Kontron CP6940 User manual

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CP6940
Document Revision 0.9 (Draft Version)
Date: September 2019
User Guide

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CP6940 User Guide
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CP6940 - USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this manual may be subject to alteration, particularly as
a result of the constant upgrading of Kontron products. This document does not entail any guarantee on the part of Kon-
tron with respect to technical processes described in the manual or any product characteristics set out in the manual.
Kontron assumes no responsibility or liability for the use of the described product(s), conveys no license or title under
any patent, copyright or mask work rights to these products and makes no representations or warranties that these pro-
ducts are free from patent, copyright or mask work right infringement unless otherwise specified. Applications that are
described in this manual are for illustration purposes only. Kontron makes no representation or warranty that such
application will be suitable for the specified use without further testing or modification. Kontron expressly informs the
user that this manual only contains a general description of processes and instructions which may not be applicable in
every individual case. In cases of doubt, please contact Kontron.
This manual is protected by copyright. All rights are reserved by Kontron. No part of this document may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form
or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the express written permission
of Kontron. Kontron points out that the information contained in this manual is constantly being updated in line with the
technical alterations and improvements made by Kontron to the products and thus this manual only reflects the techni-
cal status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
© 2019 by Kontron S&T AG
Kontron S&T AG
Lise-Meitner-Straße 3-5
86156 Augsburg
Germany
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CP6940 User Guide
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Revision History
Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE OR RESALE FOR
THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICATION SYSTEMS FOR AIRCRAFT OR
OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS
SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN
WHICH THE FAILURE OF PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENV-
IRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at your
risk. To minimize the risks associated with your products and applications, you should provide adequate design and ope-
rating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security related requi-
rements concerning your products. You are responsible to ensure that your systems (and any Kontron hardware or
software components incorporated in your systems) meet all applicable requirements. Unless otherwise stated in the
product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot therefore be
deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as device in High
Risk Applications. All application and safety related information in this document (including application descriptions,
suggested safety measures, suggested Kontron products, and other materials) is provided for reference only.
Customer Support
Find Kontron contacts by visiting: http://www.kontron.com/support.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into a
services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product expertise
coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of mind to
build and maintain successful products.
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Rev. Index Brief Description of Changes Date of Issue
0.9 First draft version of the User Guide 2019-09-05

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CP6940 User Guide
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For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron training
academy, and more visit http://www.kontron.com/support-and-services/services.
Customer Comments
If you have any difficulties using this guide, discover an error, or just want to provide some feedback, please send a mes-
sage to Kontron. Detail any errors you find. We will correct the errors or problems as soon as possible and post the revi-
sed user guide on our website.
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about warranty
compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-and-conditi-
ons.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms
& Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit our
website CONTACT US.

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Symbols
The following symbols may be used in this manual.
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided, could result in death or
serious injury.
CAUTION indicates a hazardous situation which, if not avoided, may result in minor or
moderate injury.
NOTICE indicates a property damage message.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60 V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
Please refer also to the „High.Voltage Safety Instructions“ portion below in this section.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive to
static electricity. Care must therefore be taken during all handling operations and inspections
of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
This symbol indicates general information about the product and the user manual.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its com-
pliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life expectancy of
your product can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the inte-
rest of your own safety and of the correct operation of your new Kontron product, you are requested to conform with the
following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the pro-
duct’s main disconnect device.
Special Handling and Unpacking Instruction
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is other-
wise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands or
tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices, jumper
settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed on con-
ductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the batteries or
conductive circuits on the product.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first cable
to be connected when performing installation or removal procedures on this product.
ESD
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.

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General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this User Guide or received
from Kontron’s Technical Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific environ-
mental requirements. This also applies to the operational temperature range of the specific board version, that must not
be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the present
User Guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship the
product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements where possible. Many of the
components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled.
Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or
local laws or regulations.
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the product
become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound environmental
disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE.
Environmental protection is a high priority with Kontron.
Kontron follows the DEEE/WEEE directive
You are encouraged to return our products for proper disposal.

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CP6940 User Guide
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Table of Contents
Disclaimer .......................................................................................................................................................... 2
Revision History ............................................................................................................................................... 3
Intended Use ..................................................................................................................................................... 3
Customer Support ........................................................................................................................................... 3
Customer Service............................................................................................................................................. 3
Customer Comments ..................................................................................................................................... 4
Terms and Conditions .................................................................................................................................... 4
Symbols .............................................................................................................................................................. 5
For Your Safety................................................................................................................................................. 6
General Instructions on Usage .................................................................................................................... 7
Environmental Protection Statement....................................................................................................... 7
1/ Introduction .............................................................................................................................................. 12
1.1 Product Overview ..........................................................................................................................................................12
1.1.1 CP6940 Features .............................................................................................................................................................. 12
1.1.2 General compliances ...................................................................................................................................................... 13
1.2 Technical Specification ...............................................................................................................................................14
1.2.1 Power Requirements ...................................................................................................................................................... 14
1.2.2 Mechanics ........................................................................................................................................................................... 14
1.2.3 Temperature ...................................................................................................................................................................... 14
1.2.4 Humidity ............................................................................................................................................................................... 14
1.2.5 Altitude ................................................................................................................................................................................. 14
1.2.6 Vibration .............................................................................................................................................................................. 14
1.2.7 Shock ..................................................................................................................................................................................... 15
1.2.8 Bump ..................................................................................................................................................................................... 15
1.2.9 Safety .................................................................................................................................................................................... 15
1.2.10 Electromagnetic Compatibility .................................................................................................................................... 15
1.2.11 Reliability ............................................................................................................................................................................. 15
1.2.12 WEEE ..................................................................................................................................................................................... 15
1.2.13 RoHS Compliance ............................................................................................................................................................. 15
1.2.14 Lead-free ............................................................................................................................................................................. 15
1.3 Software Support ..........................................................................................................................................................16
2/ CP6940 Installation ................................................................................................................................ 18
2.1 Safety Requirements ...................................................................................................................................................18
2.2 CP6940 Initial Installation Procedures .................................................................................................................19
2.3 Standard Removal Procedures ...............................................................................................................................20
2.4 Software Installation ...................................................................................................................................................21
2.5 Quick Start ........................................................................................................................................................................21
2.5.1 Out-of-Band CLI Access ................................................................................................................................................. 21
2.5.2 In-Band CLI Access ...........................................................................................................................................................22
3/ Functional Description ..........................................................................................................................24
3.1 Ethernet Infrastructure .............................................................................................................................................. 26
3.2 Unit Computer and Memory ..................................................................................................................................... 27
3.3 IPMI .................................................................................................................................................................................... 27
3.3.1 Voltage Sensors ............................................................................................................................................................... 28

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3.3.2 Current sensors ............................................................................................................................................................... 28
3.4 Board Interfaces ........................................................................................................................................................... 29
3.4.1 Front Panel Elements .................................................................................................................................................... 29
3.4.2 Front Panel Switches ...................................................................................................................................................... 31
3.4.3 Front Panel Ports ..............................................................................................................................................................32
3.4.4 Front Panel Management Port RJ45 .........................................................................................................................33
3.4.5 CompactPCI Connectors ............................................................................................................................................... 34
3.5 Write Protection Feature ........................................................................................................................................... 39
4/ Software Description ............................................................................................................................ 40
4.1 Supported RFCs ............................................................................................................................................................40
4.1.1 FASTPATH Management ............................................................................................................................................... 40
4.1.2 FASTPATH Switching ....................................................................................................................................................... 41
4.1.3 FASTPATH Routing .......................................................................................................................................................... 43
4.1.4 FASTPATH IPv6 Routing ................................................................................................................................................ 43
4.1.5 FASTPATH Quality of Service ...................................................................................................................................... 44
4.1.6 FASTPATH Multicast ...................................................................................................................................................... 45
4.2 Supported MIBs ............................................................................................................................................................45
4.2.1 Enterprise MIB .................................................................................................................................................................. 45
4.2.2 Base Package MIBs ......................................................................................................................................................... 45
4.2.3 Switching Package MIBs ............................................................................................................................................... 46
4.2.4 Routing Package MIBs ....................................................................................................................................................47
4.2.5 QoS Package MIBs ............................................................................................................................................................47
4.2.6 Multicast package MIBs .................................................................................................................................................47
4.2.7 Security MIBs .....................................................................................................................................................................47
4.2.8 Kontron Private MIBs ......................................................................................................................................................47
4.3 Bootloader ......................................................................................................................................................................49
4.3.1 Power On Self Test ..........................................................................................................................................................50
4.3.2 Bootloader Shell Options .............................................................................................................................................. 51
4.4 IPMI Firmware ............................................................................................................................................................... 53
4.4.1 Supported IPMI Commands ..........................................................................................................................................53
4.4.2 Board Sensors .................................................................................................................................................................. 58
4.4.3 Board FRU Information ................................................................................................................................................. 68
4.5 Software Administration ...........................................................................................................................................69
4.5.1 Firmware Storage and Flash Usage ......................................................................................................................... 69
4.5.2 Firmware Update ............................................................................................................................................................. 69
5/ Thermal Considerations .......................................................................................................................70
6/ Power Considerations ...........................................................................................................................72
6.1 Backplanes ..................................................................................................................................................................... 72

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List of Tables
Table 1: CP6940 Software Specification ............................................................................................................................16
Table 2: Ethernet Port Mapping........................................................................................................................................... 26
Table 3: CP6940 Voltages and Operational ranges......................................................................................................28
Table 4: SFP Uplink Port Pinout ........................................................................................................................................... 32
Table 5: Front RJ45 Ethernet Connector........................................................................................................................... 33
Table 6: Front RS232................................................................................................................................................................ 33
Table 7: Serial console terminal cable interface: RJ45 Female to DB9 Female .................................................34
Table 8: Connector J1 Pinout ................................................................................................................................................. 35
Table 9: Connector J2 Pinout................................................................................................................................................. 36
Table 10: Connector J3 Pinout............................................................................................................................................... 37
Table 11: Connector J4 Pinout................................................................................................................................................38
Table 12: Connector J5 Pinout ............................................................................................................................................... 39
Table 13: POST tests ................................................................................................................................................................. 50
Table 14: Bootloader Environment Variables ..................................................................................................................51
Table 15: Standard Commands............................................................................................................................................. 53
Table 16: HPM.1 Commands...................................................................................................................................................54
Table 17: Kontron OEM Commands..................................................................................................................................... 55
Table 18: Sensor List................................................................................................................................................................. 59
Table 19: IPMB Link (Type C3h) Reading...........................................................................................................................61
Table 21: MMC Reboot (Type 24h) Reading..................................................................................................................... 62
Table 20: IPMB Link (Type C3h) Event Message........................................................................................................... 62
Table 23: MMC FwUp (Type C7h) Reading ....................................................................................................................... 63
Table 22: MMC Reboot (Type 24h) Event Message ..................................................................................................... 63
Table 25: POST Fail (Type 0Fh) Reading ...........................................................................................................................64
Table 24: MMC FwUp (Type C7h) Event Message ........................................................................................................64
Table 27: Boot Fail (Sensor Type 1Eh) Reading .............................................................................................................. 65
Table 26: POST Fail (Type 0Fh) Event Message ............................................................................................................ 65
Table 28: Boot Fail (Sensor Type 1Eh) Event Message ...............................................................................................66
Table 29: Temperature Sensor Thresholds [°C] ............................................................................................................ 67
Table 30: Voltage Sensor Thresholds [V]......................................................................................................................... 67
Table 31: Current Sensor Thresholds [I]............................................................................................................................ 67
Table 32: On-board SPI NOR FLASH Partition Scheme (8MB)..................................................................................69
Table 33: eMMC Flash Layout...............................................................................................................................................69
Table 33: Thermal Requirements......................................................................................................................................... 71
Table 34: Maximum Input Power Voltage Limits .......................................................................................................... 72

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Figure 1: CP6940-RA-OC Functional Block Diagram................................................................................................. 24
Figure 2: CP6940-SA-OC(-V) Functional Block Diagram .........................................................................................25
Figure 3: Front Panel of the CP6940-RA-OC-P.............................................................................................................29
Figure 4: Front Panel of the CP6940-RA-OC .................................................................................................................29
Figure 5: Font Panel of the CP6940-SA-OC-V...............................................................................................................29
Figure 6: LED description CP6940-RA-OC-P .................................................................................................................30
Figure 7: LED description CP6940-RA-OC/CP6940-SA-OC-V ................................................................................30
Figure 8: Position of Temperature Sensors, Top Side View.....................................................................................70

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1/ Introduction
This manual describes the features of the CP6940 board. The use of this User Guide implies a basic knowledge of PC
hard- and software. This manual is focused on describing the special features and is not intended to be a standard PC
textbook.
New users are recommended to study the short installation procedure stated in the following chapter before switching
on the power.
Latest revision of this manual, datasheet, Bootloader, drivers and BSP’s (Board Support Packages) can be downloaded
from Kontron Web Page.
1.1 Product Overview
The CP6940 is a Standard Fabric 6U CompactPCI Gigabit Ethernet Switch with 24 channels compliant to PICMG 2.16.
The board is available in three variants:
•CP6940-RA-OC
Rugged optical/copper managed layer 2/3 Switch with 24 rear GbE,
Front uplinks (4x 1GBase-T RJ45, 4x 10G SFP+)
Layer 2/3 management
Ready for extended Temperature Range -40 to +85°C
•CP6940-RA-OC-P
200Gbps performance rugged optical/copper managed layer 2/3 Switch with 24x rear GbE,
Front uplinks (2x QSFP+ for 40G or 4 times 10G, 4x 10G SFP+, 2x 1G SFP)
Layer 2/3 management
Ready for extended Temperature Range -40 to +85°C
•CP6940-SA-OC-V
Value line optical/copper managed layer 2 Switch with 24 rear GbE,
Front uplinks (4x 1GBase-T RJ45, 2x 10G SFP+, 2x 1G SFP)
Layer 2 management
Standard Temperature Range 0 to +60°C
1.1.1 CP6940 Features
The board is composed of the following building blocks:
•Ethernet Infrastructure
•Unit Computer and Memory
•IPMI
•Power Supply
1.1.1.1 Ethernet Infrastructure
•Broadcom high port count integrated switch with 100-FX/1G/2.5G/5G/10G-Capable SerDes lanes
•BCM56174 with 28x 1GbE Ports (SGMII) and 12x 10GbE
•Unit Computer manages Switch via PCIe Gen2 x1 (5Gbps)
•Up to 7x Broadcom BCM54140 10/100/1000Base-T Transceiver with SGMII Ports
•Up to 24x 10/100/1000Base-T via MII interface to backplane connector J5, J4 and J3
•Up to four 10/100/1000Base-T RJ45 connectors at the front panel
•BCM56174 Switch manages transceiver via MIIM Interface
•SFP+ and SFP transceiver are direct connected to the switch
•SFIs connect to SFP+ interfaces at the front panel
•BSC Master I2C for SFP support
•SPI FLASH programming interface
•LED BUS controls the faceplate status LEDs
•Switch supports JTAG Boundary Scan

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1.1.1.2 Unit Computer and System Memory
•NXP Layerscape LS1020 CPU running at 1200 MHz
•Used for switch provisioning and diagnostics
•2 GBytes DDR3 RAM
•4 GBytes eMMC (pSLC)
•4 MBytes SPI FLASH Memory
•PCIe Management interface to BCM56174
•10/100/1000Base-T Management Port via Copper PHY AR8031 connected to FP RJ45
•UART connects to CPLD
•I2C Interface and IFC Interface to CPLD
•NVRAM write protection
•NXP LS1020 supports JTAG Boundary Scan
1.1.1.3 IPMI
•NXP LPC2368 32-Bit Microcontroller
•PICMG 2.9 / IPMI 1.5 compliant
•Dual Image Support
•2 MByte Flash (Boot Image)
•64 kByte EEPROM (FRU)
•Board Voltage and current monitoring
•Board Temperature monitoring via I²C enabled sensors
1.1.1.4 Power Supply
•5V and 3.3V only board, no 12V or -12V required
•IPMB_PWR used for 3.3V PM (generated by LDO)
•Hot Swap support
•3V3 V stabilization
•Point of Load Converters for chip core voltages
1.1.1.5 Miscellaneous
•JTAG Boundary Scan support
•All parts are extended temperature range parts: -40°C to +85°C or better
1.1.2 General compliances
The Board is compatible to the following standards:
•PICMG® 2.0 R3.0 CompactPCI® Specification, as amended by ERN 2.0-3.0-002
•PICMG® 2.1 R2.0 CompactPCI® Hot Swap Specification
•PICMG® 2.9 R1.0 CompactPCI® System Management Specification
•PICMG® 2.16 R1.0 Sep. 5, 2005 Packet Switching Backplane Specification
•Intelligent Platform Management Interface Specification V1.5
•IEEE 802.3, 2008 section 3

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1.2 Technical Specification
1.2.1 Power Requirements
Operating voltages are 5.0 Volt and 3.3 Volt.
The maximum power consumption is less than 55W.
1.2.2 Mechanics
Compliant to PICMG® 2.0 6U/4HP (233.35 mm x 160 mm).
•Weight:
•CP6940-1-RA-OC-P: TBD
•CP6940-1-RA-OC: TBD
•CP6940-1-SA-OC-V: TBD.
1.2.3 Temperature
Compliant to IEC 60068-2-1 and IEC 60068-2-2.
•CP6940-RA-OC-P
•Operation from -40° C to +85° C inlet air temperature
•CP6940-RA-OC
•Operation from -40° C to +85° C inlet air temperature
•CP6940-SA-OC-V
•Operation from 0° C to +60° C inlet air temperature
Required average inlet airflow should be around 400LFM (2 m/s) for the maximum cooling. Other thermal limitations
may apply and are the responsibility of the system integrator.
Storage temperature range is -50°C to +105°C for all variants.
1.2.4 Humidity
The board is designed to meet the standard IEC 60068-2-78 operating 93% at 40°C (non-condensing).
1.2.5 Altitude
The boards are designed to meet the following requirements:
•Operating: 4000m (13123 ft). Check for onboard peripherals if applicable
•Non-Operating: 15000 m (49212 ft)
1.2.6 Vibration
The CP6940-SA-OC-V board is designed to meet the requirements according IEC60068-2-6:
•10 Hz to 300 Hz, 2g acceleration
•1 octave/min
•10 cycles/axis, 3 directions [x, y, z]
•5 Hz to 100 Hz PSD increasing at 3 dB/octave
•100 Hz to 1000 Hz PSD = 0.04 g2/Hz
•1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave
The CP6940-RA-OC and CP6940-RA-OC-P boards are designed to meet the requirements according ANSI VITA47 V2:
•withstand vibration for 1 hour per axis:
•5 Hz to 100 Hz PSD increasing at 3 dB/octave
•100 Hz to 1000 Hz PSD = 0.04 g2/Hz
•1000 Hz to 2000 Hz PSD decreasing at 6 dB/octave

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1.2.7 Shock
The CP6940-RA-OC-P and the CP6940-RA-OC board is designed to meet the VITA 47 standard:
•20g / 11ms half-sine, or 20g / 11ms terminal sawtooth shock pulses in all three axes
The CP6940-SA-OC-V board is designed to meet the requirements of the following standards:
•DIN/IEC 60068-2-27
•Peak Acceleration: 30 g, Shock Duration: 9 ms half sine, Recovery Time: 5 s, Shock Count: 3/direction, 6 direc-
tions, total 18
1.2.8 Bump
All tree CP6940 Boards are designed to meet the IEC 60068-2-29:
•Peak Acceleration: 15 g
•Shock Dur.: 11 ms half sine
•Shock Count: 500
•Recovery time: 1 s
1.2.9 Safety
The boards are designed to meet or meets the following requirements:
•UL 61010-1
The boards are designed to meet the following flammability requirement (as specified in Telcordia GR-63-CORE):
•UL 94V-0/1 with Oxygen index of 28% or greater material
1.2.10 Electromagnetic Compatibility
he boards are designed to meet or exceed class B limit of the following specifications/requirements (assuming an ade-
quate system/chassis):
•FCC 47 CFR Part 15, Subpart B (USA)
•EN55032 (Europe)
•EN61000
•VCCI (Voluntary Japan Electromagnetic Compatibility requirement)
1.2.11 Reliability
Targeted MTBF is around 140.000h @ 30° C, calculations based on Bellcore Issue 6.
1.2.12 WEEE
Compliant to:
•Directive 2002/96/EC: Waste electrical and electronic equipment
1.2.13 RoHS Compliance
Components and materials of the product must not contain lead, mercury, cadmium, hexavalent chromium, polybromi-
nated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) according Directive 2011/65/EU.
1.2.14 Lead-free
The boards have to be completely lead-free concerning the production process and the components used.
If the CP6940 board is used in heavy shock and vibration environment, the hole system
must withstand these requirements. This means the chassis, backplane and guiderails
should be designed for harsh environment. Guide rails with wedge locks are recommend.
The backplane has to be stiffened to avoid connector micro movement. It is also recom-
mended to use connectors which are designed for a rugged environment.

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1.3 Software Support
The following table contains information related to software supported by the CP6940
Table 1: CP6940 Software Specification
CP6940 SPECIFICATIONS
General •Reliable field upgrades for all software components
•Dual boot images with roll-back capability
•Management via SNMP and Command Line Interface
•System access via TELNET, SSH and serial line
•Hot-Swap support (IPMI)
Ethernet/Bridging •Static link aggregation (IEEE 802.3ad)
•Classic and rapid spanning tree algorithms(IEEE 802.1D, IEEE 802.1w)
•Multiple Spanning Tree (IEEE 802.S)
•Quality Of Service on all ports (IEEE 802.1p)
•Full Duplex operation and flow control on all ports (IEEE 802.3x)
•Static MAC filtering
•Port Authentication (IEEE 802.1X)
•Auto negotiation of speeds and operational mode on all external copper GE
interfaces as well as on all base fabric interfaces
•Layer 2 multicast services using GARP/GMRP (IEEE 802.1p)
•VLAN support including VLAN tagging (IEEE 802.3ac), dynamic VLAN regis-
tration with GARP/GVRP (IEEE 802.1Q) and Protocol based VLANs (IEEE
802.1v)
•Double VLAN tagging
•Port Mirroring
IP Routing •Redundancy of routing functionality using a second switch hub board
•IPv4 Forwarding on all base channels and connected uplink ports
•Quality of service according to the DiffServ standards
•ARP for all routable interfaces
•ICMP for all routable interfaces
•OSPF routing protocol version 2
•RIP routing protocol version 2
•VRRP (virtual router redundancy protocol) for transparent fail over of de-
fault routers
•IGMP snooping
QoS •CoS (Class of Service )
•DifffServ (Differentiated Services)
•ACL (Access Control List)
IP Multicast •DVMRP
•PIM-DM
•PIM-SM
•IGMP (Internet Group Message Protocol) v2 and v3
•IGMP Proxy

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Applications •SNTP client for retrieving accurate time and date information
•DHCP server
•Onboard event management
•Test and trace facilities
•POST (power on self tests) diagnostics
•Standards based SNMP implementation supporting SNMP v1, v2 and v3
for monitoring and management purposes
•Persistent storage of configuration across restarts
•Support for retrieving and installing multiple configurations
•Support for startup configurations based on the cPCI SGA/GA (Shelf Geo-
graphical Address/Geographical Address), see CP6940 CLI Reference Man-
ual, chapter „AutoInstall Commands“
Supported MIBS •For a list of supported MIBs, see chapter “Supported MIBs” on page 41
Bootloader •u-boot Version 2019-07
•POST
•multi image support
•reliable field upgradable
•H/W protected
•KCS interface to PM
•serial console support
Operating System •Buildroot Linux, with vanilla LTS kernel 5.x
Table 1: CP6940 Software Specification (Continued)
CP6940 SPECIFICATIONS

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2 / CP6940 Installation
The CP6940 has been designed for easy installation. However, the following standard precautions, installation proce-
dures, and general information must be observed to ensure proper installation and to preclude damage to the board,
other system components, or injury to personnel.
2.1 Safety Requirements
The following safety precautions must be observed when installing or operating the CP6940. Kontron assumes no
responsibility for any damage resulting from failure to comply with these requirements.
Due care should be exercised when handling the board due to the fact that the heat sink can
get very hot. Do not touch the heat sink when installing or removing the board.
In addition, the board should not be placed on any surface or in any form of storage container
until such time as the board and heat sink have cooled down to room temperature.
Be careful when inserting or removing the CP6940. The SFP cages have sharp edges which
might lead to injuries.
ESD Sensitive Device
The CP6940 board contains electrostatically sensitive devices. Please observe the necessary
precautions to avoid damage to your board:
•Discharge your clothing before touching the assembly. Tools must be discharged before
use.
•When unpacking a static-sensitive component from its shipping carton, do not remove the
component's antistatic packing material until you are ready to install the component in a
computer. Just before unwrapping the antistatic packaging, be sure you are at an ESD
workstation or grounded. This will discharge any static electricity that may have built up
in your body.
•When transporting a sensitive component, first place it in an antistatic container or pack-
aging.
•Handle all sensitive components at an ESD workstation. If possible, use antistatic floor
pads and workbench pads.
•Handle components and boards with care. Don't touch the components or contacts on a
board. Hold a board by its edges or by its metal mounting bracket.
•Do not handle or store system boards near strong electrostatic, electromagnetic, magnet-
ic, or radioactive fields.

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CP6940 User Guide
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2.2 CP6940 Initial Installation Procedures
The following procedures are applicable only for the initial installation of the CP6940 in a system. Procedures for stan-
dard removal and hot swap operations are found in their respective chapters.
To perform an initial installation of the CP6940 in a system proceed as follows:
1. Ensure that the safety requirements indicated in chapter Safety Requirements are observed.
2. Ensure that the board is properly configured for operation in accordance with application requirements before in-
stalling. For information regarding the configuration of the CP6940 refer to the CLI Reference Manual.
3. To install the CP6940 perform the following:
• Ensure that no power is applied to the system before proceeding.
• Carefully insert the board into the slot designated by the application requirements for the board until it
makes contact with the backplane connectors.
• Using both ejector handles, engage the board with the backplane. When the ejector handles are locked, the
board is engaged.
• Fasten the front panel retaining screws.
• Connect all external interfacing cables to the board as required.
• Ensure that the board and all required interfacing cables are properly secured.
4. The CP6940 is now ready for operation.
Failure to comply with the instruction below may cause damage to the board or result in
improper system operation.
Care must be taken when applying the procedures below to ensure that neither the CP6940
nor other system boards are physically damaged by the application of these procedures.
DO NOT push the board into the backplane connectors. Use the ejector handles to seat the
board into the backplane connectors.

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2.3 Standard Removal Procedures
To remove the board proceed as follows:
1. Ensure that the safety requirements indicated in chapter Safety Requirements are observed.
2. Ensure that no power is applied to the system before proceeding.
3. Disconnect any interfacing cables that may be connected to the board.
4. Unscrew the front panel retaining screws.
5. Disengage the board from the backplane by first unlocking the board ejection handles and then by pressing the han-
dles as required until the board is disengaged.
6. After disengaging the board from the backplane, pull the board out of the slot.
7. Dispose of the board as required.
Care must be taken when applying the procedures below to ensure that neither the CP6940
nor other system boards are physically damaged by the application of these procedures.
Due care should be exercised when handling the board due to the fact that the heat sink can
get very hot. Do not touch the heat sink when installing or removing the board.