
3.7. Environmental Specification............................................................................................... 20
3.7.1. Temperature Specification ....................................................................................................................................................20
3.7.2. Humidity ...............................................................................................................................................................................20
3.8. Standards and Certifications............................................................................................... 21
3.9. MTBF............................................................................................................................. 23
3.10. Mechanical Specification ................................................................................................. 24
3.11. Module Dimensions ........................................................................................................ 25
3.12. Onboard Fan Connector ................................................................................................... 26
3.13. Thermal Management, Heatspreader and Cooling Solutions ..................................................... 27
4. Features and Interfaces.............................................................................28
4.1. Onboard eMMC Flash......................................................................................................... 28
4.2. Secure Digital Card........................................................................................................... 30
4.3. S5 Eco Mode ................................................................................................................... 31
4.4. LPC 32
4.5. Serial Peripheral Interface (SPI).......................................................................................... 33
4.6. SPI boot......................................................................................................................... 33
4.7. M.A.R.S. ........................................................................................................................ 35
4.8. UART............................................................................................................................. 36
4.9. Fast I2C ......................................................................................................................... 37
4.10. Dual Staged Watchdog Timer ............................................................................................. 38
4.11. SpeedstepTechnology ..................................................................................................... 39
4.12. C-States....................................................................................................................... 40
4.13. Graphics Features........................................................................................................... 41
4.14. ACPI Suspend Modes and Resume Events ............................................................................. 42
4.15. USB ............................................................................................................................ 43
5. System Resources ....................................................................................44
5.1. Interrupt Request (IRQ) Lines............................................................................................. 44
5.2. Memory Area................................................................................................................... 44
5.3. I/O Address Map .............................................................................................................. 45
5.4. Peripheral Component Interconnect (PCI) Devices................................................................... 46
5.5. LPC addresses ................................................................................................................. 46
5.6. I2C Bus.......................................................................................................................... 46
5.7. System Management (SM) Bus ............................................................................................ 47
6. Pinout List..............................................................................................48
6.1. General Signal Description ................................................................................................. 48
6.2. Connector X1A Row A ........................................................................................................ 49
6.3. Connector X1A Row B ........................................................................................................ 51
6.4. Connector X1B Row C ........................................................................................................ 53
6.5. Connector X1B Row D........................................................................................................ 55