R E2S E3-1505M CM236 Xeon™ E3-1505M, 4x 2.8 GHz, CM236, GT2,
45 W/35 W, vPro™, non-ECC/ECC
38031-0000-28-8 COMe-bSL6R E2S E3-1515M CM236 Xeon™ E3-1515M, 4x 2.8 GHz, CM236, GT4e,
45 W/35 W, vPro™, non-ECC/ECC

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 17
2.2. Accessories
The following tables provide a list of specific and general COMe-bSL6 accessories. For more information, contact your
local Kontron sales representative or Kontron Inside Sales.
Table 4: Product Specific Accessories
Part Number COMe Carrier Comment
38030-0000-99-0 HSP COMe-bSL6 Cu-core
threaded
For all CPUs and temperature grades
38030-0000-99-1 HSP COMe-bSL6 Cu-core through For all CPUs and temperature grades
Table 5: COMe Type 6 Specific Accessories
Part Number COMe Carrier Project Code Comment
38115-0000-00-x COM Express®
Reference Carrier-i Type 6
ADTI Thin-mITX Carrier with 5 mm
COMe connector
38114-0000-00-0 COM Express®
Reference Carrier Type 6
ADAS mITX Carrier with 8 mm COMe
connector
38106-0000-00-0 COM Express® Eval Carrier Type 6 Topanga
Canyon
ATX Carrier with 5 mm COMe
connector
Part Number COMe Adapter / Card Project Code Comment
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for
Evaluation Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x
DisplayPort
96006-0000-00-2 COMe POST T6 NFCB POST Code / Debug Card
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter
Part Number COMe Starter kit Project Code Comment
38114-0000-00-S COMe Ref. Starter kit T6 ADAS Starter kit with COMe Reference
Carrier T6
38106-0000-00-S COMe Eval. Starter kit T6 Topanga
Canyon
Starter kit with COMe Evaluation
Carrier T6
Table 6: General Accessories
Part Number Cooling Solutions Comments
38025-0000-99-0C05 HSK COMe-bHL6/bBL6/bSL6
active (w/o HSP)
For all CPUs and commercial temperature grade
usage, to be mounted on HSP
38025-0000-99-0C06 HSK COMe-bHL6/bBL6/bSL6
passive (w/o HSP)
For all CPUs and commercial temperature grade
usage, to be mounted on HSP
Part Number Mounting Comments
38017-0000-00-5 COMe Mount KIT 5 mm 1 set Mounting Kit for 1 module including screws for
5 mm connectors
38017-0100-00-5 COMe Mount KIT 5 mm 100 sets Mounting Kit for 100 modules including screws for
5 mm connectors
38017-0000-00-0 COMe Mount KIT 8 mm 1 set Mounting Kit for 1 module including screws for
8 mm connectors
38017-0100-00-0 COMe Mount KIT 8 mm 100 sets Mounting Kit for 100 modules including screws for
8 mm connectors

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 18
Part Number Display Adapter Comment
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Comment
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module
(COMe basic/compact)
96079-0000-00-2 KAB-HSP 40 mm Cable adapter to connect FAN to module
(COMe basic/compact)
Part Number Miscellaneous Comment
18029-0000-00-0 MARS Smart Battery Kit Starter kit Kontron Mobile Application platform for
Rechargeable Systems
Table 7: Memory Modules
Part Number Memory (validated reference types)
97017-4096-24-0 DDR4-2400 SODIMM 4 GB_COM DDR4-2400, 4GB, 260P, 1200MHz, PC4-
2400 SODIMM
97017-8192-24-0 DDR4-2400 SODIMM 8 GB_COM DDR4-2400, 8GB, 260P, 1200MHz, PC4-
2400 SODIMM
97017-1600-24-0 DDR4-2400 SODIMM 16 GB_COM DDR4-2400, 16GB, 260P, 1200MHz, PC4-
2400 SODIMM
97017-4096-24-2 DDR4-2400 SODIMM 4 GB E2_COM DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-
2400 SODIMM
97017-8192-24-2 DDR4-2400 SODIMM 8 GB E2_COM DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-
2400 SODIMM
97017-1600-24-2 DDR4-2400 SODIMM 16 GB E2_COM DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-
2400 SODIMM
Part Number Memory ECC (validated reference types)
97018-4096-24-0 DDR4-2400 SODIMM 4 GB ECC_COM DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-
2400 SODIMM
97018-8192-24-0 DDR4-2400 SODIMM 8 GB ECC_COM DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-
2400 SODIMM
97018-1600-24-0 DDR4-2400 SODIMM 16 GB ECC_COM DDR4-2400, 16GB, ECC, 260P, 1200MHz,
PC4-2400 SODIMM
97018-4096-24-2 DDR4-2400 SODIMM 4 GB ECC E2_COM DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz,
PC4-2400 SODIMM
97018-8192-24-2 DDR4-2400 SODIMM 8 GB ECC E2_COM DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz,
PC4-2400 SODIMM
97018-1600-24-2 DDR4-2400 SODIMM 16 GB ECC E2_COM DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz,
PC4-2400 SODIMM
The COMe-bSL6 supports memory modules with a maximum bus frequency of 2133 MHz.
The memory modules above can support bus frequencies up to 2400 MHz but have been
validated for the COMe-bSL6 at a reduced bus frequency of 2133 MHz.

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 19
2.3. Functional Specification
2.3.1. Block Diagram COMe-bSL6
The following figure displays the system block diagram applicable to all COMe-bSL6 modules.
Figure 1: Block Diagram COMe-bSL6

COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com // 20
2.3.2. Processor
The Intel® 6th Generation Core™ series Skylake-H product family uses the 14 nm process technology, with
42 mm x 28 mm package size and BG1440.
In general, the Intel® Skylake-H series of processors supports the following technologies:
Intel® 64 Architecture
Intel® Turbo Boost Technology 2.0 (excluding i3-6100E, i3-6102E, G3902E and G3900E)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x Extended Page Table (EPT)
Intel® vPro™ Technology (excluding i3-6100E, i3-6102E, G3902E and G3900E)
Intel® Hyper Threading Technology (excluding i5-6662EQ i5-6440EQ, G3902E and G3900E)
Intel® TSX-NI (excluding G3902E and G3900E)
Idle States
Enhanced Intel® Speedstep® Technology
Thermal Monitoring Technologies
Intel® Flex Memory Access (E3-1515M and E3-1505M only)
Intel® Identity Protection Technology (excluding E3-1505L)
Intel® Stable Image Platform Program (SIPP) (E3-1515M and E3-1505M only)
Intel® Smart Response Technology (E3-1515M and E3-1505M only)
Intel® Advanced Encryption Standard New Instructions (AES-NI)
Intel® Secure Key
Intel® Software Guard Extensions (Intel® SGX)
Intel® Memory Protection Extensions (Intel® MPX ) (excluding G3902E and G3900E)
OS Guard (excluding G3902E and G3900E)
Intel® Trusted Execution Technology (TXT) (excluding i3-6100E, i3-6102E, G3902E and G3900E)
Intel® Executive Disable Bit
Intel® Quick Sync Video
Intel® Clear Video HD Technology