Lanner LEC-5510 User manual

LEC-5510
Manual

LEC-5510
Manual
© Copyright 2007, Lanner Electronics, Inc. All rights reserved. This document
contains proprietary in ormation that is protected by copyright. No part o this
document may be reproduced, transmitted, transcribed, stored in a retrieval
system, or translated into any language in any orm by any means without the
written express o Lanner Electronics, Inc.
The author and Lanner Electronics, Inc. have used their best e orts in preparing
this manual. However, the author and Lanner Electronics, Inc. make no
warranties o any kind, expressed or implied, with regard to the in ormational
content, documentation, or iles contained in this manual, and shall not be liable

or technical or editorial errors or omissions contained herein. In no event shall
the author or publisher be responsible or liable or any incidental or consequential
damages resulting rom the urnishing, per ormance, or use o this material.
TRADEMARKS Internet Explorer, Windows Explorer, and Windows are trademarks
or registered trademarks o Microso t Corporation. Other products mentioned
herein may be trademarks/or registered trademarks o their respective owners.

Safety Guidelines
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust- ree during and a ter installation.
Do not wear loose clothing or jewelry that could get caught in the chassis.
Fasten your tie or scar and roll up your sleeves.
Wear sa ety glasses i you are working under any conditions that might be
hazardous to your eyes.
Do not per orm any action that creates a potential hazard to people or makes
the equipment unsa e.
Disconnect all power by turning o the power and unplugging the power cord
be ore installing or removing a chassis or working near power supplies
Do not work alone i potentially hazardous conditions exist.
Never assume that power is disconnected rom a circuit; always check the
circuit.
Operating Safety
Electrical equipment generates heat. Ambient air temperature may not be
adequate to cool equipment to acceptable operating temperatures without
adequate circulation. Be sure that the room in which you choose to operate
your system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design allows cooling air
to circulate e ectively. An open chassis permits air leaks, which may
interrupt and redirect the low o cooling air rom internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical
circuitry. ESD damage occurs when electronic components are improperly
handled and can result in complete or intermittent ailures. Be sure to ollow
ESD-prevention procedures when removing and replacing components to avoid
these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact.
I no wrist strap is available, ground yoursel by touching the metal part o the
chassis.

Periodically check the resistance value o the antistatic strap, which should be
between 1 and 10 megohms (Mohms).

EMC Notice
This equipment has been tested and ound to comply with the limits or a Class A
digital device, pursuant to Part 15 o the FCC Rules. These limits are designed to
provide reasonable protection against harm ul inter erence when the equipment
is operated in a commercial environment. This equipment generates, uses, and
can radiate radio requency energy and, i not installed and used in accordance
with the instruction manual, may cause harm ul inter erence to radio
communications. Operation o this equipment in a residential area is likely to
cause harm ul inter erence in which case users will be required to correct the
inter erence at their own expense.
Class A Notice or FCC
Modi ying the equipment without the authorization o Lanner Electronics, Inc.
may result in the equipment no longer complying with FCC requirements or Class
A digital devices. In that event, your right to use the equipment may be limited by
FCC regulations, and you may be required to correct any inter erence to radio or
television communications at your own expense.
This equipment is in compliance with the essential requirements and other
relevant provisions o Directive 1999/5/EC.

Contents
Safety Guidelines....................................................................................... 4
EMC Notice................................................................................................. 6
Contents .................................................................................................... 7
1. Product Overview ................................................................................. 8
1.1 Product ntroduction ....................................................................... 8
1.2 Features and Benefits...................................................................... 8
1.3 Specifications................................................................................. 10
1.4 Block Diagram................................................................................ 11
1.5 Package Contents ............................................................. 11
1.6 Technical Assistance...................................................................... 11
2. System Components ........................................................................... 13
2.1 LEC-5510 System Board ................................................................. 13
2.1.1 Board Layout............................................................................... 14
2.2 Jumper Settings and /O Connectors............................................ 14
2.1.3 Connector Pin Assignments........................................................ 15
2.2 Mechanisms .................................................................. 23
2.2.1 Front Panel LED Status and Behavior......................................... 23
2.2.2 Rear View.......................................................................... 25
B. Appendix B: Watchdog Timer............................................................. 29
B.1 ntroduction .................................................................................. 29
C. Terms and Conditions.......................................................................... 30

1. Product Overview
1.1 Product Introduction
Figure 1 – LEC-5510 Outlook
In-Vehicle Fanless Embedded Box with Intel Dual Core Atom D51O CPU, 1GB
DDR2 Memory and GPS on board. Support 6~30VDC power input and Power
Ignition Control. Dual Intel GbE, VGA, COMx2, Audio, TTL DIO, USBx4, CFx1 and
2.5" SATA HDD support.
1.2 Features and Benefits
Listed below are the key eatures o LEC-5510:
Onboard Intel Dual Core Atom D510
Onboard 1GB memory
Power ignition control mechanism provided by programmable on/o /delay
switch circuit.
Battery voltage protection: OVP (Over Voltage Protection) and UVP (Under
Voltage Protection) circuit
Storage anti-vibration protection: Anti-vibration bracket is provided to
protect CF & Hard Drive.
Onboard GPS receiver or vehicle tracking and navigation system.
Dual Mini PCIe with SIM card socket or HSPA communication (3G) and Wi-Fi
or Bluetooth.

One PCI-104 connector or easy expansion, such as Video Grabber or CAN
Bus modules.
Fanless and low power consumption
Extended operating temperature between -20ºC ~ 55 ºC
Wide range o DC power input rom 6V to 30V.
I/O ports: RS-232/422/485, 2 LAN ports, 4 USB ports, VGA, Digital
input/output ports
Onboard 3-axis digital accelerometer (G Sensor) Multiple Antenna options

1.3 Specifications

1.4 Block Diagram
VGA
Mini-PCIexpress
RJ45
M12
Flash
BIOS SPI
USB
USB x4 USB x2
SATA x2 2.5” HDD
Super
I/O
LPC
RS232/422/485 x2
RS232 x2 Ignition Power Module
Intel D510
+6-35V DC-in
Edge I/O
Internal I/O
DDR2
SO-DIMM x1
WiFi or 3G
module
SIM Card for 3G
Option Module DVI-D
Transmitter
18-bit
LVDS
1GB Memory
DIO
SPI
Mini-PCIexpress
SIM Card
Socket
+12/+5V DC-Out
ALC888 Audio
+12V
VGA
Mini-PCIexpress
RJ45
M12
Flash
BIOS SPI
USB
USB x4 USB x2
SATA x2 2.5” HDD
Super
I/O
LPC
RS232/422/485 x2
RS232 x2 Ignition Power Module
Intel D510
+6-35V DC-in
Edge I/O
Internal I/O
DDR2
SO-DIMM x1
WiFi or 3G
module
SIM Card for 3G
Option Module DVI-D
Transmitter
18-bit
LVDS
1GB Memory
DIO
SPI
Mini-PCIexpress
SIM Card
Socket
+12/+5V DC-Out
ALC888 Audio
+12V
1.5 Package Contents
Care ully unpack your package and make sure that you have the ollowing items.
LEC-5510 Fanless Embedded Box x 1
WALL MOUNT x 1
Drivers and User’s Manual CD x 1
2 pin Male Terminal Block x 1
3 pin Female Terminal Block x1
GPS ANTENNA CABLE x1
Note: If you should find any components missing or damaged, please contact your dealer immediately for
assistance.
1. Technical Assistance

Should you have any questions or problems with your product, please contact the
Lanner sales team.
Phone: [phone]
Fax: [phone]
E-mail: [e-mail]
Prior to contacting us, we ask that you irst check the electronic product
documentation or assistance. Should you still have questions, we recommend
you have the ollowing in ormation on hand in order to expedite the process:
LEC-5510 model name
Part number
Local network con iguration details
Abnormal behavior and/or error messages reported by your network system
Your questions, or a description o the problem you are experiencing

2. System Components
2.1 LEC-5510 System Board
LEB-5510 is the system board bundled with the LEC-5510 In-Vehicle Fanless
Embedded Box. The succeeding sections list LEB-5510 related jumper settings
and connector pin assignments.
Figure 2 – LEB-5510 Motherboard

2.1.1 Board Layout
Figure 3 – LEB-5510 Jumper and Connector
2.2 Jumper Settings and I/O Connectors
The jumper settings and I/O connectors o the LEB-5510 board are speci ic to the
LEC-5510. Changing these settings may result in mal unctions or damages to
your system.

JUMPER FUNCTION
VGA1 DB-15 VGA Connector
J1 7 Pin 180º SATA CONNECTOR
J4 SATA POWER CONNECTOR
JCOMA1 COM1( D-S B9) Connector
SC1T5/SC1T1 Function Selector for JCOMA1
SC1T2 Pin-9 Voltage Selector for JCOMA1
JCOMB1 COM2( D-S B9) Connector
SC1T4 Pin-9 Voltage Selector for JCOMA2
JCOMC1 COM3( D-S B9) Connector ( 2X5 Pin 2.0mm Header )
DIO1 Digital IN/O T( D-S B9 Female) Connector
JP1 Clear CMOS Data
CASEOPEN1 CASE OPEN F NCTION
CN5 Compact Flash Connector
CN2/CN3 SB Dual Connector port#0/1
AUDIO1 A DIO CONNECTOR (DB-9 Female)
KB1 PS/2 Keyboard & Mouse Connector (2x4 Header 2.54mm )
LAN1/LAN2 RJ-45 with LED
PW1 DC_IN CONNECTOR
PW2/PW3 EXT DC_IN Connector
CN1 POWER B TTON
CN9 IGNITION CONTROL
DC_OUT1/2 Main board DC_IN Connector
2.1.3 Connector Pin Assignments
VGA1: Internal VGA Connector
Pin No.
Description
Pin No.
Description
Pin No.
Description
1 CRT-R 6 GND 11 N.C
2 CRT-G 7 GND 12 V_SDAT
3 CRT-B 8 GND 13 HSYNC
4 N.C 9 VCC 14 VSYNC
5 GND 10 GND 15 V_SCLK
J1:180º SATA CONNECTOR
PIN NO.
DESCRIPTION
1 GND
2 TX+
3 TX-
4 GND
5 RX-
6 RX+
7 GND
COM1(VGA)
5 1

J4 SATA POWER CONNECTOR
PIN NO.
DESCRIPTION
1
N.C
2
GND
3
GND
4
+5V

JCOMA1: COM1( -SUB9) Connector
PIN NO. DESCRIPTION
RS-232 RS-422 RS-485
1 Data Carr er Detect ( DCDA # ) Tx- TxRx-
2 Rece ve Data ( RXDA ) Tx+ TxRx+
3 Transm t Data ( TXDA ) Rx-
4 Data Terminal Ready ( DTRA # ) Rx+
5 Ground ( GND )
6 Data Set Ready ( DSRA # )
7 Request To Send ( RTSA # )
8 Clear To Send ( CTSA # )
9 R ng Ind cator ( RIA # )
SC1T5/SC1T1:Select COM1 Function
COM1 TYPE SC1T1 SC1T5
RS-232 (Default) 1-2 1-5,2-6,3-7,4-8
RS-422 3-4 5-9,6-10,7-11,8-12
RS-485 5-6 5-9,6-10,7-11,8-12
SC1T2:Select COM1 Pin9 Function
P n 9 Funct on SC1T2
+5V 1-2
+12V 3-4
RI# 5-6
SC1T1
1
3
5
9
10
11
12
SC1T5
1
2
3
4
2
4
6
Default :
1
2
3
4
9
10
11
12
SC1T5
SC1T1
2
4
6
1
3
5
COM1
1 5
96
Default :
1
3
5
2
4
6
SC1T1

JCOMB1: COM2( -SUB9) Connector
PIN NO. DESCRIPTION
RS-232
1 Data Carr er Detect ( DCDA # )
2 Rece ve Data ( RXDA )
3 Transm t Data ( TXDA )
4 Data Terminal Ready ( DTRA # )
5 Ground ( GND )
6 Data Set Ready ( DSRA # )
7 Request To Send ( RTSA # )
8 Clear To Send ( CTSA # )
9 R ng Ind cator ( RIA # )
SC1T4:Select COM2 Pin9 Function
P n 9 Funct on SC1T4
+5V 1-2
+12V 3-4
RI# 5-6
JCOMC1: COM2( -SUB9) Connector ( 2X5 Pin 2.0mm
Header ) DESCRIPTION
PIN NO.
RS-232
1 Data Carr er Detect (DCDC #)
2 Data Set Ready (DSRC #)
3 Rece ve Data (RXDC)
4 Request To Send (RTSC #)
5 Transm t Data (TXDC)
6 Clear To Send (CTSC #)
7 Data Term nal Ready (DTRC #)
8 R ng Ind cator (RIC #)
9 Ground
10 KEY
COM2
1 5
96
Default :
1
3
5
2
4
6
SC1T4
1
2
9
10
COM2

Enable
JP1
1
2
3
JP1
1
2
3
1
2
3
IO1: igital IN/OUT( -SUB9 Female) Connector
PIN NO. DESCRIPTION
1 DO_1
2 DO_2
3 DO_3
4 DO_4
5 GND
6 DI_1
7 DI_2
8 DI_3
9 DI_4
JP1:Clear CMOS Data
Descr pt on CMOS1
Normal (Default) 1-2
Clear CMOS 2-3
CASEOPEN1:CASE OPEN FUNCTION
Descr pt on CMOS1
D sable(Default) 1-2
Enable 2-3
DIO1
1
6
Clear CMOS1
JP1
1
2
3
JP1
1
2
3
1
2
3
DIO1
1 5
96

CN5: Compact Flash Connector
PIN DESCRIPTION PIN DESCRIPTION
1 GND 26 CD1-
2 DATA3 27 DATA11
3 DATA4 28 DATA12
4 DATA5 29 DATA13
5 DATA6 30 DATA14
6 DATA7 31 DATA15
7 CE1# 32 CE2#
8 A10 33 VS1#
9 OE# 34 IOR#
10 A9 35 IOW#
11 A8 36 WE#
12 A7 37 READY#
13 CFVCC3 38 CFVCC3
14 A6 39 CSEL
15 A5 40 VS2#
16 A4 41 RESET
17 A3 42 WAIT#
18 A2 43 INPACK#
19 A1 44 REG#
20 A0 45 DASP#
21 DATA0 46 DIAG#
22 DATA1 47 DATA8
23 DATA2 48 DATA9
24 WP 49 DATA10
25 CD2- 50 GND
CN1